CN108521541B - Camera component and electronic device applying same - Google Patents
Camera component and electronic device applying same Download PDFInfo
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- CN108521541B CN108521541B CN201810613614.5A CN201810613614A CN108521541B CN 108521541 B CN108521541 B CN 108521541B CN 201810613614 A CN201810613614 A CN 201810613614A CN 108521541 B CN108521541 B CN 108521541B
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- imaging module
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- housing
- camera assembly
- image sensor
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- 238000003384 imaging method Methods 0.000 claims abstract description 106
- 238000005034 decoration Methods 0.000 claims abstract description 43
- 238000006243 chemical reaction Methods 0.000 claims abstract description 33
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- 239000000463 material Substances 0.000 description 7
- 230000000295 complement effect Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000004984 smart glass Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/51—Housings
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0264—Details of the structure or mounting of specific components for a camera module assembly
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
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- Engineering & Computer Science (AREA)
- Signal Processing (AREA)
- Multimedia (AREA)
- Studio Devices (AREA)
Abstract
The invention discloses a camera component, which comprises a first imaging module and a decoration piece, wherein the first imaging module comprises a shell, a light conversion element and a first image sensor, the shell is provided with a light inlet, the light conversion element is arranged in the shell and is used for converting incident light entering from the light inlet and transmitting the converted light to the first image sensor, a groove is formed on one side of the light inlet of the shell in the width direction of the first imaging module, and the decoration piece is covered on the light inlet and is partially arranged in the groove. The invention also discloses an electronic device. In the camera component and the electronic device, the groove is formed on one side of the light inlet, the decorating part cover is arranged on the light inlet and is partially arranged in the groove, so that the width dimension of the decorating part is smaller, the overall height dimension of the camera component is reduced, and the camera component is compact in structure and miniaturized.
Description
Technical Field
The present invention relates to the field of electronic devices, and more particularly, to a camera module and an electronic device using the same.
Background
As mobile phones are popular in daily life, users have put higher demands on functions of the mobile phones, for example, the mobile phones tend to be light and thin, and for example, the mobile phones need to obtain more photographing effects. In the related art, in order to improve a photographing effect of a mobile phone, a camera of the mobile phone adopts a zoom camera. The zoom camera may, for example, perform three times optical zooming to obtain a better quality image. Due to the limitation of the thickness of the mobile phone, the zoom camera adopts the periscope type lens to reduce the height of the zoom lens, however, due to the large width of the periscope type lens, the size of a decoration matched with the periscope type lens is also large, which is not beneficial to the compactness of the mobile phone.
Disclosure of Invention
The invention provides a camera component and an electronic device using the same.
The camera component comprises a first imaging module and a decoration, wherein the first imaging module comprises a shell, a light conversion element and a first image sensor, the shell is provided with a light inlet, the light conversion element is arranged in the shell and used for converting incident light entering from the light inlet and transmitting the converted light to the first image sensor, a groove is formed in one side of the shell on the light inlet in the width direction of the first imaging module, and the decoration is covered above the light inlet and is partially clamped in the groove.
The electronic device comprises a shell and the camera assembly in the embodiment, wherein the camera assembly is arranged on the shell.
In the camera component and the electronic device, the groove is formed on one side of the light inlet, the decorating part is covered on the light inlet and is partially clamped in the groove, so that the width size of the decorating part is smaller, the overall height size of the camera component is reduced, and the camera component is compact in structure and miniaturized.
Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.
Drawings
The foregoing and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings, in which:
FIG. 1 is a schematic plan view of an electronic device according to an embodiment of the present invention;
FIG. 2 is a schematic perspective view of a camera assembly according to an embodiment of the present invention;
FIG. 3 is an exploded view of a camera assembly according to an embodiment of the present invention;
FIG. 4 is a schematic perspective view of a trim piece according to an embodiment of the present invention;
FIG. 5 is an exploded view of a first imaging module according to an embodiment of the present invention;
FIG. 6 is a schematic cross-sectional view of a first imaging module according to an embodiment of the invention;
FIG. 7 is a schematic cross-sectional view in the A-A direction of the camera head assembly of FIG. 2;
FIG. 8 is a schematic cross-sectional view of a second imaging module according to an embodiment of the present invention;
FIG. 9 is a schematic diagram of an imaging module mated with a trim piece of some embodiments;
fig. 10 is a schematic cross-sectional view of the electronic device of fig. 1 along the direction B-B.
Description of main reference numerals:
the electronic device 1000, the housing 102, the camera assembly 100, the decoration 10, the through hole 11, the first sub-hole 111, the second sub-hole 112, the decoration ring 12, the flange 13, the first imaging module 20, the housing 21, the light inlet 211, the recess 212, the top wall 213, the side wall 214, the light conversion element 22, the mounting base 23, the first lens assembly 24, the package housing 25, the first image sensor 26, the second imaging module 30, the second lens assembly 31, the second image sensor 32, and the bracket 40.
Detailed Description
Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary only for explaining the present invention and are not to be construed as limiting the present invention.
In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more of the described features. In the description of the present invention, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.
In the description of the present invention, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically connected, electrically connected or can be communicated with each other; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.
In the present invention, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, as well as the first and second features not being in direct contact but being in contact with each other through additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.
The following disclosure provides many different embodiments, or examples, for implementing different features of the invention. In order to simplify the present disclosure, components and arrangements of specific examples are described below. They are, of course, merely examples and are not intended to limit the invention. Furthermore, the present invention may repeat reference numerals and/or letters in the various examples, which are for the purpose of brevity and clarity, and which do not themselves indicate the relationship between the various embodiments and/or arrangements discussed. In addition, the present invention provides examples of various specific processes and materials, but one of ordinary skill in the art will recognize the application of other processes and/or the use of other materials.
Referring to fig. 1, an electronic device 1000 according to an embodiment of the invention includes a housing 102 and a camera assembly 100. The camera assembly 100 is disposed on a housing 102. The electronic device 1000 may be a cell phone, tablet computer, notebook computer, smart bracelet, smart watch, smart helmet, smart glasses, etc. The embodiment of the present invention is described with reference to the electronic device 1000 being a mobile phone, it will be understood that the specific form of the electronic device 1000 may be other, and is not limited herein.
Specifically, the housing 102 is an external component of the electronic device 1000, which serves to protect internal components of the electronic device 1000. The housing 102 may be a rear cover of the electronic device 1000, which covers components such as a battery of the electronic device 1000. In this embodiment, the camera module 100 is disposed at the back of the electronic device 1000, so that the electronic device 1000 can perform the rear-mounted image capturing. As in the example of fig. 1, camera assembly 100 is disposed at the upper left corner of housing 102. Of course, it is understood that camera assembly 100 may be positioned in other locations, such as a top-up or top-right location of housing 102. The location of the camera assembly 100 in the housing 102 is not limiting to the examples of the invention.
Referring to fig. 2 and 3, the camera module 100 includes a decoration 10, a first imaging module 20, a second imaging module 30 and a bracket 40. The decoration 10 is disposed on the casing 102 and protrudes from the surface of the casing 102. The first imaging module 20 and the second imaging module 30 are both disposed inside the housing 102. The first imaging module 20 and the second imaging module 30 are each disposed proximate to the trim piece 10. The first imaging module 20 and the second imaging module 30 are both disposed in the bracket 40 and fixedly connected with the bracket 40. The decoration 10 is disposed above the support 40, and in particular, the decoration 10 may rest on the support 40 or may be disposed at a distance from the support 10. The bracket 40 can reduce the impact of the first imaging module 20 and the second imaging module 30, and prolong the service life of the first imaging module 20 and the second imaging module 30.
The decoration 10 may be made of a metal material, for example, the material of the decoration 10 is stainless steel, and the decoration 10 may be treated by a polishing process to form a bright surface so that the decoration 10 is more beautiful.
Referring to fig. 4, the decoration 10 is formed with a through hole 11, and the first imaging module 20 and the second imaging module 30 are exposed from the through hole 11 to the decoration 10, or the first imaging module 20 and the second imaging module 30 collect external images through the through hole 11. Specifically, in the present embodiment, the through hole 11 includes a first sub-hole 111 and a second sub-hole 112, and the first sub-hole 111 and the second sub-hole 112 are disposed at intervals. Alternatively, the first sub-aperture 111 and the second sub-aperture 112 are not in communication. Of course, in other embodiments, the first sub-aperture 111 and the second sub-aperture 112 may communicate to form an integral aperture. The first imaging module 20 acquires an external image through the first sub-aperture 111, and the second imaging module 30 acquires an external image through the second sub-aperture 112. In the present embodiment, the first sub-holes 111 are circular holes, and the second sub-holes 112 are square holes.
In other embodiments, the shapes of the first sub-holes 111 and the second sub-holes 112 are not limited to the shapes shown in the drawings. For example, the first sub-aperture 111 and the second sub-aperture 112 are both circular apertures; as another example, the first sub-aperture 111 and the second sub-aperture 112 are both square apertures.
The decorative piece 10 includes a bezel 12 and a flange 13, the flange 13 extending from the bottom of the bezel 12 in a direction away from the bezel 12. The through hole 11 is formed in the bezel 12 and penetrates through the bezel 12 and the flange 13, the bezel 12 is mounted on the housing 102, and the flange 13 abuts against the housing 102 as shown in fig. 10. Thus, the flange 13 can restrict the position of the decoration 10, and prevent the decoration 10 from moving outside the housing 102. In one example, when the decoration 10 is installed, the decoration 10 is inserted outward from the inside of the housing 102, and when the flange 13 abuts against the inner surface of the housing 102, the decoration 10 is installed to a predetermined position. The decoration 10 may be fixed on the casing 102 by using an adhesive, or the decoration 10 may be in interference fit with the casing 102, so that the decoration 10 is not easy to fall off from the casing 102.
The decorative member 10 may be an integrally formed structure of the bezel 12 and the flange 13, for example, the decorative member 10 is manufactured by cutting. Alternatively, the decorative ring 12 and the flange 13 may be formed as separate members, or the decorative ring 12 and the flange 13 may be formed as two separate members and then assembled together by welding or the like to form the decorative member 10.
It should be noted that in other embodiments, the collar 13 may be omitted, that is, in this embodiment, the trim 10 includes only the structure of the trim ring 12.
The first imaging module 20 and the second imaging module 30 are arranged in parallel, that is, the second imaging module 30 is disposed at one side of the first imaging module 20. In this embodiment, the first imaging module 20 and the second imaging module 30 are arranged in a straight line, or, the first imaging module 20 and the second imaging module 30 are arranged along the same straight line. In other embodiments, the first and second imaging modules 20 and 30 may be arranged in an L-shape. The first imaging module 20 and the second imaging module 30 may be disposed at intervals, or may abut against each other.
In this embodiment, the first imaging module 20 is located on the right side of the second imaging module 30, or the first imaging module 20 is located closer to the middle of the electronic device 1000 than the second imaging module 30. Of course, it is understood that in other embodiments, the positions of the first imaging module 20 and the second imaging module 30 may be interchanged, or the first imaging module 20 may be located to the left of the second imaging module 30.
One of the first imaging module 20 and the second imaging module 30 may be a black-and-white camera, and the other imaging module is an RGB camera; or one imaging module is an infrared camera, and the other imaging module is an RGB camera; or one imaging module is an RGB camera, and the other imaging module is an RGB camera; or one imaging module is a wide-angle camera, and the other imaging module is a long-focus camera and the like.
In other embodiments, the second imaging module 30 may be omitted, or the electronic device 1000 may include more than three imaging modules.
Referring to fig. 5 and 6, in the present embodiment, the first imaging module 20 includes a housing 21, a light conversion element 22, a mounting base 23, a first lens assembly 24, a package housing 25 and a first image sensor 26. The light conversion element 22, the mounting base 23, the first lens assembly 24, and the package housing 25 are all disposed within the housing 21. The light conversion element 22 is disposed on the mounting base 23, and the first lens assembly 24 is accommodated in the package housing 25. After entering the housing 21, the incident light is diverted through the light diverting element 22 and then transmitted through the first lens assembly 24 to the first image sensor 26, so that the first image sensor 26 obtains an external image.
The housing 21 is substantially square, and the housing 21 is provided with a light inlet 211, and incident light enters the first imaging module 20 from the light inlet 211. That is, the light conversion element 22 is configured to convert the incident light from the light inlet 211 and transmit the converted light to the first image sensor 26. It can be appreciated that the first imaging module 20 is a periscope type lens module, and the periscope type lens module has a smaller height than the vertical type lens module, so that the overall thickness of the electronic device 1000 can be reduced. The vertical lens module refers to that the optical axis of the lens module is a straight line, or that the incident light is conducted to the photosensitive device of the lens module along the direction of the optical axis of the straight line.
It can be appreciated that the light inlet 211 is exposed through the through hole 11, so that the external light enters the first imaging module 20 from the light inlet 211 after passing through the through hole 11.
Referring to fig. 7, in the present embodiment, in the width direction of the first imaging module 20, a recess 212 is formed on one side of the light inlet 211 of the housing 21, and the decoration 10 is covered over the light inlet 211 and is partially clamped into the recess 212.
Referring to fig. 9, if the recess is omitted, in order to make the overall thickness of the electronic device thinner, the periscope type imaging module 20a partially extends into the decoration 10a in the width direction, and since the periscope type imaging module 20a has a larger width than the vertical type imaging module, the decoration 10a has a larger size at this time, which is not beneficial to the aesthetic appearance of the electronic device and also makes the electronic device not compact enough.
Referring to fig. 5 and 7 again, in the present embodiment, the recess 212 is formed at one side of the light inlet 211, and the decoration 10 is covered over the light inlet 211 and is partially clamped into the recess 212, so that the width dimension of the decoration 10 is smaller, the overall height dimension of the camera assembly 100 is reduced, and the compact and miniaturized structure of the camera assembly 100 is facilitated.
Specifically, the housing 21 includes a top wall 213 and side walls 214. Side walls 214 are formed extending from side edges 2131 of top wall 213. The top wall 213 includes two opposite sides 2131 and two side walls 214, each side wall 214 extending from a corresponding one of the sides 2131, or the side walls 214 respectively connect the opposite sides of the top wall 213. The light inlet 211 is formed in the top wall 213, the recess 212 is formed at the junction of the top wall 213 and the side wall 214, and the decoration 10 abuts against the top wall 213. In this way, the recess 212 is easily formed, facilitating the manufacture of the housing 21. In one example, the recess 212 is a profiling of the housing 21, i.e. the recess 212 may be formed by stamping.
In one example, a portion of the bottom of the bezel 12 is received in the recess 212 and a portion of the bezel 12 rests against the top wall 213. Alternatively, the decorative ring 12 and the housing 21 form a complementary structure, and the decorative ring 12 and the housing 21 are mutually embedded, so that the matching structure of the decorative piece 10 and the housing 21 is more compact.
In this embodiment, a groove 212 is formed at the junction of each side wall 214 and the top wall 213. Alternatively, the number of grooves 212 is two. Of course, in embodiments where the number of grooves 212 is single, that is, where one of the side walls 214 is connected to the top wall 213, the grooves 212 are formed.
In this embodiment, the groove 212 is elongated, and the groove 212 extends along the length direction of the first imaging module 20. In this manner, the recess 212 mates with the trim piece 10 more compactly. In some embodiments, the recess 212 may be arcuate, with the arcuate recess 212 surrounding the light inlet 211. Of course, in other embodiments, the structure and shape of the recess 212 is not limited to the above examples, as long as the decorative piece 10 and the first imaging module 20 are formed in a complementary structure to reduce the size of the decorative piece 10.
The light conversion element 22 is a prism or a plane mirror. In one example, when the light conversion element 22 is a prism, the prism may be a triangular prism, and the cross section of the prism is a right triangle, where light is incident from one right-angle side of the right triangle, and reflected by the hypotenuse, and exits from the other right-angle side. It will be appreciated that of course, incident light may exit after refraction by the prism without reflection. The prism can be made of materials with good light transmittance such as glass, plastic and the like. In one embodiment, a reflective material such as silver may be coated on one of the surfaces of the prism to reflect incident light.
It will be appreciated that when the light turning element 22 is a planar mirror, the planar mirror reflects incident light to effect turning of the incident light.
In one example, the angle at which the light-turning element 22 turns the incident light incident from the light-inlet 211 is 90 degrees. For example, the incident angle of the incident light on the reflecting surface of the light conversion element 22 is 45 degrees, and the reflection angle is also 45 degrees. Of course, the angle at which the light conversion element 22 converts the incident light may be other angles, for example, 80 degrees, 100 degrees, or the like, as long as the incident light can be converted and then reach the first image sensor 26.
In the present embodiment, the number of light conversion elements 22 is single, and at this time, the incident light is once converted and then transmitted to the first image sensor 26. In other embodiments, the number of light conversion elements 22 is plural, and at this time, the incident light is diverted at least twice and then transmitted to the first image sensor 26.
The mounting base 23 is used for mounting the light conversion element 22, or the mounting base 23 is a carrier of the light conversion element 22, and the light conversion element 22 is fixedly arranged on the mounting base 23. This allows the position of the light-converting element 22 to be determined, which is advantageous for the light-converting element 22 to reflect or refract incident light. The light conversion element 22 may be fixed on the mounting base 23 by using adhesive bonding to achieve a fixed connection with the mounting base 23.
In one example, the mounting base 23 is movably disposed in the housing 21, and the mounting base 23 can rotate relative to the housing 21 to adjust the direction in which the light turning element 22 turns the incident light, so that the first imaging module 20 realizes optical anti-shake. When the first imaging module 20 shoots, if the first imaging module 20 shakes, the first image sensor 26 cannot acquire a stable image, and the quality of the formed image is poor. The mounting seat 23 can drive the light conversion element 22 to rotate along with the light conversion element toward the opposite direction of the shake of the first imaging module 20, so as to compensate the incident deviation of the incident light of the light inlet 211 and realize the optical shake prevention effect. The mounting block 23 may be connected to an electric motor which may drive the mounting block 23 to rotate.
The first lens assembly 24 is accommodated in the package housing 25, and further, the first lens assembly 24 is disposed between the light conversion element 22 and the first image sensor 26. The first lens assembly 24 is used to image incident light onto the first image sensor 26. This allows the first image sensor 26 to obtain a better quality image.
The first lens assembly 24, when moved entirely along its optical axis, can image on the first image sensor 26 to thereby achieve focusing of the first imaging module 20. The first lens assembly 24 includes a plurality of lenses 241, and when at least one lens 241 moves, the overall focal length of the first lens assembly 24 changes, thereby implementing the zoom function of the first imaging module 20.
The first image sensor 26 may employ a complementary metal oxide semiconductor (CMOS, complementary Metal Oxide Semiconductor) photosensitive element or a Charge-coupled Device (CCD) photosensitive element.
Referring to fig. 8, in the present embodiment, the second imaging module 30 is a vertical lens module, however, in other embodiments, the second imaging module 30 may be a periscope lens module. The second imaging module 30 includes a second lens assembly 31 and a second image sensor 32, the second lens assembly 31 is configured to image light on the second image sensor 32, and an incident optical axis of the second imaging module 30 coincides with an optical axis of the second lens assembly 31.
In the present embodiment, the second imaging module 30 is a fixed focus lens module, so the number of lenses 241 of the second lens assembly 31 is smaller, so that the height of the second imaging module 30 is lower, which is beneficial to reducing the thickness of the electronic device 1000.
The type of the second image sensor 32 may be the same as the type of the first image sensor 26, and will not be described again.
In summary, the camera module 100 according to the embodiment of the present invention includes a first imaging module 20 and a decoration 10, where the first imaging module includes a housing 21, a light conversion element 22, and a first image sensor 26.
The housing 21 is provided with a light inlet 211, the light conversion element 22 is disposed in the housing 21, the light conversion element 22 is used for converting incident light entering from the light inlet 211 and transmitting the converted light to the first image sensor 26, a groove 212 is formed on one side of the light inlet 211 of the housing 21 in the width direction of the first imaging module 20, and the decoration 10 is covered on the light inlet 211 and is partially clamped in the groove 212.
The assembly process of the camera module 100 according to the embodiment of the present invention is approximately as follows:
providing a first imaging module 20 and a decoration piece 10, wherein the first imaging module comprises a shell 21, a light conversion element 22 and a first image sensor 26, the shell 21 is provided with a light inlet 211, the light conversion element 22 is arranged in the shell 21, the light conversion element 22 is used for converting incident light entering from the light inlet 211 and transmitting the converted incident light to the first image sensor 26, a groove 212 is formed on one side of the shell 21 at the light inlet 211 in the width direction of the first imaging module 20, and a through hole 11 is formed on the decoration piece 10;
the decoration 10 is covered over the light inlet 211 and the decoration 10 is partially caught in the groove 212, and the light inlet 211 is exposed through the through hole 11.
In the camera module 100 and the electronic device 1000, the recess 212 is formed at one side of the light inlet 211, and the decoration 10 is covered on the light inlet 211 and is partially clamped into the recess 212, so that the width dimension of the decoration 10 is smaller, the overall height dimension of the camera module 100 is reduced, and the camera module 100 is compact in structure and miniaturized.
In the description of the present specification, reference to the terms "one embodiment," "certain embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
While embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that: many changes, modifications, substitutions and variations may be made to the embodiments without departing from the spirit and principles of the invention, the scope of which is defined by the claims and their equivalents.
Claims (12)
1. The utility model provides a camera subassembly, its characterized in that includes first imaging module and decoration, first imaging module includes shell, light conversion component and first image sensor, the shell has seted up the light inlet, light conversion component sets up in the shell, the decoration is formed with the through-hole, the light inlet passes through the through-hole exposes, light conversion component is used for will follow the incident light of light inlet is turned to the back and is passed to first image sensor, in the width direction of first imaging module, the shell is in one side of light inlet is formed with the recess, the decoration cover is established light inlet top and partly block into in the recess, the shell includes roof and from the side wall that the side extension of roof formed, light inlet is formed in the roof, the recess forms the junction of roof and side wall, the decoration supports and leans on the roof.
2. The camera assembly of claim 1, wherein the recess is elongated, the recess extending along a length of the first imaging module; or (b)
The grooves are arc-shaped, and the grooves surround the light inlet.
3. The camera assembly of claim 1, wherein the number of side walls is two, the top wall includes two opposite sides, each side wall extends from a corresponding one of the sides, and the recess is formed at a junction of each side wall and the top wall.
4. The camera assembly of claim 1, wherein the trim piece includes a bezel and a flange extending from a bottom of the bezel in a direction away from the bezel, a portion of the bottom of the bezel being received in the recess, the bezel portion abutting the top wall.
5. The camera assembly of claim 1, wherein the first imaging module comprises a first lens assembly disposed between the light conversion element and the first image sensor, the first lens assembly to image the incident light on the first image sensor.
6. The camera assembly of claim 5, wherein the first imaging module comprises an enclosure housing within the housing, the first lens assembly being housed within the enclosure housing, the first lens assembly being movable within the enclosure housing to adjust a focal length of the first lens assembly.
7. The camera assembly of claim 1, wherein the first imaging module comprises a mount housed within the housing, the light conversion element being secured to the mount.
8. The camera assembly of claim 7, wherein the mount is rotatable relative to the housing to adjust a direction in which the light turning element turns the incident light such that the first imaging module achieves optical anti-shake.
9. The camera assembly of claim 1, wherein the camera assembly comprises a second imaging module, the second imaging module being disposed on one side of the first imaging module, the second imaging module and the first imaging module both capturing ambient images through the through-hole.
10. The camera assembly of claim 9, wherein the second imaging module comprises a second lens assembly and a second image sensor, the second lens assembly for imaging light onto the second image sensor, an incident optical axis of the second imaging module coinciding with an optical axis of the second lens assembly.
11. The camera assembly of claim 9, wherein the camera assembly comprises a bracket, and wherein the first imaging module and the second imaging module are both disposed in the bracket and fixedly connected to the bracket.
12. An electronic device, comprising:
a housing; and
the camera assembly of any of claims 1-11, disposed on the housing.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810613614.5A CN108521541B (en) | 2018-06-14 | 2018-06-14 | Camera component and electronic device applying same |
| US16/422,994 US11019242B2 (en) | 2018-06-14 | 2019-05-25 | Camera assembly and electronic device using the same, both having a decorative member mounted on a shell and comprising a decorative ring and a flange |
| PCT/CN2019/091020 WO2019238079A1 (en) | 2018-06-14 | 2019-06-13 | Camera assembly and electronic device using the same |
| EP19180230.5A EP3581981B1 (en) | 2018-06-14 | 2019-06-14 | Camera assembly and electronic device using the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810613614.5A CN108521541B (en) | 2018-06-14 | 2018-06-14 | Camera component and electronic device applying same |
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| Publication Number | Publication Date |
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| CN108521541A CN108521541A (en) | 2018-09-11 |
| CN108521541B true CN108521541B (en) | 2024-04-12 |
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| CN201810613614.5A Active CN108521541B (en) | 2018-06-14 | 2018-06-14 | Camera component and electronic device applying same |
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Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11019242B2 (en) * | 2018-06-14 | 2021-05-25 | Guangdong Oppo Mobile Telecommunications Corp., Ltd. | Camera assembly and electronic device using the same, both having a decorative member mounted on a shell and comprising a decorative ring and a flange |
| CN109327571B (en) * | 2018-11-06 | 2020-08-14 | Oppo广东移动通信有限公司 | Camera assembly and electronic device |
| CN109831603B (en) * | 2018-12-29 | 2020-05-26 | 维沃移动通信有限公司 | Mobile terminal |
| CN109862242B (en) * | 2019-01-28 | 2022-01-18 | Oppo广东移动通信有限公司 | Electronic device |
| CN112911093A (en) * | 2020-05-28 | 2021-06-04 | 北京小米移动软件有限公司 | Camera module, electronic device, shooting processing method and storage medium |
| CN112653778B (en) * | 2020-11-26 | 2023-11-10 | Oppo广东移动通信有限公司 | electronic device |
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| CN106791329A (en) * | 2017-01-11 | 2017-05-31 | 广东欧珀移动通信有限公司 | Camera module and terminal |
| CN107707794A (en) * | 2017-09-26 | 2018-02-16 | 广东欧珀移动通信有限公司 | Camera assembly and mobile terminal |
| CN208386733U (en) * | 2018-06-14 | 2019-01-15 | Oppo广东移动通信有限公司 | The electronic device of CCD camera assembly and the application CCD camera assembly |
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| JP2013238848A (en) * | 2012-04-20 | 2013-11-28 | Hoya Corp | Imaging apparatus |
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| CN106791329A (en) * | 2017-01-11 | 2017-05-31 | 广东欧珀移动通信有限公司 | Camera module and terminal |
| CN107707794A (en) * | 2017-09-26 | 2018-02-16 | 广东欧珀移动通信有限公司 | Camera assembly and mobile terminal |
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