CN108493130B - Gluing device of diode lead gluing device - Google Patents
Gluing device of diode lead gluing device Download PDFInfo
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- CN108493130B CN108493130B CN201810214415.7A CN201810214415A CN108493130B CN 108493130 B CN108493130 B CN 108493130B CN 201810214415 A CN201810214415 A CN 201810214415A CN 108493130 B CN108493130 B CN 108493130B
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- sliding table
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
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- Condensed Matter Physics & Semiconductors (AREA)
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- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
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Abstract
The invention discloses a gluing device of a diode lead gluing device, which comprises a sliding table, a bottom plate, a gluing device, a heating box and a first movable slide rail, wherein a movable pulley is arranged below the bottom plate, the first movable slide rail is arranged inside the bottom plate, the sliding table is arranged above the first movable slide rail, a raw material placing groove is formed in one side of the sliding table, a sliding table moving motor is arranged inside the sliding table, a grabbing arm is arranged above the sliding table, a telescopic rod is arranged above the grabbing arm, a movable base is arranged above the telescopic rod, an installation table is arranged above the movable base, a second movable slide rail is arranged inside the installation table, the gluing device is arranged on one side of the second movable slide rail, the heating box is arranged on one side of the gluing device, and a positioning device is arranged on the sliding table. The invention increases the gluing processing efficiency of the diode, improves the processing precision, and has convenient operation, easy maintenance and strong practicability.
Description
Technical Field
The invention relates to the technical field of diode gluing equipment, in particular to a gluing device of a diode lead gluing device.
Background
Diodes, electronic components, a device with two electrodes, allow current to flow only in a single direction, and many applications use the rectifying function. And the varactor is used as an electronically tunable capacitor. The current directivity that most diodes have is commonly referred to as the "rectifying" function. The most common function of a diode is to allow current to pass in a single direction (referred to as forward biasing) and to block current in the reverse direction (referred to as reverse biasing). Thus, the diode can be thought of as an electronic version of the check valve.
Early vacuum electron diodes; it is an electronic device capable of conducting current in one direction. The electronic device has a PN junction and two lead terminals inside a semiconductor diode, and has conductivity of unidirectional current according to the direction of applied voltage. Generally, a crystal diode is a p-n junction interface formed by sintering a p-type semiconductor and an n-type semiconductor. Space charge layers are formed on two sides of the interface to form a self-established electric field. When the applied voltage is equal to zero, the diffusion current and the drift current caused by the self-established electric field are equal to each other due to the concentration difference of carriers on both sides of the p-n junction, so that the diode is in an electric balance state, and the characteristic is also the diode characteristic in a normal state. Most of the diodes most common today use semiconductor materials such as silicon or germanium.
The existing diode lead is a metal conductor connected with a chip in a diode, and the main processing mode is gluing and fixing, but the existing equipment has the main problems of low gluing efficiency and poor uniformity of a glued product, so that a novel device needs to be invented to solve the existing problems.
Disclosure of Invention
The present invention is directed to a glue applicator of a diode lead sealing device to solve the above problems.
The invention realizes the purpose through the following technical scheme:
a gluing device of a diode lead gluing device comprises a sliding table, a bottom plate, a gluing device, a heating box and a first movable slide rail, wherein a movable pulley is arranged below the bottom plate, the first movable slide rail is arranged inside the bottom plate, the sliding table is arranged above the first movable slide rail, a raw material placing groove is arranged on one side of the sliding table, a sliding table moving motor is arranged inside the sliding table, a grabbing arm is arranged above the sliding table, a telescopic rod is arranged above the grabbing arm, a movable base is arranged above the telescopic rod, an installation table is arranged above the movable base, a second movable slide rail is arranged inside the installation table, the gluing device is arranged on one side of the second movable slide rail, the heating box is arranged on one side of the gluing device, a temperature control plate is arranged inside the heating box, and a telescopic support frame is arranged below the gluing device, the telescopic support frame is characterized in that a gluing head is arranged below the telescopic support frame, a positioner is arranged on the sliding table, a processing table is arranged on the positioner, and a lead placing hole is formed in the processing table.
Further, the bottom plate with the removal pulley passes through the screw fastening and links together, the bottom plate with first removal slide rail passes through the block and links together, the slip table with first removal slide rail sliding connection.
Furthermore, the movable base is connected with the mounting table in a fastening mode through screws, the movable base is connected with the telescopic rod in a fastening mode through screws, and the telescopic rod is connected with the grabbing arm in a fastening mode through screws.
Furthermore, the mounting table is fastened and connected with the second movable slide rail through screws, the glue applicator is fastened and connected with the mounting table through screws, and the heating box is fastened and connected with the temperature control plate through screws.
Furthermore, the heating box is connected with the temperature control plate through screw fastening, and the telescopic support frame is connected with the gluing head through screw fastening.
Furthermore, the positioner is connected with the sliding table through clamping, the machining table is connected with the sliding table through screw fastening, and the lead placing hole is formed in the machining table.
The invention has the beneficial effects that: increase diode rubber coating machining efficiency, promote the machining precision, convenient operation easily overhauls, and the practicality is strong.
Drawings
FIG. 1 is a front view of a glue applicator of a diode lead sealing device according to the present invention;
FIG. 2 is a structural view of a glue applicator of a diode lead sealing device according to the present invention;
fig. 3 is a view of a sliding table structure of a glue applying device of a diode lead glue sealing device according to the present invention.
Wherein: 1. a sliding table; 2. a movable pulley; 3. a base plate; 4. a raw material placing groove; 5. an installation table; 6. a second movable slide rail; 7. moving the base; 8. a telescopic rod; 9. a glue applicator; 10. a temperature raising box; 11. a temperature control plate; 12. a first movable slide rail; 13. a gripper arm; 14. a sliding table moving motor; 15. a processing table; 16. a positioner; 17. a lead wire placement hole; 18. a telescopic support frame; 19. and (4) a gluing head.
Detailed Description
The invention will be further described with reference to the accompanying drawings in which:
as shown in fig. 1-3, a gluing device of a diode lead gluing device comprises a sliding table 1, a bottom plate 3, a glue applicator 9, a heating box 10 and a first movable slide rail 12, wherein a movable pulley 2 is arranged below the bottom plate 3, the movable pulley 2 is used for equipment movement, the first movable slide rail 12 is arranged inside the bottom plate 3, the first movable slide rail 12 is used for moving the sliding table 1, the sliding table 1 is arranged above the first movable slide rail 12, the sliding table 1 is used for movement of diodes to be processed, a raw material placing groove 4 is arranged on one side of the sliding table 1, a sliding table moving motor 14 is arranged inside the sliding table 1, a grabbing arm 13 is arranged above the sliding table 1, the grabbing arm 13 is used for grabbing diodes, a telescopic rod 8 is arranged above the grabbing arm 13, the telescopic rod 8 is used for adjusting the height of the grabbing arm 13, a movable base 7 is arranged above the, the mounting table 5 is used for installing parts, the inside second sliding rail 6 that is provided with of mounting table 5, second sliding rail 6 one side is provided with rubberizer 9, rubberizer 9 one side is provided with the warming box 10, the inside temperature control board 11 that is provided with of warming box 10, temperature control board 11 is used for the controlled temperature, rubberizer 9 below is provided with telescopic bracket 18, telescopic bracket 18 below is provided with rubber coating head 19, rubber coating head 19 is used for diode lead rubber coating, be provided with locator 16 on the slip table 1, locator 16 is used for slip table 1 mobile positioning, be provided with processing platform 15 on locator 16, processing platform 15 inside is provided with the lead wire and places hole 17, the lead wire is placed hole 17 and is used for placing the diode lead wire.
When carrying out the equipment operation, can place the diode that needs processing in raw materials standing groove 4 earlier, remove base 7 and remove on second movable slide 6 and snatch the diode to processing platform 15 on slip table 1 through snatching arm 13, place the diode in lead wire placing hole 17 department, slip table movable motor 14 work drive slip table 1 moves to rubberizer 9 below on first movable slide 12, locator 16 can carry out positioning work, rubberizer 9 can place the diode in the hole 17 to the lead wire and carry out rubberizing processing, later slip table 1 removes to warming box 10, temperature control plate 11 can control heating temperature, in order to cooperate rubberizing work, accomplish whole course of working promptly.
The base plate 3 is fastened and connected with the movable pulley 2 through screws, the base plate 3 is fastened and connected with the first movable slide rail 12 through a clamping manner, the sliding table 1 is slidably connected with the first movable slide rail 12, the movable base 7 is fastened and connected with the mounting table 5 through screws, the movable base 7 is fastened and connected with the telescopic rod 8 through screws, the telescopic rod 8 is fastened and connected with the grabbing arm 13 through screws, the mounting table 5 is fastened and connected with the second movable slide rail 6 through screws, the glue applicator 9 is fastened and connected with the mounting table 5 through screws, the temperature raising box 10 is fastened and connected with the temperature control plate 11 through screws, the telescopic support frame 18 is fastened and connected with the glue applying head 19 through screws, the positioner 16 is fastened and connected with the sliding table 1 through a clamping manner, the processing table 15 is fastened and connected with, the processing table 15 is formed with a lead placing hole 17.
The invention has been described above by way of example and not by way of exhaustive illustration with reference to the accompanying drawings, and it is to be understood that the invention is not limited in its application to the details of construction and to the arrangements of the components set forth in the following description, since various insubstantial modifications of the inventive concept and arrangement of components may be made, or the inventive concept and arrangement of components may be applied to other applications without modification.
Claims (5)
1. The utility model provides a rubberizing device of diode lead wire molding equipment which characterized in that: comprises a sliding table, a bottom plate, a glue applicator, a heating box and a first movable slide rail, wherein a movable pulley is arranged below the bottom plate, the first movable slide rail is arranged in the bottom plate, the sliding table is arranged above the first movable slide rail, a raw material placing groove is arranged on one side of the sliding table, a sliding table moving motor is arranged in the sliding table, a grabbing arm is arranged above the sliding table, a telescopic rod is arranged above the grabbing arm, a movable base is arranged above the telescopic rod, an installation table is arranged above the movable base, a second movable slide rail is arranged in the installation table, the glue applicator is arranged on one side of the second movable slide rail, the heating box is arranged on one side of the glue applicator, a temperature control plate is arranged in the heating box, a telescopic support frame is arranged below the glue applicator, and a glue applying head is arranged below the telescopic support frame, the improved sliding table is characterized in that a positioner is arranged on the sliding table, a machining table is arranged on the positioner, a lead wire placing hole is formed in the machining table, the bottom plate is fixedly connected with the movable pulley through screws, the bottom plate is connected with the first movable sliding rail through clamping, and the sliding table is connected with the first movable sliding rail in a sliding mode.
2. The glue applicator of the diode lead glue sealing device according to claim 1, wherein: the movable base is connected with the mounting table in a fastening mode through screws, the movable base is connected with the telescopic rod in a fastening mode through screws, and the telescopic rod is connected with the grabbing arm in a fastening mode through screws.
3. The glue applicator of the diode lead glue sealing device according to claim 1, wherein: the mounting table is fixedly connected with the second movable slide rail through screws, the glue applicator is fixedly connected with the mounting table through screws, and the heating box is fixedly connected with the temperature control plate through screws.
4. The glue applicator of the diode lead glue sealing device according to claim 1, wherein: the heating box is connected with the temperature control plate through screw fastening, and the telescopic support frame is connected with the gluing head through screw fastening.
5. The glue applicator of the diode lead glue sealing device according to claim 1, wherein: the locator with the slip table links together through the block, the processing platform with the slip table passes through the screw fastening and links together, the shaping has on the processing platform the hole is placed to the lead wire.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810214415.7A CN108493130B (en) | 2018-03-15 | 2018-03-15 | Gluing device of diode lead gluing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810214415.7A CN108493130B (en) | 2018-03-15 | 2018-03-15 | Gluing device of diode lead gluing device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108493130A CN108493130A (en) | 2018-09-04 |
| CN108493130B true CN108493130B (en) | 2020-03-17 |
Family
ID=63339504
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810214415.7A Active CN108493130B (en) | 2018-03-15 | 2018-03-15 | Gluing device of diode lead gluing device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108493130B (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6214113B1 (en) * | 1998-07-16 | 2001-04-10 | G.D. Societa Per Azioni | Gumming device |
| CN103676061A (en) * | 2012-08-31 | 2014-03-26 | 鸿富锦精密工业（深圳）有限公司 | Dispensing device and dispensing method |
| CN203803714U (en) * | 2013-12-13 | 2014-09-03 | 如皋市易达电子有限责任公司 | Dispensing device of diode chip frame |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100926622B1 (en) * | 2008-03-17 | 2009-11-11 | 삼성모바일디스플레이주식회사 | Apparatus and Method for hermetic sealing using frit |
-
2018
- 2018-03-15 CN CN201810214415.7A patent/CN108493130B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6214113B1 (en) * | 1998-07-16 | 2001-04-10 | G.D. Societa Per Azioni | Gumming device |
| CN103676061A (en) * | 2012-08-31 | 2014-03-26 | 鸿富锦精密工业（深圳）有限公司 | Dispensing device and dispensing method |
| CN203803714U (en) * | 2013-12-13 | 2014-09-03 | 如皋市易达电子有限责任公司 | Dispensing device of diode chip frame |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108493130A (en) | 2018-09-04 |
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