CN108535830B

CN108535830B - Imaging module, camera assembly and electronic device

Info

Publication number: CN108535830B
Application number: CN201810613612.6A
Authority: CN
Inventors: 张弓
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2018-06-14
Filing date: 2018-06-14
Publication date: 2020-05-01
Anticipated expiration: 2038-06-14
Also published as: CN108535830A

Abstract

The invention provides an imaging module, a camera assembly and an electronic device. The imaging module of the embodiment of the invention comprises: the device comprises a shell, a moving element accommodated in the shell, a plurality of lenses fixed on the moving element in a contact mode, an image sensor arranged on one side of the lenses, and a driving mechanism for connecting the shell and the moving element, wherein the driving mechanism is used for driving the moving element to move along optical axes of the lenses so that the lenses can be focused and imaged on the image sensor. Among above-mentioned imaging module, camera subassembly and the electron device, a plurality of lenses snap-on are on the moving element for imaging module's spare part quantity is less, imaging module's simple structure, and the volume is littleer.

Description

Imaging module, camera assembly and electronic device

Technical Field

The present invention relates to the field of electronic devices, and in particular, to an imaging module, a camera assembly and an electronic device.

Background

As the mobile phone popularizes daily life of people, users have made higher demands on functions of the mobile phone, for example, the mobile phone tends to be light and thin, and for example, the mobile phone needs to obtain a better photographing effect. In the related art, in order to improve the photographing effect of the mobile phone, a periscopic lens is adopted in the camera of the mobile phone, and the periscopic camera can perform, for example, three times of optical focal length to obtain a better quality image. However, the periscopic camera has a complicated structure, which results in a large volume of the periscopic camera.

Disclosure of Invention

The invention provides an imaging module, a camera assembly and an electronic device.

The imaging module of the embodiment of the invention comprises:

a housing;

a moving element housed within the housing;

contacting a plurality of lenses secured to the moving element;

an image sensor disposed at one side of the plurality of lenses; and

a driving mechanism connecting the housing and the moving element, the driving mechanism being configured to drive the moving element to move along the optical axis of the plurality of lenses so as to image the plurality of lenses in focus on the image sensor.

The camera assembly comprises the imaging module of the embodiment, wherein the shell is provided with a light inlet, the imaging module further comprises a light conversion element arranged in the shell, and the light conversion element is used for converting incident light incident from the light inlet, then passing through the lenses and then transmitting the converted incident light to the image sensor.

The electronic device of the embodiment of the invention comprises a machine shell and the camera assembly of the embodiment, wherein the camera assembly is arranged on the machine shell.

Among above-mentioned imaging module, camera subassembly and the electron device, a plurality of lenses snap-on are on the moving element for imaging module's spare part quantity is less, imaging module's simple structure, and the volume is littleer.

Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.

Drawings

The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

FIG. 1 is a schematic plan view of an electronic device according to an embodiment of the invention;

FIG. 2 is a schematic perspective view of a camera assembly according to an embodiment of the present invention;

FIG. 3 is an exploded schematic view of a camera assembly according to an embodiment of the present invention;

FIG. 4 is a schematic perspective view of a trim piece according to an embodiment of the present invention;

FIG. 5 is an exploded view of an imaging module according to an embodiment of the present invention;

FIG. 6 is a schematic cross-sectional view of an imaging module according to an embodiment of the invention;

FIG. 7 is a schematic cross-sectional view of an imaging module according to another embodiment of the invention;

FIG. 8 is a schematic cross-sectional view A-A of the camera assembly of FIG. 2;

FIG. 9 is a schematic cross-sectional view of an imaging module of the prior art;

FIG. 10 is a schematic view of the configuration of some embodiments of the imaging module in cooperation with a decorative element;

fig. 11 is a schematic cross-sectional view of the electronic device of fig. 1 taken along direction B-B.

Description of the main element symbols:

the electronic device 1000, the chassis 102, the camera assembly 100, the imaging module 10, the housing 11, the light inlet 111, the groove 112, the top wall 113, the side 1132, the side wall 114, the moving element 12, the clip 112, the lens 13, the image sensor 14, the driving mechanism 15, the light conversion element 16, the mounting seat 17, the decoration 20, the through hole 21, the decoration ring 22, the convex edge 23, and the support 30.

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.

In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; may be mechanically connected, may be electrically connected or may be in communication with each other; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

The following disclosure provides many different embodiments or examples for implementing different features of the invention. To simplify the disclosure of the present invention, the components and arrangements of specific examples are described below. Of course, they are merely examples and are not intended to limit the present invention. Furthermore, the present invention may repeat reference numerals and/or letters in the various examples, such repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. In addition, the present invention provides examples of various specific processes and materials, but one of ordinary skill in the art may recognize applications of other processes and/or uses of other materials.

Referring to fig. 1, an electronic device 1000 according to an embodiment of the invention includes a housing 102 and a camera assembly 100. The camera assembly 100 is disposed on a chassis 102. The electronic device 1000 may be a mobile phone, a tablet computer, a notebook computer, an intelligent bracelet, an intelligent watch, an intelligent helmet, an intelligent glasses, and the like. The embodiment of the invention is described by taking the electronic device 1000 as a mobile phone as an example, and it is understood that the specific form of the electronic device 1000 may be other, and is not limited herein.

Specifically, the housing 102 is an external component of the electronic device 1000, which functions to protect internal components of the electronic device 1000. The housing 102 may be a rear cover of the electronic device 1000, which covers components of the electronic device 1000 such as a battery. In this embodiment, the camera assembly 100 is disposed at the rear, or the camera assembly 100 is disposed at the rear of the electronic device 1000 so that the electronic device 1000 can perform rear-view imaging. As in the example of fig. 1, the camera assembly 100 is disposed at an upper left corner of the housing 102. Of course, it is understood that the camera assembly 100 may be disposed at other locations, such as at the top-middle or top-right position of the housing 102. The position where the camera assembly 100 is provided in the chassis 102 is not limited to the example of the present invention.

Referring to fig. 6, an imaging module 10 according to an embodiment of the present invention includes a housing 11, a moving element 12 accommodated in the housing 11, and a plurality of lenses 13 fixed on the moving element 12 in a contact manner; an image sensor 14 disposed on one side of the plurality of lenses 13, and a driving mechanism 15 connecting the housing 11 and the moving element 12, the driving mechanism 15 being configured to drive the moving element 12 to move along the optical axis of the plurality of lenses 13 so as to focus the plurality of lenses 13 on the image sensor 14.

Referring to fig. 9, in the imaging module 10b of the prior art, the imaging module 10b includes a carrier 12a and a lens assembly 13a, the lens assembly 13a includes a lens barrel 13b and a lens 13c, and the lens 13c is fixed in the lens barrel 13 b. The lens assembly 13a is fixed to the carrier 12a by a lens barrel 13 b. The carrier 12a is connected with a driving mechanism 15a, the driving mechanism 15a can drive the carrier 12a to move in the housing 11a, and the carrier 12a drives the lens assembly 13a and thus the lens 13c to move correspondingly, so as to achieve the purpose of zooming. Since the carrier 12a and the lens barrel 13b have a certain thickness and occupy a considerable space of the imaging module 10b, the size of the lens 13c disposed in the lens assembly 13a or the size of the entire imaging module 10b may be affected.

As shown in fig. 6, in the imaging module 10 according to the embodiment of the present invention, the design of the lens barrel is eliminated, and the plurality of lenses 13 are directly fixed on the moving element 12 to form an integral structure with the moving element 12, so that the thickness of the imaging module 10 is reduced.

Certainly, under the condition that the size of the original imaging module 10 is not changed, the plurality of lenses 13 can also be adaptively increased to increase the effective optical aperture of the lenses 13, so as to obtain a better optical effect. Or under the condition that the original optical lens 13 is kept unchanged, the height of the imaging module 10 is reduced, so that the number of parts of the imaging module 10 is less, the structure of the imaging module 10 is simple, and the volume is smaller.

Referring to fig. 6, in some embodiments, the moving element 12 is cylindrical, and a plurality of lenses 13 are fixed in the moving element 12 at intervals along the axial direction of the moving element 12; referring to fig. 7, alternatively, the moving element 12 includes two clips 122, and the two clips 122 clamp the plurality of lenses 13.

It can be understood that, because the moving element 12 is used for fixedly arranging the lenses 13 arranged at a plurality of intervals, the length of the moving element 12 is large, and the moving element 12 can be cylindrical or square cylindrical and has a certain cavity shape, so that the moving element 12 is in a cylindrical shape and can be better provided with a plurality of lenses 13, and the lenses 13 can be better protected in the cavity, so that the lenses 13 are not easy to shake.

In addition, the moving element 12 is formed by two clamping pieces for clamping the plurality of lenses 13 between the two clamping pieces, so that not only is certain stability achieved, but also the weight of the moving element 12 can be reduced, the power required by the driving structure for driving the moving element 12 can be reduced, the design difficulty of the moving element 12 is low, and the lenses 13 are easy to arrange on the moving element 12.

Of course, the moving element 12 is not limited to the above mentioned cylindrical shape and two clips, and in other embodiments, the moving element 12 may include three, four, etc. more clips to form a more stable structure, or a simpler structure such as one clip; or a rectangular body, a circular body, or the like, having a cavity for accommodating the various regular or irregular shapes of the lens 13. On the premise of ensuring normal imaging and operation of the imaging module 10, the specific selection is only needed.

The image sensor 14 may employ a Complementary Metal Oxide Semiconductor (CMOS) photosensitive element or a Charge-coupled Device (CCD) photosensitive element.

In some embodiments, the plurality of lenses 13 are adhesively secured to the moving element 12 by an adhesive.

The mode of viscose bonding is comparatively simple and easy, easy to carry out, and possesses better fixed effect.

In one embodiment, the plurality of lenses 13 may be secured within the moving element 12 by a threaded fit. Specifically, a thread adapted to the edge of the plurality of lenses 13 may be designed in the moving element 12, for example, a suction cup may be used to suck one side of the lenses 13, and then the plurality of lenses 13 may be screwed into the moving element 12 along the thread, so that the repeatability is high, the stability is good, and the connection structure between the lenses 13 and the moving element 12 does not need to be damaged.

In certain embodiments, the drive mechanism 15 is an electromagnetic drive mechanism, a piezoelectric drive mechanism, or a memory alloy drive mechanism.

Specifically, the electromagnetic driving mechanism includes a magnetic field and a conductor, if the magnetic field moves relative to the conductor, an induced current is generated in the conductor, the induced current makes the conductor subject to an ampere force, and the ampere force makes the conductor move, where the conductor is a part of the electromagnetic driving mechanism that drives the moving element 12 to move; the piezoelectric driving mechanism is based on the inverse piezoelectric effect of the piezoelectric ceramic material: if voltage is applied to the piezoelectric material, mechanical stress is generated, namely, the electric energy and the mechanical energy are converted, and the rotation or linear motion is generated by controlling the mechanical deformation of the piezoelectric material, so that the piezoelectric material has the advantages of simple structure and low speed.

The driving of the memory alloy driving mechanism is based on the characteristics of the shape memory alloy: the shape memory alloy is a special alloy which, once it has memorized any shape, even if deformed, can recover to the shape before deformation when heated to a certain proper temperature, thereby achieving the purpose of driving, and has the characteristics of rapid displacement and free direction.

Referring to fig. 6, in some embodiments, the imaging module 10 includes a light diverting element 16 disposed in the housing 11, and the light diverting element 16 is configured to divert incident light incident from outside the housing 11 to pass through the plurality of lenses 13 and then to the image sensor 14.

More, the light transfer element 16 is a prism or a plane mirror. In one example, when light-turning element 16 is a prism, the prism may be a triangular prism having a cross-section in the form of a right triangle, wherein light is incident on one of the legs of the right triangle and exits the other leg after being reflected by the hypotenuse. It will be appreciated that, of course, the incident light may exit after being refracted by the prism, without being reflected. The prism can be made of glass, plastic and other materials with better light transmittance. In one embodiment, one of the surfaces of the prism may be coated with a light reflecting material such as silver to reflect incident light.

It will be appreciated that when the light conversion element 16 is a flat mirror, the flat mirror reflects incident light to effect the conversion of the incident light.

In some embodiments, the imaging module 10 includes a mounting seat 17 received in the housing 11, and the light conversion element 16 is fixed to the mounting seat 17.

The mounting seat 17 is used for mounting the light conversion element 16, or the mounting seat 17 is a carrier of the light conversion element 16, and the light conversion element 16 is fixedly arranged on the mounting seat 17. This allows the position of the light-diverting element 16 to be determined in favour of the light-diverting element 16 reflecting or refracting the incident light. The light conversion element 16 can be fixed on the mounting seat 17 by using an adhesive bonding to realize a fixed connection with the mounting seat 17.

In some embodiments, the mounting seat 17 can rotate relative to the housing 11 to adjust the light-converting element 16 to convert the direction of the incident light, so that the imaging module 10 can achieve optical anti-shake.

Specifically, the mounting seat 17 is movably disposed in the housing 11, and the mounting seat 17 can rotate relative to the housing 11 to adjust a direction in which the light conversion element 16 converts incident light, so that the imaging module 10 can achieve optical anti-shake. When the imaging module 10 shoots, if the imaging module 10 shakes, the image sensor 14 cannot acquire a stable image, and the quality of the formed image is poor. The mounting seat 17 can drive the light conversion element 16 to rotate together in the opposite direction of the shake of the imaging module 10, so as to compensate the incident deviation of the incident light and realize the optical anti-shake effect. The mounting seat 17 may be connected to a driving mechanism 15, and the driving mechanism 15 may drive the mounting seat 17 to rotate.

In the present embodiment, the imaging module 10 includes a housing 11, a moving element 12, a lens 13, an image sensor 14, a driving mechanism 15, a light conversion element 16, and a mounting base 17. The moving element 12, the lens 13, the driving mechanism 15, the light conversion element 16 and the mounting 17 are all arranged in the housing 11. The light conversion element 16 is arranged on the mounting seat 17, and the lens 13 is accommodated in the moving element 12. After entering the housing 11, the incident light is turned by the light-turning element 16 and then reaches the image sensor 14 through the lens 13, so that the image sensor 14 obtains an external image.

The lens 13 is accommodated in the moving element 12, and further, the moving element 12 is disposed between the light conversion element 16 and the image sensor 14. The mirror 13 is used to image incident light onto the image sensor 14. This allows the image sensor 14 to obtain a better quality image.

The moving element 12 carries the lens 13 to integrally move along the optical axis of the lens 13, so that an image can be formed on the image sensor 14, and the focusing of the imaging module 10 is realized. The moving element 12 includes a plurality of lenses 13, and when at least one lens 13 moves relative to the other lenses, the overall focal length of the imaging module 10 changes, so as to implement the function of zooming of the imaging module 10.

Referring to fig. 5 and 8, a camera assembly 100 according to an embodiment of the present invention includes the imaging module 10 according to any one of the above embodiments, the housing 11 has a light inlet 111, the imaging module 10 further includes a light conversion element 16 disposed in the housing 11, and the light conversion element 16 is configured to convert incident light incident from the light inlet 111 to pass through the plurality of lenses 13 and then transmit the converted incident light to the image sensor 14.

In one example, the light diverting element 16 diverts incident light incident from the light inlet 111 by an angle of 90 degrees. For example, the incident angle of the incident light on the emitting surface of the light conversion element 16 is 45 degrees, and the reflection angle is also 45 degrees. Of course, the angle at which the light diverting element 16 diverts the incident light may be other angles, such as 80 degrees or 100 degrees, as long as the incident light can be diverted to reach the image sensor 14.

In the present embodiment, the number of the light diverting elements 16 is one, and in this case, the incident light is once diverted and then transmitted to the image sensor 14. In other embodiments, the number of the light diverting elements 16 is multiple, and the incident light is diverted to the image sensor 14 at least twice.

Referring to fig. 2, 8 and 11, in some embodiments, in the width direction of the imaging module 10, a groove 112 is formed on one side of the light inlet 111 of the housing 11, the camera assembly 100 further includes a decoration 20, the decoration 20 is covered above the light inlet 111 and partially clamped in the groove 112, a through hole 21 is formed in the decoration 20, the light inlet 111 is exposed through the through hole 21, and the imaging module 10 collects an external image through the through hole 21.

The housing 11 is substantially square, the housing 11 is provided with a light inlet 111, and the incident light enters the imaging module 10 through the light inlet 111. That is, the light diverting element 16 is used to divert incident light entering from the light inlet 111 and then pass the diverted incident light to the image sensor 14. Therefore, it can be understood that the imaging module 10 is a periscopic lens module, and the height of the periscopic lens module is smaller than that of the vertical lens module, so that the overall thickness of the electronic device 1000 can be reduced. The vertical lens module means that the optical axis of the lens module is a straight line, or the incident light is transmitted to the photosensitive device of the lens module along the direction of the straight line optical axis.

It can be understood that the decoration 20 is disposed on the housing 102 and protrudes from the surface of the housing 102, and the light inlet 111 is exposed through the through hole 21, so that external light enters the imaging module 10 through the light inlet 111 after passing through the through hole 21.

The decoration 20 may be made of a metal material, for example, the decoration 20 may be made of stainless steel, and the decoration 20 may be processed by a polishing process to form a bright surface so that the decoration 20 is more beautiful.

Referring to fig. 8, in the present embodiment, in the width direction of the imaging module 10, a groove 112 is formed on one side of the light inlet 111 of the housing 11, and the decoration 20 is covered on the light inlet 111 and partially inserted into the groove 112.

Referring to fig. 10, if the recess is omitted, in order to make the overall thickness of the electronic device thinner, the periscopic imaging module 10a partially extends into the decoration 20a in the width direction, and since the width of the periscopic imaging module 10a is larger than that of the vertical imaging module 10a, the size of the decoration 20a is larger, which is not favorable for the beauty of the electronic device, and the electronic device is not compact enough.

In this embodiment, the groove 112 is formed on one side of the light inlet 111, and the decoration 20 is covered above the light inlet 111 and partially clamped into the groove 112, so that not only the width of the decoration 20 is small, but also the overall height of the camera assembly 100 is reduced, which is beneficial to the compact structure and miniaturization of the camera assembly 100.

Referring to fig. 5, in some embodiments, the housing 11 includes a top wall 113 and a side wall 114 extending from a side 1132 of the top wall 113, the light inlet 111 is formed on the top wall 113, the groove 112 is formed at a connection between the top wall 113 and the side wall 114, and the decoration 20 abuts against the top wall 113.

The light inlet 111 is formed in the top wall 113, the groove 112 is formed at the junction of the top wall 113 and the side wall 114, and the decoration 20 abuts on the top wall 113. In this manner, the groove 112 is easily formed, facilitating the manufacture of the housing 11. In one example, the groove 112 is a profiling of the housing 11, i.e., the groove 112 may be formed by stamping.

In one example, a portion of the bottom of the bezel 22 is received in the recess 112 and a portion of the bezel 22 rests against the top wall 113. Alternatively, the bezel 22 and the housing 11 form a complementary structure, and the bezel 22 and the housing 11 are engaged with each other, so that the fitting structure of the decoration 20 and the housing 11 is more compact.

In some embodiments, the groove 112 is elongated, and the groove 112 extends along the length direction of the imaging module 10; or the groove 112 is arc-shaped, and the groove 112 surrounds the light inlet 111.

In this manner, the recess 112 mates more compactly with the trim piece 20. In some embodiments, the groove 112 may be arc-shaped, and the arc-shaped groove 112 surrounds the light inlet 111. Of course, in other embodiments, the structure and shape of the recess 112 are not limited to the above-described examples, as long as the garnish 20 and the first imaging module 10 are made to form a complementary structure to reduce the size of the garnish 20.

In some embodiments, the number of the side walls 114 is two, the top wall 113 includes the opposite side edges 1132, each side wall 114 extends from a corresponding one of the side edges 1132, and a groove 112 is formed at a connection point of each side wall 114 and the top wall 113.

Alternatively, the sidewalls 114 are connected to opposite sides of the top wall 113. In this embodiment, a groove 112 is formed at the junction of each side wall 114 and the top wall 113. Alternatively, the number of the grooves 112 is two. Of course, in an embodiment thereof, the number of the grooves 112 may also be single, that is, the groove 112 is formed at the junction of one of the side walls 114 and the top wall 113.

Referring to fig. 4 and 5, in some embodiments, the decoration 20 includes a decoration ring 22 and a convex edge 23 extending from the bottom of the decoration ring 22 to a direction away from the decoration ring 22, a portion of the bottom of the decoration ring 22 is received in the groove 112, and a portion of the decoration ring 22 abuts against the top wall 113.

The through hole 21 is formed in the decorative ring 22 and penetrates through the decorative ring 22 and the flange 23, the decorative ring 22 is mounted on the housing 102, and the flange 23 abuts against the housing 102. Thus, the flange 23 can limit the position of the decoration 20 and prevent the decoration 20 from moving out of the housing 102. In one example, the garnish 20 is inserted outwardly from the interior of the housing 102 when the garnish 20 is installed, and the garnish 20 is installed in a predetermined position when the collar 23 abuts against the interior surface of the housing 102. The decoration 20 can be fixed on the case 102 by using an adhesive, or the decoration 20 can be in interference fit with the case 102, so that the decoration 20 is not easy to fall off from the case 102.

The ornament 20 may be an integrally formed structure formed by the ornament ring 22 and the flange 23, for example, the ornament 20 is manufactured by cutting. In addition, the decorative ring 22 and the raised edge 23 may be separate structures, or the decorative ring 22 and the raised edge 23 are formed as two separate elements and then assembled together by welding or the like to form the decorative member 20.

It should be noted that in other embodiments, the collar 23 may be omitted, that is, in this embodiment, the decorative piece 20 includes only the configuration of the bezel 22.

Referring to fig. 3, the camera assembly 100 includes a decoration 20, an imaging module 10, and a bracket 30. The imaging module 10 is disposed inside the housing 102. The imaging module 10 is disposed adjacent to the trim piece 20. The imaging module 10 is disposed in the bracket 30 and is fixedly connected to the bracket 30. The garnish 20 is disposed above the bracket 30, and specifically, the garnish 20 may abut on the bracket 30 or may be disposed spaced apart from the bracket 30. The bracket 30 can reduce the impact on the imaging module 10 and improve the service life of the imaging module 10.

The decoration 20 is formed with a through hole 21, and the imaging module 10 is exposed from the through hole 21 to the decoration 20, or the imaging module 10 captures an external image through the through hole 21. Specifically, in the present embodiment, the through-hole 21 is a circular hole in other embodiments, the shape of the through-hole 21 is not limited to the shape shown in the drawings. For example, it may be a square hole.

In the description herein, references to the description of the terms "one embodiment," "certain embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

While embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A camera head assembly, comprising:

the imaging module includes:

the shell is provided with a light inlet;

a moving element housed within the housing;

the moving element comprises two clamping pieces which clamp the plurality of lenses, and the plurality of lenses and the moving element are of an integral structure;

an image sensor disposed at one side of the plurality of lenses; and

the driving mechanism is used for driving the motion element to move along the optical axis of the lenses so as to enable the lenses to be focused and imaged on the image sensor, and the imaging module further comprises a light conversion element arranged in the housing, wherein the light conversion element is used for converting incident light incident from the light inlet, then passing through the lenses and then transmitting the converted incident light to the image sensor;

in the width direction of the imaging module, a groove is formed in one side of the light inlet of the shell, the camera component further comprises a decoration piece, the decoration piece covers the light inlet and is partially clamped into the groove, a through hole is formed in the decoration piece, the light inlet is exposed out of the through hole, and the imaging module collects external images through the through hole;

the shell comprises a top wall and a side wall formed by extending from the side edge of the top wall, the light inlet is formed in the top wall, the groove is formed at the joint of the top wall and the side wall, and the decorative piece is abutted against the top wall.

2. A camera assembly according to claim 1, wherein said plurality of lenses are adhesively secured to said moving element by adhesive.

3. A camera assembly according to claim 1, wherein the drive mechanism is an electromagnetic drive mechanism, a piezoelectric drive mechanism or a memory alloy drive mechanism.

4. A camera assembly according to claim 1, wherein said imaging module includes a mount received in said housing, said light conversion element being secured to said mount.

5. The camera assembly of claim 4, wherein the mount is rotatable relative to the housing to adjust the light-converting element to divert the direction of the incident light, thereby enabling the imaging module to achieve optical anti-shake.

6. The camera assembly of claim 1, wherein said recess is elongated, said recess extending along a length of said imaging module; or

The groove is arc-shaped and surrounds the light inlet.

7. The camera assembly of claim 1, wherein the number of side walls is two, the top wall includes two opposing side edges, each side wall extends from a corresponding one of the side edges, and the recess is formed at a junction of each side wall and the top wall.

8. The camera assembly of claim 1, wherein the ornamental piece includes a decorative ring and a flange extending away from a bottom of the decorative ring, a portion of the bottom of the decorative ring being received in the recess, the decorative ring portion abutting against the top wall.

9. An electronic device, comprising:

a housing; and

the camera assembly of any of claims 1-8, disposed on the chassis.