CN108541152A - A kind of shell and its manufacturing method - Google Patents
A kind of shell and its manufacturing method Download PDFInfo
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- CN108541152A CN108541152A CN201710129433.0A CN201710129433A CN108541152A CN 108541152 A CN108541152 A CN 108541152A CN 201710129433 A CN201710129433 A CN 201710129433A CN 108541152 A CN108541152 A CN 108541152A
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- layer
- shell body
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- rigidity
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/02—Anodisation
- C25D11/04—Anodisation of aluminium or alloys based thereon
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/02—Anodisation
- C25D11/022—Anodisation on selected surface areas
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0086—Casings, cabinets or drawers for electric apparatus portable, e.g. battery operated apparatus
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
The invention discloses a kind of shells, including：Plastic shell body；Metal layer and anodic oxide coating have been sequentially depositing in the plastic shell body；Wherein, the anodic oxide coating comprising barrier layer and has porous porous layer；The barrier layer is arranged between the metal layer and porous layer.The present invention also discloses a kind of manufacturing methods of shell.
Description
Technical field
The present invention relates to terminal technology more particularly to a kind of shell and its manufacturing methods.
Background technology
With the development of terminal technology, intelligent terminal increasingly has been favored by people.And simultaneously, in order to protect intelligent end
End, in addition for aesthetic purpose, each manufacturer are also increasingly tended to configure one to intelligent terminal (such as smart mobile phone etc.)
Metal shell, to attract the eyeball of consumer.
Currently, metal chassis is generally numerous by computer digital control machine tool (CNC) process and surface treatment procedure etc.
More processes can just manufacture, and the complexity of manufacturing process makes the yield of product relatively low, so by the shadow of manufacturing process
It rings, the production cost of metal chassis is very high, so that consumer is also required to pay higher purchase cost.
Invention content
To solve existing technical problem, a kind of shell of offer of the embodiment of the present invention and its manufacturing method, to solve
Metal chassis problem of high cost.
What the technical solution of the embodiment of the present invention was realized in：
An embodiment of the present invention provides a kind of shells, including：
Plastic shell body；
Metal layer and anodic oxide coating have been sequentially depositing in the plastic shell body；Wherein,
The anodic oxide coating is comprising barrier layer and has porous porous layer；The barrier layer is arranged in the metal layer
Between porous layer.
In said program, rigidity layer is additionally provided between the plastic shell body and the metal layer；The rigidity layer makes
The hardness for obtaining the shell reaches setting value.
In said program, basal layer is additionally provided between the plastic shell body and the rigidity layer, the basal layer is
Insulating layer.
In said program, the material of the basal layer is that transparent ultraviolet photo-curing paints.
In said program, the material of the rigidity layer is chromium or nickel.
In said program, dyestuff is filled in the hole of the porous layer of anodic oxide coating, the dyestuff is described for making
The color of setting is presented in shell.
In said program, coating is additionally provided on the porous layer；The coating is for stopping that dyestuff is precipitated.
In said program, the metal layer is aluminium layer；Correspondingly, the anodic oxide coating is alumina layer.
In said program, each layer has been sequentially depositing on the second surface of the plastic shell body；The plastic shell body
First surface is formed with the accommodating space of the shell；The second surface be the holding space for holding electronic equipment after appear
Surface out.
The embodiment of the present invention additionally provides a kind of manufacturing method of shell, including：
Plastic shell body is formed by plastic injection, and is embedded with conductive component in the plastic casing, the conductive part
Part manifests part in the first surface and second surface of the plastic shell body；The first surface is formed with accommodating space；
The second surface is the surface that reveals after the holding space for holding electronic equipment；
In the second surface deposited metal layer；The metal layer of deposition covers the second surface and metal parts；
The conductive component that first surface manifests is connect as electrode with the anode of anodic oxidation circuit, to have to deposition
The plastic shell body of metal layer carries out anodized, and anodic oxide coating is formed on the metal layer；Wherein,
The anodic oxide coating is comprising barrier layer and has porous porous layer；The barrier layer is arranged in the metal layer
Between porous layer.
In said program, before the second surface deposited metal layer, the method further includes：
Rigidity layer is deposited in the second surface；The rigidity layer makes the hardness of the shell reach setting value；Deposition
Rigidity layer cover the second surface and the conductive component；
Correspondingly, the metal layer is deposited on the rigidity layer.
In said program, before the second surface deposits rigidity layer, the method further includes：
In the second surface deposition substrate layer；The basal layer of deposition does not cover the surface of the conductive component；
Correspondingly, rigidity layer is deposited on the basal layer；The rigidity layer of deposition covers the basal layer and the conduction
Component.
It is described in the second surface deposition substrate layer in said program, including：
By way of spraying the basal layer is deposited in the second surface.
It is described to deposit the basal layer in the second surface by way of spraying in said program, including：
Transparent ultraviolet photo-curing paint is sprayed in the second surface；
Correspondingly, the ultraviolet photo-curing for being sprayed on the conductive component surface is painted into removal using laser.
In said program, the deposition rigidity layer, including：
The rigidity layer is deposited by way of vapor deposition.
It is described that plastic shell body is formed by plastic injection in said program, and it is embedded with conduction in the plastic casing
Component, including：
The conductive component is placed in a mold；
The plastics injection of flowing is placed in the mold of the conductive component；
The mold for being injected with flowing plastics is plasticized.
In said program, the deposited metal layer, including：
The metal layer is deposited by way of vapor deposition.
In said program, the method further includes：
Plastic shell body after deposition anode oxide layer is placed in staining trough and is dyed, makes dye molecule through porous
After layer absorption, it is filled in the hole of porous layer.
In said program, the method further includes：
Coating is formed in the plastic shell body filled with dyestuff；The coating is for stopping that dyestuff is precipitated.
In said program, the formation coating, including：
Plastic shell body after dyeing is put into distilled water, to form the coating；
Alternatively,
The coating is deposited in plastic shell body after dyeing by way of spraying.
Shell provided in an embodiment of the present invention and its manufacturing method form plastic shell body by plastic injection, and described
Conductive component is embedded in plastic casing, the conductive component appears in the first surface and second surface of the plastic shell body
Go out part；The first surface is formed with accommodating space；The second surface is aobvious after the holding space for holding electronic equipment
The surface exposed；In the second surface deposited metal layer；The metal layer of deposition covers the second surface and metal parts；
The conductive component that first surface manifests is connect as electrode with the anode of anodic oxidation circuit, to have metal layer to deposition
Plastic shell body carries out anodized, and anodic oxide coating is formed on the metal layer；Wherein, the anodic oxide coating packet
Containing barrier layer and there is porous porous layer；The barrier layer is arranged between the metal layer and porous layer, and the present invention is implemented
The solution process that example provides is simple, and process efficiency is high, at low cost, by plastic shell body after above-mentioned processing, the plastic housing
Metal layer and anodic oxide coating have been sequentially depositing on ontology；The anodic oxide coating includes barrier layer and has porous porous
Layer；The barrier layer is arranged between the metal layer and porous layer, and the shell of formation has the texture of metal shell, and shell
Entire surface is uniform, disclosure satisfy that the use demand of user, promotes user experience.
Description of the drawings
In attached drawing (it is not necessarily drawn to scale), similar reference numeral phase described in different views
As component.Similar reference numerals with different letter suffix can indicate the different examples of similar component.Attached drawing with example and
Unrestricted mode generally shows each embodiment discussed herein.
Fig. 1 is the manufacturing method flow diagram of one shell of the embodiment of the present invention；
Fig. 2 is the manufacturing method flow diagram of two shell of the embodiment of the present invention；
Fig. 3 is the shell structure schematic diagram after the completion of two step 201 of the embodiment of the present invention；
Fig. 4 is the shell structure schematic diagram after the completion of two step 202 of the embodiment of the present invention；
Fig. 5 is the shell structure schematic diagram after the completion of two step 203 of the embodiment of the present invention；
Fig. 6 is the shell structure schematic diagram after the completion of two step 204 of the embodiment of the present invention；
Fig. 7 is two step 205 Anodic Oxidation apparatus structure schematic diagram of the embodiment of the present invention；
Fig. 8 is the shell structure schematic diagram after the completion of two step 205 of the embodiment of the present invention；
Fig. 9 is titanium dioxide aluminium film microstructure schematic diagram of the embodiment of the present invention；
Figure 10 is dye molecule and porous layer mechanism schematic diagram in two step 206 of the embodiment of the present invention；
Figure 11 is the housing parts microstructure schematic diagram after the completion of two step 207 of the embodiment of the present invention；
Figure 12 is the shell structure schematic diagram after the completion of two step 207 of the embodiment of the present invention.
Specific implementation mode
The present invention is described in further detail again with reference to the accompanying drawings and embodiments.
On the one hand, metal chassis is generally required through numerous processes such as CNC processes and surface treatment procedure just at present
It can manufacture, it is extremely complex to manufacture, even if so with most stringent of control method, process yields are still low,
So as to cause holding at high price for metal chassis, consumer has paid additional cost thus.
Specifically, the material of metal chassis is mainly aluminum alloy materials at present, and the CNC by multiple tracks complexity processes journey
Sequence, and to its surface carry out anodized process after, obtain final metal chassis.Meanwhile to ensure terminal antenna
Radio-frequency performance must have partition on metalwork, and therefore, processing is complicated, and yield is low, of high cost, and antenna performance often meets
Not design objective.
On the other hand, injection molding shell is most economical shell, but plastic casing appearance is very low-grade, it is difficult to
Attract consumer.
It is one of industry research so how plastic casing to be surface-treated into the appearance as metal shell
Important directions.
Based on this, in various embodiments of the present invention：Plastic shell body, and the plastic housing are formed by plastic injection
Conductive component is embedded in body, the conductive component manifests portion in the first surface and second surface of the plastic shell body
Point；The first surface is formed with accommodating space；The second surface be the holding space for holding electronic equipment after manifest
The surface come；In the second surface deposited metal layer；The metal layer of deposition covers the second surface and metal parts；By
The conductive component that one surface open goes out is connect as electrode with the anode of anodic oxidation circuit, to there is the plastics of metal layer to deposition
Shell ontology carries out anodized, and anodic oxide coating is formed on the metal layer；Wherein, the anodic oxide coating includes resistance
Barrier and have porous porous layer；The barrier layer is arranged between the metal layer and porous layer.
Embodiment one
The embodiment of the present invention provides a kind of manufacturing method of shell, as shown in Figure 1, this method includes：
Step 101：Plastic shell body is formed by plastic injection；
Here, be embedded with conductive component in the plastic casing, the conductive component in the plastic shell body first
Surface and second surface manifest part.
Wherein, the first surface is formed with accommodating space；The second surface is that the holding space for holding electronics is set
The surface revealed after standby.
Specifically, the conductive component is placed in a mold；
The plastics injection of flowing is placed in the mold of the conductive component；
The mold for being injected with flowing plastics is plasticized.
Here, the effect of the conductive component is：As anode electrode when subsequent deposition anodic oxide coating, with cathode electrode
And power supply forms an electric pathway together, so as to deposition anode oxide layer.
When practical application, for application convenience and electric conductivity convenient, such as connect with positive pole, the conductive part
The shape of part can be column, and its number is at least one.In addition, the conductive component can be that electric conductivity is preferably golden
Belong to material, such as copper etc..
The material for forming the plastics of the plastic shell body can be acrylonitrile-butadiene-styrene copolymerisation object
(ABS), makrolon (PC) etc. does not have the plastics of self-lubricating function.
Here, the self-lubricating function refers to：Solid plastic itself has lubricating action.Modeling without self-lubricating function
Material refers to：Itself does not have the plastics of lubricating action.
Step 102：In the second surface deposited metal layer；
Here, the metal layer of deposition covers the second surface and metal parts.
In general, the hardness of plastics is poor compared with the hardness of metal, so in order to make the shell produced have metal-back
Some texture of body, so needing to do some modifications to plastic shell body, to make it have certain hardness.
Based on this, in one embodiment, before the second surface deposited metal layer, this method can also include：
Rigidity layer is deposited in the second surface；
Here, the rigidity layer makes the hardness of the shell reach setting value.The rigidity layer covering described second of deposition
Surface and the conductive component；
Correspondingly, the metal layer is deposited on the rigidity layer.
When practical application, the hardness number of shell can be determined as needed, then goes to deposit according to the hardness number of setting
The rigidity layer of respective thickness.
When practical application, (cannot with the naked eye be found out) under microcosmic by the plastic shell body surface of plastic injection formation is
Out-of-flatness, in order to keep the hardness layer surface of deposition smooth, smooth, just have to locate the surface of plastic shell body in advance
Reason.
Based on this, in one embodiment, before the second surface deposits rigidity layer, this method can also include：
In the second surface deposition substrate layer；The basal layer of deposition does not cover the surface of the conductive component；
Correspondingly, rigidity layer is deposited on the basal layer；The rigidity layer of deposition covers the basal layer and the conduction
Component.
The basal layer of deposition is completely attached to the second surface and the rigidity layer, and keeps the rigidity layer smooth.
Wherein, described in the second surface deposition substrate layer, including：
By way of spraying the basal layer is deposited in the second surface.
Here, the basal layer is insulating layer.
It is described to deposit the basal layer in the second surface by way of spraying, including：
Transparent ultraviolet photo-curing paint is sprayed in the second surface；
Correspondingly, the ultraviolet photo-curing for being sprayed on the conductive component surface is painted into removal using laser.
The basal layer of deposition provides enough adhesive force for the deposition of subsequent rigidity layer, is provided very well for its planarization
Basis so that manufacture shell have good appearance.
It is painted by spraying transparent ultraviolet photo-curing in the second surface, paint curing after ultraviolet light irradiation, from
And the basal layer is formed, deposition substrate layer, realization method are simple, at low cost in this way.
Wherein, using laser ablation be sprayed on the conductive component surface ultraviolet photo-curing paint purpose be：Make
Conductive component is contacted with rigidity layer, is prepared for deposition anode oxide layer.
The rigidity layer is formed by by deposited metal, it is possible to the hardness is deposited by way of vapor deposition
Layer.
Specifically, the target needed for deposition rigidity layer, and the plastic housing that preamble deposition will be completed are placed in evaporator
Ontology is placed on the setting position of evaporator, then sets deposition velocity and sedimentation time, after energization, item of the evaporator in vacuum
Heat target under part so that target is evaporated or is distilled under vacuum, the metal of evaporation or distillation in the second surface or
It is precipitated on basal layer, to form rigidity layer.
Here, when practical application, the material deposited used in rigidity layer can be chromium or nickel.Correspondingly, target is chromium or nickel.
Metal layer can also be deposited by way of vapor deposition.The specific implementation process class of deposited metal layer by way of vapor deposition
Seemingly, target (aluminium), is then placed in evaporator by the deposition thickness for first setting metal layer, and the plastics that will complete preamble deposition
Shell ontology is placed on the setting position of evaporator, and deposition velocity and sedimentation time, after energization, evaporator are set according to deposition thickness
Will on rigidity layer deposited metal layer.Deposition principle and the process of deposition rigidity layer are similar with principle, and which is not described herein again.
Step 103：The deposition anode oxide layer on the metal layer.
Wherein, the anodic oxide coating comprising barrier layer and has porous porous layer；The barrier layer is arranged described
Between metal layer and porous layer.
Here, due to wanting deposition anode oxide layer, and the anodic oxide coating more common when manufacturing shell is aluminium oxide
(Al2O3) layer, so metal layer is aluminium layer.
By way of anodic oxidation on the metal layer deposition anode oxide layer.
Specifically, the conductive component that first surface manifests is connect as electrode with the anode of anodic oxidation circuit, with
There is the plastic shell body of metal layer to carry out anodized deposition, anodic oxide coating is formed on the metal layer.
(it is electricity after conducting by conductive component and circuit that first surface manifests more specifically, after completing preamble deposition
Source) anode connection, and the cathode of circuit connect a metal electrode (such as stereotype), then place into oxidation pond, connect
Anode oxidation process is carried out after circuit passband.
Wherein, the sulfuric acid solution that mass percent concentration is 20% or so is generally filled in oxidation pond.
The basic principle of the mode of anodic oxidation is：In anode oxidation process, under the action of electric current, electrolysis production
Raw O2-Ion can be moved to positive pole, meanwhile, the aluminium on aluminium layer surface can with sulphuric acid production is biochemical reacts, in aluminium layer table
Face generates Al3+Ion, O2-Ion and Al3+Ions binding, to generate aluminium oxide, and the aluminium oxide generated can be molten by sulfuric acid
Solution, retrieves Al3+Ion, with the progress of time, the dissolving and generation of aluminium oxide reach dynamic equilibrium, to ultimately form
Alumina layer.
Wherein, the alumina layer of deposition includes barrier layer and porous layer；The barrier layer is arranged in metal layer and porous layer
Between.
In addition, in order to allow the shell produced that various colors are presented, it, can to meet a variety of demands of user
It is dyed so that the plastic shell body after deposition anode oxide layer to be placed in staining trough, dye molecule is made to be adsorbed through porous layer
Afterwards, it is filled in the hole of porous layer.
Here, when practical application, dyestuff is generally aromatic sulfonate sodium, is more specifically water-soluble azo dye
Material.
After dyeing is handled, dyestuff is filled in the hole of the porous layer of anodic oxide coating, the dyestuff is for making
The color of setting is presented in the shell.
In addition, in order to make the dyestuff in hole not to be precipitated that the color of shell is made to change, can also fill
Have and forms coating in the plastic shell body of dyestuff；The coating is for stopping that dyestuff is precipitated.
Wherein it is possible to form the coating by chemical mode, the coating can also be formed by physics mode.
Specifically, the process that chemical mode forms the coating includes：
Plastic shell body (plastic shell body for being filled with dyestuff) after dyeing is put into distilled water, porous layer surface layer is made
Aluminium oxide chemically reacted with hydrone, generate monohydrate alumina, due to monohydrate alumina density be less than oxidation
The density of aluminium in the hole to cover porous layer, and then forms the coating.That is, the coating setting exists
On the porous layer, coating can stop the precipitation of dyestuff, that is to say, that coating is for stopping that the dyestuff is precipitated.
The process that physics mode forms the coating includes：
The coating is deposited in plastic shell body after dyeing by way of spraying.
Wherein, the detailed process of the coating and the processing procedure for depositing the basal layer are deposited by way of spraying
It is similar.
Specifically, transparent ultraviolet photo-curing paint, oil after ultraviolet light irradiation can be sprayed on the plastic casing
Paint solidification, to form the coating.
Based on the above method, the embodiment of the present invention additionally provides a kind of shell, and the shell includes：
Plastic shell body；
Metal layer and anodic oxide coating have been sequentially depositing in the plastic shell body；Wherein,
The anodic oxide coating is comprising barrier layer and has porous porous layer；The barrier layer is arranged in the metal layer
Between porous layer.
Here, in one embodiment, it is additionally provided with rigidity layer between the plastic shell body and the metal layer；It is described hard
Degree layer makes the hardness of the shell reach setting value, so that the shell has certain hardness, to have metal shell
Some texture.
In one embodiment, basal layer, the base are also provided between the plastic shell body and the rigidity layer
Bottom is insulating layer, and the basal layer is completely attached to the plastic shell body and the rigidity layer, and keeps the rigidity layer flat
It is whole.
Wherein, the material of the basal layer is that transparent ultraviolet photo-curing paints.
In order to allow the shell produced that various colors are presented, to meet a variety of demands of user, in anode
Dyestuff, the color that the dyestuff is used to make the shell that setting be presented are filled in the hole of the porous layer of oxide layer.
Here, in order to make the dyestuff in gap not to be precipitated that the color of shell is made to change, on the porous layer
It is additionally provided with coating；The coating is for stopping that dyestuff is precipitated.
Above-mentioned each layer can be sequentially depositing when practical application, on the second surface of the plastic shell body；The modeling
The first surface of material shell ontology is formed with the accommodating space of the shell；The second surface is the holding space for holding electronics
The surface revealed after equipment.
Scheme provided in an embodiment of the present invention forms plastic shell body by plastic injection, and embedding in the plastic casing
Entering has conductive component, and the conductive component manifests part in the first surface and second surface of the plastic shell body；It is described
First surface is formed with accommodating space；The second surface is the table that reveals after the holding space for holding electronic equipment
Face；In the second surface deposited metal layer；The metal layer of deposition covers the second surface and metal parts；By first surface
The conductive component manifested is connect as electrode with the anode of anodic oxidation circuit, to there is the plastic shell body of metal layer to deposition
Anodized is carried out, anodic oxide coating is formed on the metal layer；Wherein, the anodic oxide coating include barrier layer and
With porous porous layer；The barrier layer is arranged between the metal layer and porous layer, side provided in an embodiment of the present invention
Case is simple for process, and process efficiency is high, at low cost, by plastic shell body after above-mentioned processing, in the plastic shell body successively
Deposition has metal layer and anodic oxide coating；The anodic oxide coating is comprising barrier layer and has porous porous layer；The blocking
Layer is arranged between the metal layer and porous layer, and the shell of formation has the texture of metal shell, and surface of shell is integrally equal
It is even, it disclosure satisfy that the use demand of user, promote user experience.
In addition, in the second surface deposition substrate layer；The basal layer of deposition does not cover the surface of the conductive component；Phase
Ying Di deposits rigidity layer on the basal layer；The rigidity layer of deposition covers the basal layer and the conductive component, formation
In shell, basal layer, the basal layer and the plastics are also provided between the plastic shell body and the rigidity layer
Shell ontology and the rigidity layer completely attach to, and keep the rigidity layer smooth, and basal layer can be that the deposition of subsequent rigidity layer carries
Enough adhesive force is supplied, the planarization for the rigidity layer of deposition provides excellent basis, so that the shell tool of manufacture
There is smooth appearance, promotes user experience.
Embodiment two
On the basis of embodiment one, the manufacturing process of shell and the structure of shell is described in detail in the present embodiment.
In this example, it is assumed that there are two conductive components.
The manufacturing process of shell, as shown in Fig. 2, including：
Step 201：Plastic shell body is formed by plastic injection；
Specifically, plastic shell body 11 is to utilize injection molding.In injection-moulded plastic, two are first placed in mold
Conductive component 12, after the completion of injection molding, two conductive components 12 just imbed in plastic shell body 11, as shown in figure 3, and in plastic housing
The upper and lower surface of ontology 11 reveals, and electrode is provided for subsequent anodic oxidation.
Step 202：In plastic shell body, deposition substrate layer；
Specifically, it the surface of plastic shell body 11 (shell houses the surface revealed after equipment), sprays transparent
Ultraviolet photo-curing paints (insulation), forms basal layer 21, the basal layer 21 to be formed as subsequent evaporation metal film layer (hard
Spend layer) enough adhesive force and good appearance are provided.After spraying, the paint laser carving deposited on two conductive components 12 is fallen
(using laser ablation), to expose conductive component 12, as shown in figure 4, in this way, subsequent anodic oxidation can be smoothed out.
Step 203：Rigidity layer is deposited on the base layer；
Specifically, by the plastic shell body 11 after the completion of step 2, it is put into evaporator, deposition hardness is hung up inside evaporator
The target (such as nickel or chromium) of layer after setting corresponding parameter, after evaporator is powered, deposits one layer on basal layer 21 automatically
Nickel or chromium, to form rigidity layer 31, as shown in Figure 5.
Step 204：The deposited metal layer on rigidity layer；
Specifically, by the plastic shell body 11 after the completion of step 203, it is put into evaporator, deposition gold is hung up inside evaporator
The target (aluminium) for belonging to layer after setting corresponding parameter, after evaporator is powered, deposits one layer of aluminium on basal layer 21 automatically, from
And metal layer 41 is formed, as shown in Figure 6.Metal layer 41 is that material base is established in the anodic oxidation of next step, as forms anode
Oxide layer establishes material base.
Step 205：Deposition anode oxide layer on the metal layer；
Specifically, as shown in fig. 7, the plastic shell body 11 (being known as part 51) after the completion of step 204 is connected on circuit 55
Anode (anode of conductive component 12 and circuit 55 is connect), connect stereotype 52 in the cathode of circuit 55, be then put into oxidation pond
Filled in 54, in oxidation pond mass percent concentration be 20% or so sulfuric acid solution 53, at normal temperatures, lead to direct current after i.e. into
Row anodic oxidation reactions process.
Wherein, conductive component 12 is connected by rigidity layer 31 and metal layer 41.
After anode oxidation process, as shown in figure 8, about 20 microns of 41 Surface Creation a layer thickness of metal layer is porous
The pellumina of shape, to form anodic oxide coating 61.
In conjunction with Fig. 9 as can be seen that the microstructure of pellumina includes：Barrier layer 62 and porous layer 63.
Step 206：Fill dyestuff；
Specifically, the plastic shell body 11 after the completion of step 205 is put into staining trough and is dyed, dye molecule 71 passes through
After porous layer 63 adsorbs, it is filled in the hole of porous layer 63, as shown in Figure 10, the dyestuff of filling can be such that surface of shell presents
Go out various colors.
Step 207：Form coating.
Specifically, the plastic shell body 11 after the completion of step 206 is put into distilled water, the temperature of distilled water be 80 DEG C with
On, so that superficial oxidation aluminium and water is carried out combination reaction, generates monohydrate alumina (Al2O3·H2O), to form coating 81,
As shown in figure 11, coating 81 plays the role of sealing of hole.
Here, since the density of the density ratio aluminium oxide of monohydrate alumina is small, volume increases, to clogging
The hole of porous layer 63 makes the dyestuff in hole that discoloration will not be precipitated, and the ability for making porous layer 63 lose absorption other materials.
After the completion of above step, then shell as shown in figure 12 is formed, in conjunction with Figure 12 as can be seen that plastic shell body 11 is embedding
Enter to have conductive component 12, and basal layer 21, rigidity layer 31, metal layer 41, sun are disposed on the surface of plastic shell body 11
Pole oxide layer 61 and coating 81.
View of the above, it will be seen that the embodiment of the present invention has carried out a series of processing to the surface of plastic shell body,
Obtained surface treatments include：The basal layer that sets gradually on plastic shell body surface, rigidity layer, metal layer, anodic oxygen
Change layer.
Using scheme provided in an embodiment of the present invention, surface treatment method is simple for process, and process efficiency is high, at low cost.And
And obtained plastic casing surface treatments have whole uniform appearance, color is vivid, texture it is strong (step 205~
It, will be with the texture of metal shell after the completion of step 206).
The foregoing is only a preferred embodiment of the present invention, is not intended to limit the scope of the present invention.
Claims (20)
1. a kind of shell, which is characterized in that the shell includes：
Plastic shell body；
Metal layer and anodic oxide coating have been sequentially depositing in the plastic shell body；Wherein,
The anodic oxide coating is comprising barrier layer and has porous porous layer；Barrier layer setting the metal layer with it is more
Between aperture layer.
2. shell according to claim 1, which is characterized in that
It is additionally provided with rigidity layer between the plastic shell body and the metal layer；The rigidity layer makes the hardness of the shell
Reach setting value.
3. shell according to claim 2, which is characterized in that also set up between the plastic shell body and the rigidity layer
It is insulating layer to have basal layer, the basal layer.
4. shell according to claim 3, which is characterized in that the material of the basal layer is transparent ultraviolet photo-curing
Paint.
5. shell according to claim 2, which is characterized in that the material of the rigidity layer is chromium or nickel.
6. shell according to any one of claims 1 to 5, which is characterized in that in the hole of the porous layer of anodic oxide coating
In be filled with dyestuff, the color that the dyestuff is used to make the shell that setting be presented.
7. shell according to claim 6, which is characterized in that be additionally provided with coating on the porous layer；The covering
Layer is for stopping that dyestuff is precipitated.
8. shell according to any one of claims 1 to 5, which is characterized in that the metal layer is aluminium layer；Correspondingly, institute
It is alumina layer to state anodic oxide coating.
9. shell according to any one of claims 1 to 5, which is characterized in that on the second surface of the plastic shell body
It has been sequentially depositing each layer；The first surface of the plastic shell body is formed with the accommodating space of the shell；The second surface
For the surface revealed after the holding space for holding electronic equipment.
10. a kind of manufacturing method of shell, which is characterized in that the method includes：
Plastic shell body is formed by plastic injection, and is embedded with conductive component in the plastic casing, the conductive component exists
The first surface and second surface of the plastic shell body manifest part；The first surface is formed with accommodating space；It is described
Second surface is the surface that reveals after the holding space for holding electronic equipment；
In the second surface deposited metal layer；The metal layer of deposition covers the second surface and metal parts；
The conductive component that first surface manifests is connect as electrode with the anode of anodic oxidation circuit, to have metal to deposition
The plastic shell body of layer carries out anodized, and anodic oxide coating is formed on the metal layer；Wherein,
The anodic oxide coating is comprising barrier layer and has porous porous layer；Barrier layer setting the metal layer with it is more
Between aperture layer.
11. described according to the method described in claim 10, it is characterized in that, before the second surface deposited metal layer
Method further includes：
Rigidity layer is deposited in the second surface；The rigidity layer makes the hardness of the shell reach setting value；What is deposited is hard
It spends layer and covers the second surface and the conductive component；
Correspondingly, the metal layer is deposited on the rigidity layer.
12. according to the method for claim 11, which is characterized in that described before the second surface deposits rigidity layer
Method further includes：
In the second surface deposition substrate layer；The basal layer of deposition does not cover the surface of the conductive component；
Correspondingly, rigidity layer is deposited on the basal layer；The rigidity layer of deposition covers the basal layer and the conductive component.
13. according to the method for claim 12, which is characterized in that it is described in the second surface deposition substrate layer, including：
By way of spraying the basal layer is deposited in the second surface.
14. according to the method for claim 13, which is characterized in that described heavy in the second surface by way of spraying
The product basal layer, including：
Transparent ultraviolet photo-curing paint is sprayed in the second surface；
Correspondingly, the ultraviolet photo-curing for being sprayed on the conductive component surface is painted into removal using laser.
15. according to claim 11 to 14 any one of them method, which is characterized in that the deposition rigidity layer, including：
The rigidity layer is deposited by way of vapor deposition.
16. according to the method described in claim 10, it is characterized in that, it is described by plastic injection formed plastic shell body, and
Conductive component is embedded in the plastic casing, including：
The conductive component is placed in a mold；
The plastics injection of flowing is placed in the mold of the conductive component；
The mold for being injected with flowing plastics is plasticized.
17. according to the method described in claim 10, it is characterized in that, the deposited metal layer, including：
The metal layer is deposited by way of vapor deposition.
18. according to the method described in claim 10,11,12,13,14,16 or 17, which is characterized in that the method further includes：
Plastic shell body after deposition anode oxide layer is placed in staining trough and is dyed, dye molecule is made to be inhaled through porous layer
It is attached, it is filled in the hole of porous layer.
19. according to the method for claim 18, which is characterized in that the method further includes：
Coating is formed in the plastic shell body filled with dyestuff；The coating is for stopping that dyestuff is precipitated.
20. according to the method for claim 19, which is characterized in that the formation coating, including：
Plastic shell body after dyeing is put into distilled water, to form the coating；
Alternatively,
The coating is deposited in plastic shell body after dyeing by way of spraying.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710129433.0A CN108541152A (en) | 2017-03-06 | 2017-03-06 | A kind of shell and its manufacturing method |
| PCT/CN2017/118390 WO2018161688A1 (en) | 2017-03-06 | 2017-12-25 | Housing, and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710129433.0A CN108541152A (en) | 2017-03-06 | 2017-03-06 | A kind of shell and its manufacturing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108541152A true CN108541152A (en) | 2018-09-14 |
Family
ID=63447311
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710129433.0A Withdrawn CN108541152A (en) | 2017-03-06 | 2017-03-06 | A kind of shell and its manufacturing method |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN108541152A (en) |
| WO (1) | WO2018161688A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113423213A (en) * | 2021-06-08 | 2021-09-21 | Oppo广东移动通信有限公司 | Shell assembly, preparation method thereof and electronic equipment |
| CN113602035A (en) * | 2021-07-29 | 2021-11-05 | Oppo广东移动通信有限公司 | Ceramic decorative film, preparation method thereof, shell assembly and electronic equipment |
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| US20030087071A1 (en) * | 2001-11-07 | 2003-05-08 | Che-Yuan Hsu | Cover structure for electronic device and method of manufacturing same |
| CN1419404A (en) * | 2001-11-13 | 2003-05-21 | 鸿富锦精密工业（深圳）有限公司 | Casing of electronic device |
| CN1474742A (en) * | 2000-09-18 | 2004-02-11 | 电子设备屏蔽公司 | Multi-layered structures and method for manufacturing multi-layered structures |
| CN102111969A (en) * | 2009-12-25 | 2011-06-29 | 深圳富泰宏精密工业有限公司 | Shell for electronic device |
| CN102950838A (en) * | 2011-08-19 | 2013-03-06 | 深圳富泰宏精密工业有限公司 | Housing and preparation method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105101688B (en) * | 2015-07-08 | 2019-03-15 | Oppo广东移动通信有限公司 | A kind of production method of shell and shell, mobile terminal using this method production |
| CN205829765U (en) * | 2016-07-11 | 2016-12-21 | 石狮市星火铝制品有限公司 | A kind of antibacterial mobile phone shell |
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- 2017-03-06 CN CN201710129433.0A patent/CN108541152A/en not_active Withdrawn
- 2017-12-25 WO PCT/CN2017/118390 patent/WO2018161688A1/en active Application Filing
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1474742A (en) * | 2000-09-18 | 2004-02-11 | 电子设备屏蔽公司 | Multi-layered structures and method for manufacturing multi-layered structures |
| US20030087071A1 (en) * | 2001-11-07 | 2003-05-08 | Che-Yuan Hsu | Cover structure for electronic device and method of manufacturing same |
| CN1419404A (en) * | 2001-11-13 | 2003-05-21 | 鸿富锦精密工业（深圳）有限公司 | Casing of electronic device |
| CN102111969A (en) * | 2009-12-25 | 2011-06-29 | 深圳富泰宏精密工业有限公司 | Shell for electronic device |
| CN102950838A (en) * | 2011-08-19 | 2013-03-06 | 深圳富泰宏精密工业有限公司 | Housing and preparation method thereof |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113423213A (en) * | 2021-06-08 | 2021-09-21 | Oppo广东移动通信有限公司 | Shell assembly, preparation method thereof and electronic equipment |
| CN113602035A (en) * | 2021-07-29 | 2021-11-05 | Oppo广东移动通信有限公司 | Ceramic decorative film, preparation method thereof, shell assembly and electronic equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2018161688A1 (en) | 2018-09-13 |
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Application publication date: 20180914 |