Disclosure of Invention
The invention aims to provide a pressure sensor of an automobile air conditioner, which aims to solve the problems that when the pressure input by a refrigerant pipeline is overlarge, a pressure chip is easy to damage due to overlarge pressure, the connector model of the pressure sensor is single, the sizes of refrigerant pressure pipelines of different types of automobiles are different, and the application range of the pressure sensor with the single connector model is low.
In order to achieve the purpose, the invention provides the following technical scheme: a pressure sensor of an automobile air conditioner comprises a first pore plate, wherein a threaded joint groove is formed in the first pore plate, a threaded joint is arranged on the inner side of the threaded joint groove, a fixing screw is installed on the threaded joint, the threaded joint is fixedly connected with the first pore plate through the fixing screw, a connecting pipe is arranged on one side, away from the threaded joint, of the first pore plate, a valve main body is installed on the connecting pipe, a valve core cylinder is arranged inside the valve main body, a gear column is arranged at the top end of the valve core cylinder, an outer box is arranged at the top end of the first pore plate, a motor is arranged inside the outer box, a gear is installed on the motor, the gear is meshed with the gear column, a single chip microcomputer is arranged on one side, away from the motor, of the gear column, a second pore plate is arranged on one side, away from the first pore plate, of the second pore plate, a sensor main body is arranged on one side, away from the connecting pipe, the sensor comprises a sensor body and is characterized in that a pressure chip is arranged inside the sensor body, a glass ring is arranged on one side of the pressure chip, a pressing plate is arranged on one side, away from the pressure chip, of the glass ring, a calibration circuit board is arranged on one side, away from the glass ring, of the pressing plate, an electric connector is installed at one end, away from a second pore plate, of the sensor body, the motor is electrically connected with a single chip microcomputer, the pressure chip is electrically connected with the calibration circuit board, the calibration circuit board is electrically connected with the electric connector, and the electric connector and the single chip microcomputer are electrically connected with a vehicle-mounted computer.
Preferably, the number of the fixing screws is four.
Preferably, the threaded joint is provided with two.
Preferably, the combination of the first orifice plate and the second orifice plate is in a straight structure.
Preferably, the valve core cylinder is of a hollow sphere structure.
Compared with the prior art, the invention has the beneficial effects that:
(1) the valve body is arranged, the gear mounted on the motor drives the gear column to rotate, so that the valve core cylinder in the valve body rotates, when the pressure of a refrigerant is overlarge, the valve core cylinder is rotated to cut off the pressure of the refrigerant, the problem that the pressure chip is damaged due to overlarge pressure is avoided, and the pressure sensor has good self-protection capability.
(2) The invention is provided with the threaded joint, and the two threaded joints with different sizes are arranged, so that the installation of the sensor is convenient, when the joint of the refrigerant pipeline is larger, the larger threaded joint can be adopted, and when the joint of the refrigerant pipeline is smaller, the smaller threaded joint can be adopted, so that the sensor can be conveniently installed on the refrigerant pipelines with different specifications, and the application range of the pressure sensor is improved.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-5, the present invention provides a technical solution: a pressure sensor of an automobile air conditioner comprises a first pore plate 1, wherein a screwed joint groove 19 is formed in the first pore plate 1, a screwed joint 9 is arranged on the inner side of the screwed joint groove 19, the screwed joint 9 is provided with two screwed joints 9 which are different in size, so that refrigerant pipelines with different sizes can be conveniently connected, a fixing screw 8 is installed on the screwed joint 9, the screwed joint 9 is fixedly connected with the first pore plate 1 through the fixing screw 8, a connecting pipe 2 is arranged on one side, away from the screwed joint 9, of the first pore plate 1, a valve main body 7 is installed on the connecting pipe 2, a valve core cylinder 18 is arranged inside the valve main body 7, when the valve core cylinder 18 rotates ninety degrees, a through hole of the valve core cylinder 18 can be blocked by the valve main body 7, so that refrigerant is cut off, a gear column 16 is arranged at the top end of the valve core cylinder 18, an outer box 6 is arranged at the top end of the first pore plate 1, a motor 14 is arranged inside the outer box 6, the motor 14 adopts a DS-25RS370 driving motor, the motor 14 is provided with a gear 15, the gear 15 is meshed with a gear column 16, one side of the gear column 16 far away from the motor 14 is provided with a single chip microcomputer 17, the single chip microcomputer 17 adopts an STC89C52 single chip microcomputer, one side of the connecting pipe 2 far away from the first orifice plate 1 is provided with a second orifice plate 3, one side of the second orifice plate 3 far away from the connecting pipe 2 is provided with a sensor main body 4, the inside of the sensor main body 4 is provided with a pressure chip 10, a stress silicon film in the pressure chip 10 can be elastically deformed under the action of external force, resistance strain sheets are subjected to resistance change, a circuit balance change outputs a voltage signal proportional to the pressure, one side of the pressure chip 10 is provided with a glass ring 11, one side of the glass ring 11 far away from the pressure chip 10 is provided with a pressure plate 13, one side of the pressure plate 13 far away from the glass ring 11 is provided with a calibration circuit board 12, one end of the sensor main body 4 far away from the second orifice plate 3 is provided with an electrical connector 5, the motor 14 is electrically connected with the single chip microcomputer 17, the pressure chip 10 is electrically connected with the calibration circuit board 12, the calibration circuit board 12 is electrically connected with the electrical connector 5, and the electrical connector 5 and the single chip microcomputer 17 are both electrically connected with the vehicle-mounted computer.
In order to ensure the firm fixation of the threaded joint 9, in the present embodiment, it is preferable that four fixation screws 8 are provided.
For the convenience of installation, in the present embodiment, it is preferable that the threaded joints 9 are provided in total in two.
In order to facilitate the circulation of the refrigerant, in the present embodiment, it is preferable that the combination of the first orifice plate 1 and the second orifice plate 3 has a straight-line structure.
In order to intercept the refrigerant, in the present embodiment, the valve core cylinder 18 is preferably a hollow sphere structure.
The working principle and the using process of the invention are as follows: when the pressure sensor is used, the threaded joint 9 with which size is used can be selected according to the size of a refrigerant pipeline, when the joint of the refrigerant pipeline is larger, the larger threaded joint 9 can be adopted, when the joint of the refrigerant pipeline is smaller, the smaller threaded joint 9 can be adopted, the sensor can be conveniently installed on refrigerant pipelines with different specifications, the application range of the pressure sensor is improved, when the pressure of the refrigerant is transmitted to the pressure chip 10, the pressure chip 10 converts the pressure into a voltage signal, the signal is transmitted to the vehicle-mounted computer from the electrical appliance joint 5 through the calibration circuit board 12, in the process of detecting the pressure of the refrigerant by the sensor, when the pressure value of the refrigerant received by the vehicle-mounted computer is close to the rated maximum pressure value of the pressure chip 10, the vehicle-mounted computer controls the motor 14 to rotate through the single chip 17, so that the gear 15 drives the gear column 16 to rotate, and the valve core cylinder 18 rotates ninety degrees, the refrigerant is cut off, the pressure chip 10 is prevented from being damaged due to overlarge pressure of the refrigerant, and the valve core cylinder 18 is controlled to reset according to the same working principle after a period of time.
In order to facilitate heat dissipation, preferably, the shell of the sensor main body 4 is made of a nano heat dissipation material, the nano heat dissipation material is a resin type nano heat conduction composite material, and Al is synthesized by a sol-gel method2O3The @ ZnO core-shell nano-filler is prepared by taking zinc citrate with a high chemical active component as a precursor, uniformly mixing aluminum oxide under a liquid condition, and then carrying out full hydrolysis and condensation reaction to form a stable transparent sol system in a solution. The sol is aged, and the colloidal particles are slowly polymerized to finally form gel. And finally, drying, sintering and curing the gel to prepare the core-shell type nanometer heat conduction structure. The thermal conductivity of the heat-conducting composite material prepared by the filler obtained by processing the surface state of the filler by a sol-gel method is greatly improved; on one hand, ZnO with higher heat conductivity is coated on the surface of the alumina filler, and the heat conductivity of the alumina filler is higher, so that the ZnO has main influence on the heat conductivity of the composite material; on the other hand, due to the existence of Zn0, the interface bonding state of the epoxy resin matrix and the filler is improved, the matrix and the filler are bonded more tightly, and the interface defects of the matrix and the filler are reduced, so that the possibility of scattering of phonons at the interface bonding position is reduced, and the heat conductivity of the composite material is improved.
The preparation method comprises the following steps:
example 1
The preparation method of the resin type nanometer heat conduction composite material comprises the following steps:
step 1, weighing a certain mass of epoxy resin and a curing agent PSPA, wherein the mass ratio of the epoxy resin to the curing agent PSPA is 2:1, and mixing the epoxy resin and the curing agent PSPA in a high-speed mixer at a speed of 800 r/min for 2min to fully mix an epoxy matrix and the curing agent PSPA;
step 2, then Al2O3Adding the @ ZnO core-shell nano filler into a mixture of epoxy resin and a curing agent (the mass ratio of the filler to the epoxy resin is 3: 7), and mixing for 2min again at 1000 r/min;
step 3, pouring the mixture into a cylindrical mold which is coated with oleic acid as a release agent in advance and has the diameter of 30mm, placing the mold in a vacuum drying oven, vacuumizing to enable bubbles in the mixture to escape, setting the curing temperature at 60 ℃ and the curing time at 4 h;
and 4, after the curing is finished, demolding, and grinding the upper surface and the lower surface of the cured substance to obtain the nano heat-conducting composite material.
The Al is2O3The preparation method of the @ ZnO core-shell nano-filler comprises the following steps:
step 1, dripping 50ml of 1.0mol/L citric acid solution into 30ml of 1.0mol/L zinc nitrate solution to obtain zinc citrate precursor sol, continuously performing magnetic stirring on the zinc citrate precursor sol in a constant-temperature water bath kettle at the temperature of 80 ℃, and then adding 10.0g of flaky Al2O3Continuously heating and stirring, reacting for a period of time to obtain precursor-coated flaky Al2O3Gelling;
step 2, putting the gel into a drying oven for drying at 60 ℃ to obtain dry gel, finally putting the dry gel into a box-type furnace for calcining at 550 ℃, grinding a calcined product, and sieving to obtain Al for treating the surface of the alumina by adopting a sol-gel method2O3@ ZnO core-shell nanofiller.
Example 2
Step 2, then Al2O3@ ZnO core-shell nanoAdding the filler into a mixture of epoxy resin and a curing agent (the mass ratio of the filler to the epoxy resin is 1: 2), and mixing for 2min again at 1000 r/min; the rest of the preparation was the same as in example 1.
Example 3
Step 2, then Al2O3Adding the @ ZnO core-shell nano filler into a mixture of epoxy resin and a curing agent (the mass ratio of the filler to the epoxy resin is 3: 5), and mixing for 2min again at 1000 r/min; the rest of the preparation was the same as in example 1.
Example 4
Step 2, then Al2O3Adding the @ ZnO core-shell nano filler into a mixture of epoxy resin and a curing agent (the mass ratio of the filler to the epoxy resin is 3: 4), and mixing for 2min again at 1000 r/min; the rest of the preparation was the same as in example 1.
Example 5
Step 2, then Al2O3Adding the @ ZnO core-shell nano filler into a mixture of epoxy resin and a curing agent (the mass ratio of the filler to the epoxy resin is 3: 2), and mixing for 2min again at 1000 r/min; the rest of the preparation was the same as in example 1.
Example 6
Step 2, then Al2O3Adding the @ ZnO core-shell nano filler into a mixture of epoxy resin and a curing agent (the mass ratio of the filler to the epoxy resin is 3: 1), and mixing for 2min again at 1000 r/min; the rest of the preparation was the same as in example 1.
Example 7
Step 2, then Al2O3Adding the @ ZnO core-shell nano filler into a mixture of epoxy resin and a curing agent (the mass ratio of the filler to the epoxy resin is 1: 1), and mixing for 2min again at 1000 r/min; the rest of the preparation was the same as in example 1.
Example 8
Step 2, then Al2O3Adding the @ ZnO core-shell nano filler into a mixture of epoxy resin and a curing agent (the mass ratio of the filler to the epoxy resin is 2: 7), and mixing for 2min again at 1000 r/min; the rest of the preparation was the same as in example 1.
Example 9
Step 2, then Al2O3Adding the @ ZnO core-shell nano filler into a mixture of epoxy resin and a curing agent (the mass ratio of the filler to the epoxy resin is 1: 7), and mixing for 2min again at 1000 r/min; the rest of the preparation was the same as in example 1.
Example 10
Step 2, then Al2O3Adding the @ ZnO core-shell nano filler into a mixture of epoxy resin and a curing agent (the mass ratio of the filler to the epoxy resin is 1: 10), and mixing for 2min again at 1000 r/min; the rest of the preparation was the same as in example 1.
Comparative example 1
The difference from embodiment 1 is that: in the step 1 of preparing the nano heat conduction material, the curing agent is not added for curing reaction, and the rest steps are completely the same as those in the embodiment 1.
Comparative example 2
The difference from embodiment 1 is that: the nano-thermal conductive material was prepared by modifying PSPA with equal amount of KH-560 in step 1, and the rest of the procedure was exactly the same as in example 1.
Comparative example 3
The difference from embodiment 1 is that: in the step 2 for preparing the nano heat conduction material, Al is added2O3The filler was added to the mixture of epoxy resin and curing agent and the rest of the procedure was exactly the same as in example 1.
Comparative example 4
The difference from embodiment 1 is that: in step 2 of preparing the nano heat conduction material, the ZnO filler is added to the mixture of the epoxy resin and the curing agent, and the rest of the steps are completely the same as those in the example 1.
Comparative example 5
The difference from embodiment 1 is that: al (Al)2O3In step 1 of @ ZnO core-shell nanofiller preparation, 50ml of 1.0mol/L citric acid solution was added dropwise to 10ml of 1.0mol/L zinc nitrate solution, and the rest of the procedure was exactly the same as in example 1.
Comparative example 6
The difference from embodiment 1 is that: al (Al)2O3@ ZnO coreIn step 1 of preparing the shell nanofiller, 10ml of 1.0mol/L citric acid solution was added dropwise to 30ml of 1.0mol/L zinc nitrate solution, and the rest of the procedure was exactly the same as in example 1.
Comparative example 7
The difference from embodiment 1 is that: al (Al)2O3In step 1 of @ ZnO core-shell nanofiller preparation, zinc nitrate was replaced with an equal amount of magnesium chloride, and the rest of the procedure was exactly the same as in example 1.
Comparative example 8
The difference from embodiment 1 is that: al (Al)2O3In step 1 of @ ZnO core-shell nanofiller preparation, zinc nitrate was replaced with the same amount of nickel nitrate, exactly as in example 1.
Comparative example 9
The difference from embodiment 1 is that: al (Al)2O3In the step 1 of preparing the @ ZnO core-shell nano-filler, 5.0g of flaky Al is added2O3Heating and stirring were continued, and the rest of the procedure was exactly the same as in example 1.
Comparative example 10
The difference from embodiment 1 is that: al (Al)2O3In step 1 of @ ZnO core-shell nano-filler preparation, equivalent CaO is added to replace Al2O3The rest of the procedure was exactly the same as in example 1.
The prepared heat conduction materials are selected to be respectively subjected to performance detection,
the volume resistivity is measured according to GB/15662-; the thermal conductivity is tested by a DRL-III thermal conductivity coefficient instrument, the method is a heat flow method, and the test standard is MIL-I-49456A;
test results
The experimental result shows that the resin type nanometer heat conduction composite material adopted by the shell of the sensor main body 4 has good heat conduction effect, the higher the heat conductivity of the material is under the national standard test condition, the better the heat dissipation effect is, otherwise, the worse the effect is; examples 1 to 10, volume resistivityAll reach the standard of insulating materials, but the thermal conductivity is changed greatly; different from the embodiment 1, the embodiment 2 to the embodiment 10 respectively change the proportion of the main raw material composition in the composite heat dissipation material, have different degrees of influence on the heat dissipation performance of the material, and have the best heat conduction effect when the mass ratio of the filler to the epoxy resin is 3:7 and the dosage of other ingredients is fixed; in comparison examples 1-2, the curing agent is not added and the coupling agent KH-560 is used for substitution, so that the heat conduction effect is obviously reduced, and the curing reaction has an important influence on the composite heat conduction property of the resin; compared with the comparative examples 3 to 4, the single-component metal oxide is added as the filler for compounding, so that the heat conductivity coefficient is reduced, the heat conductivity effect is obviously deteriorated, and the composite filler particles with the core-shell structure are important to the heat conductivity of the material; the use amounts of zinc nitrate and citric acid are reduced in comparison examples 5 to 6, precursor gel is reduced, and the heat conduction effect is poor; comparative examples 7 to 8, in which zinc nitrate was replaced with equal amounts of magnesium chloride and nickel nitrate, the heat dissipation effect was significantly deteriorated, indicating that the modification effect of zinc nitrate as a core was relatively good; comparative examples 9 and 10 for reducing flaky Al2O3The dosage is replaced by CaO, the thermal conductivity is still not high, which shows that the shell layer effect of alumina as the filler is better; therefore, the shell of the sensor main body 4 of the invention adopts the resin type nanometer heat conduction composite material and has good heat conduction effect.