CN108550537A - A kind of divergence type upper electrode of semiconductor dry ecthing equipment - Google Patents

A kind of divergence type upper electrode of semiconductor dry ecthing equipment Download PDF

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Publication number
CN108550537A
CN108550537A CN201810477311.5A CN201810477311A CN108550537A CN 108550537 A CN108550537 A CN 108550537A CN 201810477311 A CN201810477311 A CN 201810477311A CN 108550537 A CN108550537 A CN 108550537A
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CN
China
Prior art keywords
holes
hole
ring
upper electrode
feed tray
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
CN201810477311.5A
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Chinese (zh)
Inventor
尹英世
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hefei Micro Optoelectronic Technology Co Ltd
Original Assignee
Hefei Micro Optoelectronic Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hefei Micro Optoelectronic Technology Co Ltd filed Critical Hefei Micro Optoelectronic Technology Co Ltd
Priority to CN201810477311.5A priority Critical patent/CN108550537A/en
Publication of CN108550537A publication Critical patent/CN108550537A/en
Withdrawn legal-status Critical Current

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment

Abstract

The invention discloses a kind of divergence type upper electrodes of semiconductor dry ecthing equipment, including horizontally disposed gas feed tray, gas feed tray coaxial sleeve is equipped with connection ring, gas feed tray wall coaxial is connected with No.1 spacing ring, the ring body of No.1 spacing ring offers several No.1 through-holes, connection ring inner wall is coaxially connected with No. two spacing rings, No. two spacing rings offer several No. two through-holes, No. two through-holes are corresponding with No.1 lead to the hole site, it is inserted with stifled bolt jointly in No.1 through-hole and No. two through-holes, stifled bolt upper end is connected with limited block, the lower end of stifled bolt offers No. three through-holes, the opening of No. three through-holes is equipped with limit protrusion, the both ends of No. three through-holes are equipped with movable block, spring is equipped in No. three through-holes, the one end of movable block far from spring is connected with jacking block.In the present invention, the gas feed tray in upper electrode is detachably connected with connection ring, and to facilitate the later stage to replace and repair, and installation and disassembly process are all extremely simple.

Description

A kind of divergence type upper electrode of semiconductor dry ecthing equipment
Technical field
The present invention relates to dry ecthing equipment more particularly to a kind of divergence type upper electrodes of semiconductor dry ecthing equipment.
Background technology
In the electrode assemblies of dry ecthing equipment, when etch process carries out, process gas is noted by gas injection tube Enter, and enters in the multiple gas jetting holes formed on upper electrode.
At this point, generating plasma according to the voltage on upper electrode, oxygen on the wafer is formd according to this plasma Change the etching of film or metal film etc..
But previous electrode assemblies are integrated with top electrode gas feed tray and connection ring, so gas supplies Entire upper electrode must be replaced when to disk or connection ring, one of them is impaired.
The especially gas feed tray of introducing technology gas compared with connection ring, not only short life and in different technology conditions Under be more easy to be damaged.
In this case, the upper electrode of high price will be entirely replaced, will be made as long as previous gas feed tray is impaired At the great wasting of resources.
Invention content
The purpose of the present invention is to provide a kind of divergence type upper electrodes of semiconductor dry ecthing equipment, to solve gas confession The technical issues of to integral replacing upper electrode is needed after disk and the one of parts damages of connection ring.
The present invention using following technical scheme in order to solve the above technical problems, realized:
The present invention provides a kind of divergence type upper electrode of semiconductor dry ecthing equipment, including horizontally disposed gas feed tray, Gas feed tray is uniformly provided with multiple gas jetting holes, and gas feed tray coaxial sleeve is equipped with connection ring, and connection ring offers multiple Connecting hole, gas feed tray wall coaxial are connected with No.1 spacing ring, and the ring body of No.1 spacing ring offers several No.1 through-holes, No.1 through-hole is longitudinally disposed, and connection ring inner wall is coaxially connected with No. two spacing rings, and No. two spacing rings are arranged under No.1 spacing ring Side, No. two spacing rings offer several No. two through-holes, and No. two through-holes are corresponding with No.1 lead to the hole site, and No.1 through-hole and No. two are led to Stifled bolt is inserted in hole jointly, stifled bolt upper end is connected with limited block, and the lower end of stifled bolt offers No. three through-holes, No. three through-hole levels Setting, the opening of No. three through-holes are equipped with limit protrusion, and the both ends of No. three through-holes are equipped with movable block, and movable block passes through limit Protrusion limit is equipped with spring in No. three through-holes in No. three through-holes, the both ends of spring are contacted with movable block respectively, and movable block is separate One end of spring is connected with jacking block, and jacking block is arranged in the lower section of No. two through-holes.
Preferably, there are four No.1 through-hole and No. two through-holes are all provided with, No.1 through-hole and No. two through-holes are along place ring Body even circumferential is arranged.
Preferably, No.1 spacing ring lower end is connected with several raised lines, raised line length direction and No.1 spacing ring diametric(al) Unanimously, No. two spacing ring upper ends offer several grooves, and raised line is corresponding with groove location.
Preferably, raised line and groove are V-type.
Preferably, there are four raised line and groove are all provided with, raised line and groove are arranged along place ring body even circumferential.
Preferably, stifled bolt is arranged with washer, and washer is arranged between limited block and No.1 through-hole.
Preferably, the one end of jacking block far from No. two through-holes is smooth curved surface.
The present invention in use, first by No. two through-holes on the No.1 through-hole and No. two spacing rings on No.1 spacing ring Alignment is inserted into stifled bolt, is inserted into during blocking up bolt, first presses the jacking block at No. three through-hole both ends, keeps jacking block logical into No. three In hole, then stifled bolt is inserted into No.1 through-hole and No. two through-holes, after stifled bolt is fully inserted into, under the action of the spring, Opening sliding of the movable block picture to No. three through-holes, to push jacking block, jacking block, that is, extended No. three through-holes, in limited block and Under the clamping action of jacking block, No.1 spacing ring and No. two limits are fixed, if the later stage needs dismounting, only need to press Jacking block, then extract stifled bolt.
The phase that the present invention passes through structure between No.1 spacing ring, No.1 through-hole, No. two spacing rings, No. two through-holes and stifled bolt Mutually cooperation so that the gas feed tray in upper electrode is detached with connection ring, and stifled stud structure is special, need not employ it His auxiliary tool can then be completed to fix, and avoid when being installed using bolt and nut, damage and install caused by upper electrode Or it is cumbersome when dismounting.
Being uniformly arranged for No.1 through-hole and No. two through-holes, makes the present invention be more uniformly stressed, is conducive to upper electrode knot The stabilization of structure.
During being directed at No.1 through-hole and No. two through-holes, it is only necessary to gas feed tray is rotated, to drive No.1 to limit Position ring rotation, in rotation process, raised line can be inserted into groove, so that No.1 spacing ring is fixed with No. two spacing rings, And then the automatic aligning of No.1 through-hole and No. two through-holes is completed, it is cumbersome when avoiding artificial alignment.
Raised line and groove, which are V-type, can then facilitate raised line to be inserted into groove so that alignment procedure is more convenient.
Washer, which is arranged, then can increase the degree of combining closely of No.1 spacing ring and No. two limits.
Jacking block is equipped with smooth curved surface and stifled bolt is then facilitated to be inserted into out of No.1 through-hole and No. two through-holes.
The beneficial effects of the invention are as follows:The present invention provides a kind of semiconductor dry ecthing equipment divergence type upper electrode, Gas feed tray in upper electrode is to be detachably connected with connection ring, to facilitate the later stage to replace and repair, and install with And disassembly process is all extremely simple.
Description of the drawings
Fig. 1 is the upward view of gas feed tray in the present invention.
Fig. 2 is the vertical view of connection ring in the present invention.
Fig. 3 is the side view of gas feed tray in the present invention.
Fig. 4 is the connection diagram of gas feed tray and connection ring in the present invention.
Fig. 5 is the enlarged drawing of part A in the present invention.
Reference numeral:1- gas feed trays, 2- gas jetting holes, 3- No.1 spacing rings, 4- No.1 through-holes, 5- raised lines, 6- Connection ring, No. bis- spacing rings of 7-, No. bis- through-holes of 8-, 9- connecting holes, 10- grooves, 11- block up bolt, 12- limited blocks, and 13- tri- leads to Hole, 14- limit protrusions, 15- movable blocks, 16- springs, 17- jacking blocks, 18- washers.
Specific implementation mode
In order to make the technical means, the creative features, the aims and the efficiencies achieved by the present invention be easy to understand, tie below Specific embodiment is closed, the present invention is further explained, but following embodiments are only the preferred embodiment of the present invention, and not all. Based on the implementation example in the implementation mode, those skilled in the art's obtained other realities without making creative work Example is applied, protection scope of the present invention is belonged to.
As shown in Figs. 1-5, a kind of divergence type upper electrode of semiconductor dry ecthing equipment, including horizontally disposed gas supply To disk 1, gas feed tray 1 is uniformly provided with multiple gas jetting holes 2, and 1 coaxial sleeve of gas feed tray is equipped with connection ring 6, connection ring 6 Multiple connecting holes 9 are offered, 1 wall coaxial of gas feed tray is connected with No.1 spacing ring 3, and the ring body of No.1 spacing ring 3 opens up There are four No.1 through-holes 4, and No.1 through-hole 4 is longitudinally disposed, and 6 inner wall of connection ring is coaxially connected with No. two spacing rings 7, No. two spacing rings 7 are arranged below No.1 spacing ring 3, and No. two spacing rings 7 are opened up there are four No. two through-holes 8, No. two through-holes 8 and No.1 through-hole 4 Set corresponding, No.1 through-hole 4 and No. two through-holes 8 are arranged along place ring body even circumferential, No.1 through-hole 4 and No. two through-holes 8 It is inside inserted with stifled bolt 11 jointly, stifled 11 upper end of bolt is connected with limited block 12, and stifled bolt 11 is arranged with washer 18, and the setting of washer 18 is limiting Between position block 12 and No.1 through-hole 4, the lower end of stifled bolt 11 offers No. three through-holes 13, and No. three through-holes 13 are horizontally disposed, and No. three logical The opening in hole 13 is equipped with limit protrusion 14, and the both ends of No. three through-holes 13 are equipped with movable block 15, and movable block 15 passes through limit 14 limit of protrusion is equipped with spring 16, the both ends of spring 16 connect with movable block 15 respectively in No. three through-holes 13 in No. three through-holes 13 It touches, the one end of movable block 15 far from spring 16 is connected with jacking block 17, and jacking block 17 is arranged in the lower section of No. two through-holes 8, jacking block 17 One end far from No. two through-holes 8 is smooth curved surface;3 lower end of No.1 spacing ring is affixed, and there are four raised line 5,5 length directions of raised line Consistent with 3 diametric(al) of No.1 spacing ring, No. two 7 upper ends of spacing ring are opened up there are four groove 10, raised line 5 and 10 position phase of groove Corresponding, raised line 5 and groove 10 are V-type, and raised line 5 and groove 10 are arranged along place ring body even circumferential.
The present invention in use, first by No. two on the No.1 through-hole 4 and No. two spacing rings 7 on No.1 spacing ring 3 Through-hole 8 is aligned, and is inserted into stifled bolt 11, is inserted into during blocking up bolt 11, is first pressed the jacking block 17 at No. three 13 both ends of through-hole, make top Block 17 enters in No. three through-holes 13, and then stifled bolt 11 is inserted into No.1 through-hole 4 and No. two through-holes 8, when stifled bolt 11 is complete After insertion, under the action of the spring 16, movable block 15 is as the opening sliding to No. three through-holes 13, to push jacking block 17, top Block 17 is extended No. three through-holes 13, under the clamping action of limited block 12 and jacking block 17, No.1 spacing ring 3 and No. two limits Position 7 is fixed, only need to be by coping block 17 if the later stage needs dismounting, then extracts stifled bolt 11.
The basic principles, main features and advantages of the present invention have been shown and described above.The technology of the industry For personnel it should be appreciated that the present invention is not limited to the above embodiments, described in the above embodiment and specification is only the present invention Preference, be not intended to limit the present invention, without departing from the spirit and scope of the present invention, the present invention also has various Changes and improvements, these changes and improvements all fall within the protetion scope of the claimed invention.The claimed scope of the invention is by institute Attached claims and its equivalent thereof.

Claims (7)

1. a kind of divergence type upper electrode of semiconductor dry ecthing equipment, including horizontally disposed gas feed tray(1), the gas Body feed tray(1)It is uniformly provided with multiple gas jetting holes(2), the gas feed tray(1)Coaxial sleeve is equipped with connection ring(6), institute State connection ring(6)Offer multiple connecting holes(9), which is characterized in that the gas feed tray(1)Wall coaxial is connected with No.1 Spacing ring(3), the No.1 spacing ring(3)Ring body offer several No.1 through-holes(4), the No.1 through-hole(4)Longitudinal direction is set It sets, the connection ring(6)Inner wall is coaxially connected with No. two spacing rings(7), No. two spacing rings(7)Setting is limited in the No.1 Position ring(3)Lower section, No. two spacing rings(7)Offer several No. two through-holes(8), No. two through-holes(8)With the No.1 Through-hole(4)Position is corresponding, the No.1 through-hole(4)With No. two through-holes(8)It is inside inserted with stifled bolt jointly(11), described stifled Bolt(11)Upper end is connected with limited block(12), the stifled bolt(11)Lower end offer No. three through-holes(13), No. three through-holes (13)It is horizontally disposed, No. three through-holes(13)Opening be equipped with limit protrusion(14), No. three through-holes(13)Two End is equipped with movable block(15), the movable block(15)Pass through the limit protrusion(14)Limit is in No. three through-holes(13) It is interior, No. three through-holes(13)It is interior to be equipped with spring(16), the spring(16)Both ends respectively with the movable block(15)Contact, The movable block(15)Far from the spring(16)One end be connected with jacking block(17), the jacking block(17)It is arranged described two Number through-hole(8)Lower section.
2. a kind of divergence type upper electrode of semiconductor dry ecthing equipment according to claim 1, which is characterized in that described No.1 through-hole(4)And No. two through-holes(8)There are four being all provided with, the No.1 through-hole(4)And No. two through-holes(8) It is arranged along place ring body even circumferential.
3. a kind of divergence type upper electrode of semiconductor dry ecthing equipment according to claim 1, which is characterized in that described No.1 spacing ring(3)Lower end is connected with several raised lines(5), the raised line(5)Length direction and the No.1 spacing ring(3)Diameter Direction is consistent, No. two spacing rings(7)Upper end offers several grooves(10), the raised line(5)With the groove(10)Phase Matching.
4. a kind of divergence type upper electrode of semiconductor dry ecthing equipment according to claim 3, which is characterized in that described Raised line(5)And the groove(10)It is V-type.
5. a kind of divergence type upper electrode of semiconductor dry ecthing equipment according to claim 4, which is characterized in that described Raised line(5)And the groove(10)There are four being all provided with, the raised line(5)And the groove(10)Along place ring body circumference It is uniformly arranged.
6. a kind of divergence type upper electrode of semiconductor dry ecthing equipment according to claim 1, which is characterized in that described Stifled bolt(11)It is arranged with washer(18), the washer(18)It is arranged in the limited block(12)With the No.1 through-hole(4)Between.
7. a kind of divergence type upper electrode of semiconductor dry ecthing equipment according to claim 1, which is characterized in that described Jacking block(17)Far from No. two through-holes(8)One end be smooth curved surface.
CN201810477311.5A 2018-05-18 2018-05-18 A kind of divergence type upper electrode of semiconductor dry ecthing equipment Withdrawn CN108550537A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201810477311.5A CN108550537A (en) 2018-05-18 2018-05-18 A kind of divergence type upper electrode of semiconductor dry ecthing equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201810477311.5A CN108550537A (en) 2018-05-18 2018-05-18 A kind of divergence type upper electrode of semiconductor dry ecthing equipment

Publications (1)

Publication Number Publication Date
CN108550537A true CN108550537A (en) 2018-09-18

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201810477311.5A Withdrawn CN108550537A (en) 2018-05-18 2018-05-18 A kind of divergence type upper electrode of semiconductor dry ecthing equipment

Country Status (1)

Country Link
CN (1) CN108550537A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113078045A (en) * 2021-03-25 2021-07-06 重庆臻宝实业有限公司 Manufacturing method of ultra-large upper electrode for 14nm dry etching equipment

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113078045A (en) * 2021-03-25 2021-07-06 重庆臻宝实业有限公司 Manufacturing method of ultra-large upper electrode for 14nm dry etching equipment
CN113078045B (en) * 2021-03-25 2022-06-21 重庆臻宝实业有限公司 Manufacturing method of ultra-large upper electrode for 14nm dry etching equipment

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Application publication date: 20180918

WW01 Invention patent application withdrawn after publication