CN108550552B - Display panel, display device, display panel mother board and manufacturing method thereof - Google Patents
Display panel, display device, display panel mother board and manufacturing method thereof Download PDFInfo
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- CN108550552B CN108550552B CN201810373588.3A CN201810373588A CN108550552B CN 108550552 B CN108550552 B CN 108550552B CN 201810373588 A CN201810373588 A CN 201810373588A CN 108550552 B CN108550552 B CN 108550552B
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
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- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
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- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
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Abstract
The invention relates to a display panel mother board, which comprises a plurality of display panels, cutting lines surrounding the display panels, a heat-resistant graphic layer and a heat-conducting graphic layer, wherein the heat-resistant graphic layer coats the packaging boundary of each display panel and is used for retarding the heat transfer during cutting; the cutting line of the display panel mother board is located in the area of the heat conductive pattern layer. In the process of cutting the display panel mother board, heat generated by laser cutting is firstly dispersed into two parts through the heat conducting pattern layer, so that the heat conducted towards the organic light-emitting element is reduced. And because the heat-resistant material layer retards the conduction of cutting heat, the damage of the boundary of the display panel is reduced, the damage of peripheral elements of the display panel caused by thermal expansion is avoided, and the production yield of the display panel is improved. Also provided are a display panel, a display device, a display panel mother board and a cutting method thereof.
Description
Technical Field
The invention relates to the technical field of display, in particular to a display panel, a display device, a display panel mother board and a manufacturing method thereof.
Background
In recent years, with the technical development of smart terminal devices and wearable devices, the demand for flat panel displays is becoming more and more diversified. Such as an Organic Light-Emitting Diode (OLED) display, has a self-luminous performance, and saves a backlight module which consumes more energy compared with a liquid crystal display, thereby having the advantage of more energy saving.
At present, the manufacturing process of the display panel is as follows: a plurality of display panels are formed on a large substrate and then cut to form individual display panels. The cutting method of the display panel mother board is generally knife wheel cutting and laser cutting, and the appearance requirement tends to diversification and a frame is as narrow as possible in order to adapt to the market.
However, in the laser dicing process, thermal influence is generated between the laser and the film material and the substrate, and particularly in the case of the irregular dicing, for example, when the laser spot profile at the chamfering position is changed from a straight line to a curved line, the energy of the spot is higher at the inner side of the circular arc than at the outer side of the circular arc, and the thermal influence is more significant than that in the case of the straight line dicing. Therefore, the edge of the display panel is easily damaged, the element is damaged, the packaging is poor, and water vapor permeates from the side edge of the display panel, so that the OLED device is damaged, and the abnormal display at the periphery of the display panel is caused.
Disclosure of Invention
Accordingly, it is necessary to provide a display panel, a display device, a display panel mother board and a manufacturing method thereof, which solve the above problem, in order to solve the problem that the edge of the display panel is easily damaged during the cutting process of the display panel.
A display panel mother board comprises a plurality of display panels, and further comprises a heat resistance graphic layer and a heat conduction graphic layer, wherein the heat resistance graphic layer is arranged around the packaging boundary of each display panel and used for retarding cutting heat transfer, and the heat conduction graphic layer is arranged around the heat resistance graphic layer.
In one embodiment, the thermal conductivity of the material of the thermal conductive pattern layer is higher than that of the material of the thermal resistance pattern layer.
In one embodiment, the thermal barrier pattern layer comprises a thermally insulating material.
In one embodiment, the display panel mother board further includes a cutting line surrounding the plurality of display panels, and the cutting line is disposed on the heat conductive pattern layer.
In one embodiment, the heat-conducting pattern layer comprises a first heat-conducting pattern layer and a second heat-conducting pattern layer which are positioned at two sides of the cutting line;
the first heat conducting pattern layer is located between the heat resisting pattern layer and the second heat conducting pattern layer.
In one embodiment, the thermal conductivity of the material of the second thermal conductivity pattern layer is higher than that of the material of the first thermal conductivity pattern layer.
In one embodiment, the thickness of the first heat conducting pattern layer is greater than that of the second heat conducting pattern layer.
In one embodiment, the first heat conducting pattern layer and the second heat conducting pattern layer are arranged at intervals.
In one embodiment, the first heat conducting pattern layer and the second heat conducting pattern layer are connected with each other;
and a cutting groove is formed between the first heat-conducting pattern layer and the second heat-conducting pattern layer along a cutting line of the display panel motherboard.
In one embodiment, the first heat conducting pattern layer and the second heat conducting pattern layer both comprise a one-way heat conducting material;
the heat conduction direction of the first heat conduction pattern layer is opposite to that of the second heat conduction pattern layer, so that cutting heat is gathered towards the cutting line.
In one embodiment, the display panel mother board includes:
a carrier substrate;
a substrate base plate formed on the carrier base plate;
a plurality of display elements formed on the substrate base plate;
the heat-resistant graphic layer is arranged around the packaging boundary of each display element, and the heat-conducting graphic layer is arranged around the heat-resistant graphic layer.
In one embodiment, the display element comprises a thin film transistor formed on the substrate, an organic light emitting element formed on the thin film transistor, and a thin film encapsulation layer covering the organic light emitting element;
the heat-resistant graphic layer wraps the boundary of the film packaging layer of each display element.
A display panel is formed by cutting a display panel mother board in the embodiment.
A display device comprising a display panel as in the above embodiments.
A method of making a display panel motherboard, the method comprising:
providing a bearing substrate;
forming a substrate base plate on the bearing base plate;
forming a plurality of display elements on the substrate base plate;
forming a heat-blocking pattern layer around an encapsulation boundary of the display element;
forming a heat conducting pattern layer around the heat resisting pattern layer; and the cutting line of the display panel motherboard is positioned in the area of the heat conduction graph layer.
According to the display panel mother board, the display panel and the display device, the heat-resistant graphic layer is arranged around the packaging boundary of the display element, and in the laser cutting process, the heat-resistant graphic layer can block heat flow from being transmitted to the packaging structure, so that the heat absorbed by the packaging structure boundary is reduced, the packaging structure is prevented from being damaged by expansion or tearing, water vapor is prevented from entering to damage OLED devices, and the production yield of the display panel is improved. The cutting line X of the display panel motherboard is positioned in the area of the heat conducting graph layer, and heat generated by laser cutting is firstly dispersed into two parts through the heat conducting graph layer, so that the heat conducted to the packaging boundary of the packaging structure is further reduced. And the heat generated by laser cutting is absorbed by the heat conducting pattern layer and is concentrated on the heat conducting pattern layer, so that the cutting is convenient, the energy is recycled, the cutting efficiency is improved, meanwhile, the damage of peripheral elements of the display panel caused by the thermal expansion due to the absorption of a large amount of heat by the substrate is avoided, and the production yield of the display panel is improved.
Drawings
Fig. 1 is a schematic structural diagram of a display panel mother board according to an embodiment of the present invention;
fig. 2 is a schematic diagram illustrating a position relationship between a heat-resistant graphic layer and a heat-conductive graphic layer of the display panel mother board shown in fig. 1;
FIG. 3 is a schematic diagram illustrating a position relationship between a heat-blocking pattern layer and a heat-conducting pattern layer of a motherboard of a display panel according to another embodiment of the present invention;
fig. 4 is a flowchart illustrating a method for manufacturing a display panel according to an embodiment of the invention.
Detailed Description
To facilitate an understanding of the invention, the invention will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
In order to better understand the technical solution of the present invention, before describing the mother board of the display panel of the present invention, the fabrication of the display panel will be described.
In the conventional manufacturing of display panels, in order to reduce the manufacturing cost and achieve mass production in a large scale, a plurality of display panels are generally manufactured on a large display panel mother board, and then the large display panel mother board is cut into a plurality of individual display panels through a cutting process, so that the display panel mother board is an intermediate structure for manufacturing the display panels. Generally, a display panel motherboard includes a motherboard main body and an encapsulation structure layer disposed on the motherboard main body, the motherboard main body has a plurality of display panels, each display panel has an OLED device disposed therein, the encapsulation structure layer includes a plurality of encapsulation structures corresponding to the plurality of display panels one to one, and each encapsulation structure is used for encapsulating the OLED device in the corresponding display panel.
In the development direction of the display panel narrow frame, along with the continuous narrowing of the display panel frame, the distance between the position of the cutting line on the display panel motherboard and the packaging boundary of the display element gradually narrows. The principle of laser cutting is to cut the film layer through thermal melting, and for example, a flexible display panel is used, and a substrate of the flexible display panel is usually made of a resin material. Since the resin material has a large thermal expansion coefficient, the substrate edge of the flexible display panel absorbs a large amount of heat and expands in the laser cutting process, which may damage the elements around the display area and cause abnormal display around the display panel. The edge of the packaging structure can absorb a large amount of heat to cause damages such as expansion or tearing, and water vapor permeates from the side edge of the display panel, so that the OLED device is damaged, and the display panel cannot realize long-term excellent display performance.
Therefore, it is desirable to provide a display panel mother board and a display panel that can reduce the edge damage of the display panel and increase the production yield of the display panel.
Fig. 1 is a schematic structural diagram of a display panel motherboard according to an embodiment of the present invention; FIG. 2 is a schematic diagram illustrating a position relationship between a heat resistance pattern layer and a heat conduction pattern layer of the display panel mother board shown in FIG. 1; for convenience of explanation, only the structures of portions related to the embodiments of the present invention are shown.
The display panel mother board 10 includes a plurality of display panels a, and the display panel mother board 10 further includes a heat-blocking pattern layer 12 and a heat-conducting pattern layer 14. The heat-blocking pattern layer 12 is disposed around the encapsulation boundary Y of each display panel, and the heat-conductive pattern layer 14 is disposed around the heat-blocking pattern layer 12.
In some embodiments, the thermal resistant graphic layer 12 wraps the package boundary Y of each display panel.
In some embodiments, the display panel mother substrate 10 further includes a cutting line X around the display panel a, the cutting line X being located on the heat conductive pattern layer 14.
It should be understood that, for convenience of illustration, the cut line X in the drawings is only an example of a cut line on one side of the display panel a, and the package boundary Y is also only for illustration.
One display panel a means one display panel cut out from the display panel mother board 10; the display panel includes a display area for forming display elements, and a frame area that is not allowed to be cut off, such as a trace for providing a signal line for display. For example, in some embodiments, one display panel a of the display panel motherboard 10 may include an Active Area (AA) for forming a display screen later, and may further include a non-display Area (including an Area for arranging a driving circuit and a chip) for forming a display screen later.
In the embodiment of the present invention, the display panel mother board 10 includes a carrier substrate, a substrate, and a plurality of display elements. The substrate base plate can be a flexible substrate base plate or a hard substrate base plate.
The bearing substrate comprises a plurality of display panel areas and a cuttable area surrounding the display panel areas. In the embodiment shown in fig. 1, the carrier substrate has six display panel regions, the display panel regions are divided into the display panel positions, and the display panel regions are rectangular and are composed of four sides. The four side edges can be used as cutting lines of the display panel mother board 10, and the cutting is performed according to the four side edges during the subsequent cutting. It is easily understood that the four sides of the six display panel regions in fig. 1 may be lines that do not actually exist or lines that are reserved on the carrier substrate. It will also be appreciated that the display panel area is not limited to being rectangular, but may also be other shapes, such as circular, hexagonal, etc.
The substrate base plate is formed on the bearing base plate. The substrate base plate is a bendable base plate, optionally an organic polymer, and may be, for example, one of a polyimide base plate, a polyamide base plate, a polycarbonate base plate, a polyphenylene ether sulfone base plate, and the like. In some embodiments, the substrate may be obtained by coating a polyimide glue solution on the carrier substrate, and then curing the polyimide.
A plurality of display elements are formed on the base substrate in one-to-one correspondence with the display panel regions, and the heat-blocking pattern layer 12 is provided around the package boundary Y of each display panel (display element). In some embodiments, the display panel is a flexible display panel, the substrate is flexible, the display device may sequentially include a thin film transistor formed on the substrate, an organic light emitting device formed on the thin film transistor, and a thin film encapsulation layer covering the organic light emitting device, and the thermal resistant pattern layer 12 covers a boundary of the thin film encapsulation layer of each display device.
It should be understood that the thin film encapsulation layer covers the organic light emitting element to block the ingress of water vapor, when the organic light emitting element emits light, electrons and holes are injected between the transparent electrode layer as an anode and the metal electrode layer as a cathode, respectively, so that the electrons and holes are recombined on the light emitting layer, the electrons are reduced from an excited state to a ground state, and excess energy is released in the form of light. Therefore, the boundary of the thin film encapsulation layer is the encapsulation boundary Y of the display device.
In the embodiment of the present invention, the cutting line X of the display panel motherboard 10 is located on the heat conductive pattern layer 14, and the cutting boundary corresponding to the cutting line X is the boundary of the frame region of the display panel, so that the heat conductive pattern layer 14 is partially located in the frame region of the display panel. In some embodiments, the heat conducting pattern layer 14 includes a first heat conducting pattern layer 142 and a second heat conducting pattern layer 144 located at two sides of the cutting line X, and the first heat conducting pattern layer 142 is located between the heat blocking pattern layer 12 and the second heat conducting pattern layer 144. That is, the first thermal conductive pattern layer 142 is located in the frame region of the display panel, and the second thermal conductive pattern layer 144 is cut during the cutting process.
In this way, the material, shape, thickness, etc. of the first and second heat conductive pattern layers 142 and 144 may be flexibly set according to the cutting of different products, so as to reduce the influence of the cutting heat on the edge of the display panel as much as possible. In the foregoing, the thermal pattern layer 12 comprises a thermal material disposed around the perimeter of the package of the display element, for example, and in particular embodiments, the thermal pattern layer 12 wraps around the perimeter of the thin film package layer. In the laser cutting process, the heat-resistant graphic layer 12 can block heat flow from being transmitted to the packaging structure, and the heat absorbed by the boundary of the packaging structure is reduced, so that the packaging structure is prevented from being damaged by expansion or tearing, water vapor is prevented from entering to damage an OLED device, and the production yield of the display panel is improved. The cutting line X of the display panel motherboard 10 is located in the area where the heat conductive pattern layer 14 is located, and heat generated by laser cutting is firstly dispersed into two parts through the heat conductive pattern layer 14, so that heat conducted to the package boundary of the package structure is further reduced. And the heat generated by laser cutting is absorbed by the heat conducting pattern layer 14 and is concentrated on the heat conducting pattern layer 14, so that the cutting is convenient, the energy is recycled to a certain extent, the cutting efficiency is improved, meanwhile, the damage of peripheral elements of the display panel caused by the thermal expansion due to the fact that the substrate absorbs a large amount of heat is avoided, and the production yield of the display panel is improved. In particular, the thermal conductive pattern layer 14 may be spaced apart from the thermal barrier pattern layer 12, so that damage to the boundary of the film encapsulation layer due to the cutting heat may be further reduced. However, in order to realize a "narrow bezel" of the display screen as much as possible, it is necessary to reduce the width of the bezel region of the display panel, and thus, the heat conductive pattern layer 14 and the heat blocking pattern layer 12 may be connected to each other. For example, in particular to the embodiment shown in fig. 2, the heat resistance pattern layer 12 is partially embedded in the heat conduction pattern layer 14. Namely, part of the heat-resisting pattern layer and the heat-conducting pattern layer are arranged in a laminating mode.
In some embodiments of the present invention, the thermal conductivity of the material of the thermal conductivity pattern layer 14 is higher than the thermal conductivity of the material of the thermal resistance pattern layer 12. It should be understood that the thermal conductivity of the material of the thermal conductive pattern layer 14 is higher than that of the material of the thermal barrier pattern layer 12, i.e. the thermal conductive pattern layer 14 conducts heat more easily than the thermal barrier pattern layer 12, and then heat is concentrated on the thermal conductive pattern layer 14 during the cutting process, thereby further blocking the conduction of cutting heat, reducing damage at the boundary of the package structure, and simultaneously facilitating cutting and improving cutting efficiency. It should be noted that in the foregoing embodiments, the thermal resistant material may be a material with low thermal conductivity, and in other embodiments, the thermal resistant pattern layer 12 may be a thermal insulating material. Thus, the heat blocking of cutting is further improved, and the damage at the boundary of the packaging structure is also reduced.
In some embodiments of the present invention, the second heat conductive pattern layer 144 has a higher heat conductivity than the first heat conductive pattern layer 142. Thus, heat is concentrated on the second thermal conductive pattern layer 144, so that the cutting heat is further away from the package boundary, and the damage at the package structure boundary is reduced.
In order to preferentially concentrate heat on the second heat conductive pattern layer 144 and to move the cutting heat further away from the package boundary, in other embodiments, as shown in fig. 3, the thickness of the first heat conductive pattern layer 142 is greater than the thickness of the second heat conductive pattern layer 144. In this way, heat is more easily transferred to the second heat conductive pattern layer 144.
In some embodiments of the present invention, the first heat conductive pattern layer 142 is spaced apart from the second heat conductive pattern layer 144. As shown in fig. 2, a cutting line X of the display panel mother substrate 10 is located in a cutting region 146 between the first thermal conductive pattern layer 142 and the second thermal conductive pattern layer 144. Thus, the area of the heat-conducting pattern layer 14 acted during cutting by the cutting line X is reduced, that is, the stress generated by the cutting action force on the heat-conducting pattern layer 14 is reduced, and the propagation carrier of the stress is also reduced, so that the influence of the heat-conducting pattern layer 14 on cutting and sheet breaking is avoided.
In other embodiments, referring to fig. 3, the first heat conducting pattern layer 142 and the second heat conducting pattern layer 144 are connected to each other; a cutting groove 148 is formed between the first and second heat conductive pattern layers 142 and 144 along a cutting line X of the display panel mother substrate 10. In this way, while it is ensured that the cutting heat is mostly concentrated on the first and second heat conductive pattern layers 142 and 144, the influence of the heat conductive pattern layer 14 on the cutting and breaking of the sheet is also avoided.
In still other embodiments, the first heat conductive pattern layer 142 and the second heat conductive pattern layer 144 are formed continuously, and the heat conductive pattern layer 14 may also include a plurality of hollow patterns, two side boundaries of the hollow patterns are respectively located at two sides of the cutting line X of the display panel mother board 10. When the display panel mother board 10 is cut, the two side boundaries of the hollow pattern are respectively located at two sides of the cutting line X, and the cutting line X passes through the hollow pattern. Therefore, the cutting line X only acts on the other heat-conducting pattern layers 14 except the hollow patterns, and the influence of the heat-conducting pattern layers 14 on cutting and breaking off the sheet is avoided, so that the cutting quality is improved, and the production yield of the display panel is improved.
In order to further improve the cutting efficiency and realize energy recycling, in some embodiments of the present invention, the first heat conductive pattern layer 142 and the second heat conductive pattern layer 144 are both made of one-way heat conductive material; the first heat conductive pattern layer 142 conducts heat in a direction opposite to that of the second heat conductive pattern layer 144, so that cutting heat is concentrated toward the cutting line X. In the cutting process, the laser spot moves along the cutting line X, and since the first heat conducting pattern layer 142 and the second heat conducting pattern layer 144 are both made of one-way heat conducting materials, heat generated by the laser spot is gathered towards the cutting line X. So, be convenient for the cutting, and improved the reuse rate of energy, improved cutting efficiency.
Based on the display panel mother board 10, an embodiment of the invention further provides a display panel, which is obtained by cutting along the cutting line X of the display panel mother board 10 in any of the embodiments. The cutting line X may be a line that does not actually exist, or may be a line reserved on the display panel mother substrate 10.
In some embodiments, the display panel includes a substrate, a display element, and a functional film portion. The display element is formed on the base substrate, and each functional film layer portion is formed on the display element. The substrate, the display device and the functional film layer are similar to those in the above embodiments, and therefore are not described herein.
In some embodiments, the display panel further includes a touch structure capable of detecting external touch, the touch structure includes a touch electrode array and a plurality of touch traces, the touch structure is attached to the polarizer on the functional film portion, and the glass cover covers the touch structure to protect the touch structure. In some embodiments, the touch structure may be adhered to a polarizer of the display panel, and in other embodiments, the touch structure may be integrated on the packaging layer structure, which is not limited herein.
Based on the display panel motherboard 10, an embodiment of the present invention further provides a display device, in some embodiments, the display device may be a display terminal, such as a tablet computer, and in other embodiments, the display device may also be a mobile communication terminal, such as a mobile phone terminal.
In some embodiments, the display device includes a display panel and a control unit. The display panel is obtained by cutting along the cutting line X of the display panel mother board 10 in any of the above embodiments, and the control unit is configured to transmit a display signal to the display panel.
Fig. 4 is a flow chart showing a method of manufacturing the display panel mother substrate 10 according to the embodiment of the present invention.
As shown in fig. 4, the method for manufacturing a display panel mother board 10 according to an embodiment of the present invention includes the following steps:
s110: providing a bearing substrate;
the bearing substrate comprises a plurality of display panel areas, and the side boundary of each display panel area is used as a cutting line X for subsequent cutting reference;
s120: forming a substrate base plate on the bearing base plate;
in an embodiment, a substrate may be formed by coating a carrier substrate, for example, in an embodiment, a Polyimide (PI) glue is coated on the carrier substrate, and then the polyimide glue is cured to obtain the substrate.
S130: forming a plurality of display elements on a substrate;
in some embodiments, a thin film transistor, an organic light emitting device formed on the thin film transistor, and a thin film encapsulation layer covering the organic light emitting device may be sequentially formed on a substrate.
S140: forming a heat-blocking pattern layer 12 around the encapsulation boundary Y of the display element;
in particular, in the embodiment, the thermal resistant pattern layer 12 is wrapped at the package boundary Y of the package structure.
S150: forming a heat conductive pattern layer 14 around the heat blocking pattern layer 12;
wherein the cutting line X of the display panel mother substrate 10 is located in the region of the thermal conductive pattern layer 14. In particular, in some embodiments, the thermal conductive pattern layer 14 is formed on a substrate base plate.
In some embodiments, the method for manufacturing the display panel mother board 10 further includes:
s132: forming a functional film layer portion on the display element;
in particular, in embodiments, a pressure sensitive adhesive layer may be coated on the display element, and then a polarizer may be attached on the pressure sensitive adhesive layer.
In some embodiments, after step S150, the method further comprises the steps of:
s160: covering a glass cover plate on the polaroid;
it should be noted that step S150 needs to be after step S140, and the timing sequence between step S140 and step 150 and step S132 is not limited.
According to the display panel mother board 10, the display panel and the display device, the heat-resistant graphic layer 12 is arranged around the packaging boundary of the display element, and in the laser cutting process, the heat-resistant graphic layer 12 can block heat flow from being transmitted to the packaging structure, so that the heat absorbed by the packaging structure boundary is reduced, the packaging structure is prevented from being damaged by expansion or tearing, water vapor is prevented from entering to damage OLED devices, and the production yield of the display panel is improved. The cutting line X of the display panel mother board 10 is located on the heat conductive pattern layer 14, and heat generated by laser cutting is firstly dispersed into two parts through the heat conductive pattern layer 14, thereby further reducing heat conducted to the package boundary of the package structure. And the heat generated by laser cutting is absorbed by the heat conducting pattern layer 14 and is concentrated on the heat conducting pattern layer 14, so that the cutting is convenient, the energy is recycled to a certain extent, the cutting efficiency is improved, meanwhile, the damage of peripheral elements of the display panel caused by the thermal expansion due to the fact that the substrate absorbs a large amount of heat is avoided, and the production yield of the display panel is improved.
In addition, the thermal conductivity of the thermal conductive pattern layer 14 is higher than that of the thermal insulation pattern layer 12, and the thermal conductive patterns of the two portions on both sides of the cutting line X are unidirectional thermal conductive materials, so that the cutting heat is collected toward the cutting line X. In the cutting process, heat is concentrated on the cutting line X, so that the cutting is facilitated, the energy is recycled, and the cutting efficiency is improved.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. A display panel mother board comprises a plurality of display panels and is characterized by further comprising a heat resistance graphic layer and a heat conduction graphic layer, wherein the heat resistance graphic layer is arranged around the packaging boundary of each display panel and used for blocking the transmission of cutting heat, and the heat conduction graphic layer is arranged around the heat resistance graphic layer; the heat conductivity coefficient of the material of the heat conducting pattern layer is higher than that of the material of the heat resisting pattern layer;
the display panel mother board also comprises a cutting line surrounding the display panels, and the heat-conducting graph layer comprises a first heat-conducting graph layer and a second heat-conducting graph layer which are positioned at two sides of the cutting line;
the first heat conducting pattern layer is located between the heat resisting pattern layer and the second heat conducting pattern layer.
2. The display panel motherboard according to claim 1, wherein the heat resistance pattern layer comprises a heat insulating material.
3. The display panel mother board according to claim 1 or 2, wherein the display panel includes a display area and a bezel area;
the first heat conducting graph layer is located in a frame area of the display panel.
4. The display panel mother board according to claim 1, wherein a thermal conductivity of a material of the second thermal conductive pattern layer is higher than a thermal conductivity of a material of the first thermal conductive pattern layer.
5. The display panel motherboard according to claim 1, wherein the first thermal conductive pattern layer is disposed at a distance from the second thermal conductive pattern layer.
6. The display panel motherboard according to claim 1, wherein the first heat conductive pattern layer and the second heat conductive pattern layer are connected to each other;
and a cutting groove is formed between the first heat-conducting pattern layer and the second heat-conducting pattern layer along a cutting line of the display panel motherboard.
7. The display panel motherboard of claim 1 wherein the first and second thermal conductive pattern layers each comprise a unidirectional thermal conductive material;
the heat conduction direction of the first heat conduction pattern layer is opposite to that of the second heat conduction pattern layer, so that cutting heat is gathered towards the cutting line.
8. A display panel, characterized in that, it is formed by cutting the mother board of the display panel according to any one of claims 1 to 7.
9. A display device characterized by comprising the display panel according to claim 8.
10. A method for manufacturing a display panel motherboard is characterized by comprising the following steps:
providing a bearing substrate;
forming a substrate base plate on the bearing base plate;
forming a plurality of display elements on the substrate base plate;
forming a heat-blocking pattern layer around an encapsulation boundary of the display element;
forming a heat conducting pattern layer around the heat resisting pattern layer; wherein the cutting line of the display panel motherboard is positioned in the area of the heat conducting graph layer; the heat conductivity coefficient of the material of the heat conducting pattern layer is higher than that of the material of the heat resisting pattern layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810373588.3A CN108550552B (en) | 2018-04-24 | 2018-04-24 | Display panel, display device, display panel mother board and manufacturing method thereof |
Applications Claiming Priority (1)
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| CN109448558A (en) * | 2018-12-27 | 2019-03-08 | 武汉华星光电技术有限公司 | A kind of display panel |
| CN109449195B (en) * | 2018-12-28 | 2021-04-09 | 厦门天马微电子有限公司 | Display panel mother board and manufacturing method thereof |
| CN109979333B (en) * | 2019-05-17 | 2022-01-28 | 京东方科技集团股份有限公司 | Display panel, manufacturing method thereof and display device |
| CN110335970B (en) * | 2019-07-15 | 2022-01-18 | 京东方科技集团股份有限公司 | Flexible display substrate, manufacturing method thereof and flexible display device |
| CN111047970B (en) * | 2019-11-21 | 2022-04-19 | 昆山国显光电有限公司 | Display panel and display panel mother board |
| CN111129090B (en) * | 2019-12-18 | 2022-05-31 | 武汉华星光电半导体显示技术有限公司 | Display panel and test method thereof |
| CN111613141A (en) * | 2020-05-25 | 2020-09-01 | 武汉华星光电半导体显示技术有限公司 | Display module and display panel |
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| JPS61280679A (en) * | 1985-05-02 | 1986-12-11 | Sanyo Electric Co Ltd | Manufacture of photo-voltaic device |
| JP2010232516A (en) * | 2009-03-27 | 2010-10-14 | Kyocera Corp | Wiring board and method for manufacturing the same |
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| CN104183785B (en) * | 2014-06-27 | 2016-05-11 | 京东方科技集团股份有限公司 | A kind of method for packing, OLED display floater and OLED display unit of OLED device |
| KR102465377B1 (en) * | 2016-02-12 | 2022-11-10 | 삼성디스플레이 주식회사 | Display device and the method of manufacturing thereof |
| CN106206988B (en) * | 2016-08-26 | 2019-03-15 | 昆山国显光电有限公司 | Encapsulating structure and preparation method thereof and application |
| CN106409875A (en) * | 2016-11-11 | 2017-02-15 | 上海天马微电子有限公司 | Display panel, display panel mother board and manufacturing method thereof |
| CN106799548B (en) * | 2017-02-06 | 2019-04-26 | 京东方科技集团股份有限公司 | The method of protective film, laser cutting |
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| JP2010232516A (en) * | 2009-03-27 | 2010-10-14 | Kyocera Corp | Wiring board and method for manufacturing the same |
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