CN108570699A - A kind of pre-electroplating treatment medicament and treatment process - Google Patents
A kind of pre-electroplating treatment medicament and treatment process Download PDFInfo
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- CN108570699A CN108570699A CN201810468212.0A CN201810468212A CN108570699A CN 108570699 A CN108570699 A CN 108570699A CN 201810468212 A CN201810468212 A CN 201810468212A CN 108570699 A CN108570699 A CN 108570699A
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
- C23G1/02—Cleaning or pickling metallic material with solutions or molten salts with acid solutions
- C23G1/08—Iron or steel
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
- C23G1/02—Cleaning or pickling metallic material with solutions or molten salts with acid solutions
- C23G1/08—Iron or steel
- C23G1/088—Iron or steel solutions containing organic acids
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
- C23G1/02—Cleaning or pickling metallic material with solutions or molten salts with acid solutions
- C23G1/10—Other heavy metals
- C23G1/103—Other heavy metals copper or alloys of copper
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
- C23G1/14—Cleaning or pickling metallic material with solutions or molten salts with alkaline solutions
- C23G1/19—Iron or steel
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
- C23G1/14—Cleaning or pickling metallic material with solutions or molten salts with alkaline solutions
- C23G1/20—Other heavy metals
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
- C25D5/36—Pretreatment of metallic surfaces to be electroplated of iron or steel
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Electrochemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
Abstract
The present invention provides a kind of pre-electroplating treatment medicaments comprising the first inorganic agent and second processing agent；First inorganic agent and the second processing agent are used alone；Wherein described first inorganic agent includes ammonium fluoride, oxalic acid and hydrogen peroxide, and the weight part ratio of the ammonium fluoride, oxalic acid and hydrogen peroxide is 10~40：20~60：5~30；The second processing agent is the dilute hydrochloric acid that pH is 3~5.The present invention also provides a kind of electroplating pretreatment process.The treatment agent of the present invention includes the second processing medicament of the first treatment agent and removal ferric ion that remove oxide and organic pollution；Two kinds of medicaments can remove greasy dirt, oxide and organic pollution, the ferric ion of metallic substrate surface successively, it can effectively and thoroughly remove the oxide and other pollutants of metallic substrate surface, good basis is provided to the subsequent electroplating technology of metal base, ensures appearance yield and electroplated layer adhesive force.
Description
Technical field
The present invention relates to the treatment agents and processing work before field of metal surface treatment more particularly to a kind of metal plating
Skill.
Background technology
Metal base is almost in each sector of the national economy all in occupation of very important status, but metal base is especially
It is the extensive use that the poor corrosion resistance of iron-based material seriously restricts steel material, it is therefore necessary to which table appropriate is carried out to it
Surface treatment.It is surface-treated the corrosion resistance to improving metal base, expands application field, improving its properties has very
Important meaning.It is plating to the metal base especially most conventional processing method of iron-based material.
Plating is the process in other metal or alloy of metal surface plating last layer using electrolysis principle, is made using electrolysis
With make metallic article surface adhere to layer of metal film technique, to play anti-corrosion, anti-corrosion, electric conductivity, reflective and enhancement
Beautiful effect.
Since metal base is easy oxidation and corrosion, during storage, total surface will appear oxide and others
Some pollutants, while can also be stained with greasy dirt.Therefore, metal base needs to carry out pretreatment appropriate before plating.It is existing
The common hydrochloric acid of generally use, sulfuric acid or nitric acid pre-process metal base especially iron-based material in technology, but this
Sample processing metallic substrate surface still has partial oxide residual, and electroplated layer poor adhesive force when plating influences electroplating effect.
Invention content
In view of the above-mentioned problems, the object of the present invention is to provide a kind of pre-electroplating treatment medicament of high treating effect and accordingly
Technique.
Technical scheme is as follows：
A kind of pre-electroplating treatment medicament comprising the first inorganic agent and second processing agent；First inorganic agent and described
Second processing agent is used alone；The first inorganic agent first uses when use, is used after second processing agent, and the first inorganic agent and second
Without using cleanings such as other medicaments or water between inorganic agent；That is base material is directly entered the after being taken out from the first inorganic agent
The processing of two inorganic agents.
Wherein described first inorganic agent includes ammonium fluoride, oxalic acid and hydrogen peroxide, the ammonium fluoride, oxalic acid and hydrogen peroxide weight
It is 10~40 to measure portion rate：20~60：5~30；
The second processing agent is the dilute hydrochloric acid that pH is 3~5.
Hydrogen fluoride is precipitated in ammonium fluoride in first inorganic agent in acidic aqueous solution, and aqueous hydrogen fluoride solution is in highly acid, and
Hydrogen peroxide is strong oxidizer, and hydrogen peroxide and hydrogen fluoride collective effect can effectively remove rapidly the oxide of iron substrate surface.It is another
Aspect ammonium fluoride can also be used as polishing agent.Oxalic acid in first inorganic agent can not only play cushioning effect, to keep
The pH value of one inorganic agent aqueous solution is stablized relatively, and another aspect oxalic acid can also be used as organic solvent to remove iron substrate surface
Organic pollution.Each component in first inorganic agent acts synergistically to remove oxide and the organic contamination of substrate surface
Object, while also having polishing action to substrate surface.Second processing agent is dilute hydrochloric acid, is used after the first inorganic agent, a side
Face second processing agent can remove the ferric ion of thoroughly removal metallic substrate surface, and another aspect dilute hydrochloric acid can be further
Ensure the polishing effect of substrate surface, while avoiding the re-oxidation of substrate surface.The present invention is replaced at present using dilute hydrochloric acid
The strong acid such as common sulfuric acid, nitric acid, on the one hand ensure that the feature of environmental protection in processing procedure, on the other hand also avoid sulfuric acid etc. with
Substrate surface reacts.
It should be noted that a concentration of 1.13g/ml of the hydrogen peroxide in the present invention.
More preferably, the mass ratio of ammonium fluoride and oxalic acid is 1 in the present invention：1~1：3.It can ensure the first inorganic agent in this way
The acidity of aqueous solution.
Further, first inorganic agent is the aqueous solution of ammonium fluoride, oxalic acid and hydrogen peroxide, the hydrogen peroxide and water
Volume ratio is 5~30：1000.
Further, the second processing agent is the dilute hydrochloric acid that mass percent concentration is 7~15%.Inventor is by real
The oxide of substrate surface can be removed by issuing after examination and approval the second processing agent for the dilute hydrochloric acid that existing mass concentration is 7~15%, while again
It will not react with the surface of base material.
Preferably, the weight part ratio of ammonium fluoride, oxalic acid and hydrogen peroxide is 15~35 in first inorganic agent：30~
50：10~30.
Preferably, the pre-electroplating treatment medicament further includes third inorganic agent, it is 8~10 that the third inorganic agent, which is pH,
Alkaline solution.Third inorganic agent is used to remove the greasy dirt of substrate surface, to facilitate subsequent first inorganic agent and second processing
Agent is handled.
Further, the alkaline solution is the sodium hydroxide solution that mass concentration is 30~40g/L.
Correspondingly, the present invention also provides a kind of electroplating pretreatment process, above-mentioned pre-electroplating treatment medicament is used；It is described
Treatment process includes the following steps：
S100：Immersion treatment is carried out to pending base material using first inorganic agent；
S200：Secondary immersion treatment is carried out to step S100 treated base materials using the second processing agent；
S300：Base material after step S200 processing is started the cleaning processing.
Further, the soaking time of step S100 is at least 20S.The soaking time of step S100 is preferably 30~80S,
Inventor has found to should be guaranteed that enough processing times just can be abundant by metallic substrate surface processing, and then ensures follow-up plating
The good appearance of processing；But soaking time is unsuitable long.Through experiment, 30~80S is preferable range.
Meanwhile the soaking time of step S200 is at least 15S.Step S200 is to remove the trivalent of metallic substrate surface
Iron ion, inventor have found that the soaking time of step S200 is preferably 20~40S, and soaking time is unsuitable long.
Preferably, further including step S001 and S002 before step S100；
S001:Immersion treatment is carried out to the pending base material using third inorganic agent, soaking time is 10~50S；
S002：Base material after step S001 processing is started the cleaning processing.
Preferably, the pending base material is iron-based material or Copper base material.
The beneficial effects of the invention are as follows：The treatment agent of the present invention includes removing at the first of oxide and organic pollution
It manages medicament and removes the second processing medicament of ferric ion；Two kinds of medicaments can remove successively metallic substrate surface greasy dirt,
Oxide and organic pollution, ferric ion can effectively and thoroughly remove oxide and other dirts of metallic substrate surface
Object is contaminated, good basis is provided to the subsequent electroplating technology of metal base, ensures appearance yield and electroplated layer adhesive force.
Oxide and various organic contamination of the present invention using unique first treatment agent removal metallic substrate surface
Object, while the ferric ion of metal base especially iron substrate surface is thoroughly removed using dilute hydrochloric acid, it avoids using common
The strong acid such as sulfuric acid, nitric acid, the feature of environmental protection in ensure that processing procedure on the basis of ensureing treatment effect, avoid processing procedure
Strong acid pollution.
Description of the drawings
Fig. 1 is the comparison diagram before and after the processing on the Fe-based substrate surface of embodiment one.
Fig. 2 is that the EDAX on the Fe-based substrate surface of embodiment one takes point diagram.
Fig. 3 is the EDAX figures before the processing of 1 position of EDS points in Fig. 2.
Fig. 4 is that treated 1 position of EDS points in Fig. 2 EDAX figures.
Fig. 5 is the EDAX figures before the processing of 2 position of EDS points of Fig. 2.
Fig. 6 is treated 2 position of the EDS points EDAX figures of Fig. 2.
Fig. 7 is the EDAX figures before the processing of 3 position of EDS points of Fig. 2.
Fig. 8 is treated 3 position of the EDS points EDAX figures of Fig. 2.
Fig. 9 is the EDAX figures before the processing of 4 position of EDS points of Fig. 2.
Figure 10 is treated 4 position of the EDS points EDAX figures of Fig. 2.
Figure 11 is the EDAX figures before the processing of 5 position of EDS points of Fig. 2.
Figure 12 is treated 5 position of the EDS points EDAX figures of Fig. 2.
Specific implementation mode
In order to make the purpose , technical scheme and advantage of the present invention be clearer, below in conjunction with specific embodiment, to this
Invention is further elaborated.
It should be noted that in the absence of conflict, the features in the embodiments and the embodiments of the present application can phase
Mutually combination.
The raw material and equipment used in following embodiment is commercially available if not otherwise indicated.
Embodiment one
Pending base material in the present embodiment is iron-based material.
A kind of electroplating pretreatment process, the treatment process include the following steps：
S100：Immersion treatment is carried out to pending base material using first inorganic agent；The wherein tool of the first treatment agent
Body formula is to contain 10g ammonium fluorides, 60g oxalic acid and 5g hydrogen peroxide in every liter of water；Soaking time is 20S；
S200：Secondary immersion treatment is carried out to step S100 treated base materials using the second processing agent；At second
Reason agent is the dilute hydrochloric acid solution that mass concentration is 10%；Wherein second processing agent is configured using 30% dilute hydrochloric acid.Step
The soaking time of S200 is 20S.
S300：Base material after step S200 processing is started the cleaning processing.
Base material after the step S300 processing of the present embodiment can carry out electroplating processes.
Clip-on device may be used when immersion treatment base material is put into the first inorganic agent and second processing agent.
Embodiment two
Pending base material in the present embodiment is iron-based material.
A kind of electroplating pretreatment process, the treatment process include the following steps：
S001：Mass concentration is used to carry out immersion treatment to the pending base material for the sodium hydrate aqueous solution of 30g/L,
Soaking time is 10S；
S002：Base material after step S001 processing is started the cleaning processing molten to remove the sodium hydroxide of substrate surface
Liquid；
S100：Immersion treatment is carried out to the base material after step S002 processing using first inorganic agent；Wherein first
The specific formula for the treatment of agent is to contain 20g ammonium fluorides, 40g oxalic acid and 20.26g hydrogen peroxide in every liter of water；Soaking time is
30S；
S200：Secondary immersion treatment is carried out to step S100 treated base materials using the second processing agent；At second
Reason agent is the dilute hydrochloric acid solution that mass concentration is 7%；Wherein second processing agent is configured using 30% dilute hydrochloric acid.Step
The soaking time of S200 is 40S.
S300：Base material after step S200 processing is started the cleaning processing.
Fig. 1 is the comparison diagram before and after the processing of the base material of the present embodiment.Pass through the comparison diagram before and after Fig. 1 substrate surface treatments
As can be seen that the substrate surface smooth in appearance after processing.Fig. 2 is the schematic diagram for 5 test points chosen in substrate surface.
Fig. 3 and Fig. 4 is the EDAX comparison diagrams of ESD points 1 before and after the processing.Table 1 is the elemental analysis table of the EDS points 1 before processing,
Table 2 is the elemental analysis table of treated EDS points 1.
Table 1
Table 2
It can be seen that the EDS points of substrate surface before processing by the comparison of Fig. 3 and Fig. 4 and the comparison of Tables 1 and 2
1 contains oxygen element, and the substrate surface after handling does not contain oxygen element then.
Fig. 5 and Fig. 6 is the EDAX comparison diagrams of ESD points 2 before and after the processing.Table 3 is the elemental analysis table of the EDS points 2 before processing,
Table 4 is the elemental analysis table of treated EDS points 2.
Table 3
Table 4
Fig. 7 and Fig. 8 is the EDAX comparison diagrams of ESD points 3 before and after the processing.Table 5 is the elemental analysis table of the EDS points 3 before processing,
Table 6 is the elemental analysis table of treated EDS points 3.
Table 5
Table 6
Fig. 9 and Figure 10 is the EDAX comparison diagrams of ESD points 4 before and after the processing.Table 7 is the elemental analysis of the EDS points 4 before processing
Table, table 8 are the elemental analysis table of treated EDS points 4.
Table 7
Table 8
Figure 11 and Figure 12 is the EDAX comparison diagrams of ESD points 5 before and after the processing.Table 9 is the elemental analysis of the EDS points 5 before processing
Table, table 10 are the elemental analysis table of treated EDS points 5.
Table 9
Table 10
By the comparison of EDS points 2 to 5 again it can be seen that containing oxygen element at 3 to EDS point 5 of EDS points before processing；And
Oxygen element is not contained at treated 2 to EDS point 5 of EDS points.
Embodiment three
Pending base material in the present embodiment is iron-based material.
A kind of electroplating pretreatment process, the treatment process include the following steps：
S001：Mass concentration is used to carry out immersion treatment to the pending base material for the sodium hydrate aqueous solution of 40g/L,
Soaking time is 10S；
S002：Base material after step S001 processing is started the cleaning processing molten to remove the sodium hydroxide of substrate surface
Liquid；
S100：Immersion treatment is carried out to the base material after step S002 processing using first inorganic agent；Wherein first
The specific formula for the treatment of agent is to contain 40g ammonium fluorides, 20g oxalic acid and 30g hydrogen peroxide in every liter of water；Soaking time is 40S；
S200：Secondary immersion treatment is carried out to step S100 treated base materials using the second processing agent；At second
Reason agent is the dilute hydrochloric acid solution that mass concentration is 15%；Wherein second processing agent is configured using 30% dilute hydrochloric acid.Step
The soaking time of S200 is 50S.
S300：Base material after step S200 processing is started the cleaning processing.
Example IV
Pending base material in the present embodiment is red copper base material.
A kind of electroplating pretreatment process, the treatment process include the following steps：
S001：Mass concentration is used to carry out immersion treatment to the pending base material for the sodium hydrate aqueous solution of 35g/L,
Soaking time is 50S；
S002：Base material after step S001 processing is started the cleaning processing molten to remove the sodium hydroxide of substrate surface
Liquid；
S100：Immersion treatment is carried out to the base material after step S002 processing using first inorganic agent；Wherein first
The specific formula for the treatment of agent is to contain 35g ammonium fluorides, 50g oxalic acid and 15g hydrogen peroxide in every liter of water；Soaking time is 60S；
S200：Secondary immersion treatment is carried out to step S100 treated base materials using the second processing agent；At second
Reason agent is the dilute hydrochloric acid solution that mass concentration is 9%；Wherein second processing agent is configured using 30% dilute hydrochloric acid.Step
The soaking time of S200 is 60S.
S300：Base material after step S200 processing is started the cleaning processing.
Embodiment five
Pending base material in the present embodiment is brass substrate.
A kind of electroplating pretreatment process, the treatment process include the following steps：
S001：Mass concentration is used to carry out immersion treatment to the pending base material for the sodium hydrate aqueous solution of 30g/L,
Soaking time is 50S；
S002：Base material after step S001 processing is started the cleaning processing molten to remove the sodium hydroxide of substrate surface
Liquid；
S100：Immersion treatment is carried out to the base material after step S002 processing using first inorganic agent；Wherein first
The specific formula for the treatment of agent is to contain 15g ammonium fluorides, 30g oxalic acid and 10g hydrogen peroxide in every liter of water；Soaking time is 60S；
S200：Secondary immersion treatment is carried out to step S100 treated base materials using the second processing agent；At second
Reason agent is the dilute hydrochloric acid solution that mass concentration is 12%；Wherein second processing agent is configured using 30% dilute hydrochloric acid.Step
The soaking time of S200 is 15S.
S300：Base material after step S200 processing is started the cleaning processing.
By the iron-based material or Copper base material handled by the embodiment of the present invention one to five, electrotinning processing is carried out to it respectively.
First, the appearance of tin coating is observed, the tin plating layer surface of the iron-based material of embodiment one to embodiment five is without rough surface, dew
Phenomena such as iron, residue glue, sour spot, nigrescence, appearance is good.
Then, electrotinning processing is carried out and by plating piece after processing to plate to the metal base of embodiment one to five respectively
Part one, plating piece two, plating piece three, plating piece four and plating piece five indicate, and carry out adhesive force detection to plating piece one to plating piece five respectively, specifically
It is tested including following four.
One, bend test
Testing program：Five plating pieces are bent 90 degree respectively to restore to the original state again, bend 3 times repeatedly in same position, then
Using amplification sem observation tin coating whether peeling.
Test result：It is observed that after being bent at 3 times, the tin coating of plating piece one to plating piece five shows still without skin effect phenomenon
Adhesive force is good for tin coating.
Two, scribing line, cross cut test
Testing program：Knife is drawn with 30 ° of acute angle hard steel to draw at a distance of line parallel 2mm on the surface of five plating pieces respectively, is scratched
Tin coating reaches iron-based material, and plating piece must not be detached from parent metal between scribing line, or intersect and be divided into lmm lattices, and observation tin coating is
No peeling falls off.
Test result：It is observed that plating piece one, plating piece two, plating piece three and plating piece four tin coating do not have peeling obscission,
And the tin coating of plating piece five has a small amount of skin effect phenomenon, has no obscission.
Three, file test
Testing program：File files the surface for moving five plating pieces from matrix arris angle about at 45 °, and whether observation coating is uncovered
Or it falls off.
Test result：It is observed that plating piece one, plating piece two, plating piece three, plating piece four and plating piece five tin coating do not uncover or
Obscission.
Four, thermal shock test
Testing program：Five plating pieces are heated to 300 DEG C in heating furnace respectively, lh is kept the temperature, then puts and be quenched in water,
Whether the coating of observation plating piece blisters and peels off separation.
Test result：It is observed that plating piece one, plating piece two, plating piece three, plating piece four and plating piece five tin coating do not have blistering existing
As.
By above-mentioned test of many times, it can be found that inorganic agent using the present invention and kept for processing time appropriate, it can
The oxide and other pollutants for removing effectively and thoroughly iron substrate surface, provide the subsequent electroplating technology of iron-based material good
Basis ensures appearance yield and electroplated layer adhesive force.
Several embodiments of the invention above described embodiment only expresses, the description thereof is more specific and detailed, but simultaneously
Cannot the limitation to the scope of the claims of the present invention therefore be interpreted as.It should be pointed out that for those of ordinary skill in the art
For, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the guarantor of the present invention
Protect range.Therefore, the protection domain of patent of the present invention should be subject to claim.
Claims (10)
1. a kind of pre-electroplating treatment medicament, which is characterized in that including the first inorganic agent and second processing agent；First inorganic agent
It is used alone with the second processing agent；
Wherein described first inorganic agent includes ammonium fluoride, oxalic acid and hydrogen peroxide, the ammonium fluoride, oxalic acid and hydrogen peroxide parts by weight
Number is than being 10~40：20~60：5~30；
The second processing agent is the dilute hydrochloric acid that pH is 3~5.
2. pre-electroplating treatment medicament according to claim 1, which is characterized in that first inorganic agent is ammonium fluoride, grass
The volume ratio of the aqueous solution of acid and hydrogen peroxide, the hydrogen peroxide and water is 5~30：1000.
3. electrotinning pre-treatment medicament according to claim 1, which is characterized in that the second processing agent is mass concentration
For the dilute hydrochloric acid of 7-15%.
4. pre-electroplating treatment medicament according to claim 1, which is characterized in that ammonium fluoride, grass in first inorganic agent
The weight part ratio of acid and hydrogen peroxide is 15~35：30~50：10~30.
5. pre-electroplating treatment medicament according to claim 1, which is characterized in that the pre-electroplating treatment medicament further includes
Three inorganic agents, the third inorganic agent are the alkaline solution that pH is 8~10.
6. pre-electroplating treatment medicament according to claim 5, which is characterized in that the alkaline solution is that mass concentration is 30
The sodium hydroxide solution of~40g/L.
7. a kind of electroplating pretreatment process, which is characterized in that using the pre-electroplating treatment described in claim 1 to 6 any one
Medicament；The treatment process includes the following steps：
S100：Immersion treatment is carried out to pending base material using first inorganic agent；
S200：Secondary immersion treatment is carried out to step S100 treated base materials using the second processing agent；
S300：Base material after step S200 processing is started the cleaning processing.
8. treatment process according to claim 7, which is characterized in that the soaking time of step S100 is at least 20S；With/
Or the soaking time of step S200 is at least 15S.
9. treatment process according to claim 7, which is characterized in that before step S100 further include step S001 and
S002；
S001:Immersion treatment is carried out to the pending base material using third inorganic agent, soaking time is 10~50S；
S002：Base material after step S001 processing is started the cleaning processing.
10. treatment process according to claim 7, which is characterized in that the pending base material is iron-based material or Copper base material.
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3537926A (en) * | 1967-06-19 | 1970-11-03 | Lancy Lab | Chemical brightening of iron-containing surfaces of workpieces |
| US4502925A (en) * | 1984-06-11 | 1985-03-05 | American Hoechst Corporation | Process for aluminum surface preparation |
| US4652340A (en) * | 1985-03-04 | 1987-03-24 | Solvay & Cie (Societe Anonyme) | Baths and process for the chemical polishing of steel surfaces |
| CN101831653A (en) * | 2010-06-23 | 2010-09-15 | 天津市电力公司 | Martensite high-alloy heat resistant steel metallography detection polishing agent and application thereof |
| CN107475715A (en) * | 2016-06-08 | 2017-12-15 | 易案爱富科技有限公司 | Hydrogen peroxide stabilizer and the etch combination for including it |
-
2018
- 2018-05-16 CN CN201810468212.0A patent/CN108570699A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3537926A (en) * | 1967-06-19 | 1970-11-03 | Lancy Lab | Chemical brightening of iron-containing surfaces of workpieces |
| US4502925A (en) * | 1984-06-11 | 1985-03-05 | American Hoechst Corporation | Process for aluminum surface preparation |
| US4652340A (en) * | 1985-03-04 | 1987-03-24 | Solvay & Cie (Societe Anonyme) | Baths and process for the chemical polishing of steel surfaces |
| CN101831653A (en) * | 2010-06-23 | 2010-09-15 | 天津市电力公司 | Martensite high-alloy heat resistant steel metallography detection polishing agent and application thereof |
| CN107475715A (en) * | 2016-06-08 | 2017-12-15 | 易案爱富科技有限公司 | Hydrogen peroxide stabilizer and the etch combination for including it |
Non-Patent Citations (1)
| Title |
|---|
| 张允诚: "《电镀手册》", 31 December 2011 * |
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Application publication date: 20180925 |