CN108527697B - Cutting device is used in processing of photovoltaic board silicon chip - Google Patents
Cutting device is used in processing of photovoltaic board silicon chip Download PDFInfo
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- CN108527697B CN108527697B CN201810309976.5A CN201810309976A CN108527697B CN 108527697 B CN108527697 B CN 108527697B CN 201810309976 A CN201810309976 A CN 201810309976A CN 108527697 B CN108527697 B CN 108527697B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
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Abstract
The invention relates to the technical field of photovoltaic equipment and discloses a cutting device for processing a photovoltaic plate silicon wafer, which comprises a machine body, wherein the bottom of the inner side of the machine body is fixedly connected with a cutting table through a support rod, the middle position of the top of the machine body is fixedly connected with a hydraulic cylinder, a hydraulic telescopic rod of the hydraulic cylinder penetrates through the top of the machine body and is fixedly connected with a bearing plate, the lower surface of the bearing plate is fixedly connected with a driving and adjusting device, the cutting table is connected with two movable clamping devices, and the middle position of the bottom of the inner side of the machine body. According to the invention, the body, the cutting table and the movable clamping device are matched with each other, so that the problem that the conventional cutting device for processing the photovoltaic plate silicon wafer cannot perform good clamping and fixing when the silicon wafer is cut is solved.
Description
Technical Field
The invention relates to the technical field of photovoltaic equipment, in particular to a cutting device for processing a photovoltaic panel silicon wafer.
Background
With the development of new energy, the application of photovoltaic equipment is greatly popularized, photovoltaic panel silicon wafers of the photovoltaic equipment need to be cut according to specific production requirements during processing, but the existing cutting device for processing the photovoltaic panel silicon wafer can not perform good clamping and fixing when cutting the silicon wafer, so that the silicon wafer is damaged when being clamped, the yield of products is reduced, the existing cutting device for processing the photovoltaic panel silicon wafer has larger transverse feeding error when cutting the photovoltaic panel silicon wafer, so that the error of cutting the silicon wafer is large, and the production cost of the silicon wafer is higher, meanwhile, the scraps generated during the cutting of the silicon wafer can not be effectively recycled, the working environment of operators is affected, the waste of production raw materials is caused, therefore, the cutting device for processing the photovoltaic panel silicon wafer is needed to cut the silicon wafer so as to reduce the production and use cost of raw materials.
Disclosure of Invention
Technical problem to be solved
Aiming at the defects of the prior art, the invention provides a cutting device for processing a photovoltaic panel silicon wafer, which solves the problem that the existing cutting device for processing the photovoltaic panel silicon wafer has higher production cost in cutting the silicon wafer.
(II) technical scheme
In order to achieve the purpose, the invention provides the following technical scheme: the utility model provides a cutting device is used in processing of photovoltaic board silicon chip, includes the organism, bracing piece fixedly connected with cutting bed is passed through to the inboard bottom of organism, the top intermediate position fixedly connected with pneumatic cylinder of organism, the hydraulic telescoping rod of pneumatic cylinder runs through the top and the fixedly connected with bearing plate of organism, the lower fixed surface of bearing plate is connected with drive adjusting device, be connected with two movable clamping device on the cutting bed, the inboard bottom intermediate position fixedly connected with of organism purifies collection device.
Preferably, the upper surface intermediate position of cutting bed has seted up the cutting groove, the spread groove has been seted up to the bottom intermediate position of cutting bed, the spread groove is located the cutting groove under, set up the edulcoration hole that is linked together between the inboard top of spread groove and the inboard bottom of cutting groove, movable through-hole has all been seted up to the left and right sides of cutting bed.
Preferably, the driving and adjusting device comprises a driving box, a driving motor, a transverse adjusting screw, a ball nut, a transverse adjusting block and a cutting device, the lower surface of the bearing plate is fixedly connected with the driving adjusting device, the lower surface of the bearing plate is fixedly connected with the driving box, the left side surface of the driving box is fixedly connected with the driving motor, an output shaft of the driving motor penetrates through the left side of the driving box and is fixedly connected with the transverse adjusting screw through a coupler, one end of the transverse adjusting screw, far away from the driving motor, is movably connected with the right inner wall of the driving box through a bearing base, the ball nut is sleeved on the transverse adjusting screw in a threaded manner, a transverse movable groove is formed in the middle position of the bottom of the driving box, the transverse adjusting block is movably connected to the inner side of the transverse movable groove, and the top of the, and the bottom of the transverse adjusting block is fixedly connected with a cutting device.
Preferably, the movable clamping devices comprise electric push-pull rods, movable hinge seats, movable connecting plates, movable seats, adjusting nuts, compression bolts, compression blocks, protective layers and C-shaped elastic pieces, the cutting table is connected with the two movable clamping devices, the left side and the right side of the upper surface of the cutting table are fixedly connected with the movable hinge seats, the cutting table is movably connected with the movable connecting plates through the movable hinge seats, the two sides of the bottom of the inner side of the machine body are fixedly connected with the electric push-pull rods matched with the movable through holes, the top ends of the two electric push-pull rods respectively penetrate through the inner walls of the two movable through holes and are movably connected to the lower surfaces of the two movable connecting plates through the movable seats, the lower surfaces of the two movable connecting plates are fixedly connected with the C-shaped elastic pieces, the C-shaped elastic pieces are bonded with the friction protective layers on the side surfaces close to the cutting table, the inner side of the adjusting nut is in threaded connection with a compression bolt, the tail end of the compression bolt penetrates through the upper surface of the movable connecting plate and is fixedly connected with a compression block, and the lower surface of the compression block is fixedly connected with a protective layer.
Preferably, the purification and collection device comprises a dust collection fan, an exhaust pipe, a three-way connector, a supporting communicating pipe, a waste collection box, an active carbon filter layer, a dust collection pipe and a sealing rubber ring, the purification and collection device is fixedly connected to the middle position of the inner bottom of the machine body, the dust collection fan is fixedly connected to the middle position of the inner bottom of the machine body, the exhaust pipe is fixedly connected to the exhaust port of the dust collection fan, one end of the exhaust pipe far away from the dust collection fan penetrates through the inner bottom of the machine body, the dust collection pipe at the top of the dust collection fan is fixedly connected with the three-way connector, the supporting communicating pipe is fixedly connected to both air outlets of the three-way connector, the waste collection box is fixedly connected to one end far away from the three-way connector, the waste collection box consists of a box body, the activated carbon filter layer is fixedly mounted at the bottom of the inner side of the waste collection box, a dust collection pipe matched with the impurity removal hole is fixedly connected to the top air vent of the waste collection box, a sealing rubber ring is sleeved on the dust collection pipe, and the top end of the dust collection pipe is inserted into the inner wall of the impurity removal hole.
Preferably, the edulcoration hole evenly distributed is in the inboard bottom of cutting the groove, the dust absorption pipe sets up for one-to-one with the edulcoration hole.
Preferably, the driving adjusting device is positioned right above the cutting table, and the transverse movable groove is positioned right above the cutting groove.
Preferably, the movable clamping devices on the left side and the right side of the cutting table are arranged symmetrically left and right about the center of the cutting table.
The working principle is as follows: when the device is used, a photovoltaic plate silicon wafer to be cut is placed on the upper surface of a cutting table, then an electric push-pull rod is started, the electric push-pull rod pulls a movable connecting plate through a movable seat, the bottom of a C-shaped elastic part on the lower surface of the movable connecting plate firstly contacts with the surface of the silicon wafer, the movable connecting plate is pulled by the electric push-pull rod through the movable seat to gradually move downwards until the bottom of the C-shaped elastic part is completely attached to the surface of the silicon wafer, at the moment, a protective layer at the bottom of a pressing block contacts with the surface of the silicon wafer, the electric push-pull rod moves downwards to enable the C-shaped elastic part and the pressing block to compress and fix the silicon wafer, the C-shaped elastic part and the pressing block are doubly fixed, and after the silicon wafer is fixed, if the silicon wafer is not fixed firmly, the pressing bolt is rotated, the pressing bolt acts on, thereby achieving the purpose of carrying out secondary fixation on the silicon chip, after the silicon chip is clamped and fixed by the movable clamping device, according to the position of the silicon chip to be cut, the driving and adjusting device is started, the output shaft of the driving motor drives the transverse adjusting screw rod to rotate through the coupler, the transverse adjusting screw rod rotates to drive the ball nut to carry out transverse micro-feeding, the ball nut drives the transverse adjusting block to transversely move, the transverse adjusting block moves in the transverse chute, the transverse adjusting block drives the cutting device to move, thereby achieving the purpose of carrying out transverse micro-feeding on the cutting device, the hydraulic telescopic rod of the hydraulic cylinder acts on the driving and adjusting device through the bearing plate, the driving and adjusting device cuts the silicon chip, meanwhile, the purifying and collecting device is started, the air suction pipe of the dust suction fan acts on the waste collecting box through the three-way connector and the supporting communicating pipe, the waste, make the inner chamber of cutting cut groove produce the negative pressure, absorb the piece that cutting device cutting silicon chip produced, prevent cutting clastic splashing, reduce operating personnel's operational environment, after the piece leads into the garbage collection box inner chamber through the dust absorption pipe, after the filtration of active carbon filter layer, the internal gas of external gas through the support communicating pipe of bottom and the leading-in dust absorption fan of tee junction head in the suction garbage collection box, at last derive gas through the blast pipe, after using a period, can dismantle the garbage collection box, carry out unified collection processing with the filterable silicon chip of active carbon filter layer.
(III) advantageous effects
The invention provides a cutting device for processing a photovoltaic panel silicon wafer. The method has the following beneficial effects:
(1) the invention arranges the machine body, the cutting table and the movable clamping device to be matched with each other, when the device is used, a photovoltaic plate silicon wafer to be cut is placed on the upper surface of the cutting table, then the electric push-pull rod is started, the electric push-pull rod pulls the movable connecting plate through the movable seat, the bottom of the C-shaped elastic piece on the lower surface of the movable connecting plate firstly contacts with the surface of the silicon wafer, the electric push-pull rod pulls the movable connecting plate through the movable seat to gradually move downwards along with the electric push-pull rod until the bottom of the C-shaped elastic piece is completely attached to the surface of the silicon wafer, at the moment, the protective layer at the bottom of the pressing block is contacted with the surface of the silicon wafer, the electric push-pull rod moves downwards to further enable the C-shaped elastic piece and the pressing block to tightly press and fix the silicon wafer, the C-shaped elastic, the pressing bolt acts on the pressing block through the adjusting nut, so that the pressing block further fixes the silicon wafer through the protective layer, the purpose of secondary fixing of the silicon wafer is achieved, and the problem that the existing cutting device for processing the photovoltaic panel silicon wafer cannot well clamp and fix the silicon wafer when the silicon wafer is cut is solved.
(2) The invention is characterized in that the machine body, the cutting table, the hydraulic cylinder, the bearing plate, the driving adjusting device and the movable clamping device are matched with each other, when the equipment is used, after the silicon wafer is clamped and fixed by the movable clamping device, the driving and adjusting device is started according to the position of the silicon wafer to be cut, the output shaft of the driving motor drives the transverse adjusting screw rod to rotate through the coupler, the transverse adjusting screw rod rotates to drive the ball nut to carry out transverse micro-feeding, the ball nut drives the transverse adjusting block to transversely move, the transverse adjusting block moves in the transverse sliding groove, the transverse adjusting block drives the cutting device to move, therefore, the purpose of transversely micro-feeding the cutting device is achieved, the transverse cutting precision of the silicon wafer during cutting is improved, and the problem that the transverse feeding error of the existing cutting device for processing the photovoltaic panel silicon wafer during cutting the photovoltaic panel silicon wafer is large is solved.
(3) The invention discloses a silicon wafer cleaning device, which is characterized in that a cleaning and collecting device, a cutting table, a driving and adjusting device and a movable clamping device are arranged to be matched with each other, when the device is used, the movable clamping device clamps a silicon wafer, a hydraulic telescopic rod of a hydraulic cylinder acts on the driving and adjusting device through a bearing plate, the driving and adjusting device cuts the silicon wafer, meanwhile, the cleaning and collecting device is started, an air suction pipe of a dust suction fan acts on a waste collection box through a three-way connector and a supporting communicating pipe, the waste collection box sucks air into a cutting groove through a dust suction pipe at the top, so that negative air pressure is generated in an inner cavity of the cutting groove, chips generated by the silicon wafer cutting of the cutting device are absorbed, the splashing of the cut chips is prevented, the working environment of an operator is reduced, after the chips are guided into the inner cavity of the waste collection box through the dust suction pipe and filtered by an And finally, gas is guided out through the exhaust pipe, after the waste collection box is used for a period of time, the waste collection box can be detached, silicon chip filtered by the activated carbon filter layer is collected and processed uniformly, and the problem that the silicon chip produced during cutting cannot be recycled effectively is solved.
(4) According to the silicon wafer cutting device, the cutting table is arranged to place the silicon wafer, when the cutting device cuts the silicon wafer, chips generated by the cutting knife of the cutting device penetrating through the silicon wafer are arranged right above the cutting groove of the cutting table, larger chips fall into the cutting groove, and fine chips are absorbed by negative air pressure generated by the purifying and collecting device, so that the chips generated when the silicon wafer is cut are prevented from falling on the cutting plane of the cutting table, and the placing stability and the cutting precision of the silicon wafer are guaranteed.
(5) According to the invention, the machine body, the cutting table, the hydraulic cylinder, the bearing plate, the driving adjusting device, the movable clamping device and the purifying and collecting device are matched with each other, when the device is used, a photovoltaic plate silicon wafer to be cut is placed on the upper surface of the cutting table, then the movable clamping device is started to compress and fix the silicon wafer, the hydraulic cylinder acts on the driving adjusting device through the bearing plate, the driving adjusting device acts on the cutting device, the cutting device cuts the silicon wafer, and the purifying and collecting device collects, processes and purifies debris generated by the cutting device when the silicon wafer is cut, so that the service performance of the silicon wafer cutting device is effectively improved.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic view of the cutting table of the present invention;
FIG. 3 is a schematic view of the driving adjustment device of the present invention;
FIG. 4 is a schematic view of the movable clamping device of the present invention;
FIG. 5 is a schematic view of the purifying and collecting device according to the present invention;
FIG. 6 is a schematic view of the waste collection bin of the present invention;
FIG. 7 is a schematic view of a C-shaped elastic member according to the present invention.
In the figure: 1 machine body, 2 cutting table, 21 cutting groove, 22 connecting groove, 23 impurity removing hole, 24 movable through hole, 3 hydraulic cylinder, 4 bearing plate, 5 driving adjusting device, 51 driving box, 52 driving motor, 53 transverse adjusting screw rod, 54 ball nut, 55 transverse movable groove, 56 transverse adjusting block, 57 cutting device, 6 movable clamping device, 61 electric push-pull rod, 62 movable hinge seat, 63 movable connecting plate, 64 movable seat, 65 adjusting nut, 66 pressing bolt, 67 pressing block, 68 protective layer, 69C type elastic element, 691 friction protective layer, 7 purification and collection device, 71 dust suction fan, 72 exhaust pipe, 73 three-way connector, 74 supporting communicating pipe, 75 waste collecting box, 76 active carbon filter layer, 77 dust suction pipe, 78 sealing rubber ring.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As shown in fig. 1 to 7, the present invention provides a technical solution: the utility model provides a cutting device is used in processing of photovoltaic board silicon chip, includes organism 1, bracing piece fixedly connected with cutting bed 2 is passed through to organism 1's inboard bottom, cutting groove 21 has been seted up to cutting bed 2's upper surface intermediate position, spread groove 22 has been seted up to cutting bed 2's bottom intermediate position, spread groove 22 is located cutting groove 21 under, the edulcoration hole 23 that is linked together is seted up between spread groove 22's inboard top and cutting groove 21's the inboard bottom, movable through-hole 24 has all been seted up to cutting bed 2's the left and right sides.
The middle position of the top of the machine body 1 is fixedly connected with a hydraulic cylinder 3, a hydraulic telescopic rod of the hydraulic cylinder 3 penetrates through the top of the machine body 1 and is fixedly connected with a bearing plate 4, the inner walls of the left side and the right side of the machine body 1 are provided with movable chutes, the left side and the right side of the bearing plate 4 are both fixedly connected with guide rollers, the two guide rollers are respectively and movably connected with the inner sides of the two movable chutes, the lower surface of the bearing plate 4 is fixedly connected with a driving and adjusting device 5, the driving and adjusting device 5 comprises a driving box 51, a driving motor 52, a transverse adjusting screw 53, a ball nut 54, a transverse adjusting block 56 and a cutting device 57, the lower surface of the bearing plate 4 is fixedly connected with the driving and adjusting device 5, the lower surface of the bearing plate 4 is fixedly connected with a driving box 51, the left side surface of the driving box 51, horizontal accommodate screw 53 has drive box 51's right side inner wall through bearing base swing joint in the one end of keeping away from driving motor 52, ball nut 54 has been cup jointed to the screw thread on horizontal accommodate screw 53, horizontal movable groove 55 has been seted up to drive box 51's bottom intermediate position, drive adjusting device 5 is located cutting bed 2 directly over, horizontal movable groove 55 is located cutting groove 21 directly over, the inboard swing joint of horizontal movable groove 55 has horizontal regulating block 56, the top fixed connection of horizontal regulating block 56 is in ball nut 54's bottom, the bottom fixedly connected with cutting device 57 of horizontal regulating block 56, cutting device 57 is including cutting motor and cutting knife, the cutting motor passes through connector fixed connection cutting knife.
The cutting table 2 is connected with two movable clamping devices 6, the movable clamping devices 6 on the left side and the right side of the cutting table 2 are arranged symmetrically left and right about the center of the cutting table 2, each movable clamping device 6 comprises an electric push-pull rod 61, a movable hinged seat 62, a movable connecting plate 63, a movable seat 64, an adjusting nut 65, a pressing bolt 66, a pressing block 67, a protective layer 68 and a C-shaped elastic piece 69, the cutting table 2 is connected with the two movable clamping devices 6, the left side and the right side of the upper surface of the cutting table 2 are fixedly connected with the movable hinged seats 62, the cutting table 2 is movably connected with the movable connecting plates 63 through the movable hinged seats 62, the two sides of the inner bottom of the machine body 1 are fixedly connected with the electric push-pull rods 61 matched with the movable through holes 24, the top ends of the two electric push-pull rods 61 respectively penetrate through, the equal fixedly connected with C type elastic component 69 of lower surface of two swing joint board 63, C type elastic component 69 is for having elastic metal shrapnel, C type elastic component 69 has friction protection layer 691 in the side that is close to cutting bed 2 bonds, the material of friction protection layer 691 is soft rubber, the equal fixedly connected with adjusting nut 65 of upper surface recess inner wall of two swing joint board 63, adjusting nut 65's inboard threaded connection has clamp bolt 66, clamp bolt 66's end runs through swing joint board 63's upper surface and fixedly connected with compact heap 67, the bottom of C type elastic component 69 and compact heap 67's bottom are on same water flat line, the lower fixed surface of compact heap 67 is connected with protective layer 68, protective layer 68 can adopt soft rubber, the antiskid line has been seted up in the side of keeping away from compact heap 67 to protective layer 68.
The purifying and collecting device 7 is fixedly connected to the middle position of the inner bottom of the machine body 1, the purifying and collecting device 7 comprises a dust suction fan 71, an exhaust pipe 72, a three-way connector 73, a supporting communicating pipe 74, a waste collecting box 75, an active carbon filter layer 76, a dust suction pipe 77 and a sealing rubber ring 78, the purifying and collecting device 7 is fixedly connected to the middle position of the inner bottom of the machine body 1, the dust suction fan 71 is fixedly connected to the middle position of the inner bottom of the machine body 1, the exhaust pipe 72 is fixedly connected to the exhaust port of the dust suction fan 71, one end of the exhaust pipe 72 far away from the dust suction fan 71 penetrates through the inner bottom of the machine body 1, the dust suction pipe 77 at the top of the dust suction fan 71 is fixedly connected with the three-way connector 73, the supporting communicating pipe 74 is fixedly connected, the waste collection box 75 is composed of a box body and a bottom cover, the bottom cover is movably clamped at the bottom of the box body, the top of the waste collection box 75 is positioned at the inner side of the connecting groove 22, an activated carbon filter layer 76 is fixedly installed at the bottom of the inner side of the waste collection box 75, a gap is reserved between the activated carbon filter layer 76 and the top of the inner side of the waste collection box 75, the left, right, front, back and side surfaces of the activated carbon filter layer 76 are respectively contacted with the inner side wall of the waste collection box 75, air vents at the top of the waste collection box 75 are respectively and fixedly connected with a dust collection pipe 77 matched with the impurity removal hole 23, a sealing rubber ring 78 is sleeved on the dust collection pipe 77, the top end of the dust collection pipe 77 is inserted in the inner wall of the impurity removal hole 23, the sealing rubber ring 78 ensures the sealing performance of the impurity removal hole 23 after the dust collection pipe 77 is inserted in, the dust suction pipes 77 are provided in one-to-one correspondence with the trash holes 23.
The electrical components presented in the document are all electrically connected with an external master controller and 220V mains, and the master controller can be a conventional known device controlled by a computer or the like.
The working principle is as follows: when the device is used, a photovoltaic plate silicon wafer to be cut is placed on the upper surface of the cutting table 2, then the electric push-pull rod 61 is started, the electric push-pull rod 61 pulls the movable connecting plate 63 through the movable seat 64, the bottom of the C-shaped elastic piece 69 on the lower surface of the movable connecting plate 63 is firstly contacted with the surface of the silicon wafer, the electric push-pull rod 61 pulls the movable connecting plate 63 through the movable seat 64 to gradually move downwards until the bottom of the C-shaped elastic piece 69 is completely attached to the surface of the silicon wafer, at the moment, the protective layer 68 at the bottom of the pressing block 67 is contacted with the surface of the silicon wafer, the electric push-pull rod 61 moves downwards so that the C-shaped elastic piece 69 and the pressing block 67 tightly press and fix the silicon wafer, the C-shaped elastic piece 69 and the pressing block 67 are doubly fixed, after the silicon wafer is fixed, if the silicon wafer is not firmly fixed, the pressing, the silicon wafer is further fixed by the pressing block 67 through the protective layer 68, so that the purpose of secondary fixing of the silicon wafer is achieved, after the silicon wafer is clamped and fixed by the movable clamping device 6, the driving and adjusting device 5 is started according to the position of the silicon wafer to be cut, the output shaft of the driving motor 52 drives the transverse adjusting screw 53 to rotate through the shaft coupling, the transverse adjusting screw 53 rotates to drive the ball nut 54 to perform transverse micro-feeding, the ball nut 54 drives the transverse adjusting block 56 to move transversely, the transverse adjusting block 56 moves in the transverse sliding groove 55, the transverse adjusting block 56 drives the cutting device 57 to move, so that the purpose of transverse micro-feeding of the cutting device 57 is achieved, the transverse cutting precision of the silicon wafer during cutting is improved, the hydraulic telescopic rod of the hydraulic cylinder 3 acts on the driving and adjusting device 5 through the bearing plate 4 to drive the adjusting device 5 to cut the silicon, at the same time, the purification and collection device 7 is started, the suction pipe of the dust suction fan 71 acts on the waste collection box 75 through the three-way connector 73 and the support communicating pipe 74, the waste collection box 75 sucks air into the cutting groove 21 through the dust suction pipe 77 at the top, so that negative air pressure is generated in the inner cavity of the cutting groove 21, absorbs the scraps generated by the cutting of the silicon wafer by the cutting device 57, prevents the cutting scraps from splashing, reduces the working environment of the operator, after the debris is guided into the inner cavity of the waste collection box 75 through the dust collection pipe 77 and filtered by the activated carbon filter layer 76, the outside air sucked into the waste collection box 75 is guided into the inner cavity of the dust collection fan 71 through the supporting communicating pipe 74 at the bottom and the three-way connector 73, and finally the air is guided out through the exhaust pipe 72, after a period of use, the scrap collecting box 75 can be disassembled and the silicon chip debris filtered by the activated carbon filter 76 can be collected and treated uniformly.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising a reference structure" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. The utility model provides a cutting device is used in processing of photovoltaic board silicon chip, includes organism (1), its characterized in that: the cutting table is characterized in that the bottom of the inner side of the machine body (1) is fixedly connected with a cutting table (2) through a support rod, the middle position of the top of the machine body (1) is fixedly connected with a hydraulic cylinder (3), a hydraulic telescopic rod of the hydraulic cylinder (3) penetrates through the top of the machine body (1) and is fixedly connected with a bearing plate (4), the lower surface of the bearing plate (4) is fixedly connected with a driving and adjusting device (5), the cutting table (2) is connected with two movable clamping devices (6), and the middle position of the bottom of the inner side of the machine body (1) is fixedly connected with a purifying;
the movable clamping device (6) comprises electric push-pull rods (61), movable hinge seats (62), movable connecting plates (63), movable seats (64), adjusting nuts (65), compression bolts (66), compression blocks (67), protective layers (68) and C-shaped elastic pieces (69), the cutting table (2) is connected with the two movable clamping devices (6), the left side and the right side of the upper surface of the cutting table (2) are fixedly connected with the movable hinge seats (62), the cutting table (2) is movably connected with the movable connecting plates (63) through the movable hinge seats (62), the two sides of the bottom of the inner side of the machine body (1) are fixedly connected with the electric push-pull rods (61) matched with the movable through holes (24), the top ends of the two electric push-pull rods (61) respectively penetrate through the inner walls of the two movable through holes (24) and are movably connected to the lower surfaces of the two movable connecting plates (63) through the movable seats (64, the lower surfaces of the two movable connecting plates (63) are fixedly connected with C-shaped elastic pieces (69), the side surfaces, close to the cutting table (2), of the C-shaped elastic pieces (69) are bonded with friction protection layers (691), the inner walls of grooves in the upper surfaces of the two movable connecting plates (63) are fixedly connected with adjusting nuts (65), the inner sides of the adjusting nuts (65) are in threaded connection with compression bolts (66), the tail ends of the compression bolts (66) penetrate through the upper surfaces of the movable connecting plates (63) and are fixedly connected with compression blocks (67), and the lower surfaces of the compression blocks (67) are fixedly connected with protection layers (68);
the purifying and collecting device (7) comprises a dust collection fan (71), an exhaust pipe (72), a three-way connector (73), a supporting communicating pipe (74), a waste collection box (75), an activated carbon filter layer (76), a dust collection pipe (77) and a sealing rubber ring (78), the purifying and collecting device (7) is fixedly connected to the middle position of the inner bottom of the machine body (1), the dust collection fan (71) is fixedly connected to the middle position of the inner bottom of the machine body (1), the exhaust pipe (72) is fixedly connected to the exhaust port of the dust collection fan (71), the exhaust pipe (72) penetrates through the inner bottom of the machine body (1) at one end far away from the dust collection fan (71), the dust collection pipe (77) at the top of the dust collection fan (71) is fixedly connected with the three-way connector (73), and the supporting communicating pipes (74) are fixedly, support communicating pipe (74) and keep away from one end fixedly connected with waste collection box (75) of tee bend connector (73), waste collection box (75) comprises box and bottom, and bottom activity joint is in the bottom of box, the top of waste collection box (75) is located the inboard of spread groove (22), the inboard bottom fixed mounting of waste collection box (75) has active carbon filter layer (76), equal fixedly connected with of top vent department of waste collection box (75) and dust absorption pipe (77) of edulcoration hole (23) looks adaptation, cup jointed sealing rubber circle (78) on dust absorption pipe (77), the inner wall at edulcoration hole (23) is pegged graft on the top of dust absorption pipe (77).
2. The cutting device for processing the silicon wafer of the photovoltaic panel according to claim 1, wherein: cutting groove (21) have been seted up to the upper surface intermediate position of cutting bed (2), spread groove (22) have been seted up to the bottom intermediate position of cutting bed (2), spread groove (22) are located cutting groove (21) under, the edulcoration hole (23) that are linked together have been seted up between the inboard top of spread groove (22) and the inboard bottom of cutting groove (21), movable through-hole (24) have all been seted up to the left and right sides of cutting bed (2).
3. The cutting device for processing the photovoltaic panel silicon wafer as claimed in claim 2, wherein: the driving adjusting device (5) comprises a driving box (51), a driving motor (52), a transverse adjusting screw rod (53), a ball nut (54), a transverse adjusting block (56) and a cutting device (57), the lower surface of the bearing plate (4) is fixedly connected with the driving adjusting device (5), the lower surface of the bearing plate (4) is fixedly connected with the driving box (51), the left side surface of the driving box (51) is fixedly connected with the driving motor (52), an output shaft of the driving motor (52) penetrates through the left side of the driving box (51) and is fixedly connected with the transverse adjusting screw rod (53) through a coupler, the transverse adjusting screw rod (53) is movably connected with the right inner wall of the driving box (51) through a bearing base at one end far away from the driving motor (52), the ball nut (54) is sleeved on the transverse adjusting screw rod (53) in a threaded manner, a transverse movable groove (55) is formed in the middle position of the bottom of the, the inner side of the transverse movable groove (55) is movably connected with a transverse adjusting block (56), the top of the transverse adjusting block (56) is fixedly connected to the bottom of the ball nut (54), and the bottom of the transverse adjusting block (56) is fixedly connected with a cutting device (57).
4. The cutting device for processing the silicon wafer of the photovoltaic panel as claimed in claim 3, wherein: edulcoration hole (23) evenly distributed is in the inboard bottom of cutting groove (21), dust absorption pipe (77) and edulcoration hole (23) are the one-to-one setting.
5. The cutting device for processing the silicon wafer of the photovoltaic panel as claimed in claim 4, wherein: the driving adjusting device (5) is located right above the cutting table (2), and the transverse movable groove (55) is located right above the cutting groove (21).
6. The cutting device for processing the silicon wafer of the photovoltaic panel as claimed in claim 5, wherein: the movable clamping devices (6) on the left side and the right side of the cutting table (2) are arranged in bilateral symmetry relative to the center of the cutting table (2).
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| CN201810309976.5A CN108527697B (en) | 2018-04-09 | 2018-04-09 | Cutting device is used in processing of photovoltaic board silicon chip |
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| CN201810309976.5A CN108527697B (en) | 2018-04-09 | 2018-04-09 | Cutting device is used in processing of photovoltaic board silicon chip |
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| CN108527697B true CN108527697B (en) | 2020-11-13 |
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| CN109624111A (en) * | 2018-10-19 | 2019-04-16 | 芜湖汉科信息技术有限公司 | A kind of integrated circuit silicon chip splitting equipment |
| CN109128523B (en) * | 2018-11-07 | 2022-12-06 | 湖南泰安硅业有限公司 | Silicon chip cutting device with cleaning function |
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| CN110774462B (en) * | 2019-11-04 | 2021-11-12 | 拓普瑞机器人科技东台有限公司 | Graphite alkene chip processing cutting device |
| CN111186040B (en) * | 2020-01-19 | 2021-11-19 | 南京轩世琪源软件科技有限公司 | Device capable of ensuring that silicon wafer cutting cannot be broken with multidirectional limiting |
| CN113858463A (en) * | 2021-11-03 | 2021-12-31 | 燕飞 | Diamond wire cutting machine for solar-grade silicon wafer |
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