CN108551752B

CN108551752B - Electronic device and circuit board assembly

Info

Publication number: CN108551752B
Application number: CN201810597756.7A
Authority: CN
Inventors: 田汉卿
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2018-06-11
Filing date: 2018-06-11
Publication date: 2020-01-24
Anticipated expiration: 2038-06-11
Also published as: CN108551752A

Abstract

The application provides an electronic device and a circuit board assembly. The electronic device comprises a circuit board, a heat source chip, a shielding cover, a heat pipe and a heat dissipation frame, wherein the circuit board is provided with a buckle, the heat source chip is welded on the circuit board and electrically connected with the circuit board, the shielding cover is covered on the heat source chip, the heat pipe is clamped in the buckle and assembled on the circuit board, the heat pipe is used for absorbing the heat of the heat source chip, and the heat dissipation frame is connected with the heat pipe to absorb the heat of the heat pipe. The heat dissipation efficiency of the heat source chip is remarkably improved.

Description

Electronic device and circuit board assembly

Technical Field

The present disclosure relates to heat dissipation technologies, and particularly to an electronic device and a circuit board assembly.

Background

With the popularization of smart phones, users can obviously feel the heat of the smart phones in the long-time use process of the smart phones, and through detection, the heat of mobile phone CPUs is the main reason when the smart phones work. The mobile phone CPU is a highly integrated SOC chip, not only a CPU central chip and a GPU graphic processing chip are integrated in the mobile phone CPU, but also a series of key chip modules such as Bluetooth, GPS, radio frequency and the like are used as chips with the highest integration level in the smart phone chip, and the modules can dissipate a large amount of heat when running at high speed. At present, various solutions are provided for the heat dissipation problem of the mobile phone, but the heat dissipation effect is not ideal.

Content of application

The application provides an electronic device, this electronic device includes circuit board, heat source chip, shield cover, heat pipe and heat dissipation frame, and the circuit board is provided with the buckle, and the heat source chip welds on the circuit board in order to with circuit board electric connection, and the shield cover is established on the heat source chip, and the heat pipe card is located in the buckle in order to assemble on the circuit board, and the heat pipe is used for absorbing the heat of heat source chip, and the heat dissipation frame is connected in order to absorb the heat of heat pipe with the heat pipe.

The application provides a circuit board assembly, this circuit board assembly includes circuit board, heat source chip, shield cover and heat pipe, and the circuit board is provided with the buckle, and the heat source chip welds on the circuit board in order to with circuit board electric connection, and the shield cover is established on the heat source chip, and the heat pipe card is located in the buckle in order to assemble on the circuit board, and the heat pipe is used for absorbing the heat of heat source chip.

The application discloses electronic device includes circuit board, heat source chip, shield cover, heat dissipation frame and heat pipe, and heat source chip and circuit board electric connection produce a large amount of heats when operating condition, and during the buckle on the circuit board was located to the heat pipe card, the evaporation zone of heat pipe was used for absorbing the heat of heat source chip, and the heat pipe shifts the heat to electronic device's heat dissipation frame's position department. The heat pipe is clamped on the circuit board in advance to form a complete assembly with the circuit board, so that the heat pipe is assembled when the circuit board is assembled, and in addition, the heat pipe can be used as a carrier for radiating heat of the heat source chip, so that the assembly efficiency of the heat pipe and the radiating efficiency of the electronic device are improved.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

FIG. 1 is a schematic structural diagram of an embodiment of an electronic device provided in the present application;

FIG. 2 is a schematic structural diagram of another embodiment of an electronic device provided in the present application;

FIG. 3 is a schematic structural diagram of another embodiment of an electronic device provided in the present application;

FIG. 4 is a schematic structural diagram of another embodiment of an electronic device provided in the present application;

FIG. 5 is a schematic structural diagram of another embodiment of an electronic device provided in the present application;

FIG. 6 is a schematic structural diagram of another embodiment of an electronic device provided in the present application;

FIG. 7 is a schematic structural diagram of another embodiment of an electronic device provided herein;

FIG. 8 is a schematic structural diagram of another embodiment of an electronic device provided herein;

FIG. 9 is a schematic structural diagram of another embodiment of an electronic device provided in the present application;

FIG. 10 is a schematic diagram of another embodiment of an electronic device provided in the present application;

FIG. 11 is a schematic diagram of another embodiment of an electronic device provided in the present application;

FIG. 12 is a schematic diagram of another embodiment of an electronic device provided in the present application;

FIG. 13 is a schematic diagram of another embodiment of an electronic device provided in the present application;

FIG. 14 is a schematic diagram of another embodiment of an electronic device provided in the present application;

fig. 15 is a schematic structural diagram of another embodiment of an electronic device provided in the present application.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It is to be understood that the specific embodiments described herein are merely illustrative of the application and are not limiting of the application. It should be further noted that, for the convenience of description, only some of the structures related to the present application are shown in the drawings, not all of the structures. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

The electronic device provided by the embodiment of the application comprises electronic equipment such as a smart phone, a tablet personal computer, intelligent wearable equipment, a digital audio and video player, an electronic reader, a handheld game machine and vehicle-mounted electronic equipment.

The terms "first" and "second" in this application are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present application, "plurality" means at least two, e.g., two, three, etc., unless explicitly specifically limited otherwise. All directional indications (such as up, down, left, right, front, and rear … …) in the embodiments of the present application are only used to explain the relative positional relationship between the components, the movement, and the like in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indication is changed accordingly. Furthermore, the terms "include" and "have," as well as any variations thereof, are intended to cover non-exclusive inclusions. Such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those steps or elements but may alternatively include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.

Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.

Referring to fig. 1, fig. 1 is a schematic structural diagram of an embodiment of an electronic device provided in the present application.

In the present embodiment, the electronic device includes a heat dissipation frame 10, a circuit board 20, a heat source chip 30, a shield case 40, and a heat pipe 50.

The heat source chip 30 is soldered on the circuit board 20 to be electrically connected to the circuit board 20, and the heat source chip 30 includes a cpu, a GPU, a radio frequency chip, a GPS chip, etc., which generate a large amount of heat in a working state, and the temperature near the heat source chip 30 may affect the working efficiency and the service life when the temperature rises above 50 ℃.

The shielding case 40 covers the heat source chip 30, and the shielding case 40 is made of a metal material, and can perform an electrostatic shielding function on the heat source chip 30, so as to prevent the heat source chip 30 or the heat source chip 30 from being electrostatically interfered by the outside. The shield 40 may be made of copper white, which has good thermal conductivity.

The working principle of the heat pipe 50 is to utilize the phase change process of the medium evaporating in the evaporation area to absorb heat and then condensing in the condensation area to dissipate heat, so that the heat is quickly conducted from the high temperature position to the low temperature position.

The heat dissipation frame 10 may be a middle frame or a rear case, and fig. 1 illustrates a case where the heat dissipation frame 10 is a middle frame. The heat pipe 50 may be mounted in the heat dissipation frame 10, an evaporation area of the heat pipe 50 corresponds to the shield case 40 to absorb heat of the heat source chip 30, and a heat dissipation area of the middle frame or the rear case is large and has sufficient contact with air to rapidly spread heat of a condensation area of the heat pipe 50, thereby preventing a local temperature of the heat source chip 30 from being excessively high.

The middle frame is a shell assembly of the electronic device and comprises two opposite side faces, wherein a display screen assembly is arranged on the front side face, components such as a circuit board and a battery are arranged on the rear side face, then the front side face is connected with the front shell, and the rear side face is connected with the rear shell to form an electronic device main body. The middle frame is generally made of metal alloy materials, such as steel plates, magnesium aluminum alloy and the like.

Different from the situation in the prior art, the electronic device of the embodiment includes a circuit board, a heat source chip, a shielding case, a heat dissipation frame and a heat pipe, wherein the heat source chip is electrically connected to the circuit board and generates a large amount of heat in a working state, the heat pipe is assembled in the heat dissipation frame, the position of an evaporation area of the heat pipe corresponds to the shielding case to absorb the heat of the heat source chip, and the heat pipe transfers the heat to the position of the heat dissipation frame of the electronic device. The heat pipe is assembled in the heat dissipation frame in advance and forms a complete assembly with the heat dissipation frame, so that the heat pipe is assembled when the heat dissipation frame is assembled, and in addition, the heat pipe can be used as a carrier for dissipating heat of the heat source chip, so that the assembly efficiency of the heat pipe and the heat dissipation efficiency of the electronic device are improved.

Referring to fig. 2, fig. 2 is a schematic structural diagram of an electronic device according to another embodiment of the present disclosure.

The heat dissipation frame 10 is provided with a slot 11 at a position corresponding to the heat source chip 30, an evaporation area of the heat pipe 50 is exposed in the air through the slot 11, heat of the heat source chip 30 is firstly conducted to the shielding case 40 and then conducted to the evaporation area of the heat pipe 50, heat dissipation silica gel or heat dissipation silicone grease is clamped between the heat source chip 30 and the shielding case 40, and the slot 11 is filled with the heat dissipation silica gel or the heat dissipation silicone grease, so that the heat conductivity between the heat source chip 30 and the shielding case 40, between the shielding case 40 and the heat pipe 50 is increased, and further, the transfer efficiency of the heat among the heat source chip 30, the shielding case 40 and between the evaporation areas of the heat pipe 50 is.

The heat-dissipating silicone grease is also called as heat-dissipating paste, and is a paste prepared by using special silicone oil as base oil, using novel metal oxide as filler and adding various functional additives and processing the mixture by a specific process, wherein the color of the paste has different appearances due to different materials. The material has good heat conduction, temperature resistance and insulation performance, is an ideal medium material for heat-resistant devices, has stable performance, does not generate corrosive gas in use, and does not influence contacted metals. High purity fillers and silicones ensure smooth, uniform and high temperature insulation of the product. The coating is coated on the assembly surfaces of the power device and the radiator, helps to eliminate air gaps of contact surfaces, increases heat circulation, reduces thermal resistance, reduces the working temperature of the power device, improves reliability and prolongs service life.

Referring to fig. 3, fig. 3 is a schematic structural diagram of an electronic device according to another embodiment of the present disclosure.

The heat pipe 50 includes a first heat pipe 51 and a second heat pipe 52, the position of the evaporation area of the first heat pipe 51 corresponds to the shield can 40 to absorb the heat from the heat source chip 30 on the shield can 40, the number of the first heat pipes 51 may be 1, 2, 3, 4, 5, etc., and the number of the first heat pipes 51 shown in fig. 3 is one. The second heat pipe 52 is connected to the condensation area of the first heat pipe 51 to absorb the heat of the first heat pipe 51 and diffuse the heat of the first heat pipe 51 to other positions of the electronic device, such as a SIM card accommodating frame, which is made of metal material and has excellent thermal conductivity, and the SIM card accommodating frame is used for accommodating a SIM card of the electronic device, and the heat generated in the operating state of the SIM card accommodating frame is less than the heat generated by the heat source chip 30.

Optionally, the SIM card receiving frame is provided with a temperature controller 12, the temperature controller 12 being adapted to monitor the temperature of the SIM card receiving frame. When the value of the temperature controller 12 exceeds a certain threshold (the threshold may be any temperature in the range of 38 degrees celsius to 50 degrees celsius, which is set by the user according to the needs of the user), the SIM card accommodating frame automatically ejects the SIM card to disconnect the communication connection of the electronic device, so as to force the running application in the electronic device to pause, and accordingly, the workload of the heat source chip 30 is correspondingly reduced, and the generation of heat in the heat source chip 30 is reduced. A part of heat can be brought out after the SIM card is popped up, and at the moment, the electronic device is directly communicated and contacted with the outside air through the SIM card opening of the SIM card accommodating frame, so that the heat is accelerated to be diffused to the outside of the electronic device.

Heat pipe 50 is comprised of a copper envelope, wick, and end caps. The copper tube shell is pumped into a negative pressure state and filled with proper liquid, and the liquid has a low boiling point and is easy to volatilize. The inner wall of the tube shell is provided with a liquid absorbing core which is made of capillary porous materials. When one end of the heat pipe 50 is heated, the liquid in the heat pipe 50 is rapidly vaporized, the vapor flows to the other end under the power of heat diffusion, and is condensed at the cold end to release heat, and the liquid flows back to the evaporation area along the porous material by capillary action, so that the circulation is not stopped until the temperatures at the two ends of the heat pipe 50 are equal.

The copper envelope of heat pipe 50 is most thermally conductive in the unfolded state because the wick is now the most intact and the wick's capillary porosity is not destroyed by the fold.

The first heat pipe 51 and the second heat pipe 52 are matched with each other, so that the heat pipe 50 extends to any heat dissipation frame 10 of the electronic device with a good heat dissipation effect on the premise of avoiding bending the heat pipe 50 too much, the first heat pipe 51 absorbs heat of the heat source chip 30, and the second heat pipe 52 absorbs heat of the first heat pipe 51 and diffuses the heat of the first heat pipe 51 to other heat dissipation frames 10 of the electronic device with lower temperature, so that the efficiency of transferring heat at the heat source chip 30 to other positions with lower temperature is greatly improved. Optionally, the first heat pipe 51 and the second heat pipe 52 are both of an unbent structure.

The condensation area of the first heat pipe 51 is provided with at least one matching groove 511, the evaporation area of the second heat pipe 52 is provided with a corresponding number of convex parts, and the convex parts are inserted into the matching grooves 511 so as to connect the first heat pipe 51 and the second heat pipe 52 together; or the condensation area of the first heat pipe 51 is provided with at least one convex part, the evaporation area of the second heat pipe 52 is provided with a corresponding number of matching grooves 511, and the convex parts are inserted into the matching grooves 511 so as to connect the first heat pipe 51 and the second heat pipe 52 together. It should be noted that the end of the first heat pipe 51 and the end of the second heat pipe 52 may be used as a single protrusion.

The matching groove 511 is filled with heat dissipation silicone or heat dissipation silicone grease to increase the thermal conductivity of the first heat pipe 51 and the second heat pipe 52. Fig. 3 illustrates a case where the condensation area of the first heat pipe 51 is provided with at least one fitting groove 511, and the protrusion of the evaporation area of the second heat pipe 52 is inserted into the fitting groove 511.

Optionally, the electronic device further comprises a third heat pipe 53, and the third heat pipe 53 is connected to the condensation area of the second heat pipe 52. The third heat pipe 53 can communicate a plurality of second heat pipes 52 together, and heat flows in the first heat pipe 51, the second heat pipe 52 and the third heat pipe 53, so that heat diffusion is more uniform, and a local overheating phenomenon cannot occur. Especially, when the heat dissipation frame 10 is a rear case, the non-uniform heat of the rear case may cause a reduction in the user's touch experience.

In addition, the third heat pipe 53 connects the plurality of second heat pipes 52 together, the third heat pipe 53, the first heat pipe 51 and the second heat pipe 52 together form a net-shaped heat dissipation structure, and the first heat pipe 51, the second heat pipe 52 and the third heat pipe 53 are laid in the heat dissipation frame 10, so that the overall strength of the heat dissipation frame 10 is greatly enhanced. Optionally, the first heat pipe 51, the second heat pipe 52 and the third heat pipe 53 are all of non-bent structure.

Referring to fig. 4, fig. 4 is a schematic structural diagram of an electronic device according to another embodiment of the present disclosure.

The electronic device further includes a battery 60, and the battery 60 is electrically connected to the circuit board 20.

The heat dissipation frame 10 may be a middle frame including a bottom plate 13 and a side plate 18, the side plate 18 being disposed around the bottom plate 13 to form an accommodation groove 14 with the bottom plate 13, the circuit board 20 and the battery 60 being accommodated in the accommodation groove 14 and connected to the middle frame, the heat source chip 30 being disposed between the circuit board 20 and the bottom plate 13, and the heat pipe 50 being mounted in the bottom plate 13 and/or the side plate 18. Optionally, the electronic device further comprises a thermal insulation foam 70, the thermal insulation foam 70 being disposed on a side of the battery 60 facing the heat pipe 50 to prevent heat of the heat pipe 50 from being conducted to the battery 60.

The middle frame further includes a partition plate 15, the partition plate 15 is disposed on the bottom plate 13 to divide the accommodating groove 14 into a first accommodating groove 141 and a second accommodating groove 142, the circuit board 20 is accommodated in the first accommodating groove 141, and the battery 60 is accommodated in the second accommodating groove 142. Optionally, the bottom plate 13 of the first receiving groove 141 is provided with a through hole, and the shielding cover 40, the heat source chip 30, and the like sink into the through hole to reduce the thickness of the electronic device in the direction perpendicular to the circuit board 20.

The heat dissipation frame 10 may also be a rear case in which the heat pipe 50 is assembled. The material of the backshell can be metal or ceramic, and the material of backshell also can be the plastic, and heat pipe 50 lays in the backshell and increases the bulk strength of backshell.

The present application also protects a heat dissipation assembly, which includes a heat dissipation frame 10 and a heat pipe 50, where the heat dissipation frame 10 can be a middle frame or a rear case, the heat pipe 50 is assembled in the heat dissipation frame 10, the middle frame or the rear case corresponds to the heat source chip 30 at a position where an evaporation area of the heat pipe 50 is located when the heat pipe 50 is assembled into an electronic device, and the heat pipe 50 absorbs heat from the heat source chip 30. For a detailed working principle and structural modifications, the description of the above embodiments is considered.

Referring to fig. 5, fig. 5 is a schematic structural diagram of an electronic device according to another embodiment of the present disclosure.

In the present embodiment, the electronic device includes a heat dissipation frame 10, a circuit board 20, a heat source chip 30, a shield case 40, and a heat pipe 50. The heat source chip 30 is soldered on the circuit board 20 to be electrically connected to the circuit board 20. The shield case 40 covers the heat source chip 30.

The heat dissipation frame 10 may be a middle frame, a rear case or a SIM card accommodating frame, and fig. 5 shows a case where the heat dissipation frame 10 is a middle frame. The heat dissipation frame 10 is provided with the clip 16, the heat pipe 50 can be clipped in the clip 16 to be assembled on the heat dissipation frame 10, the position of the evaporation area of the heat pipe 50 corresponds to the shielding case 40 to absorb the heat of the heat source chip 30, and the heat dissipation area of the middle frame or the rear case is large and has sufficient contact with the air to rapidly diffuse the heat of the condensation area of the heat pipe 50, thereby preventing the local temperature of the heat source chip 30 from being too high.

Buckle 16 and heat dissipation frame 10 can be integrated into one piece structure, and buckle 16 includes main part 161 and joint portion 162, and main part 161 is connected with heat dissipation frame 10, and joint portion 162 extends the setting perpendicular to main part 161, and the heat pipe 50 joint is in the space that main part 161, joint portion 162 and heat dissipation frame 10 enclose and establish. The clip 16 may also be a separate component that is mounted to the heat dissipation frame 10. Heat-dissipating silicone, heat-dissipating silicone grease, or copper foil is disposed between the heat pipe 50 and the shield can 40, and between the shield can 40 and the heat source chip 30 to increase heat transfer efficiency.

Different from the situation in the prior art, the electronic device of the embodiment includes a circuit board, a heat source chip, a shielding case, a heat dissipation frame and a heat pipe, wherein the heat source chip is electrically connected to the circuit board, a large amount of heat is generated in the working state, the heat pipe is clamped in a buckle on the heat dissipation frame, the position of an evaporation area of the heat pipe corresponds to the shielding case to absorb the heat of the heat source chip, and the heat pipe transfers the heat to the position of the heat dissipation frame of the electronic device. The heat pipe is clamped on the heat dissipation frame in advance to form a complete assembly with the heat dissipation frame, so that the heat pipe is assembled when the heat dissipation frame is assembled, and in addition, the heat pipe can be used as a carrier for dissipating heat of the heat source chip, so that the assembly efficiency of the heat pipe and the heat dissipation efficiency of the electronic device are improved.

Referring to fig. 6, fig. 6 is a schematic structural diagram of an electronic device according to another embodiment of the present disclosure.

The heat pipe 50 includes a first heat pipe 51 and a second heat pipe 52, the position of the evaporation area of the first heat pipe 51 corresponds to the shield can 40 to absorb the heat from the heat source chip 30 on the shield can 40, the number of the first heat pipes 51 may be 1, 2, 3, 4, 5, etc., and the number of the first heat pipes 51 shown in fig. 6 is one. The second heat pipe 52 is connected to the condensation area of the first heat pipe 51 to absorb heat of the first heat pipe 51 and diffuse the heat of the first heat pipe 51 to other heat dissipation frames of the electronic device, such as a SIM card accommodating frame.

Optionally, the SIM card receiving frame is provided with a temperature controller 12, the temperature controller 12 being adapted to monitor the temperature of the SIM card receiving frame. When the temperature of the SIM card accommodating frame exceeds a certain threshold, which may be any temperature in the range of 38 to 50 degrees celsius, the SIM card accommodating frame automatically ejects the SIM card. For the specific working principle and practical effect of the SIM card accommodating frame and the temperature controller 12, please refer to the explanation of the above embodiments, which is not repeated herein.

In addition, the third heat pipe 53 connects the plurality of second heat pipes 52 together, the third heat pipe 53, the first heat pipe 51 and the second heat pipe 52 together form a net-shaped heat dissipation structure, and the first heat pipe 51, the second heat pipe 52 and the third heat pipe 53 are laid on the heat dissipation frame 10 in a clamping manner, so that the overall strength of the heat dissipation frame 10 is greatly enhanced.

Referring to fig. 7, fig. 7 is a schematic structural diagram of an electronic device according to another embodiment of the present disclosure.

The heat dissipation frame 10 may be a middle frame, the middle frame includes a bottom plate 13 and a side plate 18, the side plate 18 is disposed around the bottom plate 13 to form a receiving groove 14 with the bottom plate 13, the circuit board 20 and the battery 60 are received in the receiving groove 14 and connected to the middle frame, the heat source chip 30 is disposed between the circuit board 20 and the bottom plate 13, and the heat pipe 50 is clamped on the bottom plate 13 and/or the side plate 18. Optionally, the electronic device further comprises a thermal insulation foam 70, the thermal insulation foam 70 being disposed on a side of the battery 60 facing the heat pipe 50 to prevent heat of the heat pipe 50 from being conducted to the battery 60.

The present embodiment is different from the above embodiments in that the heat pipe 50 is clamped on the bottom plate 13 of the middle frame to divide the accommodating groove 14 into a first accommodating groove 141 and a second accommodating groove 142, the circuit board 20 is accommodated in the first accommodating groove 141, and the battery 60 is accommodated in the second accommodating groove 142. Therefore, a baffle plate for separating the accommodating groove 14 is not arranged on the bottom plate 13, and the space position of the baffle plate is reserved for the heat pipe, so that the space utilization rate of the electronic device is improved.

The heat pipe 50 may be connected to the shielding can 40 in a bent manner, and may also be clamped on the bottom plate 13 of the middle frame to divide the accommodating groove 14 into the first accommodating groove 141 and the second accommodating groove 142. The heat pipe 50 can also be split into a first heat pipe 51 and a second heat pipe 52, and the technical scheme can be realized in a splicing mode.

The heat dissipation frame 10 may also be a rear case in which the heat pipe 50 is snapped. The rear shell may be made of metal or ceramic, or may be made of plastic, so that the heat pipe 50 is clamped in the rear shell to increase the overall strength of the rear shell.

The present application also protects a heat dissipation assembly, which includes a heat dissipation frame 10 and a heat pipe 50, where the heat dissipation frame 10 may be a middle frame or a rear case, the heat dissipation frame 10 is provided with a buckle 16, the heat pipe 50 is clamped in the buckle 16 to be assembled on the heat dissipation frame 10, the middle frame or the rear case corresponds to the heat source chip 30 at a position where an evaporation area of the heat pipe 50 is located when the heat pipe 50 is assembled into an electronic device, and the heat pipe 50 absorbs heat of the heat source chip 30. For a detailed working principle and structural modifications, the description of the above embodiments is considered.

Referring to fig. 8, fig. 8 is a schematic structural diagram of an electronic device according to another embodiment of the present disclosure.

The circuit board 20 is provided with a clip 16, the heat pipe 50 can be clipped in the clip 16 to be assembled on the circuit board 20, the heat pipe 50 is used for absorbing heat of the heat source chip 30, and the heat dissipation frame 10 is connected with the heat pipe 50 to absorb heat of the heat pipe 50.

The electronic device includes a SIM card accommodating frame, a middle frame, a middle frame bottom plate, a rear case, and other electronic devices, in which the heat generation amount is less than that of the heat source chip 30 and the heat dissipation area is large, and the heat dissipation frame 10 may be one, two, three, or four of the SIM card accommodating frame, the middle frame, the middle frame bottom plate, and the rear case. The heat dissipation frame 10 has a large heat dissipation area and sufficient contact with air to rapidly dissipate heat from the condensation area of the heat pipe 50, thereby preventing the local temperature of the heat source chip 30 from being excessively high.

The buckle 16 and the circuit board 20 may be an integrated structure, the buckle 16 includes a main body 161 and a clamping portion 162, the main body 161 is connected with the circuit board 20, the clamping portion 162 extends perpendicularly to the main body 161, and the heat pipe 50 is clamped in a space surrounded by the main body 161, the clamping portion 162 and the heat dissipation frame 10. The circuit board 20 is provided with a through hole 163 at a position corresponding to the fastening portion 162, which is beneficial to integrally molding the fastening portion 162 of the fastener 16 and the heat dissipation frame. The clip 16 may also be a separate component that is mounted to the circuit board 20.

Different from the situation in the prior art, the electronic device of the embodiment includes a circuit board, a heat source chip, a shielding case, a heat dissipation frame and a heat pipe, wherein the heat source chip is electrically connected to the circuit board and generates a large amount of heat in a working state, the heat pipe is clamped in a buckle on the circuit board, an evaporation area of the heat pipe is used for absorbing the heat of the heat source chip, and the heat pipe transfers the heat to the position of the heat dissipation frame of the electronic device. The heat pipe is clamped on the circuit board in advance to form a complete assembly with the circuit board, so that the heat pipe is assembled when the circuit board is assembled, and in addition, the heat pipe can be used as a carrier for radiating heat of the heat source chip, so that the assembly efficiency of the heat pipe and the radiating efficiency of the electronic device are improved.

Referring to fig. 9, fig. 9 is a schematic structural diagram of an electronic device according to another embodiment of the present disclosure.

The electronic device further includes a heat-dissipating silicone or copper foil 80, the shielding case 40 is provided with a via hole 41 along a direction of a plane of the circuit board 20, and the heat pipe 50 passes through the via hole 41 and is connected to the heat source chip 30 through the heat-dissipating silicone or copper foil 80 to absorb heat of the heat source chip 30.

Specifically, the heat-dissipating silicone or copper foil 80 includes a heat absorbing part 81 and a first heat transfer part 82, the heat absorbing part 81 being connected with the top of the heat source chip 30, and the first heat transfer part 82 being connected with the heat absorbing part 81 and extending to the side of the heat source chip 30 to be connected with the heat pipe 50. The heat of the heat source chip 30 is sequentially transferred to the heat pipe 50 through the heat absorbing portion 81 and the first heat conduction portion 82, and then transferred to the heat dissipation frame 10 through the heat pipe 50.

Optionally, the heat dissipation silicone or copper foil 80 further includes a second heat conducting portion 83, and the second heat conducting portion 83 is connected to the first heat conducting portion 82 and sleeved on the heat pipe 50 to increase a connection area between the heat dissipation silicone or copper foil 80 and the heat pipe 50.

Referring to fig. 10, fig. 10 is a schematic structural diagram of an electronic device according to another embodiment of the present disclosure.

The heat pipe 50 may include a first heat pipe 51 and a second heat pipe 52, and the first heat pipe 51 is snapped in the clip 16 to be mounted on the circuit board 20 to absorb heat of the heat source chip 30. The second heat pipe 52 is connected to the condensation area of the first heat pipe 51 and the heat dissipation frame 10, respectively, to absorb heat of the first heat pipe 51, so that the electronic device can diffuse the heat of the first heat pipe 51 to the heat dissipation frame 10 of the electronic device, such as a SIM card accommodating frame, on the premise of bending the first heat pipe 51 as little as possible.

The second heat pipe 52 can be assembled on the heat dissipation frame 10, and when the heat dissipation frame 10 is assembled into an electronic device, the second heat pipe 52 is directly butted to the first heat pipe 51 clamped on the circuit board 20, so as to facilitate the assembly of the second heat pipe 52.

Alternatively, the condensation area of the first heat pipe 51 is provided with a fitting groove 511, the evaporation area of the second heat pipe 52 is provided with a protrusion, and the protrusion is inserted into the fitting groove 511; or the evaporation area of the second heat pipe 52 is provided with a matching groove 511, the condensation area of the first heat pipe 51 is provided with a corresponding convex part, and the convex part is inserted into the matching groove 511. It will be appreciated that the condensation and evaporation zones of the heat pipe 50 comprise the respective heat pipe peripheral wall and the distal end of the heat pipe.

In addition, the third heat pipe 53 connects the plurality of second heat pipes 52 together, and the third heat pipe 53, the first heat pipe 51 and the second heat pipe 52 together form a net-shaped heat dissipation structure to be assembled in the electronic device, thereby enhancing the overall strength of the heat dissipation frame 10. Optionally, the sleeve 90 may be sleeved at the contact position between the first heat pipe 51 and the second heat pipe 52, and the contact position between the second heat pipe 52 and the third heat pipe 53, and the heat dissipation silicone grease is coated in the sleeve 90, so that heat is transferred in the sleeve 90, and the heat is prevented from being uncontrollably diffused to other parts in the electronic device, such as a camera, which generates a large amount of heat when working, and the normal operation of the electronic device is affected by an excessively high temperature.

Optionally, the first heat pipe 51, the second heat pipe 52 and the third heat pipe 53 are flat, and the thickness of the first heat pipe 51, the second heat pipe 52 and the third heat pipe 53 is 0.3mm to 1mm, for example, 0.3mm, 0.4mm, 0.5mm, 0.6mm, 0.7mm, 0.8mm, 0.9mm, 1 mm.

Referring to fig. 11, fig. 11 is a schematic structural diagram of an electronic device according to another embodiment of the present disclosure.

The present embodiment is different from the above embodiments in that the heat pipe 50 is outside the shielding case 40, the heat-dissipating silica gel is pressed between the heat source chip 30 and the shielding case 40, the copper foil 80 includes a heat-absorbing portion 81, a first heat-conducting portion 82 and a second heat-conducting portion 83, the heat-absorbing portion 81 is attached to one side of the shielding case 40 away from the heat-dissipating silica gel, the first heat-conducting portion 82 is connected with the heat-absorbing portion 81 and extends to a side portion of the shielding case 40, and the second heat-conducting portion 83 is connected with the first heat-conducting portion 82 and is sleeved on the heat pipe 50.

The application also protects a circuit board assembly, the circuit board assembly includes circuit board 20, heat source chip 30, shield cover 40 and heat pipe 50, heat source chip 30 welds on circuit board 20 in order to be connected with circuit board 20 electrical behavior, shield cover 40 covers establishes on heat source chip 30, circuit board 20 is provided with buckle 16, heat pipe 50 card is located in buckle 16 in order to assemble on circuit board 20, heat pipe 50 absorbs the heat of heat source chip 30. For a detailed working principle and structural modifications, the description of the above embodiments is considered.

Referring to fig. 12, fig. 12 is a schematic structural diagram of an electronic device according to another embodiment of the present disclosure.

The electronic device of the present embodiment includes a circuit board 20, a heat source chip 30, and a first heat pipe 51, wherein the heat source chip 30 is soldered on the circuit board 20 to be electrically connected to the circuit board 20, and the present embodiment is different from the above embodiments in that the first heat pipe 51 is mounted in the circuit board 20, and an evaporation area of the first heat pipe 51 corresponds to the heat source chip 30 to absorb heat of the heat source chip 30.

The circuit board 20 is provided with a first groove 21 at a position corresponding to the heat source chip 30 to expose the evaporation area of the first heat pipe 51. The first groove 21 is filled with heat dissipation silicone or heat dissipation silicone grease, and the evaporation area of the first heat pipe 51 and the heat source chip 30 directly exchange heat through the heat dissipation silicone or heat dissipation silicone grease.

Different from the prior art, the electronic device of the embodiment includes a circuit board, a heat source chip and a first heat pipe, wherein the heat source chip is electrically connected to the circuit board and generates a large amount of heat in a working state, the first heat pipe is pre-assembled in the circuit board, a position of an evaporation area of the first heat pipe corresponds to the heat source chip to absorb heat of the heat source chip, and the first heat pipe transfers the heat to other positions with lower temperature in the electronic device. The first heat pipe is embedded in the circuit board in advance to form a complete assembly with the circuit board, so that the first heat pipe is assembled when the circuit board is assembled, and in addition, the first heat pipe can take the circuit board as a carrier to dissipate heat of the heat source chip, so that the assembly efficiency of the first heat pipe and the heat dissipation efficiency of the electronic device are improved.

The electronic device further includes a second heat pipe 52, the circuit board 20 is provided with a second groove 22 for exposing the condensation area of the first heat pipe 51, the second heat pipe 52 is connected with the condensation area of the first heat pipe 51 to diffuse heat of the first heat pipe 51, and the second groove 22 is filled with heat dissipation silica gel or heat dissipation silica grease to increase heat conductivity between the first heat pipe 51 and the second heat pipe 52.

Referring to fig. 13, fig. 13 is a schematic structural diagram of an electronic device according to another embodiment of the present application.

Alternatively, the first heat pipe 51 may be mounted in the circuit board 20, and the condensation area of the first heat pipe 51 may penetrate through the circuit board 20 and be directly connected to one, two, three, or four of the SIM card accommodating frame, the middle frame rim, the middle frame bottom plate, and the rear case, so as to diffuse heat of the heat source chip 30. Of course, the condensation area of the first heat pipe 51 may also penetrate through the circuit board 20 and be connected to the second heat pipe 52, and the second heat pipe 52 is connected to one, two, three or four of the SIM card accommodating frame, the middle frame border, the middle frame bottom plate and the rear housing.

The electronic device further includes a temperature controller 12, the temperature controller 12 is disposed on the SIM card accommodating frame 10, the condensation area of the first heat pipe 51 penetrates through the circuit board 20 and is at least connected to the SIM card accommodating frame 10, or the condensation area of the first heat pipe 51 penetrates through the circuit board 20 and is connected to the second heat pipe 52, and the second heat pipe 52 is at least connected to the SIM card accommodating frame 10. The temperature controller is used to monitor the temperature of the SIM card accommodating frame 10, and when the value of the temperature controller 12 exceeds a certain threshold, the SIM card accommodating frame 10 automatically ejects the SIM card.

The present application also protects a circuit board assembly, which includes a circuit board 20, a heat source chip 30 and a first heat pipe 51, wherein the heat source chip 30 is soldered on the circuit board 20 to be electrically connected to the circuit board 20, the first heat pipe 51 is assembled in the circuit board 20, and the position of the evaporation area of the first heat pipe 51 corresponds to the heat source chip 30 to absorb the heat of the heat source chip 30.

Referring to fig. 14, fig. 14 is a schematic structural diagram of an electronic device according to another embodiment of the disclosure.

In the present embodiment, the electronic device includes the circuit board 20, the heat source chip 30, the shield case 40, the first heat pipe 51, and the second heat pipe 52. The heat source chip 30 is soldered on the circuit board 20 to be electrically connected to the circuit board 20. The shield case 40 covers the heat source chip 30.

The first heat pipe 51 is used to absorb heat of the heat source chip 30, and the second heat pipe 52 is connected to the first heat pipe 51 and the heat dissipation frame 10, respectively, to diffuse the heat of the first heat pipe 51.

The heat dissipation frame 10 can be one, two, three or four of a SIM card accommodating frame, a middle frame border, a middle frame bottom plate and a rear shell.

The second heat pipe 52 can be assembled on the heat dissipation frame 10, the first heat pipe 51 is assembled on the circuit board 20, and when the heat dissipation frame 10 is assembled into an electronic device, the second heat pipe 52 is directly butted to the first heat pipe 51, so that the assembly of the second heat pipe 52 is facilitated.

Different from the situation in the prior art, the electronic device of the embodiment includes a circuit board, a heat source chip, a shielding case, a first heat pipe and a second heat pipe, wherein the heat source chip is electrically connected to the circuit board, and generates a large amount of heat in a working state, the first heat pipe absorbs the heat of the heat source chip, and the second heat pipe is connected to the first heat pipe, so that the heat of the first heat pipe is transferred to other positions of the electronic device with lower temperature. Because the first heat pipe and the second heat pipe can be matched with each other to transfer heat, the first heat pipe and the second heat pipe can be matched to form various shapes under the condition of bending as little as possible, and the heat can be efficiently transferred to other positions with lower temperature of the electronic device.

Referring to fig. 15, fig. 15 is a schematic structural diagram of an electronic device according to another embodiment of the present disclosure.

The electronic device of the embodiment includes a circuit board 20, a heat source chip 30, a heat pipe 50 and a heat dissipation frame 10, wherein the heat source chip 30 is soldered on the circuit board 20 to be electrically connected to the circuit board 20, the heat pipe 50 is mounted in the circuit board 20, an evaporation area of the heat pipe 50 corresponds to the heat source chip 30 to absorb heat of the heat source chip 30, and the heat dissipation frame 10 is connected to the heat pipe 50 to absorb heat of the heat pipe 50.

Different from the prior art, the electronic device of the embodiment includes a circuit board, a heat source chip, a heat pipe and a heat dissipation frame, wherein the heat source chip is electrically connected to the circuit board, and generates a large amount of heat in a working state. The heat pipe is embedded in the circuit board in advance to form a complete assembly with the circuit board, so that the heat pipe is assembled when the circuit board is assembled, and in addition, the heat pipe can take the circuit board as a carrier to dissipate heat of the heat source chip, so that the assembly efficiency of the heat pipe and the heat dissipation efficiency of the electronic device are improved.

The heat dissipation frame 10 includes a SIM card receiving frame, a middle frame border, a middle frame bottom plate, a rear case, etc. the difference between the present embodiment and the above embodiments is that the heat dissipation frame 10 is provided with an assembling groove 17, and the heat pipe 50 is directly clamped in the assembling groove 17 when the circuit board 20 assembled with the heat pipe 50 is assembled into an electronic device, so as to be connected with one, two, three, or four of the SIM card receiving frame, the middle frame border, the middle frame bottom plate, and the rear case.

The electronic device further comprises a temperature controller 12, the heat pipe 50 penetrates through the circuit board 20 and is at least connected with the SIM card accommodating frame, the temperature controller 12 is arranged on the SIM card accommodating frame, and the temperature controller 12 is used for monitoring the temperature of the SIM card accommodating frame;

when the value of the temperature controller 12 exceeds a certain threshold, the SIM card accommodating frame automatically ejects the SIM card.

The present application also protects a circuit board assembly including a circuit board 20, a heat source chip 30 and a heat pipe 50, the heat source chip 30 is soldered on the circuit board 20 to be electrically connected with the circuit board 20, the heat pipe 50 is assembled in the circuit board 20, and a position of an evaporation area of the heat pipe 50 corresponds to the heat source chip 30 to absorb heat of the heat source chip 30.

It can be understood that the technical features of the above embodiments can be mutually applied to form a new technical solution to be protected by this application.

The above description is only for the purpose of illustrating embodiments of the present invention and is not intended to limit the scope of the present invention, and all modifications, equivalents, and equivalent structures or equivalent processes that can be used directly or indirectly in other related fields of technology shall be encompassed by the present invention.

Claims

1. An electronic device, comprising:

the circuit board is provided with a buckle;

the heat source chip is welded on the circuit board and electrically connected with the circuit board;

a shield case covering the heat source chip;

the heat pipe is clamped in the buckle to be assembled on the circuit board, and the heat pipe is used for absorbing heat of the heat source chip; and

a heat dissipation frame connected with the heat pipe to absorb heat of the heat pipe;

the buckle with the circuit board is integrated into one piece structure, the buckle includes main part and joint portion, the main part with the circuit board is connected, joint portion perpendicular to the main part extends the setting, the circuit board is in corresponding to the position department of joint portion is provided with broken perforation, the heat pipe joint is in the main part the joint portion with in the space that the circuit board encloses establishing.

2. The electronic device of claim 1,

the electronic device further comprises heat dissipation silica gel or copper foil, the shielding cover is arranged in the direction of the circuit board, a through hole is formed in the shielding cover, and the heat pipe penetrates through the through hole and passes through the heat dissipation silica gel or the copper foil and the heat source chip to be connected so as to absorb heat of the heat source chip.

3. The electronic device of claim 2,

the heat dissipation silica gel or the copper foil comprises a heat absorption part and a first heat conduction part, the heat absorption part is connected with the top of the heat source chip, and the first heat conduction part is connected with the heat absorption part and extends towards the side part of the heat source chip to be connected with the heat pipe.

4. The electronic device of claim 3,

the heat dissipation silica gel or the copper foil further comprises a second heat conduction part, the second heat conduction part is connected with the first heat conduction part and sleeved on the heat pipe, so that the connection area of the heat dissipation silica gel or the copper foil and the heat pipe is increased.

5. The electronic device of claim 1,

the electronic device further comprises heat dissipation silica gel and a copper foil, wherein the heat dissipation silica gel is pressed between the heat source chip and the shielding case;

the copper foil comprises a heat absorption part, a first heat conduction part and a second heat conduction part, the heat absorption part is attached to one side, away from the heat dissipation silica gel, of the shielding cover, the first heat conduction part is connected with the heat absorption part and extends towards the side part of the shielding cover, and the second heat conduction part is connected with the first heat conduction part and is sleeved on the heat pipe.

6. The electronic device of claim 1,

the heat pipe comprises a first heat pipe and a second heat pipe, the first heat pipe is clamped in the buckle to be assembled on the circuit board to absorb heat of the heat source chip, and the second heat pipe is respectively connected with the condensation area of the first heat pipe and the heat dissipation frame to diffuse heat of the first heat pipe.

7. The electronic device of claim 6,

the condensation area of the first heat pipe is provided with a matching groove, the evaporation area of the second heat pipe is provided with a corresponding convex part, and the convex part is inserted into the matching groove; or

The evaporation area of the second heat pipe is provided with a matching groove, the condensation area of the first heat pipe is provided with a corresponding convex part, and the convex part is inserted into the matching groove.

8. The electronic device of claim 7,

the electronic device further comprises a third heat pipe, and the third heat pipe is connected with the condensation area of the second heat pipe so as to form a net-shaped heat dissipation structure together with the first heat pipe and the second heat pipe.

9. The electronic device of claim 1,

the heat dissipation frame comprises an SIM card accommodating frame, a middle frame, a middle frame bottom plate and a rear shell, and the heat pipe is connected with one, two, three or four of the SIM card accommodating frame, the middle frame, the middle frame bottom plate and the rear shell.

10. A circuit board assembly, comprising:

the circuit board is provided with a buckle;

a shield case covering the heat source chip; and

the heat pipe is clamped in the buckle to be assembled on the circuit board, and the heat pipe is used for absorbing heat of the heat source chip;

wherein, the buckle with the circuit board is the integrated into one piece structure, the buckle includes main part and joint portion, the main part with the circuit board is connected, joint portion perpendicular to the main part extends the setting, the circuit board corresponding to the position department of joint portion is provided with broken perforation, the heat pipe joint is in the main part joint portion with in the space that the circuit board encloses.