CN108541128B

CN108541128B - System for supplying thermal interface to printed circuit board

Info

Publication number: CN108541128B
Application number: CN201810174825.3A
Authority: CN
Inventors: D.P.库尔卡尼; R.S.阿奥基
Original assignee: Intel Corp
Current assignee: Intel Corp
Priority date: 2017-03-02
Filing date: 2018-03-02
Publication date: 2023-06-06
Anticipated expiration: 2038-03-02
Also published as: CN108541128A; US20180254237A1; US10074591B1

Abstract

A system for supplying a thermal interface to a printed circuit board. Embodiments of the present disclosure provide techniques and configurations for providing a thermal interface to a PCB. In some embodiments, a system for providing a thermal interface to a PCB may include a heat sink couplable to a Printed Circuit Board (PCB) via the thermal interface. The heat sink may include a base configured to house a plurality of heat pipes. The system may further include a heater block coupleable to the base having the plurality of heat pipes to conduct heat generated by the heater block to the base via the plurality of heat pipes to heat the thermal interface and cause the thermal interface to spread substantially uniformly between the heat sink and the PCB. Other embodiments may be described and/or claimed.

Description

System for supplying thermal interface to printed circuit board

Technical Field

Embodiments of the present disclosure relate generally to the field of printed circuit board manufacturing and, in particular, to a thermal interface (thermal interface) in a printed circuit board.

Background

Currently produced Integrated Circuits (ICs), such as processors, require higher power due to the increase in core count, performance, and integration of multiple dies. This high power can translate into higher heat density (heat density) on the die and package and requires a better thermal solution (thermal solution) to cool them. The exclusion zone (keep out zone) on a Printed Circuit Board (PCB) for placement of thermal solutions (e.g., heat sink) may be very limited and boundary conditions may be well defined and defined by american society of heating, refrigeration and air conditioning engineers (ASHRAE) guidelines. Cost limitations may also be critical to the design of new thermal technologies. All of these parameters can place a significant burden on the design of efficient thermal solutions.

Current thermal solutions for dissipation of IC (e.g., processor) generated heat involve the use of a thermal interface between the processor and the thermal solution (e.g., heat sink). The thermal interface may include a Thermal Interface Material (TIM). Typically, a TIM may be placed between an integrated heat spreader (integrated heat spreader) (IHS) and a heat dissipating device (e.g., a heat spreader) of a processor. However, in some cases, the thermal resistance of the thermal interface material in the thermal solution (thermal resistance) can become problematic. For example, for a processor with a die power exceeding 200W, the temperature difference across the TIM may vary between 10 degrees celsius and 12 degrees celsius. At the same time, if a reduction in processor temperature is achieved (even once), it can result in high gain and increased performance of the processor.

Drawings

The embodiments will be readily understood by the following detailed description in conjunction with the accompanying drawings. To facilitate this description, like reference numerals designate like structural elements. Embodiments are illustrated by way of example and not by way of limitation in the figures of the accompanying drawings.

Fig. 1-3 illustrate an example system for supplying a thermal interface to a Printed Circuit Board (PCB) assembly, according to some embodiments.

Fig. 4 illustrates some example components of the systems of fig. 1-3, according to some embodiments.

Fig. 5-7 illustrate perspective views of some components of the system of fig. 1-4 in various stages of assembly, according to some embodiments.

Fig. 8 illustrates a perspective view of an example system for supplying heat to a thermal interface of a PCB in a partially assembled state, according to some embodiments.

Fig. 9-10 illustrate perspective views of an example system for supplying heat to a thermal interface of a PCB in a fully assembled state, according to some embodiments.

Fig. 11-13 illustrate another example system for supplying heat to a thermal interface of a PCB, according to some embodiments.

Figure 14 is an example process flow diagram for providing a thermal interface for a PCB according to some embodiments.

Detailed Description

Embodiments of the present disclosure include techniques and configurations for providing a thermal interface to a PCB. In some embodiments, a system may include a heat sink coupleable to a Printed Circuit Board (PCB) via a thermal interface. The heat sink may include a base (base) configured to house a plurality of heat pipes (heat pipes). The system may further include a heater block coupleable to the base having the plurality of heat pipes to conduct heat generated by the heater block to the base via the plurality of heat pipes to heat the thermal interface and cause the thermal interface to spread substantially uniformly between the heat sink and the PCB.

In the following detailed description, reference is made to the accompanying drawings which form a part hereof wherein like numerals designate like parts throughout, and in which is shown by way of illustration embodiments in which the subject matter of the present disclosure may be practiced. It is to be understood that other embodiments may be utilized and structural or logical changes may be made without departing from the scope of the present disclosure. The following detailed description is, therefore, not to be taken in a limiting sense, and the scope of the embodiments is defined by the appended claims and their equivalents.

For the purposes of this disclosure, the phrase "a and/or B" means (a), (B), (a) or (B) or (a and B). For the purposes of this disclosure, the phrase "A, B and/or C" means (a), (B), (C), (a and B), (a and C), (B and C), or (A, B and C).

The description may use perspective-based descriptions such as top/bottom, inside/outside, on … …/under … …, and the like. Such descriptions are merely used to facilitate the discussion and are not intended to limit the application of the embodiments described herein to any particular orientation.

The description may use the phrases "in an embodiment" or "in embodiments," which may each refer to one or more of the same or different embodiments. Furthermore, the terms "comprising," "including," "having," and the like, as used with respect to embodiments of the present disclosure, are synonymous.

The term "coupled to … …" along with its derivatives may be used herein. "coupled" may mean one or more of the following. "coupled" may mean that two or more elements are in direct physical, electrical, or optical contact. However, "coupled" may also mean that two or more elements are in indirect contact with each other, but still cooperate or interact with each other, and may mean that one or more other elements are coupled or connected between elements referred to as being coupled to each other. The term "directly coupled" may mean that two or more elements are in direct contact.

Fig. 1-3 illustrate an example system for supplying a thermal interface to a PCB assembly according to some embodiments. More specifically, fig. 1-3 illustrate a system 100 in various stages of supplying a thermal interface to a PCB assembly 102. For ease of understanding, like components of fig. 1-3 are indicated by like reference numerals.

In an embodiment, the PCB assembly 102 may include a PCB 104 (e.g., a motherboard), a portion of which PCB 104 is shown in fig. 1-3. An Integrated Circuit (IC), such as a Central Processing Unit (CPU) or a memory unit, may be disposed on PCB 104 using socket 106 (e.g., a CPU socket). For example, an IC (e.g., CPU) may be placed within the socket. For this purpose, the socket 106 may be mounted on the PCB 104, as shown.

The substrate 108 may be provided in a socket 106 for an IC such as a CPU (not shown). In an embodiment, an IC such as a CPU may have an Integrated Heat Spreader (IHS) disposed on the substrate to provide an outlet (outlet) for heat that may be dissipated by the CPU (or other IC) during operation. For ease of explanation, the IC die on which the IHS is disposed will hereinafter be referred to as IHS 110. The PCB assembly 102 may further include or be coupled with thermal solutions to provide dissipation of heat generated by the CPU or other IC. In an embodiment, such a solution may include a heat sink 112 having a base 114 and a heat exchanger 116 disposed on top of the base 114. In some embodiments, to provide efficient heat dissipation, a CPU (or other type of IC) located in socket 106 may be thermally coupled with heat sink 112 via IHS 110 and thermal interface 120.

For embodiments, thermal interface 120 may include a Thermal Interface Material (TIM) such as, for example, a high thermal conductivity paste (paste). Thermal interface 120 may act as a filler (filer) when two objects having substantially planar surfaces, such as an IHS and bottom surface 122 of base 114, are brought into contact in response to attachment of heat spreader 112 to PCB assembly 102. In some examples, contact between base 114 and IHS 110 may include non-uniformities and air pockets trapped (trap) between the two surfaces, which may impede heat transfer between IHS 110 and heat spreader 112.

Thermal interface 120 may be used to improve thermal conductivity between IHS 110 and heat spreader 112, for example, by reducing the thermal resistance between PCB 102 and heat spreader 112. Thus, a thermal interface material (e.g., thermally conductive solder paste (TIM 2), such as Alpha OM-535) may be applied to the bottom surface 122 of the base 114 of the heat spreader 112 or to the IHS 110. The heat sink 112 may then be attached to the PCB 104. Thermal interface 120 may then be heated and welded between heat spreader base 114 and IHS 110. Accordingly, thermal interface 120 may be substantially uniformly spread between bottom surface 122 of base 114 and IHS 110, reducing thermal resistance between heat spreader 112 and PCB 104. Embodiments described herein may use an external heat source to provide a heat supply to the thermal interface 120, as described in detail below.

In an embodiment, base 114 may be configured to house (e.g., receive and/or include) a plurality of heat pipes 118 to provide heat to thermal interface 120. For example, the heat pipes 118 may be distributed around the bottom surface 122 of the base 114 in various ways.

As shown in fig. 1-2, once the heat sink 112 is mounted on the PCB 104, an external removable heater block 124 may be attached to the heat sink 112, as indicated by arrow 130. In an embodiment, the heater block may be configured to be coupled to (e.g., attached to) the heat pipe 118. As described below, in some embodiments, the heat pipe 118 may be removably attachable to the base 114. In some embodiments, heat pipe 118 may be attached to base 114 (embedded in base 114).

In some embodiments, as shown in fig. 3, the heat pipe 118 may be embedded in the base 114, and the heat pipe 118 may have a corresponding extension 126, which extension 126 may extend out of the base 114 (and away from the exclusion zone of the PCB 104). Thus, the heater block 124 may be removably attachable to the base 114 via the extension 126 of the heat pipe 118.

In some embodiments described below, the heat pipe 118 may be attached to the heater block 124, and the heat pipe 118 may include corresponding extensions that may extend out of the heater block 124. The heater block 124 may be removably attachable to the base 114 via an extension of the heat pipe 118, which extension of the heat pipe 118 may be received by the base 114 (e.g., in response to the extension of the heat pipe 118 being inserted into the base 114).

Heater block 124 may include embedded (or removable) heater elements (e.g., cartridges (cartridge) not shown in fig. 1-3). An external power source may be used to energize the cartridge during installation or removal. Thus, the heater block 124 may generate heat 132 generated by the heater element. Thus, heat pipe 118 may conduct this heat from heater block 124 to thermal interface 120 until the temperature reaches the solder paste melting point and reflows (reflows) (spreads substantially uniformly) between surface 122 of base 114 and IHS 110.

After the solder paste of thermal interface 120 has been melted and expanded, heater block 124 may be removed, as indicated by arrow 134 in FIG. 3, and system 100 may be allowed to cool down to effect the soldering of the thermal interface material between IHS 110 and heat spreader 112.

The described embodiments for the provision of a thermal interface to a PCB may have the following advantages compared to conventional solutions. For example, the overall stiffness (stillness) of the entire PCB assembly may be high due to the soldered portions as described above. Furthermore, the described embodiments may provide a reduction in thermal resistance of thermal interface materials for processors or other IC types through the application of solder highly thermally conductive paste (e.g., low temperature solder materials such as TIM 2).

The described embodiments may provide in situ (in situ) soldering of thermal interface material between IHS 110 and heat spreader 112 without any need to heat the entire system 100 with PCB assembly 102 (e.g., in an oven), and make it easier to service the system 100 with PCB assembly 102 when needed, without interrupting the (disrupt) manufacturing or verification process. The described embodiments may also minimize metal-to-metal contact resistance and may be used with multiple IHS structures having different heights.

Furthermore, the described embodiments may provide for an increase in die power, a reliable junction temperature (junction temperature) implementation with the same boundary conditions, and through the use of high thermal conductivity solder materials. The described embodiments may also be used with bare die structures, e.g., without IHS.

Further, embodiments that provide a heat pipe embedded in the heat sink base may be used to transfer heat from an external heat source (e.g., heater block 124) to thermal interface 120 for melting the solder material during installation and service, and also to act as a heat spreader during normal operating conditions.

In summary, the described embodiments may provide for the use of high thermal conductivity solder materials and heat pipes integrated in the base of the thermal solution to reduce thermal resistance between the thermal solution (e.g., heat spreader) and the PCB and provide cost savings compared to conventional solutions.

Fig. 4 illustrates some example components of the systems of fig. 1-3, according to some embodiments. More specifically, fig. 4 illustrates a perspective view of the heat sink 112 and the heater block 124 of the system 100 in a partially assembled state. As described above, the heat pipe 118 may be embedded in the base 114, shown with an exposed surface 122 for ease of understanding. A corresponding portion 402 of the heat pipe 118 may be disposed in the base 114, while a portion 404 (shown below reference numeral 126 in fig. 3) may extend out of the base 114 to reside outside the exclusion zone of the heat sink 112. For example, in some embodiments, portion 402 may be disposed substantially flush with surface 122 of base 114. In some embodiments, the portion 402 may have a substantially laterally flattened shape (flattened transverse shape) as compared to the substantially cylindrical shape of the extension portion 404.

For ease of understanding, the heat pipe is shown in fig. 4 as being extruded straight (straight) from the edge of base 114. In some embodiments, depending on the orientation of the heat sink 112 on the PCB, the extension 404 of the heat pipe 118 may be bent at various angles (as schematically illustrated by the dashed curve 406) to remain outside the exclusion zone of other components on the PCB (e.g., motherboard), such as voltage regulators, heat sinks, cables, or connectors. For example, the heat pipe may be bent up to 90 degrees and moved to the side of the heat sink, and the heater block may be mounted to the heat sink substantially perpendicularly with respect to the plane of the PCB via the heat pipe. In general, there may be several different ways in which a heat pipe may be installed to achieve the same result, such as heat transfer from an external heater block to a thermal interface.

As shown, the heater block 124 may include a bottom portion 408. The bottom portion 408 may be configured to receive a cartridge heater 410, which cartridge heater 410 may be insertable 412 within a corresponding receptacle (e.g., hole) 414 provided in the bottom portion 408. The heater block 124 may further include a top portion 416 couplable with the bottom portion 408 to receive the extension portion 404 of the heat pipe 118. As shown, when coupled together, the top portion 416 and the bottom portion 408 may form a receptacle (e.g., a through-hole defined by respective slots 418 and 420) to receive respective extensions of the heat pipe 118.

Fig. 5-7 illustrate perspective views of some components of the system of fig. 1-4 in various stages of assembly, according to some embodiments. For ease of understanding, the same components of fig. 1 to 4 and 5 to 7 are enumerated with the same reference numerals.

Fig. 5 illustrates heat sink 112 before heat pipe 118 may be attached to base 114. For ease of understanding, the heat sink 112 is shown in fig. 5-7 with the exposed surface 122 of the heat sink 112. Thus, in response to the heat sink 112 being attached to a PCB (not shown), the surface 122 may face the thermal interface 120.

As shown, the base 114 may include a plurality of receptacles 502 (e.g., slots) provided on the surface 122 of the base 114 to receive the portions 402 of the heat pipes 118. In some embodiments, the receptacle 502 may include a hole or aperture disposed in the base 114 to receive the portion 402 of the heat pipe 118.

Fig. 6 illustrates heat sink 112 after some of heat pipes 118 may be attached 602 to base 114. As can be seen in fig. 6, the portion 402 of the heat pipe 118 may have a slightly flattened shape compared to the portion 404 in order to fit into the receptacle 502.

Fig. 7 illustrates a heat sink 112 having a heat pipe 118 attached to a base 114. As described above, portion 404 may extend beyond heat sink 112 to couple to a heater block (not shown).

Fig. 8 illustrates a perspective view of an example system for supplying heat to a thermal interface of a PCB in a partially assembled state, according to some embodiments. In the embodiment illustrated in fig. 8, the heat pipe 118 may be attached to a heater block 124 of the system 100, as shown. For example, a receptacle similar to that described with reference to the heat sink in fig. 5 may be used to embed the heat pipe 118 in the heater block 124. As shown, the heat pipes 118 may have respective extensions 802 that may extend out of the heater block 124 to be received by the base 114 of the heat sink 112 in response to insertion 804 of the pipes 118 into respective receptacles 806 disposed in the base 114. Thus, the heater block 124 may be removably attachable to the base 114 via the extension 802 of the heat pipe 118. As shown, the portions 802 may be partially flat to fit into corresponding receptacles 806.

More specifically, fig. 9 illustrates a perspective view of the system 100 with the heat sink 112 and the heater block 124 attached to the heat sink 112. In this assembled state, the system 100 may be attached to a PCB, such as a motherboard, schematically indicated by dashed line 902. For example, once the processor and heat sink are mounted in sockets on a PCB, e.g., using a processor heat sink loading mechanism (loading mechanism retention) and using a thermal interface such as solder paste (e.g., TIM 2), heat sink 112 may be coupled with heater block 124 resulting in a supplied heat sink assembly with a thermal interface.

Fig. 10 illustrates another perspective view of the system 100 showing, for ease of understanding, the heat sink 112 with the exposed surface 122 of the base 114 and the heater block 124 with the exposed bottom portion 408 of the heater block 124. As discussed above, in some embodiments, the tube 118 may be attached to the heat sink 112 (embedded in the heat sink 112) and may be couplable to the heater block 124. In some embodiments, the tube 118 may be attached to the heater block 124 (embedded in the heater block 124) and may be coupleable to the heat sink 112. As discussed above, the tube 118 may include a substantially cylindrical shaped portion 404, and a substantially flat shaped portion 402 to fit into corresponding receptacles of the heater block 124 and the heat sink 112.

In the embodiments of the system described above, the heater block of the system may be attached to the base of a heat sink having heat pipes. In some embodiments, the system may include a heater block, which may be attachable to other portions of the heat sink, e.g., to a heat exchanger as described with reference to fig. 11-13.

FIG. 11 illustrates a perspective view of an example system for supplying heat to a thermal interface in a disassembled state, according to some embodiments. As shown, the system 1100 may include a heater block 1102 and a heat sink 1104. The system 1100 may be coupleable to a PCB 1110 via a thermal interface (indicated schematically by 1112) as described with reference to fig. 1-3. The heat sink 1104 may include a base 1106 and a heat exchanger 1108 disposed on the base 1106. The heater block 1102 may include a thermally conductive member 1114 couplable with the heat exchanger 1108 of the heat sink 1104, configured to conduct heat generated by the heater block 1102 to the base 1106 to heat the thermal interface 1112 (similar to 120 of fig. 1-3) and to cause the thermal interface 1112 to extend substantially uniformly between the heat sink 1104 and the PCB 1110.

As shown, the heat exchanger 1108 may include a plurality of fins (fin) 1116 for heat dissipation. In an embodiment, the thermally conductive member 1114 of the heater block 1102 may further comprise a plurality of fins 1118, which may be configured to receive the first plurality of fins in response to the heater block 1102 being attached to the heat sink 1104. In other words, when the heater block 1102 is attached to the heat sink 1104, the heat sinks 1118 may be interposed between the spaces formed between the heat sinks 1116.

In some embodiments, heat exchanger 1108 may include a plurality of pins (pins) configured to dissipate heat from PCB 1110. Accordingly, the thermally conductive member 1114 of the heater block 1102 may comprise a corresponding plurality of pins that may be arranged to interact with pins of the heat exchanger in response to the heater block 1102 being attached to the heat sink 1104.

In the embodiments described herein, the thermally conductive member 1114 may transfer heat provided by the heater block 1102 to the base 1106 for heating the thermal interface 1112. A heat sink 1118 (or pin, not shown) may be used as a heat pipe (heat conduit) to provide heat to base 1106.

Fig. 12-13 illustrate the system of fig. 11 in an assembled state, according to some embodiments. Fig. 12 provides a side view and fig. 13 provides a perspective view of the system 1100 of fig. 11. As shown, the fins 1118 of the thermally conductive member 1114 of the heater block 1102 may be insertable into corresponding spaces between the fins 1116 of the heat exchanger 1108 of the heat sink 1104.

The attachment of the heater block 1102 to the base 1106 may be accomplished in a number of different ways other than that described with reference to fig. 11-13. Further, the thermally conductive member 1114 may be provided in a number of different shapes to conduct heat from the heater block 1102 to the base 1106. Embodiments relating to heat sinks or pins described herein are not limiting to the present disclosure and are provided for purposes of explanation.

Figure 14 is an example process flow diagram for providing a thermal interface for a PCB according to some embodiments. Process 1400 may be consistent with the embodiments described with reference to fig. 1-10 and 11-13 of the present disclosure.

Process 1400 may begin at block 1402 and include disposing a thermal interface between a PCB and a thermal solution, such as a heat sink. Disposing the thermal interface may include disposing a socket on a PCB, providing a substrate in the socket, disposing an integrated circuit (e.g., CPU) with an Integrated Heat Spreader (IHS) on the substrate, and disposing a thermal interface material including the thermal interface on the IHS or on a surface of a base of the heat spreader facing the integrated circuit with the IHS.

At block 1404, process 1400 may include attaching a heat sink to the PCB.

At block 1406, process 1400 may include attaching the heater block to a base of a heat sink via a plurality of heat pipes that may be coupled to the heater block and the heat sink. In some embodiments, the heat pipe may be attached to (e.g., embedded in) the base, and coupling the heater block to the base may include connecting the heater block to the heat pipe.

In some embodiments, the heat pipe may be attached to (e.g., embedded in) the heater block, and coupling the heater block to the base may include connecting the heat pipe to the base.

At block 1408, process 1400 may include applying heat to the thermal interface, which may include causing the heater block to provide heat to the base to provide welding of the thermal interface.

At block 1410, the process 1410 may include disconnecting the heater block from the base after the thermal interface reaches a melting condition.

The embodiments described herein may be further illustrated by the following examples.

Example 1 may be a system comprising: a heat sink couplable to a Printed Circuit Board (PCB) via a thermal interface, wherein the heat sink comprises a base, wherein the base is to house a plurality of heat pipes; and a heater block couplable to the base having the plurality of heat pipes to conduct heat generated by the heater block to the base via the plurality of heat pipes to heat the thermal interface and cause the thermal interface to spread substantially uniformly between the heat sink and the PCB.

Example 2 may include the system of example 1, wherein the base includes a plurality of receptacles to receive respective ones of the plurality of heat pipes.

Example 3 may include the system of example 1, wherein the heat pipe is attached to the base, wherein the heat pipe has a corresponding extension that extends out of the base, and wherein the heater block is removably attachable to the base via the extension of the heat pipe.

Example 4 may include the system of example 2, wherein the heat pipe is attached to the heater block, wherein the heat pipe has a corresponding extension that extends out of the heater block, and wherein the heater block is removably attachable to the base via the extension of the heat pipe.

Example 5 may include the system of example 3, wherein the plurality of receptacles includes a plurality of grooves provided on a surface of a side of the base that would face the thermal interface in response to the heat sink being attached to the PCB.

Example 6 may include the system of example 2, wherein the plurality of receptacles includes a plurality of holes disposed in a side of the base that will face the thermal interface in response to the heat sink being attached to the PCB.

Example 7 may include the system of example 1, wherein the thermal interface comprises a Thermal Interface Material (TIM), wherein the TIM comprises a thermally conductive solder paste, wherein in response to the portion of the heat spreader being coupled to the PCB, the heat pipe conducts heat to the base to reflow the paste to reduce thermal resistance between at least a portion of the PCB and the heat spreader.

Example 8 may include the system of example 7, further comprising: a socket disposed in a portion of the PCB; a substrate disposed in the socket; and an integrated circuit having an Integrated Heat Spreader (IHS) disposed on the substrate, wherein a thermal interface material is disposed on the IHS to provide a thermal interface between the heat spreader and the integrated circuit in response to the portion of the heat spreader coupled to the PCB.

Example 9 may include the system of example 8, wherein the PCB comprises a motherboard, wherein the integrated circuit comprises a Central Processing Unit (CPU).

Example 10 may include the system of any of examples 1 to 9, wherein the heat pipe is to operate at a temperature equal to or exceeding 200 degrees celsius.

Example 11 may be a method for providing a thermal interface in a Printed Circuit Board (PCB), comprising: disposing a thermal interface between the PCB and the heat sink; attaching the heater block to a base of the heat sink via a plurality of heat pipes couplable to the heater block and the heat sink; and applying heat to the thermal interface, wherein applying heat includes causing the heater block to provide heat to the base to provide soldering of the thermal interface to cause a substantially uniform expansion of the thermal interface between the base and the PCB.

Example 12 may include the method of example 11, further comprising: a heat sink is attached to the PCB.

Example 13 may include the method of example 11, wherein providing a thermal interface comprises: providing a substrate; disposing an integrated circuit having an Integrated Heat Spreader (IHS) on a substrate; and disposing a thermal interface material on the IHS or on a side of the heat spreader facing the IHS.

Example 14 may include the method of any of examples 11 to 13, wherein the heat pipe is attached to the base, wherein coupling the heater block to the base of the heat sink via the plurality of heat pipes comprises connecting the heater block to the heat pipe.

Example 15 may include the method of any of examples 11 to 13, wherein the heat pipe is attached to the heater block, wherein coupling the heater block to the base of the heat sink via the plurality of heat pipes comprises connecting the heat pipe to the base.

Example 16 may include the method of example 13, further comprising: disconnecting the heater block from the base.

Example 17 may be a system, comprising: a heat sink couplable to a Printed Circuit Board (PCB) via a thermal interface, wherein the heat sink comprises a base and a heat exchanger disposed on the base; and a heater block having a thermally conductive member couplable with the heat exchanger of the heat sink to conduct heat generated by the heater block to the base of the heat sink to heat the thermal interface and cause the thermal interface to spread substantially uniformly between the heat sink and the PCB.

Example 18 may include the system of example 17, wherein the heat exchanger includes a first plurality of fins, wherein the thermally conductive member of the heater block includes a second plurality of fins arranged to receive the first plurality of fins in response to the heater block being attached to the heat sink.

Example 19 may include the system of example 18, wherein the fins of the thermally conductive member are insertable into corresponding spaces between the fins of the heat exchanger.

Example 20 may include the system of any of examples 17 to 19, wherein the heat exchanger includes a first plurality of fins, wherein the thermally conductive member of the heater block includes a second plurality of fins arranged to interact with the first plurality of fins in response to the heater block being attached to the heat sink.

Example 21 may include the system of any of examples 17-19, wherein the thermal interface comprises a Thermal Interface Material (TIM), wherein the TIM comprises a thermally conductive solder paste, wherein in response to the heat spreader being coupled to the portion of the PCB, the thermally conductive member will conduct heat to the base to reflow the paste to reduce thermal resistance between at least a portion of the PCB and the heat spreader.

Example 22 may include the system of example 21, further comprising: a socket disposed in a portion of the PCB; a substrate disposed in the socket; and an integrated circuit having an Integrated Heat Spreader (IHS) disposed on the substrate, wherein a thermal interface material is disposed on the IHS to provide a thermal interface between the heat spreader and the integrated circuit in response to the portion of the heat spreader coupled to the PCB.

Example 23 may include the system of example 22, wherein the integrated circuit comprises a central processing unit, wherein the PCB comprises a motherboard.

Various operations are described as multiple discrete operations in turn, in a manner that is most helpful in understanding the claimed subject matter. However, the order of description should not be construed as to imply that these operations are necessarily order dependent. Embodiments of the present disclosure may be implemented as a system using any suitable hardware and/or software to configure as desired.

Although certain embodiments have been illustrated and described herein for purposes of description, a wide variety of alternate and/or equivalent embodiments or implementations calculated to achieve the same purposes may be substituted for the embodiments shown and described without departing from the scope of the present disclosure. This application is intended to cover any adaptations or variations of the embodiments discussed herein. Thus, it is manifestly intended that the embodiments described herein be limited only by the claims and the equivalents thereof.

Claims

1. A system for providing a thermal interface in a Printed Circuit Board (PCB), comprising:

a heat spreader couplable to a Printed Circuit Board (PCB) via a thermal interface, wherein the thermal interface comprises a Thermal Interface Material (TIM), wherein the TIM comprises a thermally conductive solder paste, wherein the heat spreader comprises a base, wherein the base is to house a plurality of heat pipes; and

a heater block couplable to a base having a plurality of heat pipes to conduct heat generated by the heater block to the base via the plurality of heat pipes to heat the thermal interface and cause the thermal interface to spread evenly between the heat sink and the PCB, wherein in response to the portion of the heat sink coupled to the PCB, the heat pipes conduct heat to the base to cause the paste to reflow to reduce thermal resistance between at least a portion of the PCB and the heat sink.

2. The system of claim 1, wherein the base includes a plurality of receptacles to receive respective ones of the plurality of heat pipes.

3. The system of claim 1, wherein the heat pipe is attached to the base, wherein the heat pipe has a corresponding extension that extends out of the base, and wherein the heater block is removably attachable to the base via the extension of the heat pipe.

4. The system of claim 2, wherein the heat pipe is attached to the heater block, wherein the heat pipe has a corresponding extension that extends out of the heater block and wherein the heater block is removably attachable to the base via the extension of the heat pipe.

5. The system of claim 2, wherein the plurality of receptacles comprises a plurality of slots provided on a surface of a side of the base that will face the thermal interface in response to the heat sink being attached to the PCB.

6. The system of claim 2, wherein the plurality of receptacles comprises a plurality of holes disposed in a side of the base that will face the thermal interface in response to the heat sink being attached to the PCB.

7. The system of claim 1, further comprising:

a socket disposed in a portion of the PCB;

a substrate disposed in the socket; and

an integrated circuit having an Integrated Heat Spreader (IHS) disposed on a substrate, wherein a thermal interface material is disposed on the IHS to provide a thermal interface between the heat spreader and the integrated circuit in response to a portion of the heat spreader being coupled to the PCB.

8. The system of claim 7, wherein the PCB comprises a motherboard, wherein the integrated circuit comprises a Central Processing Unit (CPU).

9. The system of any one of claims 1 to 8, wherein the heat pipe is to operate at a temperature equal to or exceeding 200 degrees celsius.

10. A method for providing a thermal interface in a Printed Circuit Board (PCB), comprising:

disposing a thermal interface between the PCB and the heat spreader, wherein the thermal interface comprises a Thermal Interface Material (TIM), wherein the TIM comprises a thermally conductive solder paste;

attaching the heater block to a base of the heat sink via a plurality of heat pipes couplable to the heater block and the heat sink; and

applying heat to the thermal interface, wherein applying heat includes causing the heater block to provide heat to the base to provide soldering of the thermal interface to cause uniform expansion of the thermal interface between the base and the PCB, wherein in response to the portion of the heat sink being coupled to the PCB, the heat pipe conducts heat to the base to reflow the paste to reduce thermal resistance between at least a portion of the PCB and the heat sink.

11. The method of claim 10, further comprising: a heat sink is attached to the PCB.

12. The method of claim 10, wherein providing a thermal interface comprises:

providing a substrate;

disposing an integrated circuit having an Integrated Heat Spreader (IHS) on a substrate; and

the thermal interface material is disposed on the IHS or on a side of the heat spreader facing the IHS.

13. The method of any of claims 10 to 12, wherein the heat pipe is attached to the base, wherein coupling the heater block to the base of the heat sink via the plurality of heat pipes comprises connecting the heater block to the heat pipe.

14. The method of any of claims 10 to 12, wherein the heat pipe is attached to the heater block, wherein coupling the heater block to the base of the heat sink via the plurality of heat pipes comprises connecting the heat pipe to the base.

15. The method of claim 12, further comprising: disconnecting the heater block from the base.

16. A system for providing a thermal interface in a Printed Circuit Board (PCB), comprising:

a heat spreader couplable to a Printed Circuit Board (PCB) via a thermal interface, wherein the thermal interface comprises a Thermal Interface Material (TIM), wherein the TIM comprises a thermally conductive solder paste, wherein the heat spreader comprises a base and a heat exchanger disposed on the base; and

a heater block having a thermally conductive member couplable with the heat exchanger of the heat sink to conduct heat generated by the heater block to the base of the heat sink to heat the thermal interface and cause the thermal interface to spread evenly between the heat sink and the PCB, wherein in response to the portion of the heat sink being coupled to the PCB, the thermally conductive member will conduct heat to the base to cause the paste to reflow to reduce thermal resistance between at least a portion of the PCB and the heat sink.

17. The system of claim 16, wherein the heat exchanger comprises a first plurality of fins, wherein the thermally conductive member of the heater block comprises a second plurality of fins arranged to receive the first plurality of fins in response to the heater block being attached to the heat sink.

18. The system of claim 17, wherein the fins of the thermally conductive member are insertable into corresponding spaces between the fins of the heat exchanger.

19. The system of any of claims 16 to 18, wherein the heat exchanger comprises a first plurality of fins, wherein the thermally conductive member of the heater block comprises a second plurality of fins arranged to interact with the first plurality of fins in response to the heater block being attached to the heat sink.

20. The system of claim 16, further comprising:

a socket disposed in a portion of the PCB;

a substrate disposed in the socket; and

21. The system of claim 20, wherein the integrated circuit comprises a central processing unit, wherein the PCB comprises a motherboard.