CN108530981A - PI base materials high-temperature insulation bloom white ink and preparation method thereof - Google Patents
PI base materials high-temperature insulation bloom white ink and preparation method thereof Download PDFInfo
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- CN108530981A CN108530981A CN201810337343.5A CN201810337343A CN108530981A CN 108530981 A CN108530981 A CN 108530981A CN 201810337343 A CN201810337343 A CN 201810337343A CN 108530981 A CN108530981 A CN 108530981A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/10—Printing inks based on artificial resins
- C09D11/102—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions other than those only involving unsaturated carbon-to-carbon bonds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
- C08J7/0427—Coating with only one layer of a composition containing a polymer binder
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
- C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2483/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
- C08J2483/04—Polysiloxanes
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- Polymers & Plastics (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
Abstract
The invention discloses a kind of PI base materials high-temperature insulation bloom white ink and preparation method thereof, mixing titanium dioxide, talcum powder, modified organic silicone resin, wetting dispersing agent, high speed dispersions 20~50 minutes；Then levelling agent, antifoaming agent is added, low speed disperses 5~15 minutes, and upper grinder grinding obtains host agent；Isocyanate curing agent, diluent are added in host agent, PI base material thermosetting properties high-temperature resistant, resistance to soldering, high-insulativity bloom white ink are uniformly mixing to obtain.PI base material the high-temperature insulation coatings mechanical property, resistance to soldering performance, heat resistance, solvent resistance and the ink that have had and substrate bonding of the present invention are good, environmental pollution is small, can play the role of decoration to yellow PI films；Show that the PI base material high-temperature insulation coatings composition of the present invention is reasonable, each component harmony is good, system excellent combination property.
Description
Technical field
The present invention relates to technical field of ink more particularly to a kind of PI base materials high-temperature insulation bloom white ink and
Preparation method.
Background technology
Polyimides is the aromatic heterocycle polymer compound that molecular structure contains imide chain link, English name
Polyimide (abbreviation PI), is commonly called as gold film, is one of the kind that heat resistance is best in current engineering plastics.To being at present
Only, polyimides has more than 20 big kinds, and with the expansion of its application range, the kind in relation to polyimides will
It is more and more.External manufacturer is concentrated mainly on the U.S. and Japan, General Electric Co. Limited, E.I.Du Pont Company such as the U.S., Japan
Emerging production company of space portion, Zhong Yuan limited liability companies of Japan;Domestic production producer be mainly Shanghai synthetic resin research institute and
Changchun applied chemistry study institute.
There is sufficiently stable polyimides aromatic heterocyclic structure in the molecular backbone of PI, have other special engineered under high temperature
The incomparable excellent comprehensive performance of lubriation material, tensile strength is up to 200Mpa, and heat resistance and radiation resistance are good,
High temperature, high vacuum and irradiation are lower to stablize, and volatile matter is few.Wherein thermoplasticity PI be used for a long time temperature generally at -240 DEG C -260 DEG C,
Temperature is used for a long time up to 300 DEG C or more in thermosetting property PI.There is PI good mechanical performance, frictional property to be only second to PTFE.
PI materials have the characteristics that physical property below：
(1) excellent heat resistance.The decomposition temperature of polyimides is generally more than 500 DEG C, sometimes even higher, is currently known
One of highest kind of thermal stability in organic polymer, this is primarily due to contain a large amount of aromatic rings in strand.
(2) excellent mechanical performance.The tensile strength of non-reinforced basis material is all in 100MPa or more.It is prepared with equal acid anhydride
Kapton film tensile strength be 170MPa, and biphenyl polyimide (Upilex S) can reach 400MPa.Polyimides
The elasticity modulus of fiber can reach 500MPa, be only second to carbon fiber.
(3) good chemical stability and humidity resistance.Polyimide material generally do not dissolve in organic solvent, it is corrosion-resistant,
Hydrolysis.The kind of different structure can be obtained by changing MOLECULE DESIGN.Some kinds stand under 2 atmospheric pressure, 120 DEG C,
The boiling of 500h.
(4) good radiation resistance.For Kapton after 5 × 109rad doses, intensity still keeps 86%;
Certain polyimide fibers are after 1 × 1010rad fast electron radiations, strength retention 90%.
(5) good dielectric properties.Dielectric constant is less than 3.5, if introducing fluorine atom on strand, dielectric constant can
2.5 or so are dropped to, dielectric loss 10, dielectric strength is 100 to 300kV/mm, and volume resistance is 1015-17 Ω cm.Cause
This, the synthesis of fluorinated polyimide material is current more popular research field.
Above-mentioned performance is all stable in very wide temperature range and frequency range.In addition to this, polyimides also has
There are the characteristics such as low temperature resistant, the coefficient of expansion is low, fire-retardant and good biological compatibility.The excellent comprehensive performance of polyimides and conjunction
At diversity chemically, multiple fields are can be widely applied to.
Kapton is two one of the upstream important materials applied greatly such as electronics, motor, and electronic industry is with soft board
Master is widely used in the industries such as semiconductor packages, LCD monitor, communication；Motor application is then with space flight, motor, machinery, automobile
Etc. various industries insulation application based on.Due to the excellent physical property and film-form advantage of PI, application has more and more trend,
Such as apply the COF etc. of the soft board and liquid crystal display television that are used in hand-held electronic product.In the applications described above, it relates generally to
All contain and weld this technique, since the heat resistance of PI films protrudes, but its color is partially yellow, generally all can be enterprising in film
Row coating plays decoration function, and this ink is generally known as cover film ink.Wherein white is applies most colors, this is just
It is required that white coating has high heat resistance and resistance to soldering performance.Existing cover film white ink is according to resin system
It is unusual to be divided into several big common systems：1. epoxy systems（Wherein most commonly phenolic aldehyde-bisphenol-A system）2. saturated polyester system
（Common thermoplastic's polyester and high hydroxyl value thermosetting polyester resin）3 hot setting polyurethane systems.The above each have their own spy of system
Color and advantage and disadvantage：Epoxy systems, the prices of raw materials are cheap, at low cost, and resin is excellent to the adhesive force of PI materials, but its is resistance to
Warm nature is poor, the phenomenon that xanthochromia is will appear when high temperature persistently uses；Polyester system heat resistance protrudes, and adhesive force is excellent, but
The performance of its resistance to soldering is still unable to meet demand in high request；The resistance to soldering of hot setting polyurethane system is had excellent performance, and attached
Put forth effort it is the most excellent, but due to its generally synthesis when can introduce aromatic ring（Excellent compatibility and adhesive force）, heat resistance
It is poor.Therefore, it is necessary to research and develop new cover film white ink, in addition to having efficient heat resistance and resistance to soldering, it is also necessary to
PI substrate compatibilities are good, adhesive force is good, and environmental pollution is small.
Invention content
The object of the present invention is to provide a kind of PI base materials thermosetting property high-temperature resistant, resistance to soldering, high-insulativity bloom white oil
Ink, in conjunction with inorganic material and high molecular material composite technology, design is unique, and composition is reasonable, and it is convenient to prepare, and has excellent
High temperature resistant, resistance to soldering performance, and good with PI base materials intermiscibility, environmental pollution is small.
In order to achieve the above objectives, the technical solution adopted by the present invention is：PI base materials high-temperature insulation bloom white oil
Ink, it is by weight, composed of the following components：
120-140 parts of modified organic silicone resin
90-100 parts of titanium dioxide
10-20 parts of talcum powder
4-8 parts of diluent
0.1-0.5 parts of levelling agent
0.1-0.5 parts of antifoaming agent
55-80 parts of isocyanate curing agent
The diluent is esters and/or organic solvent of ketone.
Preferably, PI base materials high-temperature insulation bloom white ink, it is by weight, composed of the following components：
130 parts of modified organic silicone resin
80 parts of titanium dioxide
18 parts of talcum powder
5 parts of diluent
0.5 part of levelling agent
0.5 part of antifoaming agent
60 parts of isocyanate curing agent
In above-mentioned technical proposal, the levelling agent is organosilicon levelling agent；The antifoaming agent is organic silicon defoamer；The talcum
Powder is monoclinic form hydrated magnesium silicate；The diluent is one or more of ethyl acetate, butanone, PMA or butyl ester；Institute
It is HDI curing agents to state isocyanate curing agent；Its chemical property torpescence is heated to 900 DEG C and still stablizes.
Under the conditions of this, ink system meets international environment close friend's standard, and low emission, and toxicity is low, high temperature resistant and Nai Xi
Weldering, insulation performance are preferable and excellent with the adhesive force of PI materials, and coating process is smooth, are not in that nail prints wire drawing etc. no
Good phenomenon, especially resistance to soldering grade are high.This product uses matrix resin of the modified organic silicone resin as crosslinking curing, because
Modified organic silicone resin has following characteristics：1. since resin is with-Si-O-Si- skeletons, so resin itself has excellent heat
Oxidation stability.2. by modification, some other functional groups is introduced, the binding force with special material can be effectively improved（Such as
The materials such as PI, PET）.3. since cover film white ink is mainly used for electronic field, so the requirement of its insulating properties is high.And change
Property organic siliconresin have outstanding electrical insulating property, belong to H class F insulating material Fs, volume resistivity changes not between 0-250 DEG C
Greatly；Film has the characteristics such as moisture-proof, acid and alkali-resistance, radiation hardness, resistance to ozone, Inverter fed motor, resistance to combustion, nontoxic simultaneously, can use extensively
In needing high-insulativity（H grades）Various motor, electric appliance insulation and protection.
In above-mentioned technical proposal, the modified organic silicone resin is sulfonated phenol formaldehyde resin modified organic silicone resin（SMP resins）, excellent
The modified organic silicone resin is selected to be modified by 15% sulfonated phenol formaldehyde resin modified organic silicone resin and 30% sulfonated phenol formaldehyde resin organic
Silicones is mixed to get.The SMP resins of the SMP resins of 15% content and 30% content are mixed in a certain ratio, general 15% content
SMP resins account for the 23%-34% of total resin content.The glass transition temperature of modified organic silicone resin of the present invention is 40~50
DEG C, molecular weight 13000-16000 provides certain toughness, and adhesive force is excellent on PI films.
In above-mentioned technical proposal, the titanium dioxide is rutile type titanium white, and purity is more than 99.8%；Such as R-706, R-
902 or R-900.Compared to anatase thpe white powder and plate titanium-type titanium dioxide, have very high structural stability, heat resistance excellent
It is different.In the present invention, titanium dioxide is rutile type titanium white, and talcum powder is monoclinic crystal water and silicic acid magnesium compound, is halogen-free, right
Environmental pollution is small.Titanium dioxide and remaining component, especially resin system intermiscibility are good, there is synergistic effect, will not weaken resin with
Adhesive force between PI base materials, overcome modified organic silicone resin surface energy it is low, to base material poor adhesive force the shortcomings that.
The above-mentioned PI base materials preparation method of high-temperature insulation bloom white ink, includes the following steps：Mix titanium white
Powder, modified organic silicone resin, talcum powder, high speed dispersion 20~50 minutes；Then upper grinder is ground；It is eventually adding levelling
Agent, antifoaming agent, low speed disperse 5~15 minutes, obtain host agent；Isocyanate curing agent, diluent are added in host agent, stirring is equal
It is even to obtain PI base material thermosetting properties high-temperature resistant, resistance to soldering, high-insulativity bloom white ink.
In above-mentioned technical proposal, the portion of diluent is the 65% of whole diluent quality；The high speed dispersion rate is
1200~1500rpm；The low speed dispersion rate is 600~800rpm.
In the present invention, diluent can be with regulation system viscosity so that each component is uniformly dispersed, and increases the boundary between each component
Face acts on, and the concertedness of system is improved, to obtain PI base material thermosetting properties high-temperature resistant, resistance to soldering, the height of high comprehensive performance
Insulating properties bloom white ink；In preparation process, diluent substep adds, and each additive amount is adjusted in right amount according to actual conditions
Whole, ensureing that each component is uniformly dispersed is advisable.
In the present invention, modified organic silicone resin is not only heat-resist, but also high with PI substrate bondings intensity, is conducive to improve
The adhesive force of ink layer and substrate layer can still keep ink layer bonding with base material in the case of being especially heated；Particularly,
The resin can fully arrange color stuffing, increase the concertedness of color stuffing and resin, make the high temperature resistance, resistance to of entire coating
Soldering performance and one grade of electrical apparatus insulation performance boost.
The isocyanate curing agent is HDI curing agents, and HDI curing agents are applied in the ink system of the present invention, and change
Property organic siliconresin mixing, intermiscibility is good；It ensures the mechanical property of ink layer, scratch resistant.The structural formula of HDI curing agents is：
Ink is constructing and some physics, chemical change can occur in film forming procedure, and the property of these variations and ink itself will
Significantly affect construction and the application performance of ink.After ink printing, it may appear that new interface, if between ink and ground
The interfacial tension at liquid/solid interface is higher than the critical surface tension of ground, and ink can not just be sprawled on ground, just be will produce naturally
The defects of flake, shrinkage cavity；When ink solidification the volatilization of solvent can cause between coating surface and inside generate temperature, density and
Surface tension is poor, these differences cause to generate the turbulent motion inside paint film in turn, form so-called vortex, vortex can cause to generate
Tangerine peel；In the system of the component containing more than one, if there is some difference for the motility of each component, vortex also likely causes to float
Color and floating, vertical surface construction can lead to silking；In crosslinking curing system, there is more than a kind of resins, it is possible to cure
Process generates insoluble micelle, and surface tension gradient is caused to be formed.After ink system is added in color stuffing, ink body can be aggravated
It fastens and states flowing and bonding agent solidification defect, not only influence appearance, while also damaging safeguard function, such as form shrinkage cavity and cause ink film thickness
Not enough, the discontinuity of ink layer can be led to by forming pin hole, and it is bonding with base material that these can all reduce ink, can substantially reduce whole
The heat resistance of a system makes whole system become not heatproof, and the PI base materials for capableing of heatproof originally is made to become more fragile, passes through
Heatproof, soldering test become worse later.
The invention devises Halogen heatproof ink system, resin and additive, especially titanium dioxide, talcum powder
Between intermiscibility it is good, avoid ink flowing with solidification when generate appearance, boundary defect, effectively increase ink/ground
Temperature tolerance, the defect of material surface heat resistance can be reduced by overcoming ink layer in the prior art；Ink system stability is good, no
Perishable, viscosity change is small after storage, on performance without influence；Reactivity is good when solidification, good for the coating performance of PI base materials, light
Cleanliness is high, reaches 95%；Solvent resistant after solidification corrodes, and the weatherability having had, non-discolouring, non-yellowing for a long time；After solidification
Ink layer there is excellent heat resistance, can be by 250 DEG C ~ -30 DEG C of cold cycling 5 times；And the PI base materials of the present invention
It is high photosensitiveness with thermosetting property high-temperature resistant, soldering high-insulativity bloom white ink, ink layer is white, can be effectively to PI base materials
Carry out functional decoration.
Therefore, the invention also discloses above-mentioned PI base materials high-temperature insulation bloom white inks to prepare the painting of PI base materials
Application in layer.
In addition, the prior art reduces drawbacks described above to the greatest extent, prints ink to improve the interfacial effect of ink and PI base materials
It is preceding that PI base materials are pre-processed（Discharge treatment）, while ensure that product appearance U.S., effectively increase the resistance to mild resistance to of PI base materials
Soldering performance.The present invention is not necessarily to pre-treatment, the coating still being had excellent performance.
The invention also discloses a kind of PI base materials high-temperature insulation coatings, by above-mentioned PI base materials high-temperature insulation bloom
White ink solidification is prepared.A kind of preparation method of PI base materials high-temperature insulation coating, by above-mentioned PI base materials high temperature resistant
Insulating properties bloom white ink is coated on PI base materials, and PI base material high-temperature insulation coatings are prepared in solidification.
Since above-mentioned technical proposal is used, the present invention has following advantages compared with prior art：
1. present invention firstly provides high-temperature resistant, resistance to soldering, the high ink to insulate is prepared for PI base materials, design is unique, composition
Rationally, it is convenient to prepare, and has excellent heatproof, and good with PI base materials adhesive force, while improving ink heat resistance, protects
Cementability, the workability for having demonstrate,proved ink, the intermolecular forces for avoiding existing ink layer and PI base materials are poor, poor heat resistance scarce
It falls into, while environmental pollution is small.
2. high-temperature resistant disclosed by the invention, resistance to soldering, the high bloom white ink to insulate are while printing ink to PI
Base material carries out discharge treatment, the phenomenon that avoiding the occurrence of poor adhesive force, while improving the binding force of coating and PI base materials, makes entirely
The concertedness of coating and PI base materials is more notable, makes the heat resistance, resistance to soldering performance, insulation performance more last layer of entire product
Building.
3. high-temperature resistant disclosed by the invention, resistance to soldering, the bloom white ink of high insulation and PI base materials adhesive force are good, keep away
The a series of defects such as temperature tolerance poor, resistance to soldering is poor, the insulation performance difference of existing ink coating are exempted from.
4. high-temperature resistant provided by the invention, resistance to soldering, high insulation bloom white ink using when without changing existing set
It is standby, it is saved greatly cost, moreover it is possible to more reduce the pollution to environment；It is convenient and identical resistance to reaching to use and store
It is lower to the injury of human body to the pollution smaller of environment under the premise of the performances such as temperature；It is more suitable for industrialized production.
Specific implementation mode
With reference to embodiment, the invention will be further described：
Embodiment one
Mixing 80g titanium dioxides are R-706 titanium dioxides（Du Pont's titanium dioxide）, 35g modified organic silicone resin JY7200EP（Dongguan is pretty
Happy chemical industry）With 95g 3601（Nation of Zhong Shan sections chemical industry）, 18g talcum powder（Linyi talcum powder factory）, 1500rpm high speed dispersions 30 divide
Clock；Then 0.5g levelling agents BYK-O54 is added（Bi Ke chemistry）, 0.5g antifoaming agent BYK-306（Bi Ke chemistry）, 800rpm low speed
Dispersion 10 minutes, finally upper grinder grinding 6 times, obtain host agent；60gHDI curing agents, 5g butanone are added in host agent, stirring
White fluid uniformly is obtained, is PI base material high-temperature insulation coatings, also known as PI base materials thermosetting property high-temperature resistant, resistance to soldering, height are exhausted
Edge bloom white ink.
Embodiment two
Mixing 80g titanium dioxides are R-902 titanium dioxides（Du Pont's titanium dioxide）, 40g modified organic silicone resin JY7200EP（Dongguan is pretty
Happy chemical industry）With 80g 3601（Nation of Zhong Shan sections chemical industry）, 20g talcum powder（Linyi talcum powder factory）, 1500rpm high speed dispersions 30 divide
Clock；Then 0.5g levelling agents BYK-O54 is added（Bi Ke chemistry）, 0.5g antifoaming agent BYK-306（Bi Ke chemistry）, 800rpm low speed
Dispersion 10 minutes, finally upper grinder grinding 6 times, obtain host agent；60gHDI curing agents, 5g butanone are added in host agent, stirring
White fluid uniformly is obtained, is PI base material thermosetting properties high-temperature resistant, resistance to soldering, high-insulativity bloom white ink.
Embodiment three
Mixing 60g titanium dioxides are R-706 titanium dioxides（Du Pont's titanium dioxide）, 40g modified organic silicone resin JY7200EP（Dongguan is pretty
Happy chemical industry）With 85g 3601（Nation of Zhong Shan sections chemical industry）, 20g talcum powder（Linyi talcum powder factory）, 1500rpm high speed dispersions 30 divide
Clock；Then 0.5g levelling agents BYK-O54 is added（Bi Ke chemistry）, 0.5g antifoaming agent BYK-306（Bi Ke chemistry）, 800rpm low speed
Dispersion 10 minutes, finally upper grinder grinding 6 times, obtain host agent；70gHDI curing agents, 5g butanone are added in host agent, stirring
White fluid uniformly is obtained, is PI base material thermosetting properties high-temperature resistant, resistance to soldering, high-insulativity bloom white ink.
The ink of embodiment one is coated on PI base materials, is then cured（150℃×3min）Obtain coating.
The thermosetting property high-temperature resistant of PI base materials after above-mentioned solidification, resistance to soldering, high-insulativity bloom white ink/PI are carried out soft
Toughness, adhesive force, ethanol-tolerant (99.5% ethyl alcohol, 500g.f × 50 time lose ground), heat-resisting, resistance to soldering test, Insulation test,
It the results are shown in Table 1, it can be seen that PI base materials thermosetting property high-temperature resistant of the invention, resistance to soldering, high-insulativity bloom white ink tool
Mechanical property, resistance to soldering performance, heat resistance, solvent resistance and the ink and substrate bonding that have had is good, environmental pollution
It is small, decoration can be played the role of to the PI films of yellow.
The result shows that the PI base materials thermosetting property high-temperature resistant of the present invention, resistance to soldering, high-insulativity bloom white ink composition
Rationally, each component harmony is good, system excellent combination property；PI base materials thermosetting property high-temperature resistant, resistance to soldering, the height of the present invention is exhausted
Edge bloom white ink entirety ink（Including titanium dioxide, talcum powder）The content of not brominated, iodine, fluorine and chlorine is in EN61249-
2-21 standards（Fluorine, chlorine, bromine, iodine≤900ppm or mg/kg, the ppm or mg/kg of chlorine+bromine≤1500）In range, meet
Halogen-free requirement as defined in EN61249-2-21 standards.
1 PI base materials thermosetting property high-temperature resistant of table, resistance to soldering, high-insulativity bloom white ink performance
Reactivity is good when the present invention cures, good for the coating performance of PI base materials, highly polished, reaches 95%；It is resistance to molten after solidification
Agent is corroded, and the weatherability having had, non-discolouring, non-yellowing for a long time；Ink layer after solidification has excellent heat resistance, can
With by 250 DEG C ~ -30 DEG C of cold cycling 5 times；And PI base materials thermosetting property high-temperature resistant, the soldering high-insulativity of the present invention
Bloom white ink is high photosensitiveness, and ink layer is white, effectively can carry out functional decoration to PI base materials.
Claims (10)
1. a kind of PI base materials high-temperature insulation bloom white ink, which is characterized in that by weight, by following components group
At：
120-140 parts of modified organic silicone resin
90-100 parts of titanium dioxide
10-20 parts of talcum powder
4-8 parts of diluent
0.1-0.5 parts of levelling agent
0.1-0.5 parts of antifoaming agent
55-80 parts of isocyanate curing agent
The glass transition temperature of the modified organic silicone resin is 40~50 DEG C, molecular weight 13000-16000；
The modified organic silicone resin is sulfonated phenol formaldehyde resin modified organic silicone resin；
The diluent is esters and/or organic solvent of ketone.
2. PI base materials high-temperature insulation bloom white ink according to claim 1, it is characterised in that：The levelling agent
For organosilicon levelling agent；The antifoaming agent is organic silicon defoamer；The talcum powder is monoclinic form hydrated magnesium silicate；It is described dilute
It is one or more of ethyl acetate, butanone, PMA or butyl ester to release agent；The isocyanate curing agent is HDI curing agent.
3. PI base materials high-temperature insulation bloom white ink according to claim 1, it is characterised in that：The titanium dioxide
For rutile type titanium white；The purity of the rutile type titanium white is more than 99.8%.
4. PI base materials high-temperature insulation bloom white ink according to claim 1, it is characterised in that：The modification has
Machine silicones is mixed by 15% sulfonated phenol formaldehyde resin modified organic silicone resin and 30% sulfonated phenol formaldehyde resin modified organic silicone resin
It arrives.
5. application of the PI base materials with high-temperature insulation bloom white ink in preparing PI substrate coatings described in claim 1.
6. the preparation method of PI base materials high-temperature insulation bloom white ink described in claim 1, which is characterized in that including
Following steps：
Mix titanium dioxide, modified organic silicone resin, talcum powder, high speed dispersion 20~50 minutes；Then upper grinder is ground；
It is eventually adding levelling agent, antifoaming agent, low speed disperses 5~15 minutes, obtains host agent；Isocyanate curing agent, diluent are added
In host agent, it is uniformly mixing to obtain PI base material high-temperature insulation bloom white inks.
7. the preparation method of PI base materials high-temperature insulation bloom white ink according to claim 7, it is characterised in that：
The high speed dispersion rate is 1200~1500rpm；The low speed dispersion rate is 600~800rpm.
8. a kind of PI base materials high-temperature insulation coating, it is characterised in that：The PI base materials high-temperature insulation coating is by claim 1
The PI base materials high-temperature insulation bloom white ink solidification is prepared.
9. a kind of preparation method of PI base materials high-temperature insulation coating, it is characterised in that：By PI base materials described in claim 1 with resistance to
High-temperature insulating quality bloom white ink is coated on PI base materials, and PI base material high-temperature insulation coatings are prepared in solidification.
10. the preparation method of PI base materials high-temperature insulation coating according to claim 9, it is characterised in that：It is described to be cured as
150 DEG C of solidification 3min.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810337343.5A CN108530981A (en) | 2018-04-16 | 2018-04-16 | PI base materials high-temperature insulation bloom white ink and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810337343.5A CN108530981A (en) | 2018-04-16 | 2018-04-16 | PI base materials high-temperature insulation bloom white ink and preparation method thereof |
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| CN108530981A true CN108530981A (en) | 2018-09-14 |
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| CN201810337343.5A Pending CN108530981A (en) | 2018-04-16 | 2018-04-16 | PI base materials high-temperature insulation bloom white ink and preparation method thereof |
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