CN108551752B - An electronic device and a circuit board assembly - Google Patents

Abstract

The present application provides an electronic device and a circuit board assembly. The electronic device includes a circuit board, a heat source chip, a shielding cover, a heat pipe and a heat dissipation frame, the circuit board is provided with a buckle, the heat source chip is welded on the circuit board to be electrically connected with the circuit board, the shielding cover is arranged on the heat source chip, and the heat pipe The heat pipe is used to absorb the heat of the heat source chip, and the heat dissipation frame is connected with the heat pipe to absorb the heat of the heat pipe. The heat dissipation efficiency of the heat source chip of the present application is significantly improved.

Description

An electronic device and a circuit board assembly

technical field

The present application relates to the technical field of heat dissipation of electronic devices, and in particular, to an electronic device and a circuit board assembly.

Background technique

With the popularity of smart phones, users will obviously feel the heat of the mobile phone during the long-term use of the smart phone. After testing, when the mobile phone is working, the main reason is that the mobile phone CPU heats up. Mobile phone CPU is a highly integrated SOC chip. It not only integrates CPU central chip and GPU graphics processing chip, but also a series of key chip modules such as Bluetooth, GPS, and radio frequency. It is the most integrated chip in smartphone chips. Modules dissipate a lot of heat when operating at high speeds. At present, there are various solutions for the heat dissipation problem of mobile phones, but the heat dissipation effect is not ideal.

Application content

The application provides an electronic device, the electronic device includes a circuit board, a heat source chip, a shield, a heat pipe and a heat dissipation frame, the circuit board is provided with a buckle, the heat source chip is welded on the circuit board to be electrically connected to the circuit board, and the shielding The cover is arranged on the heat source chip, the heat pipe is clamped in the buckle to be assembled on the circuit board, the heat pipe is used to absorb the heat of the heat source chip, and the heat dissipation frame is connected with the heat pipe to absorb the heat of the heat pipe.

The application provides a circuit board assembly, the circuit board assembly includes a circuit board, a heat source chip, a shield cover and a heat pipe, the circuit board is provided with a buckle, the heat source chip is welded on the circuit board to be electrically connected to the circuit board, and the shield cover The cover is arranged on the heat source chip, the heat pipe is clamped in the buckle to be assembled on the circuit board, and the heat pipe is used for absorbing the heat of the heat source chip.

The electronic device of the present application includes a circuit board, a heat source chip, a shielding cover, a heat dissipation frame and a heat pipe. The heat source chip is electrically connected to the circuit board and generates a large amount of heat in the working state. The heat pipe is clamped in the buckle on the circuit board. The evaporation area of the heat pipe is used to absorb the heat of the heat source chip, and the heat pipe transfers the heat to the position of the heat dissipation frame of the electronic device. Because the heat pipe is pre-clamped on the circuit board and the circuit board forms a complete assembly, the heat pipe is also assembled when the circuit board is assembled. In addition, the heat pipe can use the circuit board as a carrier to dissipate heat from the heat source chip, thereby improving the performance of the circuit board. Assembly efficiency of heat pipes and heat dissipation efficiency of electronic devices.

Description of drawings

In order to illustrate the technical solutions in the embodiments of the present application more clearly, the following briefly introduces the drawings that are used in the description of the embodiments. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can also be obtained from these drawings without any creative effort.

FIG. 1 is a schematic structural diagram of an embodiment of an electronic device provided by the present application;

2 is a schematic structural diagram of another embodiment of an electronic device provided by the present application;

3 is a schematic structural diagram of another embodiment of an electronic device provided by the present application;

4 is a schematic structural diagram of another embodiment of the electronic device provided by the present application;

5 is a schematic structural diagram of another embodiment of the electronic device provided by the present application;

6 is a schematic structural diagram of another embodiment of the electronic device provided by the present application;

7 is a schematic structural diagram of another embodiment of an electronic device provided by the present application;

8 is a schematic structural diagram of another embodiment of an electronic device provided by the present application;

9 is a schematic structural diagram of another embodiment of an electronic device provided by the present application;

10 is a schematic structural diagram of another embodiment of the electronic device provided by the present application;

11 is a schematic structural diagram of another embodiment of the electronic device provided by the present application;

12 is a schematic structural diagram of another embodiment of an electronic device provided by the present application;

13 is a schematic structural diagram of another embodiment of the electronic device provided by the present application;

14 is a schematic structural diagram of another embodiment of the electronic device provided by the present application;

FIG. 15 is a schematic structural diagram of another embodiment of the electronic device provided by the present application.

Detailed ways

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. It should be understood that the specific embodiments described herein are only used to explain the present application, but not to limit the present application. In addition, it should be noted that, for the convenience of description, the drawings only show some but not all the structures related to the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the protection scope of the present application.

The electronic devices provided by the embodiments of the present application include electronic devices such as smart phones, tablet computers, smart wearable devices, digital audio and video players, electronic readers, handheld game consoles, and in-vehicle electronic devices.

The terms "first" and "second" in this application are only used for descriptive purposes, and should not be construed as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Thus, a feature delimited with "first", "second" may expressly or implicitly include at least one of that feature. In the description of the present application, "a plurality of" means at least two, such as two, three, etc., unless otherwise expressly and specifically defined. All directional indications (such as up, down, left, right, front, rear...) in the embodiments of the present application are only used to explain the relative positional relationship between components under a certain posture (as shown in the accompanying drawings). , motion situation, etc., if the specific posture changes, the directional indication also changes accordingly. Furthermore, the terms "comprising" and "having" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product or device comprising a series of steps or components is not limited to the listed steps or components, but optionally also includes unlisted steps or components, or optionally also Other steps or components inherent to these processes, methods, products or devices are included.

Reference herein to an "embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the present application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor a separate or alternative embodiment that is mutually exclusive of other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

Please refer to FIG. 1 , which is a schematic structural diagram of an embodiment of an electronic device provided by the present application.

In this embodiment, the electronic device includes a heat dissipation frame 10 , a circuit board 20 , a heat source chip 30 , a shielding case 40 and a heat pipe 50 .

The heat source chip 30 is welded on the circuit board 20 to be electrically connected to the circuit board 20 . The heat source chip 30 includes a CPU, a GPU, a radio frequency chip, a GPS chip, and the like. These chips will generate a lot of heat when working, and the heat source chip 30 is near the heat source chip 30 When the temperature rises above 50 degrees Celsius, it will affect its working efficiency and service life.

The shielding cover 40 is covered on the heat source chip 30 . The shielding cover 40 is made of metal material and can play an electrostatic shielding function on the heat source chip 30 , thereby preventing the outside world from causing electrostatic interference to the heat source chip 30 or the heat source chip 30 to the outside world. The shielding cover 40 can be made of white copper, which has good thermal conductivity.

The working principle of the heat pipe 50 is to use the phase transition process in which the medium evaporates and absorbs heat in the evaporation area and then condenses and dissipates heat in the condensation area, so that the heat can be quickly conducted from a position with a high temperature to a position with a low temperature.

The heat dissipation frame 10 may be a middle frame or a rear case, and FIG. 1 shows the case where the heat dissipation frame 10 is a middle frame. The heat pipe 50 can be assembled in the heat dissipation frame 10. The position of the evaporation area of the heat pipe 50 corresponds to the shielding case 40 to absorb the heat of the heat source chip 30. The heat dissipation area of the middle frame or the rear case is large and has sufficient contact with the air, which can quickly dissipate the heat. The heat in the condensation area of the heat pipe 50 is diffused, thereby preventing the local temperature of the heat source chip 30 from being too high.

The middle frame is a housing component of an electronic device, which includes two opposite sides, wherein the front side is provided with a display screen assembly, and the rear side is provided with components such as circuit boards and batteries, and then the front side is connected to the front case , the rear side is connected with the rear shell to form the main body of the electronic device. Generally, the middle frame is made of metal alloy material, such as steel plate, magnesium aluminum alloy, etc.

Different from the situation in the prior art, the electronic device of this embodiment includes a circuit board, a heat source chip, a shield, a heat dissipation frame and a heat pipe. The heat source chip is electrically connected to the circuit board and generates a large amount of heat in the working state. In the heat dissipation frame, the position of the evaporation area of the heat pipe corresponds to the shield to absorb the heat of the heat source chip, and the heat pipe transfers the heat to the position of the heat dissipation frame of the electronic device. Because the heat pipe is pre-assembled in the heat dissipation frame and the heat dissipation frame forms a complete assembly, the heat pipe is also assembled when the heat dissipation frame is assembled. In addition, the heat pipe can use the heat dissipation frame as a carrier to dissipate heat from the heat source chip, thereby improving the heat pipe performance. assembly efficiency and heat dissipation efficiency of electronic devices.

Please refer to FIG. 2 , which is a schematic structural diagram of another embodiment of the electronic device provided by the present application.

The heat dissipation frame 10 is provided with a slot 11 at a position corresponding to the heat source chip 30 , the evaporation area of the heat pipe 50 is exposed to the air through the slot 11 , and the heat of the heat source chip 30 is first conducted to the shield 40 and then to the evaporation of the heat pipe 50 Heat-dissipating silica gel or heat-dissipating silicone grease is sandwiched between the heat source chip 30 and the shielding cover 40, and the slot 11 is filled with heat-dissipating silica gel or heat-dissipating silicone grease, thereby increasing the heat source chip 30 and the shielding cover 40, the shielding cover 40 and the heat pipe 50 , thereby improving the heat transfer efficiency between the heat source chip 30 , the shielding cover 40 , and the evaporation area of the heat pipe 50 .

The common name of the above-mentioned heat-dissipating silicone grease is also called heat-dissipating paste. It is made of special silicone oil as base oil, new metal oxide as filler, with a variety of functional additives. The paste is processed by a specific process. have a different look. It has good thermal conductivity, temperature resistance and insulation properties, is an ideal dielectric material for heat-resistant devices, and has stable performance. It will not generate corrosive gas during use and will not affect the metal it contacts. High-purity fillers and silicones ensure smooth, uniform and high-temperature insulation. Apply to the assembly surface of power devices and heat sinks to help eliminate air gaps on the contact surfaces to increase heat flow, reduce thermal resistance, reduce operating temperature of power devices, improve reliability and prolong service life.

Please refer to FIG. 3 , which is a schematic structural diagram of another embodiment of the electronic device provided by the present application.

The heat pipe 50 includes a first heat pipe 51 and a second heat pipe 52. The position of the evaporation area of the first heat pipe 51 corresponds to the shielding cover 40 to absorb the heat from the heat source chip 30 on the shielding cover 40. The number of the first heat pipes 51 can be 1 , 2, 3, 4, 5, etc., the number of the first heat pipes 51 shown in FIG. 3 is one. The second heat pipe 52 is connected to the condensation area of the first heat pipe 51 to absorb the heat of the first heat pipe 51 and spread the heat of the first heat pipe 51 to other positions of the electronic device, such as the SIM card accommodating frame, the SIM card accommodating frame The frame is made of metal material with excellent thermal conductivity, and the SIM card accommodating frame is used for placing the SIM card of the electronic device.

Optionally, the SIM card accommodating frame is provided with a temperature controller 12, and the temperature controller 12 is used to monitor the temperature of the SIM card accommodating frame. When the value of the temperature controller 12 exceeds a certain threshold (the threshold can be any temperature in the range of 38 degrees Celsius to 50 degrees Celsius, and the user can set it according to his own needs), the SIM card accommodating frame automatically ejects the SIM card to disconnect the Opening the communication connection of the electronic device forces the running applications in the electronic device to suspend, so that the workload of the heat source chip 30 is correspondingly reduced, thereby reducing the heat generation in the heat source chip 30 . After the SIM card is ejected, a part of the heat can also be taken out. At this time, the electronic device is in direct contact with the outside air through the SIM card opening of the SIM card accommodating frame, which accelerates the heat diffusion to the outside of the electronic device.

The heat pipe 50 is composed of a copper tube shell, a liquid wick and an end cap. The inside of the copper tube shell is pumped into a negative pressure state and filled with an appropriate liquid. This liquid has a low boiling point and is easy to volatilize. The inner wall of the tube shell has a liquid-absorbing wick, which is composed of capillary porous material. One end of the heat pipe 50 is the evaporation area, and the opposite end is the condensation area. When one end of the heat pipe 50 is heated, the liquid in the heat pipe 50 vaporizes rapidly, and the vapor flows to the other end under the power of heat diffusion, and condenses at the cold end to release heat. , the liquid flows back to the evaporation area along the porous material by capillary action, and the cycle continues until the temperatures at both ends of the heat pipe 50 are equal.

The copper tube shell of the heat pipe 50 has the best thermal conductivity in the non-bent state, because the liquid-absorbent wick is in the most complete state at this time, and the capillary porous structure of the liquid-absorbent wick is not damaged due to bending.

The first heat pipe 51 and the second heat pipe 52 cooperate with each other so that the heat pipe 50 can be extended to any heat dissipation frame 10 of the electronic device with good heat dissipation effect without excessively bending the heat pipe 50 . The first heat pipe 51 absorbs the heat source chip 30 The second heat pipe 52 absorbs the heat of the first heat pipe 51 and spreads the heat of the first heat pipe 51 to other heat dissipation frames 10 of the electronic device with a lower temperature, thereby greatly improving the heat transfer from the heat source chip 30 to other places. Efficiency at cooler locations. Optionally, both the first heat pipe 51 and the second heat pipe 52 are non-bending structures.

The condensation area of the first heat pipe 51 is provided with at least one matching groove 511 , and the evaporation area of the second heat pipe 52 is provided with a corresponding number of protrusions, and the protrusions are inserted into the matching groove 511 to connect the first heat pipe 51 and the second heat pipe 52 Or the condensation area of the first heat pipe 51 is provided with at least one convex portion, and the evaporation area of the second heat pipe 52 is provided with a corresponding number of matching grooves 511, and the convex portion is inserted into the matching grooves 511 so that the first heat pipe 51 and the The second heat pipes 52 are connected together. It is worth noting that the end of the first heat pipe 51 and the end of the second heat pipe 52 can be used as one convex portion.

The matching groove 511 is filled with heat-dissipating silica gel or heat-dissipating silicone grease to increase the thermal conductivity of the first heat pipe 51 and the second heat pipe 52 . FIG. 3 shows that the condensation area of the first heat pipe 51 is provided with at least one matching groove 511 , and the convex part of the evaporation area of the second heat pipe 52 is inserted into the matching groove 511 .

Optionally, the electronic device further includes a third heat pipe 53 , and the third heat pipe 53 is connected to the condensation area of the second heat pipe 52 . The third heat pipe 53 can connect a plurality of second heat pipes 52 together, and the heat circulates in the first heat pipe 51, the second heat pipe 52, and the third heat pipe 53, and the heat spreads more evenly, and local overheating does not occur. In particular, when the heat dissipation frame 10 is a rear case, the uneven heat of the rear case will cause a decrease in the user's touch experience.

In addition, the third heat pipe 53 connects the plurality of second heat pipes 52 together. The third heat pipe 53, the first heat pipe 51 and the second heat pipe 52 together form a mesh heat dissipation structure. The first heat pipe 51, the second heat pipe 52 and the third heat pipe Laying the heat pipes 53 into the heat dissipation frame 10 greatly enhances the overall strength of the heat dissipation frame 10 . Optionally, the first heat pipe 51 , the second heat pipe 52 and the third heat pipe 53 are all non-bending structures.

Please refer to FIG. 4 , which is a schematic structural diagram of another embodiment of the electronic device provided by the present application.

The electronic device further includes a battery 60 , and the battery 60 is electrically connected to the circuit board 20 .

The heat dissipation frame 10 may be a middle frame, the middle frame includes a bottom plate 13 and a side plate 18 , the side plate 18 is arranged around the bottom plate 13 to form an accommodating groove 14 with the bottom plate 13 , and the circuit board 20 and the battery 60 are accommodated in the accommodating groove 14 and Connected to the middle frame, the heat source chip 30 is disposed between the circuit board 20 and the bottom plate 13 , and the heat pipe 50 is assembled in the bottom plate 13 and/or the side plate 18 . Optionally, the electronic device further includes a thermal insulation foam 70 , and the thermal insulation foam 70 is disposed on the side of the battery 60 facing the heat pipe 50 to prevent the heat of the heat pipe 50 from being conducted to the battery 60 .

The middle frame further includes a dividing plate 15, which is arranged on the bottom plate 13 to divide the accommodating groove 14 into a first accommodating groove 141 and a second accommodating groove 142, and the circuit board 20 is accommodated in the first accommodating groove 141. In the groove 141 , the battery 60 is accommodated in the second accommodating groove 142 . Optionally, the bottom plate 13 of the first accommodating slot 141 is provided with a through hole, and the shielding cover 40 , the heat source chip 30 and the like sink into the through hole to reduce the thickness of the electronic device in the direction perpendicular to the circuit board 20 .

The heat dissipation frame 10 may also be a rear case in which the heat pipe 50 is assembled. The material of the rear shell can be metal or ceramic, and the material of the rear shell can also be plastic. The heat pipe 50 is laid in the rear shell to increase the overall strength of the rear shell.

The present application also protects a heat dissipation assembly. The heat dissipation assembly includes a heat dissipation frame 10 and a heat pipe 50. The heat dissipation frame 10 may be a middle frame or a rear case, the heat pipe 50 is assembled in the heat dissipation frame 10, and the middle frame or the rear case is assembled into an electronic device. The position where the evaporation area of the heat pipe 50 is located corresponds to the heat source chip 30 , and the heat pipe 50 absorbs the heat of the heat source chip 30 . Please refer to the description of the above embodiment for the specific working principle and structural deformation.

Please refer to FIG. 5 , which is a schematic structural diagram of another embodiment of the electronic device provided by the present application.

In this embodiment, the electronic device includes a heat dissipation frame 10 , a circuit board 20 , a heat source chip 30 , a shielding case 40 and a heat pipe 50 . The heat source chip 30 is soldered on the circuit board 20 to be electrically connected with the circuit board 20 . The shielding case 40 is covered on the heat source chip 30 .

The heat dissipation frame 10 may be a middle frame, a rear case or a SIM card accommodating frame, and FIG. 5 shows the case where the heat dissipation frame 10 is a middle frame. The heat dissipation frame 10 is provided with a buckle 16, and the heat pipe 50 can be clamped in the buckle 16 to be assembled on the heat dissipation frame 10. The position of the evaporation area of the heat pipe 50 corresponds to the shielding cover 40 to absorb the heat of the heat source chip 30. The middle frame or The heat dissipation area of the rear case is large and has sufficient contact with the air, which can quickly dissipate the heat in the condensation area of the heat pipe 50 , thereby preventing the local temperature of the heat source chip 30 from being too high.

The buckle 16 and the heat dissipation frame 10 can be integrally formed. The buckle 16 includes a main body portion 161 and a clamping portion 162. The main body portion 161 is connected to the heat dissipation frame 10. The clamping portion 162 extends perpendicular to the main body portion 161. It is connected to the space surrounded by the main body part 161 , the clamping part 162 and the heat dissipation frame 10 . The clip 16 can also be a separate part assembled on the heat dissipation frame 10 . Between the heat pipe 50 and the shielding case 40, and between the shielding case 40 and the heat source chip 30, heat-dissipating silicone, heat-dissipating silicone grease or copper foil are arranged to increase the heat transfer efficiency.

Different from the situation in the prior art, the electronic device of this embodiment includes a circuit board, a heat source chip, a shielding cover, a heat dissipation frame and a heat pipe. In the buckle on the heat dissipation frame, the position of the evaporation area of the heat pipe corresponds to the shield cover to absorb the heat of the heat source chip, and the heat pipe transfers the heat to the position of the heat dissipation frame of the electronic device. Because the heat pipe is pre-clamped on the heat dissipation frame and the heat dissipation frame forms a complete assembly, the heat pipe is also assembled when the heat dissipation frame is assembled. In addition, the heat pipe can use the heat dissipation frame as a carrier to dissipate heat from the heat source chip. Assembly efficiency of heat pipes and heat dissipation efficiency of electronic devices.

Please refer to FIG. 6 , which is a schematic structural diagram of another embodiment of the electronic device provided by the present application.

The heat pipe 50 includes a first heat pipe 51 and a second heat pipe 52. The position of the evaporation area of the first heat pipe 51 corresponds to the shielding cover 40 to absorb the heat from the heat source chip 30 on the shielding cover 40. The number of the first heat pipes 51 can be 1 , 2, 3, 4, 5, etc., the number of the first heat pipes 51 shown in FIG. 6 is one. The second heat pipe 52 is connected to the condensation area of the first heat pipe 51 to absorb the heat of the first heat pipe 51 and dissipate the heat of the first heat pipe 51 to other heat dissipation frames of the electronic device, such as a SIM card accommodating frame.

Optionally, the SIM card accommodating frame is provided with a temperature controller 12, and the temperature controller 12 is used to monitor the temperature of the SIM card accommodating frame. When the temperature of the SIM card accommodating frame exceeds a certain threshold, the threshold may be any temperature in the range of 38 degrees Celsius to 50 degrees Celsius, and the SIM card accommodating frame automatically ejects the SIM card. The specific working principles and actual effects of the SIM card accommodating frame and the temperature controller 12 can be referred to the explanations of the above-mentioned embodiments, which will not be repeated here.

Optionally, the electronic device further includes a third heat pipe 53 , and the third heat pipe 53 is connected to the condensation area of the second heat pipe 52 . The third heat pipe 53 can connect a plurality of second heat pipes 52 together, and the heat circulates in the first heat pipe 51, the second heat pipe 52, and the third heat pipe 53, and the heat spreads more evenly, and local overheating does not occur. In particular, when the heat dissipation frame 10 is a rear case, the uneven heat of the rear case will cause a decrease in the user's touch experience.

In addition, the third heat pipe 53 connects the plurality of second heat pipes 52 together. The third heat pipe 53, the first heat pipe 51 and the second heat pipe 52 together form a mesh heat dissipation structure. The first heat pipe 51, the second heat pipe 52 and the third heat pipe The heat pipes 53 are laid on the heat dissipation frame 10 in a snap-fit manner, which greatly enhances the overall strength of the heat dissipation frame 10 .

Please refer to FIG. 7 , which is a schematic structural diagram of another embodiment of the electronic device provided by the present application.

The heat dissipation frame 10 may be a middle frame, the middle frame includes a bottom plate 13 and a side plate 18 , the side plate 18 is arranged around the bottom plate 13 to form an accommodating groove 14 with the bottom plate 13 , and the circuit board 20 and the battery 60 are accommodated in the accommodating groove 14 and Connected to the middle frame, the heat source chip 30 is disposed between the circuit board 20 and the bottom plate 13 , and the heat pipe 50 is clamped on the bottom plate 13 and/or the side plate 18 . Optionally, the electronic device further includes a thermal insulation foam 70 , and the thermal insulation foam 70 is disposed on the side of the battery 60 facing the heat pipe 50 to prevent the heat of the heat pipe 50 from being conducted to the battery 60 .

The difference between this embodiment and the above-mentioned embodiment is that the heat pipe 50 is clamped on the bottom plate 13 of the middle frame to divide the accommodating groove 14 into a first accommodating groove 141 and a second accommodating groove 142, and the circuit board 20 accommodates In the first accommodating groove 141 , the battery 60 is accommodated in the second accommodating groove 142 . Therefore, the baffle plate 13 for separating the accommodating grooves 14 is omitted, and the space position of the baffle plate is reserved for the heat pipe, thereby improving the space utilization rate of the electronic device.

The heat pipe 50 can be connected to the shielding cover 40 in a bent form, and can also be clamped on the bottom plate 13 of the middle frame to divide the accommodating groove 14 into a first accommodating groove 141 and a second accommodating groove 142 . The heat pipe 50 can also be split into a first heat pipe 51 and a second heat pipe 52 in the form of splicing to achieve the above technical solution.

The heat dissipation frame 10 can also be a rear case, and the heat pipe 50 is clamped in the rear case. The material of the rear shell may be metal or ceramic, and the material of the rear shell may also be plastic, and the heat pipe 50 is stuck in the rear shell to increase the overall strength of the rear shell.

The present application also protects a heat dissipation assembly. The heat dissipation assembly includes a heat dissipation frame 10 and a heat pipe 50. The heat dissipation frame 10 may be a middle frame or a rear case. The heat dissipation frame 10 is provided with a buckle 16, and the heat pipe 50 is clamped in the buckle 16 for assembly. On the heat dissipation frame 10 , when the middle frame or the rear case is assembled into an electronic device, the position of the evaporation area of the heat pipe 50 corresponds to the heat source chip 30 , and the heat pipe 50 absorbs the heat of the heat source chip 30 . Please refer to the description of the above embodiment for the specific working principle and structural deformation.

Please refer to FIG. 8 , which is a schematic structural diagram of another embodiment of the electronic device provided by the present application.

In this embodiment, the electronic device includes a heat dissipation frame 10 , a circuit board 20 , a heat source chip 30 , a shielding case 40 and a heat pipe 50 . The heat source chip 30 is soldered on the circuit board 20 to be electrically connected with the circuit board 20 . The shielding case 40 is covered on the heat source chip 30 .

The circuit board 20 is provided with a buckle 16 , and the heat pipe 50 can be clamped in the buckle 16 to be assembled on the circuit board 20 . heat.

The electronic device includes components in the electronic device such as the SIM card accommodating frame, the middle frame frame, the middle frame bottom plate, and the rear shell, which generate less heat than the heat source chip 30 and have a large heat dissipation area. The heat dissipation frame 10 may be a SIM card accommodating frame, One, two, three or four of the middle frame frame, the middle frame bottom plate and the rear shell. The heat dissipation frame 10 has a large heat dissipation area and has sufficient contact with the air, which can quickly dissipate the heat in the condensation area of the heat pipe 50 , thereby preventing the local temperature of the heat source chip 30 from being too high.

The buckle 16 and the circuit board 20 can be integrally formed. The buckle 16 includes a main body portion 161 and a clamping portion 162. The main body portion 161 is connected to the circuit board 20. The clamping portion 162 extends perpendicular to the main body portion 161. It is connected to the space surrounded by the main body part 161 , the clamping part 162 and the heat dissipation frame 10 . The circuit board 20 is provided with a perforation hole 163 at a position corresponding to the clamping portion 162 , which facilitates the integral molding of the clamping portion 162 of the buckle 16 and the heat dissipation frame. The clip 16 may also be a separate part assembled on the circuit board 20 .

Different from the situation in the prior art, the electronic device of this embodiment includes a circuit board, a heat source chip, a shielding cover, a heat dissipation frame and a heat pipe. In the buckle on the circuit board, the evaporation area of the heat pipe is used to absorb the heat of the heat source chip, and the heat pipe transfers the heat to the position of the heat dissipation frame of the electronic device. Because the heat pipe is pre-clamped on the circuit board and the circuit board forms a complete assembly, the heat pipe is also assembled when the circuit board is assembled. In addition, the heat pipe can use the circuit board as a carrier to dissipate heat from the heat source chip, thereby improving the performance of the circuit board. Assembly efficiency of heat pipes and heat dissipation efficiency of electronic devices.

Please refer to FIG. 9 , which is a schematic structural diagram of another embodiment of the electronic device provided by the present application.

The electronic device further includes heat-dissipating silica gel or copper foil 80 . The shielding cover 40 is provided with a via hole 41 along the direction of the plane of the circuit board 20 . The heat pipe 50 passes through the via hole 41 and passes through the heat-dissipating silica gel or copper foil 80 and the heat source chip 30 . connected to absorb the heat of the heat source chip 30 .

Specifically, the heat-dissipating silica gel or copper foil 80 includes a heat-absorbing part 81 and a first heat-conducting part 82 . The side portion extends to connect with the heat pipe 50 . The heat of the heat source chip 30 is sequentially transferred to the heat pipe 50 through the heat absorbing portion 81 and the first heat conducting portion 82 , and then transferred to the heat dissipation frame 10 through the heat pipe 50 .

Optionally, the heat-dissipating silica gel or copper foil 80 further includes a second heat-conducting portion 83 . The second heat-conducting portion 83 is connected to the first heat-conducting portion 82 and is sleeved on the heat pipe 50 to increase the heat dissipation silica gel or copper foil 80 and the heat pipe 50 . connection area.

Please refer to FIG. 10 , which is a schematic structural diagram of another embodiment of the electronic device provided by the present application.

The heat pipe 50 may include a first heat pipe 51 and a second heat pipe 52 . The first heat pipe 51 is clamped in the clip 16 to be assembled on the circuit board 20 to absorb the heat of the heat source chip 30 . The second heat pipe 52 is respectively connected to the condensation area of the first heat pipe 51 and the heat dissipation frame 10 to absorb the heat of the first heat pipe 51 , so that the electronic device can bend the first heat pipe 51 as little as possible. The heat is dissipated to the heat dissipation frame 10 of the electronic device, such as the SIM card accommodating frame.

Optionally, the SIM card accommodating frame is provided with a temperature controller 12, and the temperature controller 12 is used to monitor the temperature of the SIM card accommodating frame. When the temperature of the SIM card accommodating frame exceeds a certain threshold, the threshold may be any temperature in the range of 38 degrees Celsius to 50 degrees Celsius, and the SIM card accommodating frame automatically ejects the SIM card. The specific working principles and actual effects of the SIM card accommodating frame and the temperature controller 12 can be referred to the explanations of the above-mentioned embodiments, which will not be repeated here.

The second heat pipe 52 can be assembled on the heat dissipation frame 10. When the heat dissipation frame 10 is assembled into an electronic device, the second heat pipe 52 is directly connected to the first heat pipe 51 clamped on the circuit board 20, so as to facilitate the operation of the second heat pipe 52. assembly.

Optionally, the condensation area of the first heat pipe 51 is provided with a matching groove 511 , the evaporation area of the second heat pipe 52 is provided with a convex portion, and the convex portion is inserted into the matching groove 511 ; or the evaporation area of the second heat pipe 52 is provided with a matching groove. 511 , the condensation area of the first heat pipe 51 is provided with a corresponding convex portion, and the convex portion is inserted into the matching groove 511 . It can be understood that the condensation area and the evaporation area of the heat pipe 50 respectively include the corresponding peripheral wall of the heat pipe and the distal end of the heat pipe.

Optionally, the electronic device further includes a third heat pipe 53 , and the third heat pipe 53 is connected to the condensation area of the second heat pipe 52 . The third heat pipe 53 can connect a plurality of second heat pipes 52 together, and the heat circulates in the first heat pipe 51, the second heat pipe 52, and the third heat pipe 53, and the heat spreads more evenly, and local overheating does not occur. In particular, when the heat dissipation frame 10 is a rear case, the uneven heat of the rear case will cause a decrease in the user's touch experience.

In addition, the third heat pipe 53 connects the plurality of second heat pipes 52 together. The third heat pipe 53 and the first heat pipe 51 and the second heat pipe 52 together form a mesh heat dissipation structure and are assembled in the electronic device, thereby enhancing the thermal conductivity of the heat dissipation frame 10 . overall strength. Optionally, the contact between the first heat pipe 51 and the second heat pipe 52, the second heat pipe 52 and the third heat pipe 53 can be sleeved with a sleeve 90, and the sleeve 90 is coated with heat-dissipating silicone grease, so that heat can be trapped in the sleeve. The heat is transferred in the tube 90 to prevent the heat from spreading uncontrollably to other parts of the electronic device, such as the camera. The camera generates a lot of heat when working, and its high temperature will affect its normal operation.

Optionally, the first heat pipe 51 , the second heat pipe 52 and the third heat pipe 53 are flat, and the thicknesses of the first heat pipe 51 , the second heat pipe 52 and the third heat pipe 53 are 0.3 mm to 1 mm, for example, 0.3 mm, 0.4 mm mm, 0.5mm, 0.6mm, 0.7mm, 0.8mm, 0.9mm, 1mm.

Please refer to FIG. 11 , which is a schematic structural diagram of another embodiment of the electronic device provided by the present application.

The difference between this embodiment and the above-mentioned embodiment is that the heat pipe 50 is outside the shielding cover 40 , the heat-dissipating silica gel is pressed between the heat source chip 30 and the shielding cover 40 , and the copper foil 80 includes a heat absorbing portion 81 , a first heat conducting portion 82 and The second heat-conducting portion 83 , the heat-absorbing portion 81 is attached to the side of the shielding cover 40 away from the heat-dissipating silica gel, the first heat-conducting portion 82 is connected to the heat-absorbing portion 81 and extends to the side of the shielding cover 40 , and the second heat-conducting portion 83 is connected to the side of the shielding cover 40 . The first heat conducting portion 82 is connected and sleeved on the heat pipe 50 .

The present application also protects a circuit board assembly. The circuit board assembly includes a circuit board 20 , a heat source chip 30 , a shielding cover 40 and a heat pipe 50 . The heat source chip 30 is welded on the circuit board 20 to be electrically connected to the circuit board 20 . The shielding cover 40 The cover is disposed on the heat source chip 30 , the circuit board 20 is provided with a buckle 16 , the heat pipe 50 is clamped in the buckle 16 to be assembled on the circuit board 20 , and the heat pipe 50 absorbs the heat of the heat source chip 30 . Please refer to the description of the above embodiment for the specific working principle and structural deformation.

Please refer to FIG. 12 , which is a schematic structural diagram of another embodiment of the electronic device provided by the present application.

The electronic device of this embodiment includes a circuit board 20 , a heat source chip 30 and a first heat pipe 51 . The heat source chip 30 is welded on the circuit board 20 to be electrically connected to the circuit board 20 . The difference between this embodiment and the above-mentioned embodiments is that the first A heat pipe 51 is assembled in the circuit board 20 , and the position of the evaporation area of the first heat pipe 51 corresponds to the heat source chip 30 to absorb the heat of the heat source chip 30 .

The circuit board 20 is provided with a first groove 21 at a position corresponding to the heat source chip 30 to expose the evaporation area of the first heat pipe 51 . The first groove 21 is filled with heat-dissipating silica gel or heat-dissipating silicone grease, and the evaporation area of the first heat pipe 51 and the heat source chip 30 directly conduct heat exchange through heat-dissipating silica gel or heat-dissipating silicone grease.

Different from the situation in the prior art, the electronic device of this embodiment includes a circuit board, a heat source chip and a first heat pipe. The heat source chip is electrically connected to the circuit board and generates a large amount of heat in the working state. The first heat pipe is pre-assembled in the circuit. In the board, the position of the evaporation area of the first heat pipe corresponds to the heat source chip to absorb the heat of the heat source chip, and the first heat pipe transfers the heat to other lower temperature positions in the electronic device. Because the first heat pipe is pre-embedded in the circuit board and the circuit board forms a complete assembly, the first heat pipe is also assembled when the circuit board is assembled. heat dissipation, thereby improving the assembly efficiency of the first heat pipe and the heat dissipation efficiency of the electronic device.

The electronic device further includes a second heat pipe 52 , the circuit board 20 is provided with a second groove 22 for exposing the condensation area of the first heat pipe 51 , and the second heat pipe 52 is connected with the condensation area of the first heat pipe 51 to diffuse the first heat pipe 51 . The second groove 22 is filled with heat-dissipating silica gel or heat-dissipating silicone grease, so as to increase the thermal conductivity between the first heat pipe 51 and the second heat pipe 52 .

Please refer to FIG. 13 , which is a schematic structural diagram of another embodiment of the electronic device provided by the present application.

Optionally, the first heat pipe 51 can also be assembled in the circuit board 20, and at the same time, the condensation area of the first heat pipe 51 penetrates through the circuit board 20 and is directly connected to one of the SIM card accommodating frame, the middle frame frame, the middle frame bottom plate, and the rear shell. , 2, 3 or 4 are connected to dissipate the heat of the heat source chip 30 . Of course, the condensation area of the first heat pipe 51 can also be connected to the second heat pipe 52 through the circuit board 20. The second heat pipe 52 is connected to one of the SIM card accommodating frame, the middle frame frame, the middle frame bottom plate, the rear shell, the second one, and the other. Three or four connections.

The electronic device further includes a temperature controller 12, the temperature controller 12 is arranged on the SIM card accommodating frame 10, and the condensation area of the first heat pipe 51 penetrates through the circuit board 20 and is at least connected to the SIM card accommodating frame 10, or the first heat pipe 51 is connected to the SIM card accommodating frame 10. The condensation area of the heat pipe 51 penetrates through the circuit board 20 and is connected to the second heat pipe 52 , and the second heat pipe 52 is at least connected to the SIM card accommodating frame 10 . The temperature controller is used to monitor the temperature of the SIM card accommodating frame 10. When the value of the temperature controller 12 exceeds a certain threshold, the SIM card accommodating frame 10 automatically ejects the SIM card.

The present application also protects a circuit board assembly. The circuit board assembly includes a circuit board 20, a heat source chip 30 and a first heat pipe 51. The heat source chip 30 is welded on the circuit board 20 to be electrically connected to the circuit board 20. The first heat pipe 51 is assembled In the circuit board 20 , the position of the evaporation area of the first heat pipe 51 corresponds to the heat source chip 30 to absorb the heat of the heat source chip 30 .

Please refer to FIG. 14 , which is a schematic structural diagram of another embodiment of the electronic device provided by the present application.

In this embodiment, the electronic device includes a circuit board 20 , a heat source chip 30 , a shield 40 , a first heat pipe 51 and a second heat pipe 52 . The heat source chip 30 is soldered on the circuit board 20 to be electrically connected with the circuit board 20 . The shielding case 40 is covered on the heat source chip 30 .

The first heat pipe 51 is used to absorb the heat of the heat source chip 30 , and the second heat pipe 52 is respectively connected to the first heat pipe 51 and the heat dissipation frame 10 to dissipate the heat of the first heat pipe 51 .

The heat dissipation frame 10 may be one, two, three or four of the SIM card accommodating frame, the middle frame frame, the middle frame bottom plate, and the rear shell.

The second heat pipe 52 can be assembled on the heat dissipation frame 10, and the first heat pipe 51 is assembled on the circuit board 20. When the heat dissipation frame 10 is assembled into an electronic device, the second heat pipe 52 is directly connected to the first heat pipe 51, thereby facilitating the second heat pipe 51. Assembly of the heat pipe 52 .

Different from the situation in the prior art, the electronic device of this embodiment includes a circuit board, a heat source chip, a shielding cover, a first heat pipe and a second heat pipe. The heat source chip is electrically connected to the circuit board and generates a large amount of heat in the working state. The first heat pipe absorbs the heat of the heat source chip, and the second heat pipe is connected to the first heat pipe to transfer the heat of the first heat pipe to other lower temperature positions of the electronic device. Because the first heat pipe and the second heat pipe can cooperate with each other to transfer heat, the first heat pipe and the second heat pipe can be matched to form various shapes with as little bending as possible, and the heat can be efficiently transferred to other lower temperatures of the electronic device. at the location.

Please refer to FIG. 15 , which is a schematic structural diagram of another embodiment of the electronic device provided by the present application.

The electronic device of this embodiment includes a circuit board 20 , a heat source chip 30 , a heat pipe 50 and a heat dissipation frame 10 . The heat source chip 30 is soldered on the circuit board 20 to be electrically connected to the circuit board 20 , and the heat pipe 50 is assembled in the circuit board 20 . The position of the evaporation area 50 corresponds to the heat source chip 30 to absorb the heat of the heat source chip 30 , and the heat dissipation frame 10 is connected to the heat pipe 50 to absorb the heat of the heat pipe 50 .

Different from the situation in the prior art, the electronic device of this embodiment includes a circuit board, a heat source chip, a heat pipe and a heat dissipation frame. The heat source chip is electrically connected to the circuit board and generates a large amount of heat in the working state. The heat pipe is pre-assembled on the circuit board. Among them, the position of the evaporation area of the heat pipe corresponds to the heat source chip to absorb the heat of the heat source chip, and the heat pipe transfers the heat to other lower temperature heat dissipation frames in the electronic device. Because the heat pipe is pre-embedded in the circuit board and the circuit board forms a complete assembly, the heat pipe is also assembled when the circuit board is assembled. In addition, the heat pipe can use the circuit board as a carrier to dissipate heat from the heat source chip, thereby improving the heat pipe. assembly efficiency and heat dissipation efficiency of electronic devices.

The heat dissipation frame 10 includes a SIM card accommodating frame, a middle frame frame, a middle frame bottom plate, a rear shell, etc. The difference between this embodiment and the above-mentioned embodiment is that the heat dissipation frame 10 is provided with an assembly groove 17, and the circuit board 20 of the heat pipe 50 is assembled When assembled into an electronic device, the heat pipe 50 is directly clamped in the assembling slot 17 to be connected to one, two, three or four of the SIM card accommodating frame, the middle frame frame, the middle frame bottom plate, and the rear shell.

The electronic device further includes a temperature controller 12, the heat pipe 50 penetrates through the circuit board 20 and is connected to at least the SIM card accommodating frame, the temperature controller 12 is arranged on the SIM card accommodating frame, and the temperature controller 12 is used for monitoring the SIM card accommodating frame. temperature;

Wherein, when the value of the temperature controller 12 exceeds a certain threshold, the SIM card accommodating frame automatically ejects the SIM card.

The present application also protects a circuit board assembly, the circuit board assembly includes a circuit board 20 , a heat source chip 30 and a heat pipe 50 , the heat source chip 30 is welded on the circuit board 20 to be electrically connected with the circuit board 20 , and the heat pipe 50 is assembled on the circuit board 20 , the position of the evaporation area of the heat pipe 50 corresponds to the heat source chip 30 to absorb the heat of the heat source chip 30 .

It is understandable that the technical features of the above embodiments can be applied to each other to form the technical solution to be protected in the present application.

The above description is only an embodiment of the present application, and does not limit the scope of the patent of the present application. Any equivalent structure or equivalent process transformation made by using the contents of the description and drawings of the present application, or directly or indirectly applied to other related technologies Fields are similarly included within the scope of patent protection of this application.

Claims (10)

1. an electronic device, is characterized in that, comprises: The circuit board is provided with a buckle; a heat source chip, soldered on the circuit board to be electrically connected with the circuit board; a shielding cover, the cover is arranged on the heat source chip; a heat pipe, which is clamped in the buckle to be assembled on the circuit board, and the heat pipe is used for absorbing the heat of the heat source chip; and a heat dissipation frame, connected with the heat pipe to absorb the heat of the heat pipe; The buckle and the circuit board are integrally formed, the buckle includes a main body part and a clamping part, the main body part is connected with the circuit board, and the clamping part is extended perpendicular to the main body part , the circuit board is provided with a broken hole at a position corresponding to the clamping part, and the heat pipe is clamped in the space enclosed by the main body part, the clamping part and the circuit board. 2. The electronic device according to claim 1, wherein, The electronic device further includes heat-dissipating silica gel or copper foil, the shielding cover is provided with a via hole along the direction of the circuit board, and the heat pipe passes through the via hole and passes through the heat-dissipating silica gel or the copper foil and the heat-dissipating silica gel or the copper foil. The heat source chips are connected to absorb the heat of the heat source chips. 3. The electronic device according to claim 2, wherein, The heat-dissipating silica gel or the copper foil includes a heat-absorbing part and a first heat-conducting part, the heat-absorbing part is connected to the top of the heat source chip, and the first heat-conducting part is connected to the heat-absorbing part and faces the heat-absorbing part. The side portion of the heat source chip extends to be connected with the heat pipe. 4. The electronic device according to claim 3, wherein, The heat-dissipating silica gel or the copper foil further includes a second heat-conducting part, the second heat-conducting part is connected to the first heat-conducting part and is sleeved on the heat pipe, so as to increase the heat-dissipating silica gel or the copper The connection area of the foil with the heat pipe. 5. The electronic device according to claim 1, wherein, The electronic device further includes heat-dissipating silica gel and copper foil, and the heat-dissipating silica gel is pressed between the heat source chip and the shielding cover; The copper foil includes a heat-absorbing part, a first heat-conducting part and a second heat-conducting part, the heat-absorbing part is attached to the side of the shielding cover away from the heat-dissipating silica gel, and the first heat-conducting part is connected to the heat-absorbing part. The heat portion is connected and extends to the side of the shielding case, the second heat-conducting portion is connected to the first heat-conducting portion and sleeved on the heat pipe. 6. The electronic device according to claim 1, wherein, The heat pipe includes a first heat pipe and a second heat pipe, the first heat pipe is clamped in the buckle to be assembled on the circuit board to absorb the heat of the heat source chip, and the second heat pipe is respectively connected to the The condensation area of the first heat pipe and the heat dissipation frame are connected to dissipate the heat of the first heat pipe. 7. The electronic device according to claim 6, wherein, The condensation area of the first heat pipe is provided with a matching groove, and the evaporation area of the second heat pipe is provided with a corresponding convex portion, and the convex portion is inserted into the matching groove; or The evaporation area of the second heat pipe is provided with a matching groove, and the condensation area of the first heat pipe is provided with a corresponding convex portion, and the convex portion is inserted into the matching groove. 8. The electronic device according to claim 7, wherein, The electronic device further includes a third heat pipe, and the third heat pipe is connected to the condensation area of the second heat pipe to form a mesh heat dissipation structure together with the first heat pipe and the second heat pipe. 9. The electronic device according to claim 1, wherein, The heat dissipation frame includes a SIM card accommodating frame, a middle frame frame, a middle frame bottom plate, and a rear shell, and the heat pipe is connected to the SIM card accommodating frame, the middle frame frame, the middle frame bottom plate, and the rear shell. One, two, three or four connections. 10. A circuit board assembly, comprising: The circuit board is provided with a buckle; a heat source chip, soldered on the circuit board to be electrically connected with the circuit board; a shield cover disposed on the heat source chip; and a heat pipe, which is clamped in the buckle to be assembled on the circuit board, and the heat pipe is used for absorbing the heat of the heat source chip; Wherein, the buckle and the circuit board are integrally formed, the buckle includes a main body part and a clamping part, the main body part is connected with the circuit board, and the clamping part is perpendicular to the main body part By extending, the circuit board is provided with a broken hole at a position corresponding to the clamping part, and the heat pipe is clamped in the space enclosed by the main body part, the clamping part and the circuit board.

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