CN108493314A - To carry the shell and its light emitting diode construction of LED wafer - Google Patents
To carry the shell and its light emitting diode construction of LED wafer Download PDFInfo
- Publication number
- CN108493314A CN108493314A CN201810290940.7A CN201810290940A CN108493314A CN 108493314 A CN108493314 A CN 108493314A CN 201810290940 A CN201810290940 A CN 201810290940A CN 108493314 A CN108493314 A CN 108493314A
- Authority
- CN
- China
- Prior art keywords
- shell
- led wafer
- fluorinated polymer
- face coat
- carry
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Led Device Packages (AREA)
Abstract
The present invention discloses a kind of carrying the shell and its light emitting diode construction of a LED wafer.This shell includes a shell, is made with nonfluorinated polymers；And one face coat cover at least part of the shell, which is made with a fluorinated polymer dispersion liquid, and the face coat is reflecting the light that the LED wafer being placed on the shell is sent out.Invention additionally discloses a light emitting diode constructions, including above-mentioned shell and LED wafer.
Description
The application be on 04 15th, 2010 the applying date, application No. is 201010151780.1, it is entitled " to
The divisional application of the patent of the shell and its light emitting diode construction of carrying LED wafer ".
Technical field
The present invention relates to a kind of light emitting diode construction, more particularly to a kind of face coat having fluorinated polymer shines
Diode case and its light emitting diode construction.
Background technology
Promote the important topic that light extraction efficiency is always light emitting diode development.What one light extraction efficiency was difficult to be promoted
The reason is that, the light that the internal reflection or refraction of LED wafer itself and the interface of peripheral element cause chip to send out is anti-
And it is absorbed by peripheral element.In order to solve the problems, such as this, it will usually coat light-emitting diodes using the shell containing titanium dioxide
Pipe.Titanium dioxide can promote the reflectivity of visible light.General such shell be with polyphenyl hydrazine (polyphenylhydrazine,
PPA) engineering plastic is made.However, such way disadvantage be titanium dioxide can gradually make the color of the shell of polyphenyl hydrazine by
It is white to turn Huang, thus light extraction efficiency also can be gradually reduced.
The prior art provides another solution as described in U.S. Patent Publication No. US 20100032702, with fluorine-containing
Engineering plastic replace polyphenyl hydrazine.The technology of this patent is, fluorinated polymer is fashioned into light-emitting diodes using ejection formation
Pipe monolithic case.This technology can no doubt solve the problems, such as the yellow of polyphenyl hydrazine, but since the price is very expensive for fluorinated polymer,
Cost will be made to increase so making light emitting diode monolithic case with it, it is difficult to generally be implemented on various light-emitting diodes
On.
Invention content
In view of above-mentioned existing issue, the embodiment of the present invention provides a kind of novel and innovation carrying light-emitting diodes
The shell and its light emitting diode construction of pipe chip.
The embodiment of the present invention provide it is a kind of to carry the shell of LED wafer, including：
One shell, is made with nonfluorinated polymers；And
One face coat covers at least part of the shell, which is made with a fluorinated polymer dispersion liquid,
The face coat is reflecting the light that the LED wafer being placed on the shell is sent out.
One embodiment of the invention, the color stability of fluorinated polymer face coat can reflect visible light, and with resistance to
The welding procedure that weldering property can bear 260 DEG C to 280 DEG C is up to 3 minutes or more.
One embodiment of the invention, shell can be made of polyphenyl hydrazine PPA engineering plastics.One embodiment of the invention, shell
It can be made of liquid crystal polymer engineering plastic.
One embodiment of the invention, shell can be also comprising a groove to place LED wafer, and face coat is only
Cover the surface of groove.
One embodiment of the invention, fluorinated polymer dispersion liquid include fluorinated polymer, which includes fluorination
Homopolymer, the perfluoroalkoxy fluorocarbon (perfluoroalkoxy of ethylene (vinyl floride, VF)
Fluorocarbon resin, PFA) co-polymer or vinylidene fluoride (vinylidene fluoride, VDF) homopolymerization
Close object.
One embodiment of the invention, fluorinated polymer dispersion liquid include the filler material that can dissipate visible light.
One embodiment of the invention, fluorinated polymer dispersion liquid include the filler material for the modulus that can adjust the face coat.
One embodiment of the invention, fluorinated polymer dispersion liquid include luminous (luminescent) compound.
The embodiment of the present invention also provides a kind of light emitting diode construction, including luminous to carry described in above-described embodiment
The shell and LED wafer of diode wafer, are set on the shell.
The embodiment of the present invention to carry the shell and its light emitting diode construction of LED wafer, including having
The light-emitting diode housing of fluorinated polymer face coat.Fluorinated polymer face coat covers the engineering plastic of non-fluorinated polymer
Made shell.According to this embodiment, fluorinated polymer face coat is formed by the way that fluorinated polymer dispersion liquid to be coated on
On shell.Therefore, fluorinated polymer used herein will be saved many compared to existing whole ejection forming technique.And
And according to this embodiment, the engineering plastic shell of other widely used non-fluorinated polymers is still sustainable sharp on the market
With having the advantages that avoid the wasting of resources.
Description of the drawings
Figure 1A to Fig. 1 D is the sectional view of the shell of the reeded various light emitting diodes of tool provided in an embodiment of the present invention.
Fig. 2 is the sectional view of the shell of the light emitting diode provided in an embodiment of the present invention for not having groove.
Fig. 3 is the light emitting diode construction sectional view of the shell provided in an embodiment of the present invention comprising Figure 1A.
Main element symbol description：
100：Shell；
101：Metal frame；
102：Shell；
103：Groove；
104：Face coat；
104a：Extension；
110：Shell；
114：Face coat；
120：Shell；
124：Face coat；
102a：Top surface；
130：Shell；
134：Face coat；
200：Shell；
202：Shell；
204：Face coat；
300：Light emitting diode construction；
301：LED wafer, LED wafer；
303：Packaging body.
Specific implementation mode
Below with reference to attached drawing demonstrate presently preferred embodiments of the present invention.Similar components are accorded with using identical element in attached drawing
Number.It should be noted that clearly appear from the present invention, each element in attached drawing is not the ratio drafting according to material object, and to avoid obscuring
Present disclosure illustrates also to omit existing spare part, associated materials and its correlation processing technique below.
The shell of the embodiment of the present invention, LED wafer can have multiple functions.It can be LED wafer packaging body
Carrier provides the suitable position of LED wafer packaging body and orientation, is thereby electrically connected on circuit board.Hair can be contained in packaging body
Body of light (phosphors).For example, blue LED wafers can allow green luminophores and red illuminator to generate white light.This
Outside, the shell of LED wafer also can reflection light to increase LED matrix overall brightness.
Figure 1A to Fig. 1 D is each reality of the shell of the reeded LED wafer of tool provided in an embodiment of the present invention
Apply example.Figure 1A to Fig. 1 D show the sectional view of the shell of the light emitting diode of each embodiment.As shown in Figure 1A, it is sent out to carry
The shell 100 of optical diode chip includes that a metal frame 101 and a shell 102 connect metal frame 101.Metal frame 101 may be selected
It penetrates in shell 102 to property, as shown in broken lines.Metal frame 101 is made with conductive metal.Shell 102 is with non-fluorine
Fluidized polymer is made, and is for example polyphenyl hydrazine (PPA), liquid crystal polymer (LCP) or other suitable engineering plastics, injection molding and
At.Shell 102 forms the position that groove 103 is carried as LED wafer.It is brilliant that one groove 103 can place one or more LED
Piece.Groove 103 can make light along the angle reflection for meeting expectation, and depth, the angle of inclination of wall surface, size etc. can be by designers
To determine.
With reference also to Figure 1A, shell 100 also includes at least part on the surface of a face coat 104 covering shell 102.
Face coat 104 is made with a fluorinated polymer dispersion liquid, to reflect the LED wafer institute being placed on shell 102
The light sent out.Face coat 104 shown in figure 1A covers shell 102 on the surface of 101 or more metal frame.Face coat 104 is also
Include one end of an extension 104a covering metal frames 101.Figure 1B is that the light emitting diode that another embodiment of the present invention provides is brilliant
The shell 110 of piece, with Figure 1A's the difference is that the surface of 114 covering grooves 103 of face coat.Fig. 1 C are that the present invention is another
The shell 120 for the LED wafer that embodiment provides, with Figure 1B's the difference is that face coat 124 is except covering groove
103 surface also covers a part of the top surface 102a of shell 102, however in 101 or more the shell of some of metal frame
102 exposings are not covered by face coat 124.Fig. 1 D are the outer of the LED wafer that another embodiment of the present invention provides
Shell 130, with Figure 1A's the difference is that face coat 134 covers the overall surface of shell 102.
The various change of face coat in the embodiment that Figure 1A to Fig. 1 D is illustrated the present invention, with each face coat
Formation process is related.Can be after metal frame and shell complete, using suitable coating technique, such as sputter, spray or contain
Leaching using etching mode removes extra coating and completes the various aspects of the present invention through suitable shade or in the rear of coating
Face coat.Fig. 2 is the shell 200 of the plane formula LED wafer of un-grooved provided in an embodiment of the present invention, packet
Containing metal frame 101, the overall surface of 101 or more the metal frame of shell 202 and the covering shell 202 of face coat 204.The present invention's
Embodiment is not limited to above-mentioned, and those skilled in the art should be appreciated that the face coat of the present invention includes that can reflect and set in the shell
On the various embodiments of light that are sent out of LED wafer.
As above-mentioned, face coat is made with a fluorinated polymer dispersion liquid.One embodiment of the invention, fluorinated polymer table
The color stability of finishing coat can reflect visible light, and can bear 260 DEG C to 280 DEG C of welding procedure up to 3 with soldering resistance
Minute or more.One embodiment of the invention, fluorinated polymer face coat is in 380nm to the light reflective of 780nm wave-length coverages
(photopic reflectance) is at least about 80%.
Fluorinated polymer dispersion liquid include fluorinated polymer and other suitable fillers, the wherein content of fluorinated polymer about
It is the 30wt% to 90wt% of the total weight of fluorinated polymer dispersion liquid, the content of filler is approximately the total of fluorinated polymer dispersion liquid
The 10%wt% to 70wt% of weight.Fluorinated polymer dispersion liquid have can implement coating process so that it is deposited on shell
Characteristic, coating process can pass through spraying, impregnation or other various appropriate technologies.
Fluorinated polymer in fluorinated polymer dispersion liquid includes the polymer of various molecular weight, and the monomer of polymer can have
There are 2 to 8 carbon.Fluorinated polymer can be the homopolymer of single monomer composition or the copolymer of various of monomer composition, or contain
The various combinations of the two.Monomer can be fluorine-containing or not fluorine-containing.For example, fluorochemical monomer can not be ethylene or propylene；It is fluorine-containing
Monomer can be tetrafluoroethene (tetrafluoroethylene, TFE), ethylene fluoride (vinyl floride, VF), inclined difluoro second
Alkene (vinylidene fluoride, VDF, hexafluoro-isobutene (hexafluoroisobutylene, HFIB), hexafluoropropene
(hexafluoropropylene, HFP) or perfluoroalkyl vinyl ether (perfluoro (alkyl vinyl ether,
PAVE), so without being limited thereto.The perfluoroalkyl of PAVE includes 1 to 5 carbon atom, can be structure that is linear or having branch, example
Such as perfluoro methyl vinyl ether (perfluoro (methyl vinyl ether), PMVE), perfluoroethylvinyl ether
(perfluoro (ethyl vinyl ether), PEVE), perfluoro propyl vinyl ether (perfluoro (propyl vinyl
), ether PPVE), and perfluorobutyl ethylene base ether (perfluoro (butyl vinyl ether, PBVE).Illustrated with example
The various fluorinated polymers of the present invention, can be selected from the following nd various combinations thereof, but be not limited only to this：TFE's and HFP is total to
Polymers, referred to as perfluoroethylene-propylene (perfluorinated ethylene-propylene, FEP)；The copolymerization of TFE and PAVE
Object, referred to as perfluoroalkoxy fluorocarbon (perfluoroalkoxy fluorocarbon resin, PFA)；The homopolymerization of VDF
Close object, referred to as PVDF；The copolymer of ethylene and TFE, referred to as ethylene-tetrafluoroethylene copolymer (ethylene
tetrafluoroethylene,ETFE)；The homopolymer of VF, referred to as PVF；Chlorotrifluoroethylene
(chlorotrifluoroethylene) homopolymer, referred to as PCTFE；The copolymer of chlorotrifluoroethylene and ethylene, referred to as
ECTFE。
One embodiment of the invention, fluorinated polymer dispersion liquid include the filler material that can dissipate visible light.Dissipate visible light
Particle kind it is very much, for example, can be metallic salt, metal hydroxides or metal oxide or white pigment, example
Such as titanium dioxide.In an embodiment, the content for dissipating the particle of visible light is approximately the total weight of fluorinated polymer dispersion liquid
20wt% to 60wt%.
One embodiment of the invention, fluorinated polymer dispersion liquid include the filler material for the modulus that can adjust the face coat.
In detail, the linear swollen account number of heat, thermal conductivity can be adjusted by suitable weighting materials by adjusting the modulus (modulus) of the face coat
Number, suitable weighting materials can be glass fibre or hollow glass microspheres (hollow glass microspheres)
One embodiment of the invention, fluorinated polymer dispersion liquid include luminous (luminescent) compound.Luminousization
Close the function that the light that object can make face coat be intended to reflect changes into the color for meeting expectation.For example, reflection can be intended to
Blue light changes into green light or feux rouges, or UV light is changed into blue and green light or feux rouges.Luminophor can be phosphorescent compound
(phosphorescent) or luminophor (fluorescent) etc..
Fig. 3 is provided in an embodiment of the present invention a kind of comprising shell 100 and light emitting diode (light-emitting
diode；Hereinafter referred to as LED) chip 301 light emitting diode construction 300 sectional view.As shown in figure 3, shell 100 is to scheme
Shell shown in 1A.Shell 100 includes groove 103, and top is carried as the LED wafer 301 that packaging body 303 is coated.LED is brilliant
Piece 301 can be any suitable LED wafer, if light emitting region is in the LED wafer of UV light to infrared light.Light emitting diode construction
300 by taking shell 100 shown in figure 1A as an example, and but not limited to this.Light emitting diode construction can place LED wafer the present invention's
The top of the shell of various embodiments.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not limited to the protection domain of the present patent application；
It is all other without departing from the equivalent change or modification completed under disclosed spirit, it should be included in the right of the application
In the range of it is required that.
Claims (8)
1. a kind of carrying the shell of LED wafer, which is characterized in that include：
Shell is made with nonfluorinated polymers；And
Face coat covers at least part of the shell, and the face coat is made with fluorinated polymer dispersion liquid, described
Face coat is reflecting the light that the LED wafer being placed on the shell is sent out.
2. it is according to claim 1 to carry the shell of LED wafer, wherein the shell is PPA engineering plastics
Glue is made.
3. it is according to claim 1 to carry the shell of LED wafer, wherein the shell also includes groove
To place the LED wafer, the face coat only covers the surface of the groove.
4. it is according to claim 1 to carry the shell of LED wafer, wherein the fluorinated polymer disperses
Liquid includes fluorinated polymer, and the fluorinated polymer includes the copolymerization of the homopolymer, perfluoroalkyl vinyl ether of ethylene fluoride
Close the homopolymer of object or vinylidene fluoride.
5. it is according to claim 1 to carry the shell of LED wafer, wherein the fluorinated polymer disperses
Liquid includes the filler material that can dissipate visible light.
6. it is according to claim 1 to carry the shell of LED wafer, wherein the fluorinated polymer disperses
Liquid includes the filler material for the modulus that can adjust the face coat.
7. it is according to claim 1 to carry the shell of LED wafer, wherein the fluorinated polymer disperses
Liquid includes luminophor.
8. a kind of light emitting diode construction, including：
According to any shell in claim 1 to 7；And
LED wafer is set on the shell.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810290940.7A CN108493314A (en) | 2010-04-15 | 2010-04-15 | To carry the shell and its light emitting diode construction of LED wafer |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010101517801A CN102222751A (en) | 2010-04-15 | 2010-04-15 | Housing for bearing light emitting diode wafer and light emitting diode composition |
| CN201810290940.7A CN108493314A (en) | 2010-04-15 | 2010-04-15 | To carry the shell and its light emitting diode construction of LED wafer |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010101517801A Division CN102222751A (en) | 2010-04-15 | 2010-04-15 | Housing for bearing light emitting diode wafer and light emitting diode composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108493314A true CN108493314A (en) | 2018-09-04 |
Family
ID=44779242
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810290940.7A Pending CN108493314A (en) | 2010-04-15 | 2010-04-15 | To carry the shell and its light emitting diode construction of LED wafer |
| CN2010101517801A Pending CN102222751A (en) | 2010-04-15 | 2010-04-15 | Housing for bearing light emitting diode wafer and light emitting diode composition |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010101517801A Pending CN102222751A (en) | 2010-04-15 | 2010-04-15 | Housing for bearing light emitting diode wafer and light emitting diode composition |
Country Status (1)
| Country | Link |
|---|---|
| CN (2) | CN108493314A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101366127A (en) * | 2005-12-09 | 2009-02-11 | 奥斯兰姆奥普托半导体有限责任公司 | Optical element, production method therefor, and composite component provided with an optical element |
| CN101517755A (en) * | 2006-09-21 | 2009-08-26 | 3M创新有限公司 | Thermally conductive LED assembly |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100032702A1 (en) * | 2008-08-11 | 2010-02-11 | E. I. Du Pont De Nemours And Company | Light-Emitting Diode Housing Comprising Fluoropolymer |
| CN101694273A (en) * | 2009-10-12 | 2010-04-14 | 陈炜旻 | Light-emitting diode (LED) of heat-radiating ring-groove |
-
2010
- 2010-04-15 CN CN201810290940.7A patent/CN108493314A/en active Pending
- 2010-04-15 CN CN2010101517801A patent/CN102222751A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101366127A (en) * | 2005-12-09 | 2009-02-11 | 奥斯兰姆奥普托半导体有限责任公司 | Optical element, production method therefor, and composite component provided with an optical element |
| CN101517755A (en) * | 2006-09-21 | 2009-08-26 | 3M创新有限公司 | Thermally conductive LED assembly |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102222751A (en) | 2011-10-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TW201013996A (en) | Light-emitting diode housing comprising fluoropolymer | |
| JP5250949B2 (en) | Light emitting element module | |
| CN1243256C (en) | Optical scattering sheet, optical element and vision display device | |
| CN1653561A (en) | Transparent conductive laminate film, touch panel having this transparent conductive laminate film, and production method for this transparent conductive laminate film | |
| TW200412675A (en) | Semiconductor light emitting device with fluoropolymer lens | |
| US10147854B2 (en) | Packaging for ultraviolet optoelectronic device | |
| US10886426B2 (en) | Method for producing an electronic device and electronic device | |
| US20160064631A1 (en) | Packaging for Ultraviolet Optoelectronic Device | |
| CN107968141A (en) | Light-emitting device and preparation method thereof | |
| CN1659452A (en) | Reduced-reflection film having low-refractive-index layer | |
| US12002908B2 (en) | Light-emitting packaging device | |
| CN108493314A (en) | To carry the shell and its light emitting diode construction of LED wafer | |
| TWI509838B (en) | Led housing with fluoropolymer surface coating layer and led structure having the same | |
| KR102665124B1 (en) | Fluoropolymer compositions for components of light-emitting devices | |
| JP7301866B2 (en) | Fluoropolymer composition for light emitting device components | |
| TW201336111A (en) | Surface treatment methods for LED housing packages | |
| JP5755916B2 (en) | Multi-core plastic optical fiber and cable | |
| CN110335957A (en) | Display panel and display device | |
| KR102126949B1 (en) | Encapsulant composition, encapsulant, manufacturing method and electronic device package | |
| WO2022132744A1 (en) | Material stack for leds with a dome | |
| JP5654370B2 (en) | Multi-core plastic optical fiber and cable | |
| JP2005082683A (en) | Covering material for lighting apparatus and lighting apparatus protection film containing the same | |
| TWM393074U (en) | Electronic device having protection structure | |
| TWM506699U (en) | Composite film | |
| JP2001264506A (en) | Optical member with thick film |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180904 |