CN108559425A - A kind of solventless adhesive of anti-FDM print devices warpage, print platform and preparation method thereof - Google Patents
A kind of solventless adhesive of anti-FDM print devices warpage, print platform and preparation method thereof Download PDFInfo
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- CN108559425A CN108559425A CN201810448846.XA CN201810448846A CN108559425A CN 108559425 A CN108559425 A CN 108559425A CN 201810448846 A CN201810448846 A CN 201810448846A CN 108559425 A CN108559425 A CN 108559425A
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/12—Esters of monohydric alcohols or phenols
- C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
- C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/14—Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur or oxygen atoms in addition to the carboxy oxygen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/12—Esters of monohydric alcohols or phenols
- C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
- C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
- C08F220/1818—C13or longer chain (meth)acrylate, e.g. stearyl (meth)acrylate
Abstract
The invention belongs to fusion sediment printing technique field, a kind of solventless adhesive of anti-FDM print devices warpage, print platform and preparation method thereof are disclosed.The adhesive includes following components：Ethylene glycol diglycidylether, Isooctyl acrylate monomer, 1,2 epoxy, 4 vinyl cyclohexane, octadecyl acrylate, acrylic acid, hydroxy-ethyl acrylate, Process Conditions of Cetane Acrylate, lauryl acrylate, glycidyl methacrylate, radical initiator and acrylate cross linked dose.The print platform of the present invention includes adhesive and substrate；Adhesive is coated on substrate.Initial bonding strength and peel strength of the adhesive of the present invention when temperature is less than 40 DEG C are extremely low, and print device is easy to remove from platform, there is preferable cementability, print device to be bonded closely with platform, device is without warpage under high temperature.
Description
Technical field
The invention belongs to the field fusion sediment printing technique (FDM), it is related to a kind of the solvent-free of anti-FDM print devices warpage
Type adhesive, print platform and preparation method thereof.
Background technology
Fusion sediment printing technique is one of the technology that current 3D printing field is most widely used, and is with thermoplasticity silk material
Raw material, silk material form the melt with certain fluidity by printer heating melting, and melt flows out the solidification of nozzle postcooling, by
Stacking plus printing shaping.But thermoplasticity silk material is melted by heating, larger thermal contraction can occur during cooled and solidified, is caused
Warpage occurs for FDM print devices.Generally by heating print platform, reducing fuse temperature and platform temperature difference reduces 3D printing part
Warpage occurs.However, since thermoplasticity silk material melt is laid on print platform, silk material can occur more firm with platform after cooling
Solid bonding, be difficult to remove from platform after causing device to print.
In order to safely and conveniently remove print device from print platform, print platform is bonded using masking tape at present,
Masking tape surface directprinter part coats one layer of polytetrafluorethylecoatings coatings on platform.However, in print platform table
Face coats one layer of masking tape, and masking tape specific surface area is bigger, and the adhesive strength of device and masking tape is also bigger, cold
But it is not easy to remove print device afterwards.It pulls pickup according to larger and can then masking tape be caused to rupture, some adhesive tapes can also attach
It is difficult to remove on device base surface.One layer of polytetrafluorethylecoatings coatings are coated on print platform surface, when silk material contraction is larger,
Device is Nian Jie with platform securely in print procedure difficulty, the risk of generating device warpage.
The adhesion strength of the adhesive reported at present under the high temperature conditions is generally relatively low, as adhesive occurs after cooling
It shrinks, excludes the free volume between interface, increase the contact area of adhesive and base material, energy strong bond to body surface.
Application No. is 201410719676.6 patent application disclose it is a kind of using by Isooctyl acrylate monomer, vinylacetate, third
The groups such as olefin(e) acid, hydroxy-ethyl acrylate, methyl methacrylate, N hydroxymethyl acrylamide, azodiisobutyronitrile and ethyl acetate
The Acrylic Pressure Sensitive Adhesive point being polymerized, when 130 DEG C of the pressure-sensitive tape, could fully foam realization and substrate bonding,
And in order to reduce the thermal deformation of 3D printing device, when the conventional strands such as general 3D printing polylactic acid, ABS, HIPS and PETG, platform
Temperature be no more than 120 DEG C, it is seen that this pressure sensitive adhesive tape is not suitable for the 3D printing of such conventional strand.Chinese patent
201410037153.3 disclose it is a kind of using butyl acrylate, Isooctyl acrylate monomer, chlorobutadiene, methyl methacrylate,
Solvent pressure-sensitive adhesive prepared by the components such as acrylic acid, hydroxy ethyl methacrylate and glycidyl ether, the pressure sensitive adhesive is in room
Two kinds of pressure sensitive adhesive products of warm environment, which are put together, not to stick together, i.e., adhesion strength is relatively low in room temperature environment, but high temperature is lived
Adhesion strength is also relatively low after change, and it is Nian Jie with print platform to meet 3D printing device, and solvent type adhesive is beaten making
It is difficult to coat higher thickness during print platform.Therefore, high temperature bonding is strong when such adhesive cannot meet FDM printings
The application requirement that can be easily removed after degree height, cooling.
Invention content
Based on the defect of above-mentioned technology, the purpose of the present invention is to provide a kind of the solvent-free of anti-FDM print devices warpage
Type adhesive and preparation method thereof.3D printing device and print platform can be effectively bonded by the adhesive of the present invention at high temperature
Together, it prevents FDM print devices from warpage occurs because being heat-shrinked during Slow cooling, reduces the quality of printing, and
It can easily be removed during being detached with platform after device cooling, avoid agitating using objects such as sharp metals and cause device damage
Or print platform damage.
The present invention also provides a kind of print platforms of anti-FDM print devices warpage.The present invention coats above-mentioned adhesive
On the surface of gradient heat-shrinkage material, then gradient heat-shrinkage material is fixed on the substrate of platform, is beaten to obtain anti-FDM
Print the print platform of device warpage.Because of platform and device two when the present invention effectively reduces device cooling using gradient heat-shrinkage material
The inconsistent defect for leading to device contraction distortion of person's coefficient of thermal expansion.This method make print platform also have it is easy to disassemble and
Advantage at low cost.
The purpose of the present invention is achieved through the following technical solutions：
A kind of solventless adhesive of anti-FDM print devices warpage, including the following component counted in parts by weight：
The radical initiator is that cyclohexanone peroxide, dibenzoyl peroxide, tert-butyl hydroperoxide, azo two are different
One or more of butyronitrile and azobisisoheptonitrile, it is preferable that more than one in cyclohexanone peroxide or dibenzoyl peroxide.
Described acrylate cross linked dose is hydrogenated-tallow group primary amine, erucyl amide, caprolactam, polyetheramine D-2000, reed
One or more of bamboo alkali, stearic amide and zinc stearate.Add acrylate cross linked dose of the present invention can improve gluing
The crosslinking degree and cohesive force of agent improve the adhesion strength of adhesive under the high temperature conditions.
The preparation method of the solventless adhesive of the anti-FDM print devices warpage, includes the following steps：
(1) under protective gas atmosphere, by Isooctyl acrylate monomer, acrylic acid, 1,2- epoxy -4- vinyl cyclohexanes,
Octadecyl acrylate, Process Conditions of Cetane Acrylate and lauryl acrylate are uniformly mixed, and obtain mixture；Step mixes described in (1)
Refer to uniformly uniform in 40~70 DEG C of stirring at low speed；The rotating speed of the stirring at low speed is 20~100rpm；
(2) under stirring conditions, the mixed solution being made by free initiator and ethylene glycol diglycidylether is dripped
It is added in above-mentioned mixture, during dropwise addition, the temperature of system is no more than 80 DEG C；85~88 are warming up to after dripping
DEG C, the reaction was continued, obtains product A；The rotating speed stirred described in step (2) is 200~300 revs/min；The speed of the dropwise addition
For 0.1~0.25 Unit Weight/min；The time that the reaction was continued is 60~120min；The Unit Weight refers to each component
Unit of weight；
(3) mixture of hydroxy-ethyl acrylate and glycidyl methacrylate is added dropwise in above-mentioned product A, is dripped
240~300min is kept the temperature in 85~88 DEG C after adding, acrylate cross linked dose is then added portionwise, continues to stir, obtain without molten
Dosage form adhesive；The speed being added dropwise described in step (3) is 0.05~0.19 Unit Weight/min.
The number being added portionwise in step (3) is 3~5 times, and the time for continuing stirring is 30~60min, works as system
Stop stirring when middle no particle.The crosslinking agent need to be added dropwise in 30min.
Step continues in (3) after having stirred, and is cooled to the nothing that 40 DEG C of filtering and dischargings can be obtained anti-FDM print devices warpage
Solvent type adhesive.
The anti-FDM print devices warpage solventless adhesive of the present invention is contracted using Isooctyl acrylate monomer, methacrylic acid
The groups such as water glyceride, 1,2- epoxy -4- vinyl cyclohexanes, octadecyl acrylate, Process Conditions of Cetane Acrylate and lauryl acrylate
It is allocated as comonomer, after each monomer polymerization, adhesive is improved in room by the crystallinity of long soft segment at ambient temperature
Stripping performance under the conditions of temperature, and in a heated condition, these component energy crystal meltings regain higher adhesive strength,
Realization print device is firm bonding with platform.
The present invention dissolves radical initiator (such as using ethylene glycol diglycidylether：Benzoyl peroxide), it overcomes
The initiator that conventional method dissolves radical initiator using comonomers such as hydroxy-ethyl acrylates and introduces is not added drop-wise to reaction
Defect in kettle with regard to polymerizeing.Meanwhile the present invention reacting ethylene glycol diglycidylether by acrylic acid and epoxy group
It is grafted onto in adhesive molecular structure and increases the crystallization effect of adhesive at room temperature, improve adhesive under room temperature
Removability.
The printing that the anti-FDM print devices warpage solventless adhesive is used to prepare anti-FDM print devices warpage is flat
Platform.
The print platform includes adhesive and substrate；The adhesive is coated on substrate under heating conditions；Institute
It is anti-FDM print devices warpage solventless adhesive to state adhesive.The temperature of heating is 30~90 DEG C；The substrate is glass
Glass, stainless steel or plastic plate, preferably plastic plate；The plastic plate is makrolon (PC), polyethylene terephthalate
(PET), polyethylene (PE), poly- (butadiene-styrene-acrylonitrile) (ABS), polyethylene terephthalate -1,4- hexamethylenes
Alkane diformazan alcohol ester (PETG) or polystyrene (PS).In order to matching the thermal contraction ratio of printout, needing in adhesive and putting down
Thermal Contraction Coefficient functionally gradient material (FGM) is set between platform causes device to become to prevent thermal-shrinkage differential larger between device and platform
The defect of shape.Thermal Contraction Coefficient functionally gradient material (FGM) is plastic plate.
The substrate be arranged in support device or conventional print platform on, substrate can be flat from support device and printing
It is dismantled on platform.
When substrate is arranged on platform, print platform of the invention at this time includes platform, the substrate that is arranged on platform
And coated in the adhesive on substrate.
The method of the anti-FDM print devices warpage, includes the following steps：
(a) adhesive of heating is coated on already fixed substrate, obtains print platform；
(b) print platform is heated, print device falls into print platform, and print device is bonded with print platform；With
After be down to room temperature, remove print device.
The temperature heated in step (a) is 30~90 DEG C；
The temperature heated in step (b) is 50~110 DEG C.
The anti-FDM print devices warpage print platform of the present invention according to print device volume size and needs to be used time
Number selects the thickness of solvent-free adhesive, it is preferable that the thickness of solventless adhesive is 0.08~0.3 millimeter.
In the preparation of the print platform of the present invention, after coating adhesive on plastic plate, release paper rubber cover need to be used
Another surface of glutinous agent prevents adhesive contaminated；Then by the plastic plate for being coated with adhesive be fixed on armorplate glass or
On stainless-steel sheet, FDM print platforms are made.In use, stripping release paper, heating platform, print device, device fall into printing
Platform.
Compared with prior art, effect of the invention is：
Initial bonding strength and stripping of the anti-FDM print devices warpage solventless adhesive of the present invention when temperature is less than 40 DEG C
Intensity is extremely low, it is ensured that FDM print devices can be taken off from platform easily, have preferable cementability at 50~110 DEG C, beat
FDM can be melted to the thermoplasticity printed material that prints being pasted onto on print platform tightly during print.Adhesive with
One layer of sheet plastic is added between print platform, is heat-shrinked uneven when can reduce printout cooling and generates lacking for device deformation
It falls into, further increases FDM print qualities.
Description of the drawings
Fig. 1 is the schematic diagram of the print platform (when not printing) of embodiment 1；1- glass plates or steel plate, 2- plastic plates, 3- glue
Glutinous agent, 4- release papers.
Specific implementation mode
With reference to specific embodiments and the drawings, the invention will be further described, but embodiments of the present invention are unlimited
In this.
Embodiment 1
A kind of solventless adhesive of anti-FDM printings polylactic acid device warpage, including the following group counted in parts by weight
Point：
The preparation method of the solventless adhesive of the anti-FDM printings polylactic acid device warpage, includes the following steps：
(1) under nitrogen atmosphere, by Isooctyl acrylate monomer, acrylic acid, 1,2- epoxy -4- vinyl cyclohexanes, acrylic acid
Octadecyl ester, Process Conditions of Cetane Acrylate and 70 DEG C of stirring at low speed of lauryl acrylate are uniform, obtain mixture；The stirring at low speed turns
Speed is 60rpm；
(2) mixed by being made by benzoyl peroxide and ethylene glycol diglycidylether under conditions of 200rpm is stirred
It closes solution to be added dropwise in above-mentioned mixture, during dropwise addition, the temperature of system is no more than 80 DEG C；It is warming up to after dripping
85 DEG C, the reaction was continued 120min, obtain product A；The mixing that the speed of the dropwise addition drips 18.3 parts by weight for 90min is molten
Liquid；
(3) mixture of hydroxy-ethyl acrylate and glycidyl methacrylate is added dropwise in above-mentioned product A, is dripped
240min is kept the temperature in 85~88 DEG C after adding, acrylate cross linked dose is then added portionwise and (divided erucyl amide every 10 minutes
Be added three times), continue to stir 10min, be cooled to 40 DEG C of filtering and dischargings, obtain anti-FDM printing polylactic acid device warpage without molten
Dosage form adhesive；The speed of the dropwise addition is that the mixture 60min of 11 parts by weight is dripped.
The solventless adhesive of the present embodiment is coated on cooling 30 minutes on PC plastic plate, is combined with armorplate glass
It is placed on printing pedestal and forms print platform, print platform is heated to 50 DEG C by 0.08 millimeter of dry glue thickness, and FDM printings are poly-
Lactic acid device (thickness is 1 centimetre, the thin plate that scale is 150*150 millimeters), device is bonded with adhesive, cooling, removes device.
Thickness is 1 centimetre, and scale is that warpage does not occur for 150*150 millimeters of thin plate.Using ASTM D1876-08 standard testing results：
Peel strength is only 0.1N/2.5cm on polylactic acid interface under room temperature, and the peel strength at 50 DEG C on polylactic acid interface is
10.5N/2.5cm。
The schematic diagram of the print platform of the present embodiment is as shown in Figure 1；1- glass plates or steel plate, 2- plastic plates, 3- adhesives,
4- release papers.After coating adhesive on plastic plate, another surface of release paper covering adhesive need to be used, adhesive is prevented
It is contaminated；Then the plastic plate for being coated with adhesive is fixed on armorplate glass or stainless-steel sheet, it is flat that FDM printings is made
Platform.In use, stripping release paper, heating platform, print device, device fall into print platform.
Embodiment 2
A kind of solventless adhesive of anti-FDM printings ABS device warpages, including the following component counted in parts by weight：
The preparation method of the solventless adhesive of the anti-FDM printings ABS device warpages, includes the following steps：
(1) under nitrogen atmosphere, by Isooctyl acrylate monomer, acrylic acid, 1,2- epoxy -4- vinyl cyclohexanes, acrylic acid
Octadecyl ester, Process Conditions of Cetane Acrylate and 70 DEG C of stirring at low speed of lauryl acrylate are uniform, obtain mixture；The stirring at low speed turns
Speed is 60rpm；
(2) mixed by being made by cyclohexanone peroxide and ethylene glycol diglycidylether under conditions of 200rpm is stirred
It closes solution to be added dropwise in above-mentioned mixture, during dropwise addition, the temperature of system is no more than 80 DEG C；It is warming up to after dripping
85 DEG C, the reaction was continued 120min, obtain product A；The mixing that the speed of the dropwise addition drips 12.4 parts by weight for 90min is molten
Liquid；
(3) mixture of hydroxy-ethyl acrylate and glycidyl methacrylate is added dropwise in above-mentioned product A, is dripped
240min are kept the temperature in 85~88 DEG C after adding, are then added portionwise acrylate cross linked dose (every 10 minutes by stearic amide
It is added in three times), continue to stir 10min, be cooled to 40 DEG C of filtering and dischargings, obtains the solvent-free of anti-FDM printings ABS device warpages
Type adhesive；The speed of the dropwise addition is that the mixture 60min of 9 parts by weight is dripped.
The solventless adhesive of the present embodiment is coated on cooling 30 minutes on PET plastic plate, with tempered glass board group
Conjunction, which is placed on printing pedestal, forms print platform, 0.08 millimeter of dry glue thickness, print platform is heated to 80 DEG C, FDM printings
ABS devices (thickness is 1 centimetre, the thin plate that scale is 150*150 millimeters), device is bonded with adhesive, cooling, removes device.
Thickness is 1 centimetre, and scale is that warpage does not occur for 150*150 millimeters of thin plate.Using ASTM D1876-08 standard testing results：
Peel strength is only 0.8N/2.5cm on the interfaces ABS under room temperature, and the peel strength at 50 DEG C on the interfaces ABS is 14.5N/
2.5cm。
Embodiment 3
A kind of solventless adhesive of anti-FDM printings PETG device warpages, including the following component counted in parts by weight：
The preparation method of the solventless adhesive of the anti-FDM printings PETG device warpages, includes the following steps：
(1) under nitrogen atmosphere, by Isooctyl acrylate monomer, acrylic acid, 1,2- epoxy -4- vinyl cyclohexanes, acrylic acid
Octadecyl ester, Process Conditions of Cetane Acrylate and 70 DEG C of stirring at low speed of lauryl acrylate are uniform, obtain mixture；The stirring at low speed turns
Speed is 60rpm；
(2) under conditions of 200rpm is stirred, by what is be made by dibenzoyl peroxide and ethylene glycol diglycidylether
Mixed solution is added dropwise in above-mentioned mixture, and during dropwise addition, the temperature of system is no more than 80 DEG C；It heats up after dripping
To 85 DEG C, the reaction was continued 120min obtains product A；The mixing that the speed of the dropwise addition drips 12.6 parts by weight for 90min is molten
Liquid；
(3) mixture of hydroxy-ethyl acrylate and glycidyl methacrylate is added dropwise in above-mentioned product A, is dripped
240min are kept the temperature in 88 DEG C after adding, are then added portionwise acrylate cross linked dose (every 10 minutes by hydrogenated-tallow group primary amine
Be added in three times), continue to stir 10min, be cooled to 40 DEG C of filtering and dischargings, obtain anti-FDM printing PETG device warpages without molten
Dosage form adhesive；The speed of the dropwise addition is that the mixture 60min of 11 parts by weight is dripped.
The solventless adhesive of the present embodiment is coated on cooling 30 minutes on PS plastic plate, is combined with armorplate glass
It is placed on printing pedestal and forms print platform, print platform is heated to 100 DEG C, FDM printings by 0.08 millimeter of dry glue thickness
PETG devices (thickness is 1 centimetre, the thin plate that scale is 150*150 millimeters), device is bonded with adhesive, cooling, removes device.
Thickness is 1 centimetre, and scale is that warpage does not occur for 150*150 millimeters of thin plate.Using ASTM D1876-08 standard testing results：
Peel strength is only 1.0N/2.5cm on the faces PETG under room temperature, and the peel strength at 50 DEG C on the interfaces PETG is 9.5N/
2.5cm。
Embodiment 4
A kind of solventless adhesive of anti-FDM printing high density polyethylene (HDPE) device warpage, including it is following in parts by weight
The component of meter：
The preparation method of the solventless adhesive of the anti-FDM printings PE device warpages, includes the following steps：
(1) under nitrogen atmosphere, by Isooctyl acrylate monomer, acrylic acid, 1,2- epoxy -4- vinyl cyclohexanes, acrylic acid
Octadecyl ester, Process Conditions of Cetane Acrylate and 70 DEG C of stirring at low speed of lauryl acrylate are uniform, obtain mixture；The stirring at low speed turns
Speed is 60rpm；
(2) mixed by being made by azodiisobutyronitrile and ethylene glycol diglycidylether under conditions of 200rpm is stirred
It closes solution to be added dropwise in above-mentioned mixture, during dropwise addition, the temperature of system is no more than 80 DEG C；It is warming up to after dripping
85 DEG C, the reaction was continued 120min, obtain product A；The mixing that the speed of the dropwise addition drips 15.6 parts by weight for 90min is molten
Liquid；
(3) mixture of hydroxy-ethyl acrylate and glycidyl methacrylate is added dropwise in above-mentioned product A, is dripped
240min is kept the temperature in 85~88 DEG C after adding, acrylate cross linked dose is then added portionwise and (divided zinc stearate every 10 minutes
It is added three times), continue to stir 10min, be cooled to 40 DEG C of filtering and dischargings, obtains the no-solvent type of anti-FDM printings PE device warpages
Adhesive；The speed of the dropwise addition is that the mixture 60min of 3 parts by weight is dripped.
The solventless adhesive of the present embodiment is coated on cooling 30 minutes on PE plastic plates, is combined with armorplate glass
It is placed on printing pedestal and forms print platform, print platform is heated to 50 DEG C by 0.08 millimeter of dry glue thickness, and FDM prints PE
Device (thickness is 1 centimetre, the thin plate that scale is 150*150 millimeters), device is bonded with adhesive, cooling, removes device.Thickness
It it is 1 centimetre, scale is that warpage does not occur for 150*150 millimeters of thin plate.Using ASTM D1876-08 standard testing results：Room temperature
Under on high density polyethylene (HDPE) interface peel strength be only 0.4N/2.5cm, the stripping at 50 DEG C on high density polyethylene (HDPE) interface
It is 12.0N/2.5cm from intensity.
Claims (10)
1. a kind of solventless adhesive of anti-FDM print devices warpage, it is characterised in that：It is in parts by weight counted including following
Component：
2. the solventless adhesive of anti-FDM print devices warpage according to claim 1, it is characterised in that：The freedom
Base initiator is cyclohexanone peroxide, dibenzoyl peroxide, two different heptan of tert-butyl hydroperoxide, azodiisobutyronitrile and azo
One or more of nitrile；
Described acrylate cross linked dose for hydrogenated-tallow group primary amine, erucyl amide, caprolactam, polyetheramine D-2000, donaxine,
One or more of stearic amide and zinc stearate.
3. according to the preparation method of the solventless adhesive of any one of the claim 1~2 anti-FDM print devices warpage,
It is characterized in that：Include the following steps：
(1) under protective gas atmosphere, by Isooctyl acrylate monomer, acrylic acid, 1,2- epoxy -4- vinyl cyclohexanes, propylene
Sour octadecyl ester, Process Conditions of Cetane Acrylate and lauryl acrylate are uniformly mixed, and obtain mixture；
(2) under stirring conditions, it will be added dropwise to by free initiator and the mixed solution that ethylene glycol diglycidylether is made into
In above-mentioned mixture, during dropwise addition, the temperature of system is no more than 80 DEG C；85~88 DEG C are warming up to after dripping, after
Continuous reaction, obtains product A；
(3) mixture of hydroxy-ethyl acrylate and glycidyl methacrylate is added dropwise in above-mentioned product A, is dripped
240~300min is kept the temperature in 85~88 DEG C afterwards, acrylate cross linked dose is then added portionwise, continues to stir, obtain no-solvent type
Adhesive.
4. the preparation method of the solventless adhesive of anti-FDM print devices warpage, feature exist according to claim 3
In：It refers to uniform in 40~70 DEG C of stirring at low speed to be uniformly mixed described in step (1)；
The rotating speed stirred described in step (2) is 200~300 revs/min；The time that the reaction was continued is 60~120min；
The number being added portionwise in step (3) is 3~5 times, and the time for continuing stirring is 30~60min.
5. special according to the application of the solventless adhesive of any one of the claim 1~2 anti-FDM print devices warpage
Sign is：The printing that the anti-FDM print devices warpage solventless adhesive is used to prepare anti-FDM print devices warpage is flat
Platform.
6. application according to claim 5, it is characterised in that：The print platform includes adhesive and substrate；The glue
Glutinous agent is coated on substrate under heating conditions；The adhesive is anti-FDM print devices warpage solventless adhesive.
7. application according to claim 6, it is characterised in that：The substrate is glass, stainless steel or plastic plate；The base
Plate be arranged in support device or conventional print platform on, substrate can be dismantled from support device and print platform.
8. application according to claim 7, it is characterised in that：The plastic plate is makrolon, poly terephthalic acid second
Diol ester, polyethylene, poly- (butadiene-styrene-acrylonitrile), polyethylene terephthalate -1,4 cyclohexane dimethanol
Ester or polystyrene.
9. a kind of method of anti-FDM print devices warpage, it is characterised in that：Include the following steps：(a) in already fixed base
The adhesive of heating is coated on plate, obtains print platform；(b) print platform being heated, print device falls into print platform,
Print device is bonded with print platform；It is subsequently reduced to room temperature, removes print device；The print platform such as claim 5~8 times
One is defined.
10. the method for anti-FDM print devices warpage according to claim 9, it is characterised in that：The temperature heated in step (a)
Degree is 30~90 DEG C, and the temperature heated in step (b) is 50~110 DEG C.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810448846.XA CN108559425B (en) | 2018-05-11 | 2018-05-11 | Solvent-free adhesive for preventing warping of FDM printing device, printing platform and manufacturing method of solvent-free adhesive |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810448846.XA CN108559425B (en) | 2018-05-11 | 2018-05-11 | Solvent-free adhesive for preventing warping of FDM printing device, printing platform and manufacturing method of solvent-free adhesive |
Publications (2)
| Publication Number | Publication Date |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109628023A (en) * | 2018-11-13 | 2019-04-16 | 桐乡市星邦科技发展有限公司 | A kind of acryloid cement gold stamping for casement and preparation method thereof |
| CN111331132A (en) * | 2020-03-17 | 2020-06-26 | 苏州复浩三维科技有限公司 | 3D printing method |
| CN115368851A (en) * | 2021-12-17 | 2022-11-22 | 湖州绿田新材料有限公司 | Acrylate adhesive and application thereof |
| CN115368852A (en) * | 2021-12-17 | 2022-11-22 | 湖州绿田新材料有限公司 | Ultra-high temperature resistant protective film adhesive and preparation method thereof |
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| CN109628023A (en) * | 2018-11-13 | 2019-04-16 | 桐乡市星邦科技发展有限公司 | A kind of acryloid cement gold stamping for casement and preparation method thereof |
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| CN115368851A (en) * | 2021-12-17 | 2022-11-22 | 湖州绿田新材料有限公司 | Acrylate adhesive and application thereof |
| CN115368852A (en) * | 2021-12-17 | 2022-11-22 | 湖州绿田新材料有限公司 | Ultra-high temperature resistant protective film adhesive and preparation method thereof |
| CN115368851B (en) * | 2021-12-17 | 2024-03-22 | 湖州绿田新材料有限公司 | Acrylic adhesive and application thereof |
| CN115368852B (en) * | 2021-12-17 | 2024-03-26 | 湖州绿田新材料有限公司 | Ultra-high temperature resistant protective film adhesive and preparation method thereof |
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| CN108559425B (en) | 2020-01-17 |
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