CN108572412B - High-stability temperature self-adaptive compensation device - Google Patents
High-stability temperature self-adaptive compensation device Download PDFInfo
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- CN108572412B CN108572412B CN201810428523.4A CN201810428523A CN108572412B CN 108572412 B CN108572412 B CN 108572412B CN 201810428523 A CN201810428523 A CN 201810428523A CN 108572412 B CN108572412 B CN 108572412B
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B2006/12133—Functions
- G02B2006/12135—Temperature control
Abstract
The invention discloses a high-stability temperature self-adaptive compensation device, which comprises a bottom plate and a temperature driver, wherein the bottom plate comprises a moving part I, a moving part II and a rotary connecting shaft, a gap is formed between the moving part I and the moving part II, and the rotary connecting shaft is arranged in the gap and connects the moving part I and the moving part II together; the temperature driver is installed between the lug I and the lug II, and the expansion coefficient of the bottom plate is different from that of the temperature driver. The invention adopts three or more than three rotating shafts, realizes high stability, and the rotating shafts and other parts on the bottom plate are directly formed by hollowing out relevant areas and are a unified whole without any other bonding modes, thereby further improving the stability. The invention can automatically compensate the temperature dependence of the optical waveguide device, and greatly reduces the power consumption of the device.
Description
Technical Field
The invention relates to a high-stability temperature self-adaptive compensation device, in particular to automatic compensation of temperature characteristics of an optical waveguide chip and a device, and belongs to the field of optical communication.
Background
Optical waveguide integrated devices (PLC) are an important development direction for future optical communications, and planar optical waveguides (PLC) are a photonic integrated solution with the highest commercialization level, for example, optical splitters (Splitter), Arrayed Waveguide Gratings (AWG), mach-zehnder interferometers (MZI), Variable Optical Attenuators (VOA) and arrays, Optical Switches (OS) and arrays, multicast switching optical switches (MCS), optically tunable wavelength division multiplexing/demultiplexing devices (VMUX), reconfigurable optical add-drop multiplexers (ROADM), differential quadrature phase-shift keying (DQPSK) demodulators, mixers (Co-Mixer), and the like are based on PLC technology. Among these functional devices, the AWG, MZI, VOA, OS, MCS, DQPSK demodulators are all realized by using the principle of interference/diffraction of two or more beams, and there is a fixed optical path difference between the beams. The optical path difference is mainly determined by the optical waveThe effective index of refraction of the waveguide, and the geometry of the waveguide. Generally, the PLC waveguide chip is fabricated using silica-on-silicon technology, and the thermo-optic coefficient of the silica material is 1.01 × 10-5K, coefficient of thermal expansion of 0.55X 10-6and/K. Therefore, the refractive index of silica changes with temperature, and the geometry of the waveguide also changes with temperature. When the ambient temperature changes, the optical path difference between the beams also changes, and the change of the optical path difference further deteriorates the optical indexes of the device, such as wavelength, extinction ratio, crosstalk, insertion loss and the like. In practical applications, in order to solve the temperature sensitivity of these devices, a heater or a Peltier (Peltier) refrigerator is currently used in the market for temperature control, and a temperature control circuit is used to keep them in a constant temperature environment, so that the optical performance of the devices is not deteriorated. But such an approach would increase the complexity and operating cost of the device and system. Therefore, the temperature sensitivity problem of the planar optical waveguide device is solved, a temperature control circuit is omitted, and the elimination of additional cost is imperative; in addition, in outdoor application environments such as WDM-PON, power supply is not provided, so that devices with a temperature control circuit using power supply cannot meet the requirements; in addition, the key problems of heat and electric power consumption and the like are easily solved without using a device of a temperature control circuit, so that the system development is provided with greater design freedom. All these show that designing a temperature adaptive compensation device is of crucial significance for the commercial application of the device; at the same time, devices for commercial applications must meet stringent reliability and stability requirements.
Disclosure of Invention
In order to solve the problems of temperature dependence and reliability and stability of the optical waveguide integrated device based on the PLC technology, the present invention provides a temperature adaptive compensation device, which automatically moves according to the change of the environment, thereby compensating the temperature dependence of the PLC optical waveguide device.
In order to solve the technical problems, the technical scheme adopted by the invention is as follows:
a high-stability temperature self-adaptive compensation device comprises a bottom plate and a temperature driver, wherein the bottom plate comprises a moving part I, a moving part II and a rotary connecting shaft, a gap is formed between the moving part I and the moving part II, and the rotary connecting shaft is arranged in the gap and connects the moving part I and the moving part II together; the temperature driver is installed between the lug I and the lug II, and the expansion coefficient of the bottom plate is different from that of the temperature driver. The temperature driver and the bottom plate are two relatively independent entities and are fixed on the bottom plate in a mechanical, welding or adhesive mode.
The moving part I, the moving part II and the rotary connecting shaft are of an integrated structure formed by hollowing out the bottom plate, and other bonding modes are not needed. The integrated structure can further improve the high stability of the temperature self-adaptive compensation device.
The number of the rotary connecting shafts is at least three.
The rotary connecting shafts are located on the same plane, and the moving portion I and the moving portion II are in mutual translation or rotation in the plane. Three or more than three rotating shafts limit two parts of relative movement to only translate or rotate in the plane of the bottom plate, but not move in the direction vertical to the plane of the bottom plate, so that the high stability of the temperature self-adaptive compensation device is realized.
The mutual geometric relationship of the rotating connecting shafts is parallel, vertical or any other angle.
The geometric relationship between the rotating connecting shaft and the temperature driver is parallel, vertical or any other angle.
The invention adopts three or more than three rotating shafts, realizes high stability, and the rotating shafts and other parts on the bottom plate are directly formed by hollowing out relevant areas and are a unified whole without any other bonding modes, thereby further improving the stability. The invention can automatically compensate the temperature dependence of the optical waveguide device, is a pure passive technical scheme and does not need an active temperature control circuit. Therefore, the power consumption of the device is greatly reduced, meanwhile, the application scene of the device is expanded, and the device is suitable for outdoor environments with inconvenient power supply.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic structural view before processing of a base plate.
Fig. 2 is a schematic structural diagram of a base plate of the temperature adaptive compensation device after relevant areas are dug out.
Fig. 3 is a schematic structural diagram of a temperature driver of the temperature adaptive compensation device.
Fig. 4 is a schematic structural diagram of a high-stability temperature adaptive compensation device according to the present invention.
Fig. 5 is a schematic structural diagram of an exemplary application of the high-stability temperature adaptive compensation device according to the present invention.
Figure 6 is a characteristic curve between wavelength and temperature for a PLC AWG chip.
Figure 7 is a graph of the measured wavelength versus temperature characteristics of a PLC AWG chip employing the present invention.
Wherein: 1, a bottom plate; 1-1, a moving part I; 1-2, a moving part II; 1-3, rotating the connecting shaft; 1-4, a lug I; 1-5, lug II; 2, a temperature driver; 4 and 5, the fixing point of the temperature driver and the bottom plate; d, a PLC optical waveguide chip; 6, cutting lines on the PLC optical waveguide chip; d1 and D2, the PLC optical waveguide chip is cut along the cutting line 6 to form two parts.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without inventive effort based on the embodiments of the present invention, are within the scope of the present invention.
As shown in FIG. 4, a high-stability temperature self-adaptive compensation device comprises a bottom plate 1 and a temperature driver 2, wherein the bottom plate 1 comprises a moving part I1-1, a moving part II 1-2 and a rotating connecting shaft 1-3, a gap is arranged between the moving part I1-1 and the moving part II 1-2, and the rotating connecting shaft 1-3 is arranged in the gap and connects the moving part I1-1 and the moving part II 1-2 together; the temperature driver 2 is arranged between the lug I1-4 and the lug II 1-5, and the expansion coefficient of the bottom plate 1 is different from that of the temperature driver 2. The temperature driver and the bottom plate are two relatively independent entities and are fixed on the bottom plate in a mechanical, welding or adhesive mode.
Specifically, the moving part I1-1, the moving part II 1-2 and the rotating connecting shaft 1-3 are integrated structures formed by hollowing the bottom plate 1, and no other bonding mode is needed, so that the integrated structures can further improve the high stability of the temperature self-adaptive compensation device.
In this embodiment, the number of the rotating connecting shafts 1-3 is at least three, and the rotating connecting shafts 1-3 are located on the same plane, and the moving part i 1-1 and the moving part ii 1-2 are mutually translated or rotated in the plane. Three or more than three rotating shafts limit two parts of relative movement to only translate or rotate in the plane of the bottom plate, but not move in the direction vertical to the plane of the bottom plate, so that the high stability of the temperature self-adaptive compensation device is realized.
And the mutual geometrical relationship of the rotating connecting shafts 1-3 is parallel, vertical or any other angle according to different designs. The geometrical relationship between the rotary connecting shaft 1-3 and the temperature driver 2 is parallel, vertical or any other angle.
The high-stability temperature adaptive compensation device proposed by the present invention is described below by taking 3 rotating shafts as an example.
FIG. 1 shows the base plate as a whole without machining, the base plate material having a coefficient of thermal expansion α1The relative area of the base plate is cut out in a designed configuration to form the geometry shown in fig. 2, in which the reference numerals 1-3 denote rotary joints connecting the two parts of the moving part I1-1 and the moving part II 1-2, the two parts of the moving part I1-1 and the moving part II 1-2 are able to move relative to each other about the 3 rotary joints under the action of force, and the temperature driver 2 is then fixed to the base plate at the fixing points 4, 5 by mechanical, welding or adhesive means, the temperature driver C having a coefficient of thermal expansion of α2α2≠α1The temperature driver has the function of automatically sensing temperature, and when the ambient temperature changes, the temperature driver 2 can extend or contract, so that the moving part I1-1 and the moving part II 1-2 of the bottom plate are driven to move relatively around the 3 rotating connecting shafts on the bottom plate. By utilizing the relative movement of the two components and reasonably designing according to a corresponding principle, the temperature dependence of the PLC optical waveguide device can be compensated. The bottom plate is provided with 3 rotary connecting shafts, so that the two parts of the moving part I1-1 and the moving part II 1-2 on the bottom plate are well limited to move or rotate relatively only in the plane of the bottom plate and cannot move in the direction vertical to the bottom plate; meanwhile, the part shown in fig. 2 is the whole body which is left by hollowing out the partial area of the bottom plate, and has good stability. Therefore, the whole temperature adaptive compensation device has high stability and high reliability.
FIG. 5 is an exemplary embodiment of the high stability temperature adaptive compensation device of the present invention, wherein D represents a PLC optical waveguide chip (e.g., AWG, MZI, VOA, OS, MCS, DQPSK demodulator, etc.) which is fixed to a corresponding position on a substrate by mechanical, adhesive, or soldering; and 6 is the position of a cutting line on the chip, and the PLC optical waveguide chip is cut along the cutting line and is divided into two parts D1 and D2, wherein the part D1 of the chip is fixed with the part II 1-2 of the moving part of the bottom plate, and the part D2 of the chip is fixed with the part I1-1 of the moving part of the bottom plate. Thus, after the temperature driver 2 senses the change of the environmental temperature, the two parts of the moving part i 1-1 and the moving part ii 1-2 on the bottom plate are driven to translate or rotate around the rotating shaft, so as to drive the two parts D1 and D2 of the chip to translate or rotate around the rotating shaft. The relative translation or rotation between the two parts D1, D2 of the chip automatically compensates for the temperature dependence of the chip itself, thereby making it temperature independent.
The automatic compensation principle of the adaptive temperature compensation device proposed by the present invention is specifically explained below by taking AWG as an example.
Central wavelength lambda of AWGcComprises the following steps:
wherein n iseffΔ L is the length difference between adjacent arrayed waveguides, and m is the diffraction order, for the effective index of the waveguide.
The derivation of equation 1 on both sides can yield the temperature sensitivity of the central wavelength of the AWG expressed as:
wherein the content of the first and second substances,
the linear expansion coefficient of the substrate is generally used because the thickness of the substrate is generally much larger than those of the clad layer and the core layer.
For a silica-on-silicon waveguide,
neff＝1.456，αsub＝3.0×10-6at λcSubstituting the corresponding value into formula 2 at 1550nm to obtain the temperature drift coefficient of the center wavelength
0.015 nm/DEG C, but actually, the actual temperature drift coefficient of the chip is caused by the variation of the manufacturing process
0.011 nm/DEG C.
Fig. 6 shows the characteristic curve between the wavelength and the temperature of the PLC AWG chip obtained by the actual test, the central wavelength of the AWG is 1559.39nm at-40 ℃, and the central wavelength of the AWG is 1560.791nm at 85 ℃, so that the drift amount of the central wavelength is 1401pm in the temperature range of-40 ℃ to 85 ℃, so that the temperature compensation technology is required in the actual commercial application.
According to the linear dispersion relation of the AWG, the relation between the displacement and the wavelength drift is obtained as follows:
wherein L isfAnd nsRespectively the focal length and refractive index of the slab waveguide, d is the distance between adjacent arrayed waveguides on the output slab waveguide, ngIs the group index of the arrayed waveguides.
Therefore, as shown in the application of fig. 5, if the input or output slab waveguide is cut along the cutting line 6 to form two parts D1 and D2, the two parts can be moved relatively with the temperature change by the temperature compensator 2, so that the wavelength shift caused by the temperature can be compensated, and the central wavelength of the AWG is obtained without changing with the ambient temperature.
Variation of the central wavelength with temperature at a variation of temperature Δ T
When the relative movement distance of the two cut parts is Deltax, the central wavelength of one output channel changes with the displacement
If let Δ λc＝Δλc 1If true, complete wavelength compensation can be achieved.
After the temperature adaptive compensation device provided by the invention is utilized, the actually measured characteristic curve between the wavelength and the temperature can be seen as shown in fig. 7: in the temperature range of-40 ℃ to 85 ℃, the central wavelength is in the range of 1560.013nm to 1560.065nm, the drift amount of the central wavelength is only 52pm, and the temperature dependence of the device is greatly reduced.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.
Claims (5)
1. The utility model provides a high stability temperature self-adaptation compensation arrangement which characterized in that: the temperature control device comprises a base plate (1) and temperature drivers (2), wherein the base plate (1) comprises a moving part I (1-1), a moving part II (1-2) and rotating connecting shafts (1-3), a gap is formed between the moving part I (1-1) and the moving part II (1-2), the rotating connecting shafts (1-3) are arranged in the gap and connect the moving part I (1-1) and the moving part II (1-2) together, and the number of the rotating connecting shafts (1-3) is at least three; the temperature driving device comprises a moving part I (1-1), a lug I (1-4), a lug II (1-5), a temperature driver (2) and a base plate, wherein the lug I (1-4) is arranged at the side end of the moving part I (1-1), the lug II (1-5) is arranged at the side end of the moving part II (1-2), the lug I (1-4) corresponds to the lug II (1-5), the temperature driver (2) is installed between the lug I (1-4) and the lug II (1-5), and the expansion coefficient of the base plate (1) is different.
2. The high stability temperature adaptive compensation device of claim 1, wherein: the moving part I (1-1), the moving part II (1-2) and the rotating connecting shaft (1-3) are of an integrated structure formed by hollowing the bottom plate (1).
3. The high-stability temperature adaptive compensation device according to claim 1 or 2, wherein: the rotary connecting shafts (1-3) are located on the same plane, and the moving part I (1-1) and the moving part II (1-2) are in mutual translation or rotation in the plane.
4. The high stability temperature adaptive compensation device of claim 3, wherein: the mutual geometric relationship of the rotating connecting shafts (1-3) is parallel, vertical or any other angle.
5. The high-stability temperature adaptive compensation device according to claim 1 or 4, wherein: the geometrical relationship between the rotary connecting shaft (1-3) and the temperature driver (2) is parallel, vertical or any other angle.
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