CN108587560A - Resinification organic silicon electronic encapsulates glue composition - Google Patents

Resinification organic silicon electronic encapsulates glue composition Download PDF

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Publication number
CN108587560A
CN108587560A CN201810517346.7A CN201810517346A CN108587560A CN 108587560 A CN108587560 A CN 108587560A CN 201810517346 A CN201810517346 A CN 201810517346A CN 108587560 A CN108587560 A CN 108587560A
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component
parts
resinification
glue composition
organic silicon
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CN108587560B (en
Inventor
张鹏硕
刘彬
赵洁
李献起
曹鹤
毕昆鹏
孙长江
曹彩虹
周健
曲雪丽
王红娜
任海涛
赵磊
郑颖
王东英
刘秋艳
高树凯
赵由春
范艳霞
冯梦文
张铁军
王议
陈立军
郑银虎
王威
张伟
孙景辉
赵景辉
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Tangshan Sanyou Silicon Industry Co.,Ltd.
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SANYOU SILICON INDUSTRY Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/003—Additives being defined by their diameter
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/011—Nanostructured additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

The present invention relates to electronic encapsulation material preparing technical field, especially a kind of resinification organic silicon electronic encapsulates glue composition.The encapsulation glue composition is made of component A and B component, component A and B component in mass ratio 1：Cure after 1 mixing deaeration, wherein component A is made of the material of following mass parts：Mix 20~40 parts of reinforced type filler, 12.5~25 parts of vinyl silicone oil, 5~16 parts of tackifier, 0.006~0.014 part of platinum catalyst；Wherein B component is made of the material of following mass parts：Mix 15~40 parts of reinforced type filler；10~25 parts of vinyl silicone oil；5~16 parts of fluidity regulator；10~20 parts of enhanced type polysiloxanes；It is crosslinked 6~20 parts of chain extender；1~8 part of inhibitor.The thermal conductivity, tensile strength and elongation at break for significantly improving electron pouring sealant, reduce the polarity of tackifier and powder, reduce intermolecular active force, form good adhesive effect.

Description

Resinification organic silicon electronic encapsulates glue composition
Technical field
The present invention relates to electronic encapsulation material preparing technical field, especially a kind of resinification organic silicon electronic packaging plastic group Close object.
Background technology
In recent years, electronics, electrical industry are the important applied fields of organosilicon new material, and the demand to silicon materials is increasingly Greatly.The electrical packaging plastic of organosilicon is mainly used in the embedding of circuit board, electric components, LED power, panel.Organosilicon encapsulates Material can effectively protect component and complete machine make it avoid the pollution and erosion of aqueous vapor in air, impurity and various chemical atmospheres, To enable complete machine to stablize electric function of bringing into normal play.Embedding Material used at present includes：Silicone fluid glue, asphalt mixtures modified by epoxy resin Several classes such as fat, polyurethane elastomer, wherein organosilicon liquid body rubber have excellent dielectric properties, good mechanical property, interior Portion's stress and molding shrinkage is small, good weatherability, the advantages that high and low temperature resistance is excellent and water resistance is good, it has also become answer There is significant performance advantage especially in high-end electrical encapsulation field with a kind of most wide electronic encapsulation material.Currently, both at home and abroad Organosilicon is all made of as mainstream encapsulating material of new generation.
Overwhelming majority electronic encapsulation material preferable thermal conductivity and mechanical strength, but often electronics embedding in order to obtain at present The adhesive property of material and other materials is bad, because organosilicon and metal and polymeric bonding material power are smaller, to be easy from It cracks interface.Patent No. CN201610373062 discloses a kind of heat dissipation casting glue for encasing electronic components, and heat dissipation fills Sealing includes component A and B component, and component A includes that epoxy resin, mixed diluent, inorganic mixing heat filling, spherical silicon are micro- Powder；B component includes composite curing agent, plasticizer, epoxy accelerating agent.The casting glue component A that radiates and B component mass ratio (8~10)： (4~8) it is uniformly mixed.Although this heat dissipation casting glue has extensibility, tensile strength and excellent heat conductivility and dielectric Performance, but its adhesive property is not improved and is promoted, and cannot be met the actual needs.
Patent No. CN107227142A discloses a kind of preparation method of LED encapsulation organic silicon potting adhesive, and organosilicon fills Sealing is made of component A and B component, and component A includes silicon powder, ball-aluminium oxide, hydroxy silicon oil, tetramethyl tetravinyl ring four Siloxanes, platinum catalyst；B component includes silicon powder, ball-aluminium oxide, vinyl silicone oil, containing hydrogen silicone oil, methyl butynol.LED Encapsulation with organic silicon potting adhesive component A and B component by etc. quality than being used after mixing row's bubble.Although gained organic silicon potting adhesive has There are good mobility and heat conductivility, but its adhesive property is not obviously improved, and cannot be met the actual needs.
In conclusion the organosilicon and epoxy-modified casting glue developed at present have good flowing before not having both solidification Property and solidification after have good bonding and tensile strength.
Invention content
It is insufficient present in the above technology it is an object of the invention to solve, to prepare a kind of resinification organosilicon electricity Son encapsulation glue composition, has mobility and bond effect before excellent solidification, while having good dielectric properties, thermal conductivity Can, anti-aging and high physical strength feature.
The present invention adopts the following technical scheme that：
A kind of resinification organic silicon electronic encapsulation glue composition, the encapsulation glue composition are made of component A and B component, A groups Divide and B component in mass ratio 1：Cure after 1 mixing deaeration, wherein component A is made of the material of following mass parts：
Wherein B component is made of the material of following mass parts：
Using above-mentioned technical proposal the present invention compared with prior art：1) silica flour used is used as with silicon carbide and mixes Reinforced type filler can significantly improve the thermal conductivity, tensile strength and fracture of organic silicon electronic potting adhesive because of the addition of silicon carbide Elongation, the and because resistance that is subject to is small when the addition of fluidity regulator can guarantee casting glue flowing, to formed have it is good The organic silicon potting adhesive of good mobility；2) it by the compound tackifier of introducing, is formed containing with functional group in powder surface Molecular layer, can have preferable compatibility with vinyl silicone oil, reduce the polarity of tackifier and powder, reduce intermolecular Active force, to form good adhesive effect.
The present invention preferred embodiment be：
The mixture that reinforced type filler is silica flour and silicon carbide is mixed, wherein silica flour accounts in mixing reinforced type filler 60~80wt.%, silicon carbide account for 20~40wt.%；Silica flour is 3 μm by grain size and grain size is 30 μm two kinds and constitutes, 3 μm of grain size With 30 μm of two kinds of silica flour mass ratioes 1.5 of grain size：1；Silicon carbide grain size is 20nm~40nm.
Enhanced type polysiloxane structure is：
Wherein, m=5~10, n=10~30.
Being crosslinked chain extender structures is：
Wherein, m=5~10, n=10~20.
Tackifier are that gamma-methyl allyl acyloxypropyl trimethoxysilane and γ-dredge hydroxypropyl methyl dimethoxysilane, two The molar ratio of kind substance is 1:2~3.5.
Fluidity regulator be dioctyl phthalate, diethyl phthalate, benzyl butyl phthalate, One or several kinds in the double cyclohexyls of n-butyl phthalate, diisooctyl phthalate, phthalic acid.
Inhibitor is the complex of ethynylcyclohexanol, polyalcohol and organosilicon hybrid ring body.
Platinum catalyst is the complex compound of platinum and organosilicon hybrid ring body.
Specific implementation mode
With reference to embodiment, the invention will be further described.Following embodiment is explanation of the invention and of the invention It is not limited to following instance.
Embodiment 1：
A kind of resinification organic silicon electronic encapsulation glue composition, encapsulation glue composition are made of component A and B component, component A It is made of the material of following mass parts：Mix reinforced type 30 parts of (3 μm of grain sizes of filler：Grain size 30 μm=1.5:1) (silica flour：Carbon SiClx=3:2)；15 parts of vinyl silicone oil；5 parts of (gamma-methyl allyl acyloxypropyl trimethoxysilanes of tackifier：γ-dredges propyl Methyl dimethoxysilane=1:2)；0.006 part of platinum catalyst.B component is made of the material of following mass parts：Mix reinforced type 30 parts of filler (3 μm of grain size：Grain size 30 μm=1.5:1) (silica flour：Silicon carbide=3:2)；20 parts of vinyl silicone oil；Enhanced type is poly- 6 parts of siloxanes；10 parts of (dioctyl phthalates of fluidity regulator：Benzyl butyl phthalate=4：3)；Crosslinking is expanded 8 parts of chain agent；1 part of (ethynylcyclohexanol of inhibitor：Polyalcohol：Organosilicon hybrid ring body=2:1:1).Component A presses matter with B component Measure ratio 1:Cure after 1 mixing deaeration.
Embodiment 2：
A kind of resinification organic silicon electronic encapsulation glue composition, encapsulation glue composition are made of component A and B component, component A It is made of the material of following mass parts：Mix reinforced type 40 parts of (3 μm of grain sizes of filler：Grain size 30 μm=1.5:1) (silica flour：Carbon SiClx=7:3)；25 parts of vinyl silicone oil；(gamma-methyl allyl acyloxypropyl trimethoxysilane γ-dredges propyl to 8 parts of tackifier Methyl dimethoxysilane=1:2.2)；0.008 part of platinum catalyst.
B component is made of the material of following mass parts：Mix reinforced type 40 parts of (3 μm of grain sizes of filler：Grain size 30 μm=1.5: 1) (silica flour：Silicon carbide=7:3)；25 parts of vinyl silicone oil；7 parts of enhanced type polysiloxanes；12 parts of (adjacent benzene of fluidity regulator Diformazan dioctyl phthalate：Benzyl butyl phthalate：Diethyl phthalate=4：3：2)；It is crosslinked 9 parts of chain extender；Inhibit 1 part of (ethynylcyclohexanol of agent：Polyalcohol：Organosilicon hybrid ring body=2:2:1).Component A and B component in mass ratio 1:1 mixing Cure after deaeration.
Embodiment 3：
A kind of resinification organic silicon electronic encapsulation glue composition, encapsulation glue composition are made of component A and B component, component A It is made of the material of following mass parts：Mix reinforced type 40 parts of (3 μm of grain sizes of filler：Grain size 30 μm=1.5:1) (silica flour：Carbon SiClx=4:1)；18 parts of vinyl silicone oil；10 parts of (gamma-methyl allyl acyloxypropyl trimethoxysilanes of tackifier：γ-dredges third Ylmethyl dimethoxysilane=1:2.5)；0.008 part of platinum catalyst.
B component is made of the material of following mass parts：Mix reinforced type 40 parts of (3 μm of grain sizes of filler：Grain size 30 μm=1.5: 1) (silica flour：Silicon carbide=4:1)；18 parts of vinyl silicone oil；10 parts of enhanced type polysiloxanes；10 parts of fluidity regulator is (adjacent Dioctyl phthalate：Benzyl butyl phthalate：Diethyl phthalate=3：2：1)；It is crosslinked 15 parts of chain extender； 2 parts of (ethynylcyclohexanols of inhibitor：Polyalcohol：Organosilicon hybrid ring body=1:1:1).Component A and B component in mass ratio 1:1 Cure after mixing deaeration.
Embodiment 4：
A kind of resinification organic silicon electronic encapsulation glue composition, encapsulation glue composition are made of component A and B component, component A It is made of the material of following mass parts：Mix reinforced type 40 parts of (3 μm of grain sizes of filler：Grain size 30 μm=1.5:1) (silica flour：Carbon SiClx=3:1)；18 parts of vinyl silicone oil；10 parts of (gamma-methyl allyl acyloxypropyl trimethoxysilanes of tackifier：γ-dredges third Ylmethyl dimethoxysilane=1:3)；0.008 part of platinum catalyst.
B component is made of the material of following mass parts：Mix reinforced type 40 parts of (3 μm of grain sizes of filler：Grain size 30 μm=1.5: 1) (silica flour：Silicon carbide=4:1)；18 parts of vinyl silicone oil；10 parts of enhanced type polysiloxanes；10 parts of fluidity regulator is (adjacent The double cyclohexyls of phthalic acid：Benzyl butyl phthalate：N-butyl phthalate=4：2：1)；It is crosslinked chain extender 15 Part；2 parts of (ethynylcyclohexanols of inhibitor：Polyalcohol：Organosilicon hybrid ring body=1:2:1).Component A and B component are in mass ratio 1:Cure after 1 mixing deaeration.
Embodiment 5：
A kind of resinification organic silicon electronic encapsulation glue composition, encapsulation glue composition are made of component A and B component, component A It is made of the material of following mass parts：Mix reinforced type 40 parts of (3 μm of grain sizes of filler：Grain size 30 μm=1.5:1) (silica flour：Carbon SiClx=4:1)；18 parts of vinyl silicone oil；10 parts of (gamma-methyl allyl acyloxypropyl trimethoxysilanes of tackifier：γ-dredges third Ylmethyl dimethoxysilane=1:3.5)；0.008 part of platinum catalyst.
B component is made of the material of following mass parts：Mix reinforced type 40 parts of (3 μm of grain sizes of filler：Grain size 30 μm=1.5: 1) (silica flour：Silicon carbide=4:1)；18 parts of vinyl silicone oil；10 parts of enhanced type polysiloxanes；10 parts of fluidity regulator is (adjacent Phthalic acid benzyl butyl ester：Diethyl phthalate=3：2)；It is crosslinked 15 parts of chain extender；2 parts of (acetenyl hexamethylenes of inhibitor Alcohol：Polyalcohol：Organosilicon hybrid ring body=1:1:2).Component A and B component in mass ratio 1:Cure after 1 mixing deaeration.
It is the data comparison of each embodiment in the following table 1：Wherein comparative example is that the add-on type of external certain company production is organic Each item data of silicon Electronic Packaging glue
The performance comparison table of 1 each organic silicon packaging glue of table
Resinification organic silicon packaging glue produced by the present invention has good flowing it can be seen from 1 test result of upper table Property, while having excellent cementability, dielectric properties, heat conductivility and flame retardant property concurrently, the mobility and bonding that product has Property and mechanical strength are superior to the commercially available organic silicon packaging glue product of comparative example, before electrical encapsulation field has a vast market Scape.

Claims (8)

1. a kind of resinification organic silicon electronic encapsulates glue composition, it is characterised in that：The encapsulation glue composition is by component A and B groups It is grouped as, component A and B component in mass ratio 1：Cure after 1 mixing deaeration, wherein component A by following mass parts material group At：
Wherein B component is made of the material of following mass parts：
2. resinification organic silicon electronic according to claim 1 encapsulates glue composition, it is characterised in that：Mixing reinforced type is filled out Material is the mixture of silica flour and silicon carbide, and wherein silica flour accounts for 60~80wt.% in mixing reinforced type filler, and silicon carbide accounts for 20~40 wt.%；Silica flour is 3 μm by grain size and grain size is 30 μm two kinds and constitutes, 3 μm of grain size and 30 μm of two kinds of quartz of grain size Powder mass ratio 1.5：1；Silicon carbide grain size is 20nm~40nm.
3. resinification organic silicon electronic according to claim 1 encapsulates glue composition, which is characterized in that the poly- silica of enhanced type Alkyl structure is：
Wherein, m=5~10, n=10~30.
4. resinification organic silicon electronic according to claim 1 encapsulates glue composition, which is characterized in that crosslinking chain extender knot Structure is：
Wherein, m=5~10, n=10~20.
5. resinification organic silicon electronic according to claim 1 encapsulates glue composition, which is characterized in that tackifier are γ- Methyl allyl acyloxypropyl trimethoxysilane dredges hydroxypropyl methyl dimethoxysilane with γ-, and the molar ratio of two kinds of substances is 1:2 ~3.5.
6. resinification organic silicon electronic according to claim 1 encapsulates glue composition, it is characterised in that：Fluidity regulator For dioctyl phthalate, diethyl phthalate, benzyl butyl phthalate, n-butyl phthalate, One or several kinds in the double cyclohexyls of diisooctyl phthalate, phthalic acid.
7. resinification organic silicon electronic according to claim 1 encapsulates glue composition, it is characterised in that：Inhibitor is acetylene The complex of cyclohexanol, polyalcohol and organosilicon hybrid ring body.
8. resinification organic silicon electronic according to claim 1 encapsulates glue composition, it is characterised in that：Platinum catalyst is platinum With the complex compound of organosilicon hybrid ring body.
CN201810517346.7A 2018-05-25 2018-05-25 Resinated organic silicon electronic packaging adhesive composition Active CN108587560B (en)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1282771A (en) * 2000-06-23 2001-02-07 杭州之江有机硅化工有限公司 Dual-component structural adhesive of epoxy resin for buildings
CN104804704A (en) * 2014-01-25 2015-07-29 东莞市长安东阳光铝业研发有限公司 Preparation method and applications of additive vulcanized silicon rubber used for encapsulation
CN106634809A (en) * 2016-12-06 2017-05-10 烟台德邦先进硅材料有限公司 Anti-poisoning anti-sedimentation high-cohesiveness thermal conductive silica gel for LED (Light-Emitting Diode) power supply packaging
CN107312339A (en) * 2017-06-28 2017-11-03 广州惠利电子材料有限公司 White-light LED encapsulation silica gel and its preparation method and application

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1282771A (en) * 2000-06-23 2001-02-07 杭州之江有机硅化工有限公司 Dual-component structural adhesive of epoxy resin for buildings
CN104804704A (en) * 2014-01-25 2015-07-29 东莞市长安东阳光铝业研发有限公司 Preparation method and applications of additive vulcanized silicon rubber used for encapsulation
CN106634809A (en) * 2016-12-06 2017-05-10 烟台德邦先进硅材料有限公司 Anti-poisoning anti-sedimentation high-cohesiveness thermal conductive silica gel for LED (Light-Emitting Diode) power supply packaging
CN107312339A (en) * 2017-06-28 2017-11-03 广州惠利电子材料有限公司 White-light LED encapsulation silica gel and its preparation method and application

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Title
张铁成: "《最新新型工程材料生产新技术应用与新产品开发研制及行业技术标准实用大全涂料与胶粘剂卷》", 30 November 2004, 学苑音像出版社 *
李子东: "《胶黏剂助剂》", 30 June 2009, 化学工业出版社 *

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