CN108470841B - Display device, display panel and method for measuring packaging yield of display panel - Google Patents
Display device, display panel and method for measuring packaging yield of display panel Download PDFInfo
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- CN108470841B CN108470841B CN201710099196.8A CN201710099196A CN108470841B CN 108470841 B CN108470841 B CN 108470841B CN 201710099196 A CN201710099196 A CN 201710099196A CN 108470841 B CN108470841 B CN 108470841B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/70—Testing, e.g. accelerated lifetime tests
Abstract
The invention provides a display device, a display panel and a method for measuring the packaging yield of the display panel, wherein the display device comprises: a back plate; an organic light emitting material formed on the first side of the back plate; the first electrode is formed on the first side of the back plate, the pattern of the first electrode is annular, and the first electrode surrounds the organic light-emitting material; the packaging film is formed on one side of the organic light-emitting material, which is far away from the back plate, and the organic light-emitting material and the first electrode are sealed by the packaging film and the back plate; and the second electrode is formed on one side of the packaging film, which is far away from the back plate, and the projections of the second electrode and the first electrode on the back plate have an overlapping area. According to the invention, the first electrode and the second electrode are respectively designed on the upper surface and the lower surface of the area where the packaging film is easy to break, so that the integrity of the film packaging can be detected in time on the premise of not puncturing the packaging film, no additional manufacturing process is added, and the operation is simple and easy.
Description
Technical Field
The invention relates to the field of display devices, in particular to a display device in a high-pixel AMOLED display device, a display panel and a method for measuring the packaging yield of the display panel.
Background
With the development of display screen technology, foldable products are receiving more and more attention, but the technology in terms of foldable products (i.e., "flexible") is not mature at present, unlike glass processes, which tend to be stable, and the yield is easy to control, and there are uncertain factors in terms of many processes in flexible product parts.
Fig. 1 is a schematic cross-sectional view of a display panel of the prior art. As shown in fig. 1, the conventional display panel includes a back plate 1 ', an organic light emitting material (e.g., OLED material) 2', an encapsulation film 4 ', and a polarizer 6'. The organic luminescent material 2 'is formed on the back plate 1', and then the organic luminescent material 2 'is encapsulated by an encapsulation film 4', and the polarizer 6 'is formed on the encapsulation film 4'. But is liable to be broken during the process of encapsulating the encapsulation film 4'.
At present, in a thin film packaging part, the yield is always in an uncontrollable range, and the failure of timely detecting the integrity of the thin film packaging is one of key factors; the organic light emitting material fails due to moisture ingress caused by the rupture of the thin film package, resulting in irreparable loss.
At present, after the organic light-emitting material is evaporated, a layer of packaging film 4 ' is plated on the back plate 1 ', the film thickness is about 1-2 um, the film packaging is easy to break during film forming at present, and particularly, the film packaging is easy to break at the edge contacting with the back plate 1 ', and cannot be found in time through the present manufacturing process. Fig. 2 is a schematic view of the frangible region of fig. 1. As shown in fig. 2, the edge (e.g., region D) where the encapsulation film 4 'contacts the back sheet 1' is susceptible to cracking, resulting in the ingress of moisture.
In view of the above, the present invention provides a display device, a display panel and a method for measuring the packaging yield of the display panel.
Disclosure of Invention
Aiming at the defects in the prior art, the invention aims to provide a display device, a display panel and a method for measuring the packaging yield of the display panel, which overcome the difficulties in the prior art, can detect the integrity of film packaging in time, do not increase additional processing procedures and are simple and easy to operate.
According to an aspect of the present invention, there is provided a display device including:
a back plate;
an organic light emitting material formed on the first side of the back plate;
the first electrode is formed on the first side of the back plate, the pattern of the first electrode is annular, and the first electrode surrounds the organic light-emitting material;
the packaging film is formed on one side of the organic light-emitting material, which is far away from the back plate, and the organic light-emitting material and the first electrode are sealed by the packaging film and the back plate; and
and the second electrode is formed on one side of the packaging film, which is far away from the back plate, and the projection of the second electrode and the first electrode on the back plate has an overlapping area.
Preferably, the projection of the second electrode on the back plate comprises the projection of the first electrode on the back plate.
Preferably, the pattern of the second electrode is ring-shaped, the second electrode surrounds the organic light emitting material, and an outer edge of the second electrode exceeds an outer edge of the first electrode.
Preferably, the first electrode has a first distance between an inner edge thereof and an outer edge of the organic light emitting material.
Preferably, the first pitch ranges from 2um to 10 um.
Preferably, the inner edge of the second electrode and the outer edge of the organic light emitting material have a second spacing therebetween.
Preferably, the second pitch ranges from 2um to 10 um.
Preferably, the outer edge of the first electrode and the outer edge of the second electrode have a third spacing therebetween.
Preferably, the third distance is in the range of 2um to 10 um.
Preferably, the second electrode is a transparent conductive colloid.
Preferably, the first electrode is a transparent conductive organic material.
According to another aspect of the present invention, there is also provided a display panel, including the display device as described above, and further including a polarizer, where the polarizer is formed on a side of the encapsulation film away from the backplane, and the second electrode is located between the polarizer and the encapsulation film.
According to another aspect of the present invention, there is also provided a method for measuring a packaging yield of a display panel, using the display device as described above, including:
respectively pricking needles to the first electrode and the second electrode, and measuring whether the first electrode and the second electrode are conducted or not, wherein if yes, the packaging film is broken; if not, the packaging film is intact.
In view of the above, the display device, the display panel and the method for measuring the packaging yield of the display panel of the invention can detect the integrity of the film package in time without puncturing the packaging film by designing the first electrode and the second electrode on the upper surface and the lower surface of the region where the packaging film is easy to break, and have no additional process and are simple and easy to operate.
Drawings
Other features, objects and advantages of the invention will become more apparent upon reading of the detailed description of non-limiting embodiments with reference to the following drawings:
FIG. 1 is a cross-sectional view of a prior art display panel;
FIG. 2 is a schematic view of the frangible region of FIG. 1;
FIG. 3 is a schematic cross-sectional view of a display device of the present invention;
FIG. 4 is a schematic cross-sectional view of a display panel with an unbroken encapsulation film according to the present invention;
FIG. 5 is a schematic view of a conduction test of a display panel with an unbroken packaging film according to the present invention;
FIG. 6 is a schematic cross-sectional view of a display panel with a broken packaging film according to the present invention; and
FIG. 7 is a schematic view of a conduction test of a display panel with a broken packaging film according to the present invention.
Reference numerals
1' Back plate
2' organic luminescent material
4' packaging film
6' polarizer
A first pitch
B second pitch
C third distance
D region of easy cracking
1 Back Panel
2 organic light-emitting Material
3 conductive organic material
4 packaging film
5 conductive colloid
6 polarizer
7 Probe
8 conduction test unit
Detailed Description
Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of example embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar structures, and thus their repetitive description will be omitted.
The described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. In the following description, numerous specific details are provided to provide a thorough understanding of embodiments of the invention. One skilled in the relevant art will recognize, however, that the invention may be practiced without one or more of the specific details, or with other methods, components, materials, and so forth. In some instances, well-known structures, materials, or operations are not shown or described in detail to avoid obscuring the invention.
Fig. 3 is a schematic cross-sectional view of a display device of the present invention. As shown in fig. 3, a driving back plate of the present invention includes: a back plate 1, an organic light emitting material 2, a first electrode, an encapsulation film 4 and a second electrode. The first electrode in this embodiment is a conductive organic material 3, but not limited thereto. The second electrode in this embodiment is a conductive paste 5, but not limited thereto. The organic light emitting material 2 is formed on the first side of the back plate 1 by evaporation. The conductive organic material 3 is also plated on the first side of the back sheet 1 such that the conductive organic material 3 is located below the junction of the encapsulation film 4 and the back sheet 1 (the region most susceptible to cracking, i.e., region D). The pattern of conductive organic material 3 is ring-shaped, the conductive organic material 3 surrounding the organic luminescent material 2. The packaging film 4 is arranged on one side of the organic light-emitting material 2 far away from the back plate 1, and the organic light-emitting material 2 and the conductive organic material 3 are sealed by the packaging film 4 and the back plate 1. The conductive paste 5 is formed on the side of the packaging film 4 away from the back plate 1, and the conductive paste 5 is also located above the joint (the area most prone to crack, i.e. the area D) of the packaging film 4 and the back plate 1. The projection of the conductive gel 5 on the back sheet 1 comprises the projection of the conductive organic material 3 on the back sheet 1. The pattern of the conductive paste 5 is ring-shaped, the conductive paste 5 surrounds the organic light emitting material 2, and the outer edge of the conductive paste 5 exceeds the outer edge of the conductive organic material 3, but not limited thereto.
The conductive gel 5 has an overlapping area with the projection of the conductive organic material 3 on the back plate 1. Due to the overlapping of the conductive colloid 5 and the conductive organic material 3, when the joint (e.g., region D) between the packaging film 4 and the backplane 1 is broken, the conductive colloid 5 will immediately contact the conductive organic material 3, so that the conductive colloid 5 and the conductive organic material 3 are electrically connected. Therefore, the conducting state between the conductive colloid 5 and the conductive organic material 3 can be measured on the premise of not penetrating the packaging film 4, so that whether the packaging film 4 is broken or not and whether the packaging is complete or not can be known.
In order to prevent the conductive colloid 5 and the conductive organic material 3 from interfering with the coverage and light emission of the organic light emitting material 2, the conductive colloid 5 and the conductive organic material 3 are both kept at a certain distance from the range of the organic light emitting material 2. The conductive colloid 5 and the conductive organic material 3 are transparent colloids. And, the inner edge of the conductive organic material 3 and the outer edge of the organic light emitting material 2 have a first distance a therebetween. The first pitch a ranges from 2um to 10 um. The first distance a may be 5um, but is not limited thereto. The inner edge of the conductive paste 5 and the outer edge of the organic light emitting material 2 have a second distance B therebetween. The second pitch B ranges from 2um to 10 um. Likewise, the second pitch B may also be 5um, but is not limited thereto.
To further ensure that once the joint of the packaging film 4 and the back plate 1 is broken, the conductive colloid 5 at the broken part will contact with the conductive organic material 3 immediately, the area of the conductive colloid 5 is larger than that of the conductive organic material 3. The shape of the conductive colloid 5 may be a ring shape larger than that of the conductive organic material 3. In the present invention, a third distance C is provided between the outer edge of the conductive organic material 3 and the outer edge of the conductive paste 5. The third pitch C ranges from 2um to 10 um. The third distance C may also be 5um, but is not limited thereto.
FIG. 4 is a schematic cross-sectional view of a display panel with an unbroken encapsulation film according to the present invention. As shown in fig. 4, the display panel of the present invention includes the above display device, and further includes a polarizer 6 (or other substrate layer), the polarizer 6 is attached to one side of the packaging film 4 away from the backplane 1, and the conductive adhesive 5 is located between the polarizer 6 and the packaging film 4. The technical features of the display panel of the present invention are the same as those of the display device, and are not described herein again.
FIG. 5 is a schematic view of a conduction test of a display panel without a broken packaging film according to the present invention. As shown in fig. 5, the present invention further provides a method for measuring a packaging yield of a display panel, which adopts the display device, including: the probes 7 are respectively penetrated into the conductive organic material 3 and the conductive colloid 5, so that the conductive organic material 3 and the conductive colloid 5 are respectively conducted with the probes 7. In the measuring method of the present invention, the probe 7 does not pierce the encapsulating film 4, so the encapsulating film 4 can still be sealed against the organic luminescent material 2. Whether the two probes 7 are conducted or not is measured through a conduction test unit 8, and the conduction test unit 8 can be a flexible circuit board (FPC) connected with a mobile phone mainboard. Since the encapsulation film 4 in fig. 5 is not broken, so that the conductive organic material 3 and the conductive colloid 5 are not in contact and are insulated, the two probes 7 are not conducted, and the test result (non-conduction) shows that the encapsulation film 4 between the conductive organic material 3 and the conductive colloid 5 is not broken.
FIG. 6 is a schematic cross-sectional view of a display panel with a broken packaging film according to the present invention. FIG. 7 is a schematic view of a conduction test of a display panel with a broken packaging film according to the present invention. As shown in fig. 6 and 7, when the encapsulation film 4 is broken, the conductive organic material 3 and the conductive paste 5 are in contact conduction. At this time, the probes 7 are respectively penetrated into the conductive organic material 3 and the conductive colloid 5, the conduction test unit 8 can measure the conduction between the two probes 7, and the fact that the encapsulation film 4 between the conductive organic material 3 and the conductive colloid 5 is broken can be known through the test result (conduction).
In summary, the display device, the display panel and the method for measuring the packaging yield of the display panel of the invention can detect the integrity of the film package in time without puncturing the packaging film by respectively designing the first electrode and the second electrode on the upper surface and the lower surface of the region where the packaging film is easy to break, and have no additional process and simple and easy operation.
The foregoing description of specific embodiments of the present invention has been presented. It is to be understood that the present invention is not limited to the specific embodiments described above, and that various changes and modifications may be made by one skilled in the art within the scope of the appended claims without departing from the spirit of the invention.
Claims (11)
1. A display device, comprising:
a back plate;
an organic light emitting material formed on the first side of the back plate;
the first electrode is formed on the first side of the back plate, the pattern of the first electrode is annular, and the first electrode surrounds the organic light-emitting material;
the packaging film is formed on one side of the organic light-emitting material, which is far away from the back plate, and the organic light-emitting material and the first electrode are sealed by the packaging film and the back plate;
the second electrode is formed on one side, far away from the back plate, of the packaging film, and the second electrode and the projection of the first electrode on the back plate have an overlapping area which is arranged at an interval with the projection of the organic light-emitting material on the back plate; and
the pattern of the second electrode is ring-shaped, the second electrode surrounds the organic light emitting material, a first distance is provided between an inner edge of the first electrode and an outer edge of the organic light emitting material, and a second distance is provided between an inner edge of the second electrode and an outer edge of the organic light emitting material.
2. The display device of claim 1, wherein: the projection of the second electrode on the backplate includes the projection of the first electrode on the backplate.
3. The display device of claim 2, wherein: the outer edge of the second electrode exceeds the outer edge of the first electrode.
4. The display device of claim 1, wherein: the range of the first pitch is 2um to 10 um.
5. The display device of claim 1, wherein: the second pitch ranges from 2um to 10 um.
6. The display device of claim 1, wherein: a third spacing is provided between an outer edge of the first electrode and an outer edge of the second electrode.
7. The display device of claim 6, wherein: the range of the third interval is 2um to 10 um.
8. The display device of claim 1, wherein: the second electrode is transparent conductive colloid.
9. The display device of claim 1, wherein: the first electrode is made of a transparent conductive organic material.
10. A display panel comprising the display device according to any one of claims 1 to 9, and further comprising a polarizing plate formed on a side of the encapsulating film remote from the rear plate, wherein the second electrode is located between the polarizing plate and the encapsulating film.
11. A method for measuring the packaging yield of a display panel, which is characterized by using the display device as claimed in claim 9, comprising:
respectively pricking needles to the first electrode and the second electrode, and measuring whether the first electrode and the second electrode are conducted or not, wherein if yes, the packaging film is broken; if not, the packaging film is intact.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201710099196.8A CN108470841B (en) | 2017-02-23 | 2017-02-23 | Display device, display panel and method for measuring packaging yield of display panel |
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| CN201710099196.8A CN108470841B (en) | 2017-02-23 | 2017-02-23 | Display device, display panel and method for measuring packaging yield of display panel |
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| CN108470841B true CN108470841B (en) | 2020-10-09 |
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Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102484211A (en) * | 2009-05-27 | 2012-05-30 | 皇家飞利浦电子股份有限公司 | Sealed thin-film device, method of and system for repairing sealing layer applied to thin-film device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| KR100853242B1 (en) * | 2004-01-21 | 2008-08-20 | 파이오니아 가부시키가이샤 | Semiconductor device and method for manufacturing same |
| CN103178214B (en) * | 2011-12-22 | 2017-07-07 | 上海大学 | Method for packaging photoelectric device and equipment |
| KR102102353B1 (en) * | 2013-04-25 | 2020-04-21 | 삼성디스플레이 주식회사 | Method for testing of organic light-emitting dsplay panel, apparatus and method for testing mother substrate |
| KR20150017991A (en) * | 2013-08-08 | 2015-02-23 | 삼성디스플레이 주식회사 | Display device comprising encapsulation film and method for inspecting the encapsulation film |
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Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102484211A (en) * | 2009-05-27 | 2012-05-30 | 皇家飞利浦电子股份有限公司 | Sealed thin-film device, method of and system for repairing sealing layer applied to thin-film device |
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Address after: 201506, No. nine, No. 1568, Jinshan Industrial Zone, Shanghai, Jinshan District Applicant after: Shanghai Hehui optoelectronic Co., Ltd Address before: 201506 No. nine, No. 1568 engineering road, Shanghai, Jinshan District Applicant before: EverDisplay Optronics (Shanghai) Ltd. |
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