CN108531121A - A kind of double solidified glues of UV heating reducing shrinking percentage - Google Patents
A kind of double solidified glues of UV heating reducing shrinking percentage Download PDFInfo
- Publication number
- CN108531121A CN108531121A CN201810308971.0A CN201810308971A CN108531121A CN 108531121 A CN108531121 A CN 108531121A CN 201810308971 A CN201810308971 A CN 201810308971A CN 108531121 A CN108531121 A CN 108531121A
- Authority
- CN
- China
- Prior art keywords
- polyurethane
- shrinking percentage
- silica
- aerosil
- bismaleimide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
- C09J175/14—Polyurethanes having carbon-to-carbon unsaturated bonds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
Abstract
The invention discloses a kind of double solidified glues of UV heating reducing shrinking percentage, are made of the raw material of following weight content：Six degree of functionality polyurethane are 5 25%, polyurethane modified acrylic resin is 5 25%, hydroxy propyl methacrylate is 5 15%, methacrylic acid is 1 8%, 1 hydroxycyclohexyl phenyl ketone is 0.1 0.5%, benzoyl peroxide is 0.1 0.5%, bismaleimide is 1 5%, silica is 50 80% and aerosil is 1 8%.The present invention accelerates curing rate and increases silica content by adjusting glue component and its ratio, improves the high problem of the low Tg of glue, shrinking percentage, can meet the bonding of the materials such as glass, metal, LCP, PET and solve the problems, such as that shrinking percentage is high.
Description
Technical field
The invention belongs to glue technical field, more particularly to a kind of double solidified glues of UV heating.
Background technology
UV (ultraviolet light) glue is also known as shadowless glue, light-sensitive emulsion, ultraviolet light-cured glue, be a kind of one-component ultraviolet light/
Visible-light curing modified acrylic ester adhesion agent, energy saving, environmental protection more efficient compared to traditional glue, and properties of product are more
Add superior, with the promotion of whole people's energy conservation and environmental awareness, UV glue is applied to more and more industries.With CRCBOND industry
For grade UV glue, not only adhesive strength is high for it, and transparency is high, non yellowing, non-whitening, good weatherability, and modest viscosity, right
Plastics and metal adhesive have higher intensity, be directed to the various plastic bondings such as metal and PMMA, PC, ABS, PVC, PS, SAN,
Reinforcement, reinforcing have good application effect, be widely used in microelectronics, optics, optic communication, photoelectricity, medical treatment, aerospace,
The industries such as military project and instantly extremely hot virtual reality.
But in the fields such as computer, mobile phone, TV, air-conditioning, refrigerator, medical instrument, space flight, glass, metal, LCP, PET
When bonding, since material is soft or hard different with basic performance, same glue is difficult to meet the bonding of these materials equal materials, and
There is low Tg (glass transition temperature), shrinking percentage is high the problems such as.
Such as Chinese patent《A kind of UV glue》, 106281057 A of publication No. CN, disclosed a kind of UV glue, by following
The component of weight percent is made：Modified bisphenol A epoxy resin 10%, polyethylene glycol 3%, nanometer butadiene-styrene-vinyl rubber 2%, adjacent benzene two
Formic acid dibutyl ester 4%, nano diatomite 1%, ethoxylated trimethylolpropane triacrylate 5%, three propylene of pentaerythrite
Acid esters 10%, phthalic anhydride 8%, glycerine 7%, maleic anhydride 12%, 2- phenoxyethyl acrylates 15%,
α-methylstyrene 13%, phenol 2%, levelling agent 1%, antifoaming agent 1%, photoinitiator 1%, p-tert-Butylcatechol 1%,
The shrinking percentage of this glue is sent higher, cannot be met the bonding of the materials such as glass, metal, LCP, PET and be solved that shrinking percentage is high asks
Topic.
Invention content
In order to solve the above problem, especially low Tg, the high problem of shrinking percentage, the present invention provides a kind of UV reducing shrinking percentage
The double solidified glues of heating by adjusting glue component and its ratio, while accelerating curing rate and increasing silica content, improve
The low Tg of glue, shrinking percentage high problem can meet the bonding of the materials such as glass, metal, LCP, PET and to solve shrinking percentage high
Problem.
In order to solve the above technical problems, one aspect of the present invention is：A kind of UV reducing shrinking percentage is provided
The double solidified glues of heating, including six degree of functionality polyurethane, polyurethane modified acrylic resin, hydroxy propyl methacrylate, methyl
Acrylic acid, 1- hydroxycyclohexyl phenyl ketones, benzoyl peroxide, bismaleimide, silica and aerosil；
The weight percentage of above-mentioned each component is：The six degrees of functionality polyurethane is 5-25%, described polyurethane-modified
Acrylic resin is 5-25%, the hydroxy propyl methacrylate is 5-15%, the methacrylic acid is 1-8%, the 1-
Hydroxycyclohexyl phenyl ketone is 0.1-0.5%, the benzoyl peroxide is 0.1-0.5%, the bismaleimide is
1-5%, the silica are 50-80% and the aerosil is 1-8%.
To solve the above-mentioned problems, the further technical solution that the present invention uses is：Each component in double solidified glues
Weight percentage be：The six degrees of functionality polyurethane is 5-20%, the polyurethane modified acrylic resin be 5-20%,
The hydroxy propyl methacrylate is 5-12%, the methacrylic acid is 1-6%, the 1- hydroxycyclohexyl phenyl ketones are
0.1-0.5%, the benzoyl peroxide are 0.1-0.5%, the bismaleimide is 1-5%, the silica is 50-
80% and the aerosil be 1-8%.
It further says, the weight percentage of each component is in double solidified glues：The six degrees of functionality polyurethane
For 5-25%, the polyurethane modified acrylic resin be 5-15%, the hydroxy propyl methacrylate is 5-10%, the first
Base acrylic acid is 1-6%, the 1- hydroxycyclohexyl phenyl ketones are 0.1-0.3%, the benzoyl peroxide is 0.1-
0.2%, the bismaleimide is 1-5%, the silica is 50-80% and the aerosil is 1-8%.
Furthermore, the weight percentage of each component is in double solidified glues：The poly- ammonia of six degrees of functionality
Ester is 20%, the polyurethane modified acrylic resin is 9%, the hydroxy propyl methacrylate is 10%, the methyl-prop
Olefin(e) acid is 5%, the 1- hydroxycyclohexyl phenyl ketones are 0.5%, the benzoyl peroxide is 0.5%, the span comes
Acid imide is 1%, the silica is 50% and the aerosil is 4%.
The beneficial effects of the invention are as follows：
The present invention includes six degree of functionality polyurethane, polyurethane modified acrylic resin, hydroxy propyl methacrylate, methyl-prop
Olefin(e) acid, 1- hydroxycyclohexyl phenyl ketones, benzoyl peroxide, bismaleimide, silica and aerosil, wherein
Six degree of functionality polyurethane are one of the main component of the glue, are the matrix of glue, and polymerizable molecular amount is high, Grafting Structure is complicated,
High strength after curing, 5 times up to common glue of cured strength；
Polyurethane modified acrylic resin is another main component of the glue, and after graft modification, polyurethane changes
Property acrylic resin had both the features such as solidification intensity is high, resistance to acid and alkali improves, temperature tolerance improves；
Hydroxy propyl methacrylate primarily serves the effect of graft crosslinking, enhances the intensity after glue curing；
Methacrylic acid primarily serves the effect for promoting polymerization, improves the adhesive strength and stability of adhesive；
1- hydroxycyclohexyl phenyl ketones are mainly as the efficient photoinitiator of UV curing system, anti-yellowing property
It is high；
Benzoyl peroxide is mainly as initiator so that glue is accelerated to polymerize in use；
Bismaleimide accelerates curing rate, high Tg, reduces glue shrinking percentage mainly as curing agent；Silica master
If reducing shrinking percentage；
Aerosil is mainly that glue provides sag resistance, glue is prevented to be layered；And the proportioning of each component is reasonable,
Various component synergistic effects by adjusting glue component and its ratio, while accelerating curing rate and increasing silica content, change
The high problem of the low Tg of glue, shrinking percentage has been apt to it so that the shrinking percentage of glue of the invention is relatively low, only 0.3-0.5, can meet glass
The bonding of the materials such as glass, metal, LCP, PET and solve the problems, such as that shrinking percentage is high.
Above description of the invention is only the general introduction of technical solution of the present invention, in order to better understand the skill of the present invention
Art means, and can be implemented in accordance with the contents of the specification, below with presently preferred embodiments of the present invention and after being described in detail such as.
Specific implementation mode
Illustrate that the specific implementation mode of the present invention, those skilled in the art can be by these below by way of particular specific embodiment
The revealed content of specification understands advantages of the present invention and effect easily.The present invention can also other different modes give
Implement, that is, under the scope of without departing substantially from disclosed, different modification and change can be given.
A kind of double solidified glues of UV heating reducing shrinking percentage, including six degree of functionality polyurethane, polyurethane-modified acrylic acid
Resin, hydroxy propyl methacrylate, methacrylic acid, 1- hydroxycyclohexyl phenyl ketones, benzoyl peroxide, bismaleimide
Amine, silica and aerosil；
The weight percentage of above-mentioned each component is：The six degrees of functionality polyurethane is 5-25%, described polyurethane-modified
Acrylic resin is 5-25%, the hydroxy propyl methacrylate is 5-15%, the methacrylic acid is 1-8%, the 1-
Hydroxycyclohexyl phenyl ketone is 0.1-0.5%, the benzoyl peroxide is 0.1-0.5%, the bismaleimide is
1-5%, the silica are 50-80% and the aerosil is 1-8%.
It is preferred that the six degrees of functionality polyurethane is 5-20%, the polyurethane modified acrylic resin be 5-20%,
The hydroxy propyl methacrylate is 5-12%, the methacrylic acid is 1-6%, the 1- hydroxycyclohexyl phenyl ketones are
0.1-0.5%, the benzoyl peroxide are 0.1-0.5%, the bismaleimide is 1-5%, the silica is 50-
80% and the aerosil be 1-8%.
More optimizedly, the weight percentage of each component is：The six degrees of functionality polyurethane is 5-25%, the polyurethane
Acrylic resin modified for 5-15%, the hydroxy propyl methacrylate is 5-10%, the methacrylic acid is 1-6%, institute
State that 1- hydroxycyclohexyl phenyl ketones are 0.1-0.3%, the benzoyl peroxide is 0.1-0.2%, the bismaleimide
Amine is 1-5%, the silica is 50-80% and the aerosil is 1-8%.
It is the formula and shrinking percentage of specific embodiments of the present invention and comparative example, record such as following table below.
As can be seen from the above table, various component synergistic effects in the present invention, by adjusting glue component and its ratio, together
When accelerate curing rate and increase silica content, improve the high problem of the low Tg of glue, shrinking percentage so that glue of the invention
Shrinking percentage it is relatively low, only 0.3-0.5, can meet the materials such as glass, metal, LCP, PET bonding and solve shrinking percentage it is high
Problem.
Example the above is only the implementation of the present invention is not intended to limit the scope of the invention, every to utilize this hair
Equivalent structure made by bright description is applied directly or indirectly in other relevant technical fields, and is similarly included in
In the scope of patent protection of the present invention.
Claims (4)
1. a kind of double solidified glues of UV heating reducing shrinking percentage, it is characterised in that：Change including six degree of functionality polyurethane, polyurethane
It is property acrylic resin, hydroxy propyl methacrylate, methacrylic acid, 1- hydroxycyclohexyl phenyl ketones, benzoyl peroxide, double
Maleimide, silica and aerosil；
The weight percentage of above-mentioned each component is：The six degrees of functionality polyurethane is 5-25%, the polyurethane-modified propylene
Acid resin is 5-25%, the hydroxy propyl methacrylate is 5-15%, the methacrylic acid is 1-8%, the 1- hydroxyls
Cyclohexyl phenyl ketone is 0.1-0.5%, the benzoyl peroxide is 0.1-0.5%, the bismaleimide is 1-
5%, the silica is 50-80% and the aerosil is 1-8%.
2. a kind of double solidified glues of UV heating reducing shrinking percentage according to claim 1, it is characterised in that：The weight of each component
Measuring percentage composition is：The six degrees of functionality polyurethane is 5-20%, the polyurethane modified acrylic resin is 5-20%, described
Hydroxy propyl methacrylate is 5-12%, the methacrylic acid is 1-6%, the 1- hydroxycyclohexyl phenyl ketones are 0.1-
0.5%, the benzoyl peroxide is 0.1-0.5%, the bismaleimide is 1-5%, the silica is 50-80%
It is 1-8% with the aerosil.
3. a kind of double solidified glues of UV heating reducing shrinking percentage according to claim 1, it is characterised in that：The weight of each component
Measuring percentage composition is：The six degrees of functionality polyurethane is 5-25%, the polyurethane modified acrylic resin is 5-15%, described
Hydroxy propyl methacrylate is 5-10%, the methacrylic acid is 1-6%, the 1- hydroxycyclohexyl phenyl ketones are 0.1-
0.3%, the benzoyl peroxide is 0.1-0.2%, the bismaleimide is 1-5%, the silica is 50-80%
It is 1-8% with the aerosil.
4. a kind of double solidified glues of UV heating reducing shrinking percentage according to claim 1, it is characterised in that：The weight of each component
Measuring percentage composition is：The six degrees of functionality polyurethane is 20%, the polyurethane modified acrylic resin is 9%, the methyl
Hydroxypropyl acrylate is 10%, the methacrylic acid is 5%, the 1- hydroxycyclohexyl phenyl ketones are 0.5%, the mistake
Benzoyl Oxide is 0.5%, the bismaleimide is 1%, the silica is 50% and the aerosil is
4%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810308971.0A CN108531121A (en) | 2018-04-09 | 2018-04-09 | A kind of double solidified glues of UV heating reducing shrinking percentage |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810308971.0A CN108531121A (en) | 2018-04-09 | 2018-04-09 | A kind of double solidified glues of UV heating reducing shrinking percentage |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108531121A true CN108531121A (en) | 2018-09-14 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810308971.0A Pending CN108531121A (en) | 2018-04-09 | 2018-04-09 | A kind of double solidified glues of UV heating reducing shrinking percentage |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01123849A (en) * | 1987-11-10 | 1989-05-16 | Asahi Glass Co Ltd | Resin composition for laminating material and metal foil-clad laminate |
| CN105566983A (en) * | 2016-03-10 | 2016-05-11 | 吕凤荣 | High performance caulking putty and preparing method |
| CN105713549A (en) * | 2016-02-02 | 2016-06-29 | 苏州索梦得电子有限公司 | UV heating dual-curing glue |
| CN106867435A (en) * | 2015-12-11 | 2017-06-20 | 华烁科技股份有限公司 | A kind of flexible printed circuit polyimides stiffening plate modified acrylic ester adhesion agent and its application |
-
2018
- 2018-04-09 CN CN201810308971.0A patent/CN108531121A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01123849A (en) * | 1987-11-10 | 1989-05-16 | Asahi Glass Co Ltd | Resin composition for laminating material and metal foil-clad laminate |
| CN106867435A (en) * | 2015-12-11 | 2017-06-20 | 华烁科技股份有限公司 | A kind of flexible printed circuit polyimides stiffening plate modified acrylic ester adhesion agent and its application |
| CN105713549A (en) * | 2016-02-02 | 2016-06-29 | 苏州索梦得电子有限公司 | UV heating dual-curing glue |
| CN105566983A (en) * | 2016-03-10 | 2016-05-11 | 吕凤荣 | High performance caulking putty and preparing method |
Non-Patent Citations (2)
| Title |
|---|
| 翟海潮等: "后固化具有膨胀性的耐高温厌氧胶粘剂的研究", 《中国胶粘剂》 * |
| 钟洪: "低收缩高耐磨新型口腔树脂填料的制备与应用研究", 《中国优秀硕士学位论文全文数据库 工程科技Ⅰ辑》 * |
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| PB01 | Publication | ||
| PB01 | Publication | ||
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| RJ01 | Rejection of invention patent application after publication | ||
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Application publication date: 20180914 |