CN108469305A - A kind of patch-type pyroelectric infrared sensor - Google Patents
A kind of patch-type pyroelectric infrared sensor Download PDFInfo
- Publication number
- CN108469305A CN108469305A CN201810552999.9A CN201810552999A CN108469305A CN 108469305 A CN108469305 A CN 108469305A CN 201810552999 A CN201810552999 A CN 201810552999A CN 108469305 A CN108469305 A CN 108469305A
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- China
- Prior art keywords
- substrate
- infrared sensor
- pyroelectric infrared
- patch type
- type pyroelectric
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- 239000000758 substrate Substances 0.000 claims abstract description 53
- 239000002184 metal Substances 0.000 claims abstract description 23
- 229910052751 metal Inorganic materials 0.000 claims abstract description 23
- 230000003287 optical effect Effects 0.000 claims abstract description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 15
- 229920005989 resin Polymers 0.000 claims description 10
- 239000011347 resin Substances 0.000 claims description 10
- 239000011889 copper foil Substances 0.000 claims description 8
- 238000007789 sealing Methods 0.000 claims description 8
- 229910052802 copper Inorganic materials 0.000 claims description 7
- 239000010949 copper Substances 0.000 claims description 7
- 239000007769 metal material Substances 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 6
- 239000003822 epoxy resin Substances 0.000 claims description 4
- 229920000647 polyepoxide Polymers 0.000 claims description 4
- 239000000919 ceramic Substances 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 238000002844 melting Methods 0.000 claims description 3
- 230000008018 melting Effects 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 238000010276 construction Methods 0.000 description 4
- 230000005669 field effect Effects 0.000 description 3
- 238000001514 detection method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910000975 Carbon steel Inorganic materials 0.000 description 1
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 1
- 241001465754 Metazoa Species 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 239000010426 asphalt Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000009738 saturating Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
- G01J5/34—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using capacitors, e.g. pyroelectric capacitors
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
Abstract
The present invention provides a kind of patch type pyroelectric infrared sensor, the patch type pyroelectric infrared sensor includes forming closure by cover board and substrate, the support element and signal processing circuit that infrared-sensitive member is contained in the closure, fixes infrared-sensitive member；Wherein, cover board is infrared optics optical filter；The jamb surface and inner side of substrate are provided with the metal layer to form electro-magnetic screen layer；The middle part of substrate has the sunk part for forming certain receiving space；Support element and signal processing circuit are directly anchored to the surface of base plate recess portion；Base plate recess portion surface and bottom are both provided with pad, are electrically connected by via and cabling.Constitute it is a kind of miniaturization, low cost, the patch type pyroelectric infrared sensor with electromagnetic armouring structure.This patch type pyroelectric infrared sensor does not need traditional metal shell or labyrinth and has been saved the production time to reduce cost, and has excellent capability of electromagnetic shielding.
Description
Technical field
The present invention relates to a kind of pyroelectric infrared sensor, specially a kind of patch-type pyroelectric infrared sensor.
Background technology
Pyroelectric infrared sensor is a kind of sensor utilizing detection infra-red radiation made of pyroelectric effect principle, energy
It is defeated to be converted to electric signal after a series of actions such as filtered, amplification for the infrared ray that enough detection people or certain animals etc. launches
Go out.
Currently, more typical traditional pyroelectric infrared sensor structure has the tube socket and pipe cap of enclosed construction on the market, pipe
The infrared optics optical filter of cap upper surface is the window of saturating infrared ray, and heat is constituted together with the Fresnel Lenses on pipe cap
Release the optical system of electric infrared sensor.It is provided with optical sensitive member in enclosed construction and fixes the support portion of optical sensitive member
Part has field-effect tube below optical sensitive member and support member and fixes the substrate of the field-effect tube, is printed on substrate
Make the circuit of each component electrical connection, the pin of three carbon steels or iron-nickel alloy material is extended downwardly inside tube socket.Its work
It is that the infrared signal received is exported by analog signal after field-effect tube carries out impedance transformation by infrared-sensitive member as principle.
There are the problems such as inconvenient, production efficiency is low, the window visual field is small.
In addition, in the current of electronics industry rapid development, electro-magnetic screen layer is the important means for preventing Contamination of Electromagnetic Wave.Mesh
The more commonly used means of preceding pyroelectric infrared sensor are shielded using external metal shell, although this mode shielding
Can good, price big but there is also weight, the shortcomings of being not easy adjusted design.
Invention content
In view of above-mentioned deficiency, the purpose of the present invention is to provide a kind of compact, it is compact-sized, easy to produce, have
The patch type pyroelectric infrared sensor of stronger anti-radio frequency interference ability.
The present invention is achieved through the following technical solutions：
The patch type pyroelectric infrared sensor includes forming closure by cover board and substrate, receiving in the closure
The support element and signal processing circuit for having infrared-sensitive member, fixing infrared-sensitive member；Wherein, cover board filters for infrared optics
Piece；The frame top surface of substrate and inner side are provided with the metal layer to form electro-magnetic screen layer；The middle part of substrate, which has, forms one
Determine the sunk part of receiving space；Support element and signal processing circuit are directly anchored to the surface of base plate recess portion；Substrate is recessed
It falls into part surface and bottom is both provided with pad, be electrically connected by via and cabling.Constitute it is a kind of miniaturization, low cost, electrification
The patch type pyroelectric infrared sensor of magnet shielding structure.
Preferably, the shape of the substrate and/or cover board is polygon or round.
Preferably, the metal layer of the jamb surface of the substrate with lower structure by being realized：The frame table of the substrate
Face carries copper foil；Not oxidizable metal material is coated on the copper foil.
Preferably, the metal layer that the substrate inner side is equipped with lower structure by being realized：Pass through the bound edge that metallizes
Form copper wall；The copper wall surface is coated with not oxidizable metal material.
Preferably, the base plate recess portion surface and bottom are both provided with pad, the substrate frame is provided with
Several are used to be electrically connected the vertical through hole of substrate frame metal layer and base plate bottom pad.
Preferably, the vertical through hole inner wall is coated with metal layer, the through-hole uses filling holes with resin process filling,
It is coated with metal layer again after resin leveling.
Preferably, the base plate bottom is provided with several external pads for constituting element pasted on surface.
Preferably, the infrared-sensitive member stated is unit or polynary infrared-sensitive member.
Preferably, being provided with the step for making the cover board be positioned relative to the substrate around the cover board
Portion.
Preferably, the substrate is metallized ceramic substrate or epoxy resin pcb board, the cover board and substrate pass through
Sealing medium seals；The sealing medium is electroconductive resin or high melting point solder.
The advantageous effect of technical solution of the pyroelectric infrared sensor of the present invention is：
Using internal shield layer structure, traditional metal shell is not needed, while significantly reducing cost, is had good
The ability of electromagnetism interference；Traditional cover plate of outer casing and infrared fileter combination are substituted using monoblock type infrared fileter cover board,
Simplify structure；It is encapsulated using patch form, easy to process, yields is higher, is suitable for the fields such as toy, number, security protection, market
It has a extensive future.
Description of the drawings
Fig. 1 is the structure sectional view of the present invention；
1 is infrared-sensitive member, and 2 be signal processing circuit, and 3 be substrate, and 31 be cabling, and 32 be via, and 33 be pad, and 34 are
Vertical through hole, 4 be cover board, and 41 be stage portion, and 5 be support element, and 6 be substrate jamb surface metal layer, and 7 be substrate inner side gold
Belong to layer, 8 be sealing medium.
Specific implementation mode
The invention will be further described with reference to the accompanying drawings and detailed description：
The present invention, a kind of patch-type infrared sensor are illustrated with reference to Fig. 1, including is made of cover board 4 and substrate 3
Shell with enclosed construction contains infrared-sensitive member 1 in the enclosed construction, fixes 5 He of support element of infrared-sensitive member
Signal processing circuit 2.Cover board 4 is arranged to can to transmit infrared ray and conductive；Substrate 3 is provided with one in the middle
A sunk part forms certain receiving space；The frame top surface of substrate and inner side are provided with metal layer, form electromagnetic screen
Cover layer；Infrared-sensitive member is fixed by support element 5, and support element 5 and signal processing circuit 2 are directly anchored to 3 sunk part of substrate
Surface；Signal processing circuit 2 is technotron/signal condition unit etc.；The surface and bottom of 3 sunk part of substrate are all provided with
It is equipped with pad 33, is electrically connected by internal via 32 and cabling 31.
The contour substrate has polygon or round shape.The substrate is metallized ceramic substrate or asphalt mixtures modified by epoxy resin
Fat pcb board.The base plate bottom is formed with several external pads, constitutes element pasted on surface, passes through SMT automatic pasting techniques
And reflow soldering process, it is applied to the assembling of various interlock circuits.The cover board shape has polygon or round shape.It is described
Jamb surface carry copper foil.Not oxidizable metal material is coated on the copper foil.The inner side passes through metal
Change bound edge and forms copper wall.The copper wall surface is coated with not oxidizable metal material.The substrate frame is provided with several
A vertical through hole 34, for being electrically connected substrate metal layer and base plate bottom ground pad, to be grounded.Described is vertical logical
Hole inner wall is coated with metal layer, and the through-hole uses filling holes with resin process filling, and metal layer is coated with again after resin leveling.Described
Infrared-sensitive member is unit or polynary infrared-sensitive member.It is provided with around the cover board for making the cover board relative to institute
State the stage portion 41 of substrate positioning.The cover board is infrared optics optical filter.The cover board and substrate passes through sealing medium 8
To seal.The sealing medium is electroconductive resin or high melting point solder.
In the present embodiment, as shown in Figure 1, substrate 3 is epoxy resin pcb board, jamb surface carries copper foil, on copper foil
It is coated with not oxidizable metal material；Inner side forms copper wall by metal coating face, and Tong Bishang is also coated with not oxidizable gold
Belong to material, form electro-magnetic screen layer, to reduce extraneous electromagnetic interference.Cover board 4 is plane infrared optics optical filter, embedded base
Plate sunk part, and cemented with resin material, traditional cover board and optical filter are combined into one, structure is simplified, reduces into
This.Signal processing circuit is technotron.Form sealing, the patch type rpyroelectric infrared of internally charged magnet shielding structure
Sensor.
Above-described embodiment, only an example of the present invention is not the implementation for limiting the present invention and interest field,
All technical solutions identical or equivalent with content described in the claims in the present invention should all include in the scope of the present invention.
Claims (10)
1. a kind of patch type pyroelectric infrared sensor, it is characterised in that：The patch type pyroelectric infrared sensor includes by covering
Plate (4) and substrate (3) form closure, and infrared-sensitive first (1) is contained in the closure, fixes infrared-sensitive member
(1) support element (5) and signal processing circuit (2)；Wherein, cover board (4) is infrared optics optical filter；The frame of substrate (3)
Top surface and inner side are provided with the metal layer to form electro-magnetic screen layer；The middle part of substrate (3), which has, forms certain receiving space
Sunk part；Support element and signal processing circuit (2) are directly anchored to the surface of substrate (3) sunk part；Substrate (3) is recessed
Part surface and bottom are both provided with pad (33), are electrically connected by via (32) and cabling (31).
2. patch type pyroelectric infrared sensor according to claim 1, it is characterised in that：The substrate (3) and/or lid
The shape of plate (4) is polygon or round.
3. patch type pyroelectric infrared sensor according to claim 1, it is characterised in that：The frame of the substrate (3)
The metal layer (6) on surface with lower structure by being realized：The jamb surface of the substrate (3) carries copper foil；It is plated on the copper foil
There is not oxidizable metal material.
4. patch type pyroelectric infrared sensor according to claim 1, it is characterised in that：Substrate (3) private side
The metal layer (7) that face is equipped with lower structure by being realized：By metallizing, bound edge forms copper wall；The copper wall surface is coated with not
Oxidizable metal material.
5. patch type pyroelectric infrared sensor according to claim 1, it is characterised in that：Substrate (3) recessed portion
Point surface and bottom are both provided with pad, and the substrate (3) frame is provided with several for being electrically connected substrate (3) frame gold
Belong to the vertical through hole of layer and substrate (3) bottom land.
6. patch type pyroelectric infrared sensor according to claim 7, it is characterised in that：The vertical through hole inner wall
It is coated with metal layer, the through-hole uses filling holes with resin process filling, and metal layer is coated with again after resin leveling.
7. patch type pyroelectric infrared sensor according to claim 1, it is characterised in that：Substrate (3) bottom is set
It is equipped with several external pads for constituting element pasted on surface.
8. patch type pyroelectric infrared sensor according to claim 1, it is characterised in that：The infrared-sensitive member
(1) it is that unit or polynary infrared-sensitive are first (1).
9. patch type pyroelectric infrared sensor according to claim 1, it is characterised in that：Around the cover board (4)
It is provided with the stage portion (41) for making the cover board (4) be positioned relative to the substrate (3).
10. patch type pyroelectric infrared sensor according to claim 1, it is characterised in that：The substrate (3) is metal
Change ceramic substrate (3) or epoxy resin pcb board, the cover board (4) and substrate (3) are sealed by sealing medium (8)；It is described
Sealing medium be electroconductive resin or high melting point solder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810552999.9A CN108469305A (en) | 2018-05-31 | 2018-05-31 | A kind of patch-type pyroelectric infrared sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810552999.9A CN108469305A (en) | 2018-05-31 | 2018-05-31 | A kind of patch-type pyroelectric infrared sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108469305A true CN108469305A (en) | 2018-08-31 |
Family
ID=63260748
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810552999.9A Withdrawn CN108469305A (en) | 2018-05-31 | 2018-05-31 | A kind of patch-type pyroelectric infrared sensor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108469305A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110108369A (en) * | 2019-04-25 | 2019-08-09 | 东莞传晟光电有限公司 | A kind of surface attaching type pyroelectric sensor and its installation method |
| CN112781734A (en) * | 2020-12-18 | 2021-05-11 | 杭州麦乐克科技股份有限公司 | Pyroelectric sensor and packaging method thereof |
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| CN201450592U (en) * | 2009-06-06 | 2010-05-05 | 歌尔声学股份有限公司 | Miniature microphone with circuit board frame structure |
| CN202188910U (en) * | 2011-07-20 | 2012-04-11 | 郑国恩 | Intelligent pyroelectric infrared ray sensor |
| CN102625907A (en) * | 2009-08-17 | 2012-08-01 | 松下电器产业株式会社 | Infrared sensor |
| CN102656430A (en) * | 2009-12-18 | 2012-09-05 | 松下电器产业株式会社 | Infrared sensor module |
| CN105698936A (en) * | 2016-03-30 | 2016-06-22 | 南阳森霸光电股份有限公司 | SMT intelligent pyroelectric infrared sensor |
| CN106455363A (en) * | 2016-08-09 | 2017-02-22 | 华进半导体封装先导技术研发中心有限公司 | Printed circuit board manufacturing method and printed circuit board |
| CN208399017U (en) * | 2018-05-31 | 2019-01-18 | 中电科技德清华莹电子有限公司 | A kind of patch-type pyroelectric infrared sensor |
-
2018
- 2018-05-31 CN CN201810552999.9A patent/CN108469305A/en not_active Withdrawn
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201450592U (en) * | 2009-06-06 | 2010-05-05 | 歌尔声学股份有限公司 | Miniature microphone with circuit board frame structure |
| CN102625907A (en) * | 2009-08-17 | 2012-08-01 | 松下电器产业株式会社 | Infrared sensor |
| CN102656430A (en) * | 2009-12-18 | 2012-09-05 | 松下电器产业株式会社 | Infrared sensor module |
| CN202188910U (en) * | 2011-07-20 | 2012-04-11 | 郑国恩 | Intelligent pyroelectric infrared ray sensor |
| CN105698936A (en) * | 2016-03-30 | 2016-06-22 | 南阳森霸光电股份有限公司 | SMT intelligent pyroelectric infrared sensor |
| CN106455363A (en) * | 2016-08-09 | 2017-02-22 | 华进半导体封装先导技术研发中心有限公司 | Printed circuit board manufacturing method and printed circuit board |
| CN208399017U (en) * | 2018-05-31 | 2019-01-18 | 中电科技德清华莹电子有限公司 | A kind of patch-type pyroelectric infrared sensor |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110108369A (en) * | 2019-04-25 | 2019-08-09 | 东莞传晟光电有限公司 | A kind of surface attaching type pyroelectric sensor and its installation method |
| CN112781734A (en) * | 2020-12-18 | 2021-05-11 | 杭州麦乐克科技股份有限公司 | Pyroelectric sensor and packaging method thereof |
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| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20180831 |
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| WW01 | Invention patent application withdrawn after publication |