CN108517188A - The photovoltaic encapsulation material of high transparency - Google Patents
The photovoltaic encapsulation material of high transparency Download PDFInfo
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- CN108517188A CN108517188A CN201810445679.3A CN201810445679A CN108517188A CN 108517188 A CN108517188 A CN 108517188A CN 201810445679 A CN201810445679 A CN 201810445679A CN 108517188 A CN108517188 A CN 108517188A
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- encapsulation material
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- resin
- photovoltaic encapsulation
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- HWSSEYVMGDIFMH-UHFFFAOYSA-N 2-[2-[2-(2-methylprop-2-enoyloxy)ethoxy]ethoxy]ethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCOCCOCCOC(=O)C(C)=C HWSSEYVMGDIFMH-UHFFFAOYSA-N 0.000 claims description 3
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
- C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
- C09J123/04—Homopolymers or copolymers of ethene
- C09J123/08—Copolymers of ethene
- C09J123/0846—Copolymers of ethene with unsaturated hydrocarbons containing other atoms than carbon or hydrogen atoms
- C09J123/0853—Vinylacetate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
- C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
- C09J123/04—Homopolymers or copolymers of ethene
- C09J123/08—Copolymers of ethene
- C09J123/0807—Copolymers of ethene with unsaturated hydrocarbons only containing more than three carbon atoms
- C09J123/0815—Copolymers of ethene with aliphatic 1-olefins
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
- C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
- C09J123/04—Homopolymers or copolymers of ethene
- C09J123/08—Copolymers of ethene
- C09J123/0846—Copolymers of ethene with unsaturated hydrocarbons containing other atoms than carbon or hydrogen atoms
- C09J123/0869—Acids or derivatives thereof
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- C09J151/00—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
- C09J151/06—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers grafted on to homopolymers or copolymers of aliphatic hydrocarbons containing only one carbon-to-carbon double bond
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- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
- H01L31/0481—Encapsulation of modules characterised by the composition of the encapsulation material
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/054—Optical elements directly associated or integrated with the PV cell, e.g. light-reflecting means or light-concentrating means
- H01L31/0543—Optical elements directly associated or integrated with the PV cell, e.g. light-reflecting means or light-concentrating means comprising light concentrating means of the refractive type, e.g. lenses
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
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- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/33—Applications of adhesives in processes or use of adhesives in the form of films or foils for batteries or fuel cells
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/52—PV systems with concentrators
Abstract
The present invention relates to a kind of photovoltaic encapsulation materials of high transparency, and the high transparent resin of the photovoltaic encapsulation material matrix resin of 100 mass parts or the matrix resin of graft modification, the high transparency of 0.01 20 mass parts and/or high refractive index and other auxiliary agents are prepared to the photovoltaic encapsulation material of high transparency by processes such as premixing, melting extrusion, casting film-forming, cooling, cutting and windings.By introducing high transparency and/or the high transparent resin of high refractive index in encapsulating material system, realize the perfect matching of refraction index between glass, front layer encapsulating material, cell piece three, improve the light transmittance of photovoltaic encapsulation material, improve the light intensity for being incident on cell piece, increase utilization rate of the component to sunlight, battery current and output power are improved, optimizes and improves component photoelectric conversion efficiency.
Description
Technical field
The invention belongs to photovoltaic module encapsulating material fields, and in particular to a kind of photovoltaic encapsulation material of high transparency.
Background technology
What solar cell power generation utilized be the semi-conducting materials such as silicon by sunlight when photovoltaic effect occurs, directly
It connects and solar radiation is converted into electric energy.Seldom a part of solar energy can only be converted into electric energy by solar cell, and reason is
There are electricity loss and optical loss in conversion process of energy for solar cell, it means that improves photovoltaic module power and needs
Absorb solar irradiation to silicon wafer maximum magnitude, it is necessary to reduce light loss of the sunlight by glass and packaging adhesive film when, therefore
As unique " barrier " of silicon wafer and glass outer, to ensure that photovoltaic module has higher photoelectric conversion efficiency, packaging plastic
Film needs to have very excellent light transmittance.
It is also had been reported that about the method for improving packaging adhesive film light transmittance.Pass through optimizing application of the lower transition material in EVA
Solar energy Spectral structure improves light transmittance and power, but is restricted by EVA adhesive film processing temperature and material compatibility, for
How lower transition material, the either organic complex of organic fluorescent dye or rare earth ion, evenly spread to
It is the deciding factor of lower transition material success application in EVA adhesive film；In addition, the transfer efficiency of lower transition material is in battery
Whether it is able to maintain that stabilization in life cycle, determines that can lower transition material be converted to production application from theoretical research.It is ultraviolet
Infiltration type EVA adhesive film is not contained or is carried containing micro UV absorbers with reducing absorption of the glued membrane to ultraviolet light in formula
The transmitance of high ultraviolet band, to improve the generating efficiency of battery.However ultraviolet light can cause macromolecule material under normal conditions
The aging of material makes it tarnish and reduce the mechanical performance of material, also just because of no addition ultraviolet absorber, is easy to make
It is reduced at the UV resistance of EVA material itself.
Invention content
In view of the above-mentioned deficiencies in the prior art, it is an object of the present invention to provide a kind of photovoltaic encapsulation material of high transparency.
The purpose of the present invention is achieved through the following technical solutions：A kind of photovoltaic encapsulation material of high transparency,
It is characterized in that, is prepared by the following method to obtain：By the matrix resin of 100 mass parts, the high transparency of 0.01-20 mass parts
And/or assistant crosslinking agent, the 0.1- of the high transparent resin of high refractive index, the initiator of 0.01-1.5 mass parts, 0.01-10 mass parts
The light stabilizer of the UV absorbers of 0.4 mass parts, the tackifier of 0.1-3.0 mass parts and 0.1-1.0 mass parts is by pre-
The processes such as mixing, melting extrusion, casting film-forming, cooling, cutting and winding prepare the photovoltaic encapsulation material of high transparency.The base
Body resin is photovoltaic encapsulation material matrix resin or carries out the matrix resin of graft modification by photovoltaic encapsulation material matrix resin.
Further, the photovoltaic encapsulation material matrix resin be transparent polymer material, the polymer material by
Ethylene-vinyl acetate copolymer, ethylene-alpha-olefin copolymer, ethylene methyl methacrylate copolymer, ethylene-methyl-prop
One in olefin(e) acid ionomer, low density polyethylene (LDPE), polypropylene, polybutene, polyvinyl butyral, organosilicon material
Kind or a variety of mixed according to arbitrary proportioning.
Further, it is described by photovoltaic encapsulation material matrix resin carry out graft modification matrix resin by matrix resin with
Grafted monomers carry out graft modification by the frit reaction of free radical grafting and obtain；Grafted monomers are selected from vinylsiloxane, no
It is saturated monoacid, unsaturated dibasic acid, α, β beta-unsaturated carbonyl compounds, the α, β beta-unsaturated carbonyl compounds include Malaysia
The acid of acid, fumaric acid, acrylic acid, methacrylic acid, itaconic acid, crotonic acid, tiglic acid, cinnamic acid and above-mentioned acid
Any one in acid anhydride, ester, salt derivative.
Further, in the matrix resin of the graft modification, grafting rate 0.1-20wt%；It is preferred that grafting rate is 1-
10wt%, more preferable grafting rate are 1-5wt%.
Further, the high transparency and/or the high transparent resin of high refractive index are by polymethacrylate resin, poly-
Acrylate, polyurethane resin, General Purpose Polystyrenre (GPPS), transparent propene nitrile-butadiene-styrene are total
Polymers (ABS), the copolymer (MS resins) of styrene methyl methacrylate, acrylonitritrile-styrene resin resin (AS),
Polysulfone resin (PSU), cyclic olefine copolymer (COP), poly(4-methyl-1-pentene) (TPX), gathers polyphenylene sulphone resin (PPSU)
Carbonic ester (PC), epoxy acrylic biester resin, polyphenylmetacrylate, epoxy resin, poly bis alkene diethylene glycol (DEG) diallyl
Carbonic ester, polyethylene terephthalate (PET), polypropylene terephthalate (PPT), polyethylene terephthalate
Ester -1,4 cyclohexane dimethanol ester (PETG), polybutylene terephthalate (PBT) and polyethylene naphthalate (PEN)
In it is one or more according to arbitrary proportioning mixing composition.
Further, the refractive index for the high transparent resin material being added in the photovoltaic encapsulation material is 1.49-1.60.
Further, the initiator being added in the photovoltaic encapsulation material is by tert-butyl hydroperoxide propylene carbonate, 2,5-
Bis- (tert-butyl peroxy base) hexanes of dimethyl 2,5-, bis- (the tert-butyl peroxide) -3,3,5- trimethyl-cyclohexanes of 1-, t-butyl peroxy
Change carbonic acid -2- ethylhexyls, bis- (the t-butyl peroxy) -3,3,5- trimethyl-cyclohexanes of 1,1-, bis- (t-amyl peroxy) -3 1,1-,
Bis- (the tertiary butyl base peroxide) butane of bis- (t-amyl peroxy) hexamethylenes of 3,5- trimethyl-cyclohexanes, 1,1-, 2,2-, peroxidating carbonic acid
It is one or more according to arbitrary proportioning mixing composition in tert-pentyl ester, peroxidating 3,3,5- trimethylhexanoates.
Further, the assistant crosslinking agent is multi-functional acrylate or methyl acrylic ester compound, is selected from
Pentaerythritol triacrylate, pentaerythritol tetraacrylate, ethoxyquin pentaerythritol tetraacrylate, the third oxidation pentaerythrite
Tetraacrylate, trimethylolpropane trimethacrylate, ethoxyquin trimethylolpropane trimethacrylate, the third oxidation trihydroxy methyl
Propane triacrylate, ethoxy-lated glycerol triacrylate, glycerol propoxylate triacrylate, trimethylol propane trimethyl third
Olefin(e) acid ester, ethoxyquin trimethylol-propane trimethacrylate, triethylene glycol dimethacrylate, polyethylene glycol dimethyl
Acrylate.Further, the UV absorbers are 2-hydroxy-4-n-octoxybenzophenone, and the tackifier are
KH550 or KH570, the light stabilizer are double -2,2,6, the 6- tetramethyl piperidine alcohol esters of decanedioic acid.
Further, the thickness of the encapsulating material is 0.10-1.00mm.
The beneficial effects of the invention are as follows：The photovoltaic encapsulation material of the high transparency of the present invention not only has higher light transmission
Rate, and the photoelectric conversion efficiency of component is improved, to maximally utilise inexhaustible sunlight.Pass through
The high transparent resin with high transparency or high refractive index is introduced in encapsulating material system, improves the refraction of front layer encapsulating material
Rate and light transmittance realize the perfect matching of index of refraction between glass/front layer encapsulating material/cell piece three, with reduction and glass
With the interface light reflection of cell piece and light scattering, optical loss is reduced, improves the light intensity for being incident on cell piece, improves battery
Electric current and output power increase component to the utilization rate of sunlight, optimize and improve component photoelectric conversion efficiency.
Specific implementation mode
The present invention provides a kind of photovoltaic encapsulation material of high transparency.
The technical scheme in the embodiments of the invention will be clearly and completely described below, it is clear that described implementation
Example is only a part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, this field is general
The every other embodiment that logical technical staff is obtained without making creative work belongs to what the present invention protected
Range.
Embodiment 1
The present embodiment provides a kind of encapsulating material, the photovoltaic encapsulation material with high transparency.
In this example, based on mass fraction, the ethyl vinyl acetate that VA (vinyl acetate) mass contents of 100 mass parts is 28%
10 mass parts polymethyl methacrylates, the tert-butyl hydroperoxide propylene carbonate of 1 mass parts, 5 matter are added in vinyl ester copolymers
Measure the pentaerythritol triacrylate of part, the KH550 of 1 mass parts, 0.1 mass parts 2-hydroxy-4-n-octoxybenzophenone,
Double -2,2,6,6- tetramethyl piperidine the alcohol esters of 0.1 mass parts decanedioic acid.It is uniformly mixed, said mixture is crowded through being pre-mixed, melting
Go out, casting film-forming, cooling, the processes such as cutting and winding, the photovoltaic encapsulation material is made, is denoted as E-1.
Embodiment 2
The present embodiment provides a kind of encapsulating material, the photovoltaic encapsulation material with high transparency.
In this example, based on mass fraction, the poly- amino first of 5 mass parts is added in the own hydrocarbon copolymers of ethylene -1- of 100 mass parts
The pentaerythrite tetrapropylene acid of acid ester resin, bis- (tert-butyl peroxy base) hexanes of 2,5- dimethyl 2,5- of 1 mass parts, 5 mass parts
Ester, the KH550 of 1 mass parts, 0.1 mass parts 2-hydroxy-4-n-octoxybenzophenone, 0.1 mass parts decanedioic acid double -2,2,6,
6- tetramethyl piperidine alcohol esters.It is uniformly mixed, said mixture is through premixing, melting extrusion, casting film-forming, cooling, cutting and receipts
The processes such as volume are made the photovoltaic encapsulation material, are denoted as E-2.
Embodiment 3
The present embodiment provides a kind of encapsulating material, the photovoltaic encapsulation material with high transparency.
In this example, based on mass fraction, 5 mass parts are added in the ethylene methyl methacrylate copolymer of 100 mass parts
Poly bis alkene diethylene glycol (DEG) diallyl carbonic ester, bis- (the tert-butyl peroxide) -3,3,5- trimethyl-cyclohexanes of 1- of 1 mass parts, 5 matter
Measure the ethoxyquin pentaerythritol tetraacrylate of part, the KH570 of 0.5 mass parts, 0.5 mass parts KH550,0.1 mass parts 2- hydroxyls
Base -4- oxy-octyl benzophenones, the double -2,2,6,6- tetramethyl piperidine alcohol esters of 0.1 mass parts decanedioic acid.It is uniformly mixed, it is above-mentioned
The photovoltaic encapsulation material is made through processes such as premixing, melting extrusion, casting film-forming, cooling, cutting and windings in mixture,
It is denoted as E-3.
Embodiment 4
The present embodiment provides a kind of encapsulating material, the photovoltaic encapsulation material with high transparency.
In this example, based on mass fraction, 5 mass parts acrylonitrile-butadienes-benzene is added in the organosilicon material of 100 mass parts
Ethylene copolymer, the tert-butyl hydroperoxide carbonic acid -2- ethylhexyls of 1 mass parts, the pentaerythritol triacrylate of 5 mass parts, 1
The KH550 of mass parts, 0.1 mass parts 2-hydroxy-4-n-octoxybenzophenone, 0.1 part of quality decanedioic acid pair -2,2,6,6- four
Methyl piperidine alcohol ester.It is uniformly mixed, said mixture is through premixing, melting extrusion, casting film-forming, cooling, cutting and winding etc.
Process is made the photovoltaic encapsulation material, is denoted as E-4.
Embodiment 5
The present embodiment provides a kind of encapsulating material, the photovoltaic encapsulation material with high transparency.
In this example, based on mass fraction, the ethyl vinyl acetate that VA (vinyl acetate) mass contents of 100 mass parts is 28%
Vinyl ester copolymers grafted maleic anhydride (grafting rate 5wt%), be added 10 mass parts makrolon, 1 mass parts tertiary butyl mistake
Aoxidize propylene carbonate, the trimethylolpropane trimethacrylate of 5 mass parts, the KH550 of 1 mass parts, 0.1 mass parts 2- hydroxyls
Base -4- oxy-octyl benzophenones, the double -2,2,6,6- tetramethyl piperidine alcohol esters of 0.1 mass parts decanedioic acid.It is uniformly mixed, it is above-mentioned
The photovoltaic encapsulation material is made through processes such as premixing, melting extrusion, casting film-forming, cooling, cutting and windings in mixture,
It is denoted as E-5.
Embodiment 6
The present embodiment provides a kind of encapsulating material, the photovoltaic encapsulation material with high transparency.
In this example, based on mass fraction, the ethyl vinyl acetate that VA (vinyl acetate) mass contents of 100 mass parts is 28%
20 mass parts poly terephthalic acid second two are added in vinyl ester copolymers grafting vinyl trimethoxy silane (grafting rate 10wt%)
Third oxidation pentaerythrite 4 third of ester, bis- (the t-butyl peroxy) -3,3,5- trimethyl-cyclohexanes of 1,1- of 1 mass parts, 5 mass parts
Olefin(e) acid ester, 0.1 mass parts 2-hydroxy-4-n-octoxybenzophenone, double -2,2,6, the 6- tetramethyl piperazines of 0.1 mass parts decanedioic acid
Pyridine alcohol ester.It is uniformly mixed, said mixture is through the processes such as premixing, melting extrusion, casting film-forming, cooling, cutting and winding, system
The photovoltaic encapsulation material is obtained, E-6 is denoted as.
Embodiment 7
The present embodiment provides a kind of encapsulating material, the photovoltaic encapsulation material with high transparency.
In this example, based on mass fraction, the ethylene-alpha-olefin copolymer grafted propylene acid hydroxyl ethyl ester (grafting of 100 mass parts
Rate 5wt%), 10 mass parts polyethylene naphthalate, the tert-butyl hydroperoxide propylene carbonate of 1 mass parts, 5 mass are added
The ethoxyquin trimethylolpropane trimethacrylate of part, KH570, the 0.1 mass parts 2- hydroxyl -4- n-octyloxies two of 1 mass parts
Benzophenone, the double -2,2,6,6- tetramethyl piperidine alcohol esters of 0.1 mass parts decanedioic acid.Be uniformly mixed, said mixture through premixing,
The processes such as melting extrusion, casting film-forming, cooling, cutting and winding are made the photovoltaic encapsulation material, are denoted as E-7.
Embodiment 8
The present embodiment provides a kind of encapsulating material, the photovoltaic encapsulation material with high transparency.
In this example, based on mass fraction, the ethylene-alpha-olefin copolymer grafting vinyl trimethoxy silane of 100 mass parts
(grafting rate 20wt%), be added the poly bis alkene diethylene glycol (DEG) diallyl carbonic ester of 5 mass parts, 1 mass parts bis- (the tertiary pentyl mistakes of 1,1-
Oxygen) -3,3,5- trimethyl-cyclohexanes, 5 mass parts ethoxy-lated glycerol triacrylate, the 0.1 just pungent oxygen of mass parts 2- hydroxyls -4-
Base benzophenone, the double -2,2,6,6- tetramethyl piperidine alcohol esters of 0.1 mass parts decanedioic acid.It is uniformly mixed, said mixture is through premix
The processes such as conjunction, melting extrusion, casting film-forming, cooling, cutting and winding are made the photovoltaic encapsulation material, are denoted as E-8.
Embodiment 9
The present embodiment provides a kind of encapsulating material, the photovoltaic encapsulation material with high transparency.
In this example, based on mass fraction, the grafted low density polyethylene glycidyl methacrylate of 100 mass parts
5 mass parts polyphenylene sulphone resins, bis- (t-amyl peroxy) hexamethylenes of 1,1- of 1 mass parts, 5 are added in (grafting rate 0.1wt%)
The ethoxyquin trimethylol-propane trimethacrylate of mass parts, 0.1 mass parts 2-hydroxy-4-n-octoxybenzophenone, 1
The KH570 of mass parts, the double -2,2,6,6- tetramethyl piperidine alcohol esters of 0.1 mass parts decanedioic acid.It is uniformly mixed, said mixture warp
The processes such as premixing, melting extrusion, casting film-forming, cooling, cutting and winding are made the photovoltaic encapsulation material, are denoted as E-9.
Embodiment 10
The present embodiment provides a kind of encapsulating material, the photovoltaic encapsulation material with high transparency.
In this example, based on mass fraction, the ethyl vinyl acetate that VA (vinyl acetate) mass contents of 100 mass parts is 30%
5 mass parts General Purpose Polystyrenres, bis- (the tertiary butyl base peroxide) butane of 2,2- of 1 mass parts, 5 matter are added in vinyl ester copolymers
Measure the trimethylolpropane trimethacrylate of part, the KH570 of 1 mass parts, 0.1 mass parts 2- hydroxyl -4- n-octyloxy hexichol first
Ketone, the double -2,2,6,6- tetramethyl piperidine alcohol esters of 0.1 mass parts decanedioic acid.It is uniformly mixed, said mixture is through being pre-mixed, melting
The processes such as extrusion, casting film-forming, cooling, cutting and winding are made the photovoltaic encapsulation material, are denoted as E-10.
Embodiment 11
The present embodiment provides a kind of encapsulating material, the photovoltaic encapsulation material with high transparency.
In this example, based on mass fraction, 0.01 mass parts cycloolefin is added in the ethylene-l-octane copolymer of 100 mass parts
Copolymer, the peroxidating carbonic acid tert-pentyl esters of 1 mass parts, the triethylene glycol dimethacrylate of 5 mass parts, 1 mass parts
KH570,0.1 mass parts 2-hydroxy-4-n-octoxybenzophenone, the double -2,2,6,6- tetramethyl piperidines of 0.1 mass parts decanedioic acid
Alcohol ester.It is uniformly mixed, said mixture is made through processes such as premixing, melting extrusion, casting film-forming, cooling, cutting and windings
The photovoltaic encapsulation material, is denoted as E-11.
Embodiment 12
The present embodiment provides a kind of encapsulating material, the photovoltaic encapsulation material with high transparency.
In this example, based on mass fraction, taking 90% ethylene-vinyl acetate copolymer, (vinyl acetate (VA) quality contains
Amount is 28%) 10% ethylene-l-octane copolymer.On the basis of the above-mentioned matrix resin of 100 mass parts, 10 mass are added
The polyethylene glycol dimethyl of part polymethyl acrylate, the peroxidating 3,3,5- trimethylhexanoates of 1 mass parts, 5 mass parts
Acrylate, the KH570 of 1 mass parts, 0.1 mass parts 2-hydroxy-4-n-octoxybenzophenone, 0.1 mass parts decanedioic acid pair-
2,2,6,6- tetramethyl piperidine alcohol esters.Be uniformly mixed, said mixture through premixing, melting extrusion, casting film-forming, cooling, point
It the processes such as cuts and winds, the photovoltaic encapsulation is made, is denoted as E-12.
Comparative example 1
In this example, based on mass fraction, it is 28% ethene-vinyl acetate to take 100 parts of VA (vinyl acetate) mass contents
The tert-butyl hydroperoxide propylene carbonate of 1 mass parts, the pentaerythritol triacrylate of 5 mass parts, 1 matter is added in ester copolymer
Measure the KH550,0.1 mass parts 2-hydroxy-4-n-octoxybenzophenone, the double -2,2,6,6- tetramethyls of 0.1 mass parts decanedioic acid of part
Phenylpiperidines alcohol ester.It is uniformly mixed, said mixture is through works such as premixing, melting extrusion, casting film-forming, cooling, cutting and windings
Sequence is made the photovoltaic encapsulation, is denoted as C-1.
Comparative example 2
In this example, based on mass fraction, 100 parts of ethylene-l-octane copolymers is taken, 2, the 5- dimethyl of 1 mass parts is added
Bis- (tert-butyl peroxy base) hexanes of 2,5-, the pentaerythritol tetraacrylate of 5 mass parts, the KH570 of 1 mass parts, 0.1 part of 2- hydroxyl
Base -4- oxy-octyl benzophenones, the double -2,2,6,6- tetramethyl piperidine alcohol esters of 0.1 part of decanedioic acid.It is uniformly mixed, above-mentioned mixing
Object is made the photovoltaic encapsulation, is denoted as C-2 through processes such as premixing, melting extrusion, casting film-forming, cooling, cutting and windings.
Performance test
Light transmittance test is carried out after being laminated to the encapsulating material of embodiment 1~12 and comparative example 1~2, it is each after lamination
The thickness of Examples and Comparative Examples glued membrane is 0.45mm, and refractive index is tested using abbe's refractometer, and light transmittance tests foundation
GB/T2410-2008 is measured, and the light transmittance of 400~700nm of glued membrane is measured with ultraviolet-visible spectrophotometer.
Table 1 is the test result of the encapsulating material of embodiment 1-12 and comparative example 1-2
| Encapsulating material | Light transmittance (%) | Refractive index | Encapsulating material | Light transmittance (%) | Refractive index |
| Embodiment 1 | 92.79 | 1.538 | Embodiment 8 | 92.85 | 1.536 |
| Embodiment 2 | 92.77 | 1.536 | Embodiment 9 | 92.68 | 1.521 |
| Embodiment 3 | 92.59 | 1.515 | Embodiment 10 | 92.86 | 1.539 |
| Embodiment 4 | 92.78 | 1.536 | Embodiment 11 | 92.52 | 1.507 |
| Embodiment 5 | 92.85 | 1.539 | Embodiment 12 | 92.73 | 1.527 |
| Embodiment 6 | 92.89 | 1.542 | Comparative example 1 | 91.62 | 1.482 |
| Embodiment 7 | 92.86 | 1.539 | Comparative example 2 | 91.99 | 1.493 |
It is compared from the performance test data of above-described embodiment and comparative example：Photovoltaic encapsulation material obtained by the present invention program
With higher light transmittance, light transmittance (700-400nm) is up to 92.5% or more, and refractive index is obviously improved compared to comparative example.
By the comparison of above-described embodiment and comparative example it is found that there is high transparency or high refractive index by being introduced in encapsulating material system
High transparent resin, improve front layer encapsulating material refractive index and light transmittance, glass, front layer encapsulating material, electricity is better achieved
The perfect matching of index of refraction between the piece three of pond, to reduce and the light reflection at the interface of glass and cell piece and light scattering, reduction
Optical loss improves the light intensity for being incident on cell piece, improves battery current and output power, increases component to sunlight
Utilization rate, optimizes and improves the photoelectric conversion efficiency of component, while achieving the purpose that synergy drop originally.
The present invention is described in detail above, its object is to allow the personage for being familiar with this field technology that can understand this
The content of invention is simultaneously implemented, and it is not intended to limit the scope of the present invention, and the present invention is not limited to above-mentioned implementations
, equivalent change or modification made by all Spirit Essences according to the present invention should be covered by the protection scope of the present invention.
Claims (10)
1. a kind of photovoltaic encapsulation material of high transparency, which is characterized in that be prepared by the following method to obtain：By 100 mass parts
Matrix resin, 0.01-20 mass parts high transparency and/or the high transparent resin of high refractive index, 0.01-1.5 mass parts
The increasing of initiator, the assistant crosslinking agent of 0.01-10 mass parts, the UV absorbers of 0.1-0.4 mass parts, 0.1-3.0 mass parts
Stick and the light stabilizer of 0.1-1.0 mass parts are by works such as premixing, melting extrusion, casting film-forming, cooling, cutting and windings
Sequence prepares the photovoltaic encapsulation material of high transparency.Described matrix resin is for photovoltaic encapsulation material matrix resin or by photovoltaic encapsulation material
Expect that matrix resin carries out the matrix resin of graft modification.
2. the photovoltaic encapsulation material of high transparency according to claim 1, it is characterised in that：The photovoltaic encapsulation material base
Body resin is transparent polymer material, and the polymer material is copolymerized by ethylene-vinyl acetate copolymer, ethylene-alpha-olefin
Object, ethylene methyl methacrylate copolymer, ethylene-methyl methacrylate ionomer, low density polyethylene (LDPE), poly- third
One or more in alkene, polybutene, polyvinyl butyral, organosilicon material mix according to arbitrary proportioning.
3. the photovoltaic encapsulation material of high transparency according to claim 2, which is characterized in that described by photovoltaic encapsulation material
Matrix resin carry out the matrix resin of graft modification by matrix resin and grafted monomers by the frit reaction of free radical grafting into
Row graft modification obtains；Grafted monomers are selected from vinylsiloxane, unsaturated monoacid, unsaturated dibasic acid, α, β unsaturation carbonyls
Based compound, the α, β beta-unsaturated carbonyl compounds include maleic acid, fumaric acid, acrylic acid, methacrylic acid, itaconic acid, bar
Any one in beans acid, tiglic acid, the acid anhydrides of cinnamic acid and above-mentioned acid, ester, salt derivative.
4. the photovoltaic encapsulation material of high transparency according to claim 3, which is characterized in that the matrix of the graft modification
In resin, grafting rate 0.1-20wt%；It is preferred that grafting rate is 1-10wt%, more preferable grafting rate is 1-5wt%.
5. the photovoltaic encapsulation material of high transparency according to claim 1, it is characterised in that：The high transparency and/or
The high transparent resin of high refractive index is by polymethacrylate resin, polyacrylate resin, polyurethane resin, general
Polystyrene, transparent propene nitrile-butadiene-styrene copolymer, the copolymer of styrene methyl methacrylate, benzene second
Alkene-acrylonitrile copolymer resin, polysulfone resin, polyphenylene sulphone resin, cyclic olefine copolymer, poly(4-methyl-1-pentene), poly- carbon
Acid esters, epoxy acrylic biester resin, polyphenylmetacrylate, epoxy resin, poly bis alkene diethylene glycol (DEG) diallyl carbonic ester,
Polyethylene terephthalate, polypropylene terephthalate, polyethylene terephthalate -1,4- hexamethylene diformazans
It is one or more according to arbitrary proportioning mixing composition in alcohol ester, polybutylene terephthalate, polyethylene naphthalate.
6. high transparent resin according to claim 5, it is characterised in that：The high transparency being added in the photovoltaic encapsulation material
The refractive index of resin material is 1.49-1.60.
7. the photovoltaic encapsulation material of high transparency according to claim 1, it is characterised in that：In the photovoltaic encapsulation material
The initiator of addition is by bis- (tert-butyl peroxy base) hexanes of tert-butyl hydroperoxide propylene carbonate, 2,5- dimethyl 2,5-, the bis- (mistakes of 1-
Aoxidize tertiary butyl) -3,3,5- trimethyl-cyclohexanes, tert-butyl hydroperoxide carbonic acid -2- ethylhexyls, bis- (the tertiary butyl mistakes of 1,1-
Oxygen) -3,3,5- trimethyl-cyclohexanes, bis- (the t-amyl peroxy) -3,3,5- trimethyl-cyclohexanes of 1,1-, bis- (the tertiary pentyl mistakes of 1,1-
Oxygen) hexamethylene, bis- (the tertiary butyl base peroxide) butane of 2,2-, peroxidating carbonic acid tert-pentyl ester, peroxidating 3,3,5- tri-methyl hexanoic acid uncles
It is one or more according to arbitrary proportioning mixing composition in butyl ester.
8. the photovoltaic encapsulation material of high transparency according to claim 1, it is characterised in that：The assistant crosslinking agent is more officials
The acrylate or methyl acrylic ester compound that can be rolled into a ball, selected from pentaerythritol triacrylate, pentaerythrite tetrapropylene acid
Ester, ethoxyquin pentaerythritol tetraacrylate, third oxidation pentaerythritol tetraacrylate, trimethylolpropane trimethacrylate,
Ethoxyquin trimethylolpropane trimethacrylate, the third oxidation trimethylolpropane trimethacrylate, three acrylic acid of ethoxy-lated glycerol
Ester, glycerol propoxylate triacrylate, trimethylol-propane trimethacrylate, ethoxyquin trimethylol propane trimethyl third
Olefin(e) acid ester, triethylene glycol dimethacrylate, polyethylene glycol dimethacrylate.
9. the photovoltaic encapsulation material of high transparency according to claim 1, it is characterised in that：The UV absorbers are
2-hydroxy-4-n-octoxybenzophenone, the tackifier are KH550 or KH570, and the light stabilizer is decanedioic acid double -2,
2,6,6- tetramethyl piperidine alcohol esters.
10. according to the photovoltaic encapsulation material of claim 1-9 any one of them high transparency, it is characterised in that：The encapsulation
The thickness of material is 0.10-1.00mm.
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112430435A (en) * | 2020-11-12 | 2021-03-02 | 江苏鹿山新材料有限公司 | Composite packaging adhesive film, preparation method thereof and photovoltaic module |
| WO2022002666A1 (en) | 2020-06-30 | 2022-01-06 | Borealis Ag | Polymer composition with improved storage stability |
| CN114561064A (en) * | 2022-03-21 | 2022-05-31 | 中节能太阳能科技（镇江）有限公司 | Photovoltaic module with high use reliability and easy recovery |
| WO2022127070A1 (en) * | 2020-12-17 | 2022-06-23 | 杭州福斯特应用材料股份有限公司 | Encapsulating composition, composition, encapsulating glue film, electronic component and solar cell assembly |
| CN114940878A (en) * | 2022-06-10 | 2022-08-26 | 湖北祥邦新能源科技有限责任公司 | Intermediate film of high-strength fireproof laminated glass and preparation method thereof |
| CN115058215A (en) * | 2022-06-28 | 2022-09-16 | 万华化学集团股份有限公司 | High-refraction photovoltaic module packaging adhesive film and preparation method and application thereof |
| CN115703946A (en) * | 2021-08-05 | 2023-02-17 | 南京同翔新材料科技有限公司 | Aging-resistant high-transmittance EVA (ethylene vinyl acetate) adhesive film for bonding photoelectric digital display glass |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102408841A (en) * | 2011-09-19 | 2012-04-11 | 陈光伟 | EVA film for packaging high-transmittance solar cell and preparation method thereof |
| CN102504715A (en) * | 2011-12-01 | 2012-06-20 | 宁波华丰包装有限公司 | EVA (ethylene vinyl acetate) adhesive film for solar cells |
| CN104497899A (en) * | 2014-12-12 | 2015-04-08 | 杭州福斯特光伏材料股份有限公司 | High-reflectivity photovoltaic module packaging film and application thereof |
| WO2016146982A1 (en) * | 2015-03-13 | 2016-09-22 | Dupont Teijin Films U.S. Limited Partnership | Pv cells and backsheet polyester films |
| CN106811150A (en) * | 2016-12-27 | 2017-06-09 | 宁波卓胜新材料有限公司 | A kind of photovoltaic component encapsulating glued membrane of high reflection polymer microballoon filling and preparation method thereof |
-
2018
- 2018-05-11 CN CN201810445679.3A patent/CN108517188A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102408841A (en) * | 2011-09-19 | 2012-04-11 | 陈光伟 | EVA film for packaging high-transmittance solar cell and preparation method thereof |
| CN102504715A (en) * | 2011-12-01 | 2012-06-20 | 宁波华丰包装有限公司 | EVA (ethylene vinyl acetate) adhesive film for solar cells |
| CN104497899A (en) * | 2014-12-12 | 2015-04-08 | 杭州福斯特光伏材料股份有限公司 | High-reflectivity photovoltaic module packaging film and application thereof |
| WO2016146982A1 (en) * | 2015-03-13 | 2016-09-22 | Dupont Teijin Films U.S. Limited Partnership | Pv cells and backsheet polyester films |
| CN106811150A (en) * | 2016-12-27 | 2017-06-09 | 宁波卓胜新材料有限公司 | A kind of photovoltaic component encapsulating glued membrane of high reflection polymer microballoon filling and preparation method thereof |
Non-Patent Citations (1)
| Title |
|---|
| 柳青等: ""高透光封装胶膜技术综述"", 《功能材料》 * |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022002666A1 (en) | 2020-06-30 | 2022-01-06 | Borealis Ag | Polymer composition with improved storage stability |
| CN112430435A (en) * | 2020-11-12 | 2021-03-02 | 江苏鹿山新材料有限公司 | Composite packaging adhesive film, preparation method thereof and photovoltaic module |
| CN112430435B (en) * | 2020-11-12 | 2022-05-24 | 江苏鹿山新材料有限公司 | Composite packaging adhesive film, preparation method thereof and photovoltaic module |
| WO2022127070A1 (en) * | 2020-12-17 | 2022-06-23 | 杭州福斯特应用材料股份有限公司 | Encapsulating composition, composition, encapsulating glue film, electronic component and solar cell assembly |
| CN115703946A (en) * | 2021-08-05 | 2023-02-17 | 南京同翔新材料科技有限公司 | Aging-resistant high-transmittance EVA (ethylene vinyl acetate) adhesive film for bonding photoelectric digital display glass |
| CN114561064A (en) * | 2022-03-21 | 2022-05-31 | 中节能太阳能科技（镇江）有限公司 | Photovoltaic module with high use reliability and easy recovery |
| WO2023236539A1 (en) * | 2022-06-06 | 2023-12-14 | 杭州福斯特应用材料股份有限公司 | Encapsulation adhesive film and application thereof |
| CN114940878A (en) * | 2022-06-10 | 2022-08-26 | 湖北祥邦新能源科技有限责任公司 | Intermediate film of high-strength fireproof laminated glass and preparation method thereof |
| CN115058215A (en) * | 2022-06-28 | 2022-09-16 | 万华化学集团股份有限公司 | High-refraction photovoltaic module packaging adhesive film and preparation method and application thereof |
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Application publication date: 20180911 |