CN108551011A - A kind of high speed highly dense, high fever backboard is realized with a low cost mode - Google Patents
A kind of high speed highly dense, high fever backboard is realized with a low cost mode Download PDFInfo
- Publication number
- CN108551011A CN108551011A CN201810503683.0A CN201810503683A CN108551011A CN 108551011 A CN108551011 A CN 108551011A CN 201810503683 A CN201810503683 A CN 201810503683A CN 108551011 A CN108551011 A CN 108551011A
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- CN
- China
- Prior art keywords
- backboard
- high speed
- speed signal
- voltage supply
- high voltage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/7005—Guiding, mounting, polarizing or locking means; Extractors
Landscapes
- Mounting Of Printed Circuit Boards And The Like (AREA)
Abstract
The present invention provides a kind of high speed, highly dense, high fever backboard it is realized with a low cost mode, the backboard includes high speed signal backboard and high voltage supply backboard, the realization method is stacked by high speed signal backboard and high voltage supply backboard, is formed signal backplane and is responsible for transmitting high speed signal；Power supply backboard is responsible for high voltage supply, the present invention is by way of will power backboard and the separation of high speed signal backboard, solves the increase of backboard high-speed link Insertion Loss, the presence of high voltage supply can lead to problems such as the backboard number of plies increase, backboard cost increases or even can not process, and reduces system cost.
Description
Technical field
The present invention relates to field of computer technology more particularly to a kind of high speed, highly dense, high fever backboard the sides of being realized with a low cost
Formula.
Background technology
Currently, with information/communications industry explosion develop, large-scale computing device, the network equipment backboard electric signal
Transmission rate is more next fast, and backboard is as large-scale frame computing device, the high speed transmission of signals carrier of the network equipment and core power supply
Channel, design become increasingly complex, and not only cost is very high, but also face high-voltage high-speed and interfere with each other equal EMI problems.It is how lower
The transmission high speed signal of cost, while ensureing the difficulty that system power supply and EMI performances become mainframe computing devices, the network equipment designs
Point.
Present back plate design mode is the high speed signal communicated between the board being plugged on backboard and slave outer frame to plate
High pressure such as-the 48V/12V for blocking power supply is transmitted on backboard simultaneously, and high speed signal and high voltage supply can be located at same layer or difference
Layer.Since high voltage supply electric current is larger, is transmitted on backboard and will produce a large amount of heat, caused backboard temperature to increase, make backboard
High-speed link Insertion Loss increases, and influences the reliability even realizability of system.Usual backboard is in order to transmit high speed signal using non-
The plank of Chang Gui, and the presence of high voltage supply can cause the backboard number of plies to increase, causing backboard cost to increase can not even process.
Invention content
The present invention provides a kind of high speed, it is highly dense, high fever backboard be realized with a low cost mode, the present invention passes through the back of the body that will power
The mode of plate and the separation of high speed signal backboard, solves the above problems and reduces system cost.
The present invention is achieved by the following technical programs：
A kind of high speed, it is highly dense, high fever backboard be realized with a low cost mode, the backboard includes high speed signal backboard and height
Pressure power supply backboard, the realization method are stacked by high speed signal backboard and high voltage supply backboard, are formed signal backplane and are responsible for
Transmit high speed signal；Power supply backboard is responsible for high voltage supply.
The high speed signal backboard overlays high voltage supply backboard upper end, the high speed signal backboard and high voltage supply
It is connected through a screw thread between backboard.
The high speed signal backboard and high voltage supply backboard is the similar two pieces of backboards of shape.
The high speed signal backboard is equipped with through-hole.
The high speed number letter backboard is equipped with 2 through-holes.
The high voltage supply backboard is equipped with the straight male end of power connector, and the straight male end of the power connector passes through institute
The through-hole stated.
The high speed signal backboard is equipped with slot, and plug-in card is inserted in slot, the power connector on the plug-in card
Curved female end is connected with the straight male end of power connector.
A kind of high speed, highly dense, high fever backboard, the backboard include high speed signal backboard and high voltage supply backboard, described
High speed signal backboard and high voltage supply backboard be the similar two pieces of backboards of shape, the high speed signal backboard overlays high pressure
Power backboard upper end, is connected through a screw thread between the high speed signal backboard and high voltage supply backboard, the high speed signal
Backboard is equipped with through-hole, and the high voltage supply backboard is equipped with the straight male end of power connector, and the power connector is directly public
End is equipped with slot by the through-hole, the high speed signal backboard, and plug-in card is inserted in slot, the electricity on the plug-in card
The curved female end of source connector is connected with the straight male end of power connector.
Compared with prior art, it is an advantage of the invention that：
1, the present invention by by high voltage supply backboard with high speed transmission of signals back plate design to two block-shaped similar backboards
In, stacking and fixing to reach and carry on the back identical effect with existing tradition by two pieces of backboards in systems, i.e. signal backplane is responsible for
Transmit high speed signal；Power supply backboard is responsible for high voltage supply.In systems by two pieces of backboards stack and fix reach with it is existing
Tradition carries on the back identical effect.
2, it is distributed in due to high speed signal and high voltage supply in different backboards, reduces the fever of high voltage supply backboard to height
The baking of fast signal plate significantly reduces the temperature of high speed signal backboard, improves its high speed performance, can reduce high speed signal
The plank grade of backboard is to reduce cost.
3, there is no signal connector on high voltage supply backboard, greatly improve the copper foil integrality of high voltage supply layer, to
Power supply efficiency is improved, reaching reduces the backboard number of plies and energy-efficient target.
4, high speed signal backboard and the separation of high voltage supply backboard, can select plank, to reduce using high-performance respectively
The number of plies of expensive plank, reduces cost.
Description of the drawings
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technology description to be briefly described.
Fig. 1 is high speed signal back board structure schematic diagram of the present invention；
Fig. 2 is high speed signal backboard, high voltage supply backboard and plug-in card connection diagram of the present invention；
In figure：1- high speed signal backboards, 11- through-holes, 2- high voltage supply backboards, the straight male end of 21- power connectors, 3- are inserted
Card, the curved female end of 4- connectors.
Specific implementation mode
In order to make the object, technical scheme and advantages of the embodiment of the invention clearer, below in conjunction with the embodiment of the present invention
In attached drawing, technical scheme in the embodiment of the invention is clearly and completely described, it is clear that described embodiment is
A part of the embodiment of the present invention, instead of all the embodiments.
Embodiment 1
As shown in Figs. 1-2, a kind of high speed, it is highly dense, high fever backboard be realized with a low cost mode, the backboard includes high speed
Signal backplane 1 and high voltage supply backboard 2, the realization method are stacked by the high speed signal back of the body 1 and high voltage supply backboard 2, institute
The high speed signal backboard stated overlays high voltage supply backboard upper end, forms signal backplane and is responsible for transmitting high speed signal；Power supply backboard
It is responsible for high voltage supply.The high speed signal backboard and high voltage supply backboard is the similar two pieces of backboards of shape.Since high speed is believed
Number and high voltage supply be distributed in different backboards, reduce high voltage supply backboard and generate heat baking to high speed signal plate, substantially
The temperature for reducing high speed signal backboard improves its high speed performance, can reduce the plank grade of high speed signal backboard to
Reduce cost.
It is connected through a screw thread between the high speed signal backboard and high voltage supply backboard, can have the function that conduction.
The high speed signal backboard is equipped with through-hole 11.High speed signal backplane of the present invention is equipped with 2 through-holes.The high pressure supplies
Electric backboard 2 is equipped with the straight male end 21 of power connector, and the straight male end of the power connector passes through the through-hole 11.Described
High speed signal backboard is equipped with slot, and plug-in card is inserted in slot, and the curved female end of the power connector on the plug-in card and power supply connect
Connect the straight male end connection of device.There is no signal connector on high voltage supply backboard, greatly improve the copper foil integrality of high voltage supply layer,
To improve power supply efficiency, reaching reduces the backboard number of plies and energy-efficient target.High speed signal backboard and high voltage supply backboard point
From can select plank respectively, to reduce the number of plies using high-performance costliness plank, reduce cost.
The technology contents of the not detailed description of the present invention are known technology.
Claims (9)
1. a kind of high speed, it is highly dense, high fever backboard be realized with a low cost mode, the backboard includes high speed signal backboard and high pressure
Power supply backboard, which is characterized in that the realization method is stacked by high speed signal backboard and high voltage supply backboard, forms signal
Backboard is responsible for transmitting high speed signal；Power supply backboard is responsible for high voltage supply.
2. a kind of high speed according to claim 1 highly dense, high fever backboard is realized with a low cost mode, which is characterized in that institute
The high speed signal backboard stated overlays high voltage supply backboard upper end, leads between the high speed signal backboard and high voltage supply backboard
Cross threaded connection.
3. a kind of high speed according to claim 1 highly dense, high fever backboard is realized with a low cost mode, which is characterized in that institute
The high speed signal backboard and high voltage supply backboard stated are the similar two pieces of backboards of shape.
4. a kind of high speed according to claim 1 highly dense, high fever backboard is realized with a low cost mode, which is characterized in that institute
The high speed signal backboard stated is equipped with through-hole.
5. a kind of high speed according to claim 4 highly dense, high fever backboard is realized with a low cost mode, which is characterized in that institute
The high speed signal backboard stated is equipped with 2 through-holes.
6. a kind of high speed according to claim 4 highly dense, high fever backboard is realized with a low cost mode, which is characterized in that institute
The high voltage supply backboard stated is equipped with the straight male end of power connector, and the straight male end of the power connector passes through the through-hole.
7. a kind of high speed according to claim 1 highly dense, high fever backboard is realized with a low cost mode, which is characterized in that institute
The high speed signal backboard stated is equipped with slot, and plug-in card is inserted in slot, the curved female end of the power connector on the plug-in card and electricity
The straight male end connection of source connector.
8. a kind of high speed as described in claim 1, highly dense, high fever backboard, which is characterized in that the backboard includes that high speed is believed
Number backboard and high voltage supply backboard, the high speed signal backboard and high voltage supply backboard are the similar two pieces of backboards of shape, institute
The high speed signal backboard stated overlays high voltage supply backboard upper end, and the high speed signal backboard is equipped with through-hole, the height
Pressure power supply backboard is equipped with the straight male end of power connector, and the straight male end of the power connector is described by the through-hole
High speed signal backboard is equipped with slot, and plug-in card is inserted in slot, and the curved female end of the power connector on the plug-in card and power supply connect
Connect the straight male end connection of device.
9. a kind of high speed according to claim 8, highly dense, high fever backboard, which is characterized in that the high speed signal backboard
It is connected through a screw thread between high voltage supply backboard.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810503683.0A CN108551011A (en) | 2018-05-23 | 2018-05-23 | A kind of high speed highly dense, high fever backboard is realized with a low cost mode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810503683.0A CN108551011A (en) | 2018-05-23 | 2018-05-23 | A kind of high speed highly dense, high fever backboard is realized with a low cost mode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108551011A true CN108551011A (en) | 2018-09-18 |
Family
ID=63495479
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810503683.0A Pending CN108551011A (en) | 2018-05-23 | 2018-05-23 | A kind of high speed highly dense, high fever backboard is realized with a low cost mode |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108551011A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0330119A2 (en) * | 1988-02-26 | 1989-08-30 | Licentia Patent-Verwaltungs-GmbH | Plug connection for electrical cables |
| CN102420743A (en) * | 2011-08-17 | 2012-04-18 | 福建星网锐捷网络有限公司 | Back plate of exchanger |
| CN103051566A (en) * | 2012-12-27 | 2013-04-17 | 华为技术有限公司 | Backplane device and communication equipment |
| CN104064893A (en) * | 2014-06-06 | 2014-09-24 | 华为技术有限公司 | Backboard and communication device |
-
2018
- 2018-05-23 CN CN201810503683.0A patent/CN108551011A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0330119A2 (en) * | 1988-02-26 | 1989-08-30 | Licentia Patent-Verwaltungs-GmbH | Plug connection for electrical cables |
| CN102420743A (en) * | 2011-08-17 | 2012-04-18 | 福建星网锐捷网络有限公司 | Back plate of exchanger |
| CN103051566A (en) * | 2012-12-27 | 2013-04-17 | 华为技术有限公司 | Backplane device and communication equipment |
| CN104064893A (en) * | 2014-06-06 | 2014-09-24 | 华为技术有限公司 | Backboard and communication device |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180918 |
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| RJ01 | Rejection of invention patent application after publication |