CN108465945A - A kind of laser cutting system and cutting method - Google Patents

A kind of laser cutting system and cutting method Download PDF

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Publication number
CN108465945A
CN108465945A CN201810264111.1A CN201810264111A CN108465945A CN 108465945 A CN108465945 A CN 108465945A CN 201810264111 A CN201810264111 A CN 201810264111A CN 108465945 A CN108465945 A CN 108465945A
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CN
China
Prior art keywords
cutting
laser
cut
lasing light
light emitter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201810264111.1A
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Chinese (zh)
Inventor
胡红伟
于名印
辛燕霞
佘建民
李千数
王神通
王旭东
徐晶
张彩霞
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BOE Technology Group Co Ltd
Chengdu BOE Optoelectronics Technology Co Ltd
Original Assignee
BOE Technology Group Co Ltd
Chengdu BOE Optoelectronics Technology Co Ltd
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Publication date
Application filed by BOE Technology Group Co Ltd, Chengdu BOE Optoelectronics Technology Co Ltd filed Critical BOE Technology Group Co Ltd
Priority to CN201810264111.1A priority Critical patent/CN108465945A/en
Publication of CN108465945A publication Critical patent/CN108465945A/en
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)

Abstract

The present invention relates to display technology fields,Disclose a kind of laser cutting system and cutting method,The position of all lasing light emitters of the laser cutting system setting laser cutting system is relatively fixed,The laser that different lasing light emitters are sent out is completely misaligned in the projected spot of plane where cutting board to be cut,And the laser that all lasing light emitters are sent out is parallel with cutting line in the line of the geometric center of the projected spot of plane where cutting board to be cut,The projected spot for the laser that i.e. all lasing light emitters are sent out is spaced from each other a distance arrangement along the cutting line,It is cut so that all lasing light emitters can treat cutting substrate simultaneously along same cutting line,The cutting line of different lasing light emitter cuttings is completely superposed,Overcome different lasing light emitters to align to the cutting line by different driving mechanisms to carry out cutting caused offset,Improve cut quality,Improve the quality of product.Clipping time can also be saved, simplification of flowsheet, and the flue dust that cutting generates is reduced, particle and reduction heat affected area.

Description

A kind of laser cutting system and cutting method
Technical field
The present invention relates to display technology fields, more particularly to a kind of laser cutting system and cutting method.
Background technology
In the prior art using laser cutting display screen, existing laser cutting system construction is mainly CO2Cutter unit, Femto (femtosecond) laser cutting units and mobile machine console.One cutting line of display screen is by CO2Laser and Femto laser point It Qie Ge not complete once.CO2It is cut by laser upper protective film, works as CO2Laser cuts the upper protection of complete substrate in one direction Film, board are moved to the cutting that Femto laser cutting units carry out Panel and lower protective film.Whether cutting twice path overlaps When depending on upper and lower film layer cutting twice, CO2The position of laser and Femto laser on a display screen and board moving direction Departure degree.Every time when cutting, corresponding CO2It needs to move with Femto laser heads, be not fixed since two laser heads are opposite, It is limited by mobile accuracy, there are offsets for two cutting paths.
Invention content
A kind of laser cutting system of present invention offer and cutting method, the cut-out to solve display screen need different laser The multiple of source is independently cut to complete, and different lasing light emitters, which are aligned to cutting line, has offset.
In order to solve the above technical problems, a kind of laser cutting system is provided in the embodiment of the present invention, including at least two swash Light source, at least two lasing light emitter are used to cut the different layers structure of cutting board to be cut, and at least two lasing light emitter is sent out Laser along first cutting wire cutting described in cutting board to be cut, wherein the position of at least two lasing light emitter, which is relatively fixed, to be set It sets, the laser projection that at least two lasing light emitter is sent out to the cutting board to be cut, what at least two lasing light emitter was sent out Laser is completely misaligned in the projected spot of plane where the cutting board to be cut, and at least two lasing light emitter send out swash Light is parallel with first cutting line in the line of the geometric center of the projected spot of plane where the cutting board to be cut.
Laser cutting system as described above, wherein further include at least two focusing elements, each lasing light emitter is sent out Laser focus by corresponding focusing elements, the different layers structure of cutting board to be cut is focused on for adjusting laser.
Laser cutting system as described above, wherein the laser cutting system further includes optical element, and described at least two The laser that a lasing light emitter is sent out is projected to the cutting board to be cut after the optical element.
Laser cutting system as described above, wherein the laser cutting system includes two lasing light emitters, the optics member Part is a reflecting prism；The same side of plane where described two lasing light emitters are located at cutting board to be cut, and be arranged in the reflection The opposite sides of prism.
Laser cutting system as described above, wherein further include driving device, the driving device is for driving described wait for Cutting substrate is moved along first direction, and the first direction is parallel with the extending direction of the first cutting line, and described at least two A lasing light emitter fixed setting.
Laser cutting system as described above, wherein described two lasing light emitters are respectively CO2Lasing light emitter and femtosecond laser Source.
Laser cutting system as described above, wherein the laser projection that at least two lasing light emitter is sent out is waited for described The direction of cutting substrate is vertical with the plane where the cutting board to be cut.
A kind of method cut using laser cutting system as described above is also provided in the embodiment of the present invention, is wrapped It includes：
At least two lasing light emitters are opened, the laser that at least two lasing light emitter is sent out is controlled while being cut along the first cutting line Cutting board to be cut is cut, the laser that at least two lasing light emitter is sent out is complete in the projected spot of plane where the cutting board to be cut It is complete misaligned, and the laser that at least two lasing light emitter is sent out is in the several of the projected spot of plane where the cutting board to be cut The line at what center is parallel with first cutting line.
Cutting method as described above, wherein the cutting method further includes：
It focuses at least two lasing light emitter, adjusts the different layers structure that laser focuses on cutting board to be cut.
Cutting method as described above, wherein the cutting method further includes：
Close portion shunt excitation light source, it is ON state only to retain a lasing light emitter, controls the laser edge that one lasing light emitter is sent out Cutting board to be cut described in second cutting wire cutting.
Cutting method as described above, wherein at least two lasing light emitters fixed setting is waited for especially by described in driving Cutting substrate moves so that at least one lasing light emitter cuts the cutting board to be cut.
Cutting method as described above, wherein the cutting board to be cut includes substrate, the display of setting on the substrate The protective film of film layer and the covering display film layer；
The laser cutting system includes the CO of the same side of plane where being fixed at the cutting board to be cut2Laser Source and femtosecond laser source, in a first direction, the femtosecond laser source is in the projection light where the cutting board to be cut in plane Spot is located at the CO2Lasing light emitter is in the front of the projected spot where the cutting board to be cut in plane；
The cutting method is specially：
Open CO2Lasing light emitter and femtosecond laser source drive the cutting board to be cut to be moved along first direction, CO2Lasing light emitter edge Protective film described in first cutting wire cutting, femtosecond laser source is along substrate, the first direction and institute described in the first cutting wire cutting The extending direction for stating the first cutting line is parallel.
The above-mentioned technical proposal of the present invention has the beneficial effect that：
In above-mentioned technical proposal, the position of all lasing light emitters by the way that laser cutting system is arranged is relatively fixed, when treating When cutting substrate is cut, the laser that different lasing light emitters are sent out does not weigh completely in the projected spot of plane where cutting board to be cut It closes, and the laser that all lasing light emitters are sent out is in the line of the geometric center of the projected spot of plane and cutting where cutting board to be cut Line is parallel, i.e., the projected spot for the laser that all lasing light emitters are sent out is spaced from each other a distance arrangement along the cutting line, to Enable all lasing light emitters along same cutting line while treating cutting substrate and cut, the cutting of different lasing light emitters cuttings Line is completely superposed, and is overcome different lasing light emitters to be aligned to the cutting line by different driving mechanisms and is carried out cutting caused offset Amount, improves cut quality, improves the quality of product.Clipping time can also be saved, simplification of flowsheet, and reduce cutting The flue dust of generation, particle and reduction heat affected area.
Description of the drawings
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below There is attached drawing needed in technology description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this Some embodiments of invention without having to pay creative labor, may be used also for those of ordinary skill in the art With obtain other attached drawings according to these attached drawings.
Fig. 1 shows the laser cutting system courses of work one in the embodiment of the present invention；
Fig. 2 indicates to cut the partial schematic diagram of cutting board to be cut in Fig. 1；
Fig. 3 indicates the laser cutting system course of work two in the embodiment of the present invention；
Fig. 4 indicates to cut the partial schematic diagram of cutting board to be cut in Fig. 3；
Fig. 5 indicates the cutting path schematic diagram of oled display substrate in the embodiment of the present invention.
Specific implementation mode
The cutting of display screen needs different lasing light emitters to cut different layers structure in the prior art, and different lasing light emitters pass through Different driving mechanisms is aligned to same cutting line and is cut, and is caused different lasing light emitters to there is contraposition offset, is influenced to cut Quality.
In order to solve the above technical problem, the present invention provides a kind of laser cutting system, can with but be not limited to be used for Cut display screen.The laser cutting system includes at least two lasing light emitters, and at least two lasing light emitter is to be cut for cutting The different layers structure of cutting board, the laser that at least two lasing light emitter is sent out is along base to be cut described in the first cutting wire cutting Plate.Wherein, the position of at least two lasing light emitter is relatively fixed setting, the laser projection that at least two lasing light emitter is sent out To the cutting board to be cut, projection light of the laser that at least two lasing light emitter is sent out in plane where the cutting board to be cut Spot is completely misaligned, and the laser that sends out of at least two lasing light emitter is in the projected spot of plane where the cutting board to be cut Geometric center line it is parallel with first cutting line.
Above-mentioned laser cutting system is relatively fixed by the way that the position of all lasing light emitters is arranged, and is cut when treating cutting substrate When cutting, the laser that different lasing light emitters are sent out is completely misaligned in the projected spot of plane where cutting board to be cut, and all laser The laser that source is sent out is parallel with cutting line in the line of the geometric center of the projected spot of plane where cutting board to be cut, i.e., all The projected spot for the laser that lasing light emitter is sent out is spaced from each other a distance arrangement along the cutting line, so that all lasing light emitters Display screen can be cut simultaneously along same cutting line, the cutting line of different lasing light emitter cuttings is completely superposed, and is overcome not It is aligned to the cutting line by different driving mechanisms with lasing light emitter and carries out cutting caused offset, improve cutting matter Amount, improves the quality of product.Clipping time can also be saved, simplification of flowsheet.
In addition, in technical scheme of the present invention, all lasing light emitters are treated cutting substrate along same cutting line and are carried out simultaneously Cutting, preceding beam of laser can form a temperature field in the zone of action, there is the heat transfer of heat, when after a branch of laser action preceding The cumulative function of heat is just had when the heat affected area that beam of laser is formed, when being equivalent to rear beam of laser and starting effect, effect There has been certain temperature in region.A branch of laser action region is preheated by preceding beam of laser afterwards, and previous laser is utilized Energy meets the energy that can reduce latter laser under split requirement, reduces the flue dust that cutting generates, particle and reduction heat affecting Area.
The axis for the laser that at least two lasing light emitter is sent out can be with parallel projection to the cutting board to be cut.
Further, laser projection that at least two lasing light emitter is sent out can also be set to the cutting board to be cut Direction is vertical with the plane where the cutting board to be cut so that focusing laser energy is in the first cutting line, in practice, projection light Spot has certain area, thus projecting direction of the laser on cutting board to be cut is vertical with the plane where cutting board to be cut can be with The energy density of projection hot spot is improved, cutting efficiency is improved.
Preferably, the laser cutting system further includes at least two focusing elements, and what each lasing light emitter was sent out swashs Light is focused by corresponding focusing elements, and the different layers structure of cutting board to be cut is focused on for adjusting laser.Focusing member The setting of part can be achieved different laser and focus on different layers structure, and different layers structure is cut in realization simultaneously.It can also be achieved same Laser focuses on different layers structure, realizes the cutting to different layers structure.
In order to facilitate the fixation of lasing light emitter, simplied system structure, it further includes optical element that the laser cutting system, which is arranged, The laser that at least two lasing light emitter is sent out is projected to the cutting board to be cut after the optical element.The optics member Part including is reflected, is reflected for changing the propagation light path of laser so that the position of lasing light emitter is unrestricted, can flexibly set It sets, is conducive to the volume of reduction system, reduce occupied space.
The optical element may include the combination of plane mirror or prism or plane mirror and prism, swash with specific reference to difference The position relationship and lasing light emitter of light source are arranged with the position relationship of cutting board to be cut.
Such as：When the laser cutting system includes two lasing light emitters, the optical element can be a reflecting prism, The same side of plane, described two lasing light emitters correspond to the difference of reflecting prism where described two lasing light emitters are located at cutting board to be cut Reflecting surface is arranged, and the laser that lasing light emitter is sent out is projected to the cutting board to be cut after the reflection of corresponding reflecting surface.Specifically , two lasing light emitters can be arranged to the opposite sides in the reflecting prism, the two neighboring reflecting surface of corresponding reflecting prism Setting.Optionally, after the reflection of corresponding reflecting surface, two beam laser projections wait for the laser that two lasing light emitters are sent out to described The direction of cutting substrate is vertical with the plane where the cutting board to be cut so that focusing laser energy in the first cutting line, with Improve cutting efficiency.
It should be noted that the position relationship of lasing light emitter and reflecting prism can be according to the concrete structure of laser cutting system It is arranged, for the purpose of installing, it is not limited to a kind of above-mentioned form.
Those skilled in the art it is readily conceivable that the optical element be not limited to selection reflecting prism, such as：May be used also It is above-mentioned to illustrate the operation principle of optical element only by taking reflecting prism as an example to select the combination of multiple plane mirrors, specifically Suitable optical element is selected according to the position of lasing light emitter.
Certainly, different lasing light emitters can also be arranged in the both sides of plane where cutting board to be cut, and the optical element includes The multiple optical textures being correspondingly arranged respectively from different lasing light emitters.Based on same principle, the optical texture may include putting down The combination of face mirror or prism or plane mirror and prism, position relationship and lasing light emitter with specific reference to different lasing light emitters with it is to be cut The position relationship of cutting board is arranged, and no longer citing is described in detail herein.
Optionally, it further includes driving device that the laser cutting system, which is arranged, and the driving device is for driving described wait for Cutting substrate is moved along first direction, and the first direction is parallel with the extending direction of the first cutting line, and described at least two A lasing light emitter fixed setting.
The position of lasing light emitter is fixed in above-mentioned technical proposal, and cutting is realized by the movement cutting board to be cut.Laser The position in source is fixed, and the position of corresponding optical element optical system is also fixed, it can be ensured that the stability of light path improves cutting Quality.
It is obvious also possible to which the position that cutting board to be cut is arranged is fixed, drive lasing light emitter along the first cutting by driving mechanism Cutting board to be cut described in wire cutting.
Technical scheme of the present invention can open simultaneously at least two lasing light emitter, to be cut simultaneously along the first cutting line The different layers structure of cutting board to be cut can cut cutting board to be cut open completely.One of lasing light emitter can also be only opened, is closed Other lasing light emitters are closed, realize the portion's layered structure for independently cutting cutting board to be cut along the second cutting line, there is higher flexibility. Specific cutting path all can be：At least two lasing light emitter is fixedly installed, is driven by driving device described to be cut Substrate moves, to realize lasing light emitter along cutting board to be cut described in the first cutting line or the second cutting wire cutting.
Correspondingly, include using the method that above-mentioned laser cutting system is cut：
At least two lasing light emitters are opened, the laser that at least two lasing light emitter is sent out is controlled while being cut along the first cutting line Cutting board to be cut is cut, the laser that at least two lasing light emitter is sent out is complete in the projected spot of plane where the cutting board to be cut It is complete misaligned, and the laser that at least two lasing light emitter is sent out is in the several of the projected spot of plane where the cutting board to be cut The line at what center is parallel with first cutting line.
The position of at least two lasing light emitters is relatively fixed setting in above-mentioned cutting method, by once fixed in cutting process Bit-by-bit overcomes offset issue caused by respectively aligning lasing light emitter to same cutting line to same cutting line, and raising is cut Quality is cut, the quality of product is improved.Clipping time can also be saved, simplification of flowsheet.In addition, in cutting process, institute There is lasing light emitter to be cut simultaneously to display screen along same cutting line, the accumulation of laser energy is conducive to reduce the energy of laser Amount, it might even be possible to reduce the flue dust that cutting generates, particle and reduction heat affected area.
Preferably, the cutting method further includes：
It focuses at least two lasing light emitter, adjusts the different layers structure that laser focuses on cutting board to be cut.
By focusing to lasing light emitter in above-mentioned steps, it can realize to different layers structure while cut, it can be complete Cut off the cutting board to be cut.It can also be achieved same laser and focus on different layers structure, realize the cutting to different layers structure.
In order to improve flexibility, the cutting method further includes：
Close portion shunt excitation light source, it is ON state only to retain a lasing light emitter, controls the laser edge that one lasing light emitter is sent out Cutting board to be cut described in second cutting wire cutting.
Above-mentioned steps realize the part for independently cutting cutting board to be cut of a lasing light emitter by only opening a certain lasing light emitter Layer structure.By focusing to lasing light emitter, it may also be ensured that laser is focused in real time in the layer structure of corresponding cutting, to layer knot The depth of cut of structure is consistent, improves cut quality, promotes the quality of product.
Specifically, at least two lasing light emitter fixed setting, especially by driving the cutting board to be cut mobile so that It obtains at least one lasing light emitter and cuts the cutting board to be cut.Can be：
At least two lasing light emitter is opened, the cutting board to be cut is driven to be moved along first direction, described at least two Along the first cutting wire cutting substrate to be cut, base to be cut is completely cut through along the first cutting line simultaneously for the laser that lasing light emitter is sent out Plate；
A lasing light emitter is opened, other lasing light emitters are closed, the cutting board to be cut is driven to move in a second direction, described one The laser that a lasing light emitter is sent out cuts cutting board to be cut along the second cutting wire cutting substrate to be cut along the second cutting line part.
The position of lasing light emitter is fixed in above-mentioned technical proposal, and cutting is realized by the movement cutting board to be cut.Laser The position in source is fixed, and the position of corresponding optical element optical system is also fixed, it can be ensured that the stability of light path improves cutting Quality.
Below in conjunction with drawings and examples, the specific implementation mode of the present invention is described in further detail.Following reality Example is applied for illustrating the present invention, but is not limited to the scope of the present invention.
Below by taking oled display substrate as an example, the structure conjunction for carrying out the specific laser cutting system for introducing the present invention is worked Journey.
In conjunction with shown in Fig. 1-Fig. 5, oled display substrate 100 includes substrate 101, the display being arranged in the substrate 101 The protective film 103 of film layer 102 and the covering display film layer 102.It is described display film layer include OLED each film layer, driving it is thin Film transistor etc..The laser cutting system cut to oled display substrate 100 includes CO2Lasing light emitter 10 and femtosecond laser source 20。
Wherein, CO2The position of lasing light emitter 10 and femtosecond laser source 20 is relatively fixed setting, CO2Lasing light emitter 10 and femtosecond laser The laser that source 20 is sent out is completely misaligned in the projected spot of 100 place plane of oled display substrate, and CO2Lasing light emitter 10 and fly The laser that second lasing light emitter 20 is sent out the geometric center of the projected spot of 100 place plane of oled display substrate line with it is described First cutting line is parallel.When being cut to oled display substrate 100 along the first cutting line, CO2Lasing light emitter 10 is cut along first Secant cuts the protective film 103, and femtosecond laser source 20 is along substrate 101 described in the first cutting wire cutting, in conjunction with Fig. 1, Fig. 2 and figure Shown in 5.
Preferably, the laser cutting system includes two focusing elements 1, CO2Lasing light emitter 10 and femtosecond laser source 20 are sent out The laser gone out is focused by corresponding focusing elements 1, makes CO2The laser that lasing light emitter 10 is sent out focuses on the protective film On 103, the laser that femtosecond laser source 20 is sent out focuses in substrate 101.When being cut to oled display substrate 100, adjust Burnt element 1 can be to CO2Lasing light emitter 10 or femtosecond laser source 20 are focused, and the cutting to corresponding layer structure is completed, and are improved Capacity usage ratio improves cutting efficiency.
In order to facilitate the fixation of lasing light emitter, simplied system structure, setting laser cutting system also wraps in the embodiment of the present invention A reflecting prism 2 is included, specifically by CO2Lasing light emitter 10 and femtosecond laser source 20 are located at the same of 100 place plane of oled display substrate Side, and it is oppositely arranged on the both sides of reflecting prism 2, CO2Lasing light emitter 10 and femtosecond laser source 20 are by the opposite of reflecting prism 2 After the reflex of two reflectings surface, it is projected to oled display substrate 100.Further, when laser cutting system includes above-mentioned When focusing elements 1, focusing elements 1 can be arranged between lasing light emitter and reflecting prism 2, specifically, a focusing elements 1 are arranged In CO2Between lasing light emitter 10 and reflecting prism 2, CO2The laser that lasing light emitter 10 is sent out after the focusing of a focusing elements 1, It is projected to the reflecting surface of reflecting prism 2.Another focusing elements 1 are arranged between femtosecond laser source 20 and reflecting prism 2, and femtosecond swashs The laser that light source 20 is sent out is projected to the reflecting surface of reflecting prism 2 after the focusing of a focusing elements 1.
It is of course also possible to focusing elements 1 are set between reflecting prism 2 and oled display substrate 100, what lasing light emitter was sent out Laser is incident to focusing elements 1 by the reflex of reflecting surface and focuses, and is then projected to oled display substrate 100 again On.
The making of oled display substrate 100 is to make multiple oled display substrates 100 on one big scale substrates 101 Each layer structure, is finally cut again.Wherein, cutting technique includes：Multiple independent oled display substrates are obtained by cutting 100, cutting line is as shown in the dotted line 200 in Fig. 5；The frame of each oled display substrate 100 is cut, is obtained required Shape, in cutting line such as figure shown in 5 dotted line 201；To the protective film in PAD (interface) region of each oled display substrate 100 103 are cut, and expose PAD, cutting line is as shown in the dotted line 202 in Fig. 5.
For above-mentioned first two cutting technique, CO is set2The position of lasing light emitter 10 and femtosecond laser source 20 is fixed, by OLED Display base plate 100 is fixed on board.Open CO2Lasing light emitter 10 and femtosecond laser source 20, driving board are moved along first direction, CO2Lasing light emitter 10 is along the first cutting wire cutting protective film 103, and femtosecond laser source 20 is along the first cutting wire cutting substrate, and described the One direction is parallel with the extending direction of the first cutting line.As seen from Figure 5, it in the first cutting technique, cuts Technique to a certain oled display substrate 100 includes four the first cutting lines, and four the first cutting lines surround a closed rectangle, It should be noted that first direction is only defined for ease of description, and when the long side cutting along rectangle, first direction and long side Extending direction it is parallel, when along rectangle broadside cutting when, first direction is parallel with the extending direction of broadside.It is cut at second In technique, the cutting to a certain oled display substrate 100 includes two the first cutting lines.
And for a kind of last cutting technique, due to only cutting protective film 103, only it need to open CO2Lasing light emitter 10 is It can.In the embodiment of the present invention, in conjunction with shown in Fig. 3, Fig. 4 and Fig. 5, driving board moves in a second direction, CO2Lasing light emitter 10 is along Two cutting lines (as shown in dotted line 202 in Fig. 5) cut cutting board to be cut, independent cutting are realized, so as to be cut along second The protective film 103 that secant only treats cutting substrate is cut.By the way that above-mentioned focusing elements 1 are arranged, it may also be ensured that laser is real When focus on protective film 103, it is consistent to the depth of cut of protective film 103, improve cut quality.It can be seen from attached drawing In a kind of last cutting technique, the cutting to a certain oled display substrate 100 includes second cutting line.
The cutting technique of 100 manufacture craft back segment of oled display substrate is completed by above-mentioned three kinds of cutting techniques.
Above-mentioned is only specifically to introduce technical scheme of the present invention, technical side of the invention by taking the cutting of oled substrate as an example Case can be applicable to the cutting of other types display base plate, such as：Thin-film transistor array base-plate, naturally it is also possible to be suitable for it He has the cutting of the substrate of multiple layers of structure, such as：PCB circuit board.Specific incision principle is similar to the above, it is only necessary to which selection is closed Suitable lasing light emitter.
The above is only a preferred embodiment of the present invention, it is noted that for the ordinary skill people of the art For member, without departing from the technical principles of the invention, several improvement and replacement can also be made, these improve and replace Also it should be regarded as protection scope of the present invention.

Claims (12)

1. a kind of laser cutting system, including at least two lasing light emitters, at least two lasing light emitter is for cutting base to be cut The different layers structure of plate, the laser that at least two lasing light emitter is sent out cut cutting board to be cut described in wire cutting along first, It is characterized in that, the position of at least two lasing light emitter is relatively fixed setting, and the laser that at least two lasing light emitter is sent out is thrown It is incident upon the cutting board to be cut, projection of the laser that at least two lasing light emitter is sent out in plane where the cutting board to be cut Hot spot is completely misaligned, and the laser that sends out of at least two lasing light emitter is in the projection light of plane where the cutting board to be cut The line of the geometric center of spot is parallel with first cutting line.
2. laser cutting system according to claim 1, which is characterized in that further include at least two focusing elements, it is each The laser that the lasing light emitter is sent out is focused by corresponding focusing elements, and cutting board to be cut is focused on for adjusting laser Different layers structure.
3. laser cutting system according to claim 2, which is characterized in that the laser cutting system further includes optics member Part, the laser that at least two lasing light emitter is sent out are projected to the cutting board to be cut after the optical element.
4. laser cutting system according to claim 3, which is characterized in that the laser cutting system includes two laser Source, the optical element are a reflecting prism；The same side of plane where described two lasing light emitters are located at cutting board to be cut, and set Set the opposite sides in the reflecting prism.
5. laser cutting system according to claim 4, which is characterized in that further include driving device, the driving device For driving the cutting board to be cut to be moved along first direction, the extending direction of the first direction and first cutting line is flat Row, at least two lasing light emitters fixed setting.
6. laser cutting system according to claim 4, which is characterized in that described two lasing light emitters are respectively CO2Lasing light emitter And femtosecond laser source.
7. laser cutting system according to claim 1, which is characterized in that the laser that at least two lasing light emitter is sent out The direction for being projected to the cutting board to be cut is vertical with the plane where the cutting board to be cut.
8. a kind of method cut using claim 1-7 any one of them laser cutting systems, including：
At least two lasing light emitters are opened, the laser that at least two lasing light emitter is sent out is controlled and is waited for simultaneously along the first cutting wire cutting Cutting substrate, the laser that at least two lasing light emitter is sent out plane where the cutting board to be cut projected spot completely not It overlaps, and the laser that at least two lasing light emitter is sent out is in the geometry of the projected spot of plane where the cutting board to be cut The line of the heart is parallel with first cutting line.
9. cutting method according to claim 8, which is characterized in that the cutting method further includes：
It focuses at least two lasing light emitter, adjusts the different layers structure that laser focuses on cutting board to be cut.
10. cutting method according to claim 8, which is characterized in that the cutting method further includes：
Close portion shunt excitation light source, it is ON state only to retain lasing light emitter, controls laser that one lasing light emitter is sent out along second Cut cutting board to be cut described in wire cutting.
11. cutting method according to claim 10, which is characterized in that at least two lasing light emitters fixed setting, tool Body is by driving the cutting board to be cut to move so that at least one lasing light emitter cuts the cutting board to be cut.
12. cutting method according to claim 8, which is characterized in that the cutting board to be cut includes substrate, is arranged in institute State the protective film of the display film layer and the covering display film layer in substrate；
The laser cutting system includes the CO of the same side of plane where being fixed at the cutting board to be cut2Lasing light emitter and Femtosecond laser source, in a first direction, the femtosecond laser source is in the projected spot position where the cutting board to be cut in plane In the CO2Lasing light emitter is in the front of the projected spot where the cutting board to be cut in plane；
The cutting method is specially：
Open CO2Lasing light emitter and femtosecond laser source drive the cutting board to be cut to be moved along first direction, CO2Lasing light emitter is along first Protective film described in wire cutting is cut, femtosecond laser source is along substrate described in the first cutting wire cutting, the first direction and described the The extending direction of one cutting line is parallel.
CN201810264111.1A 2018-03-28 2018-03-28 A kind of laser cutting system and cutting method Pending CN108465945A (en)

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Publication number Priority date Publication date Assignee Title
CN110480190A (en) * 2019-07-29 2019-11-22 武汉华星光电技术有限公司 The preparation method and cutter device of display device
CN110693618A (en) * 2019-10-15 2020-01-17 浙江隐齿丽医学技术有限公司 Method and device for determining cutting direction of shell-shaped tooth appliance and electronic equipment

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US20030006221A1 (en) * 2001-07-06 2003-01-09 Minghui Hong Method and apparatus for cutting a multi-layer substrate by dual laser irradiation
KR20120004794A (en) * 2010-07-07 2012-01-13 주식회사 이오테크닉스 Laser cutting apparatus and method capable of cutting workpiece having multi layer
CN103811682A (en) * 2012-11-14 2014-05-21 乐金显示有限公司 Method Of Cutting Flexible Display Device And Method Of Fabricating Flexible Display Device Using The Same
CN206925467U (en) * 2017-05-16 2018-01-26 漳州市澳捷光学科技有限公司 Optical mirror slip automatic laser cutter device
CN107649789A (en) * 2017-10-24 2018-02-02 武汉华星光电半导体显示技术有限公司 Soft panel cutting equipment and soft panel cutting method

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Publication number Priority date Publication date Assignee Title
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KR20120004794A (en) * 2010-07-07 2012-01-13 주식회사 이오테크닉스 Laser cutting apparatus and method capable of cutting workpiece having multi layer
CN103811682A (en) * 2012-11-14 2014-05-21 乐金显示有限公司 Method Of Cutting Flexible Display Device And Method Of Fabricating Flexible Display Device Using The Same
CN206925467U (en) * 2017-05-16 2018-01-26 漳州市澳捷光学科技有限公司 Optical mirror slip automatic laser cutter device
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110480190A (en) * 2019-07-29 2019-11-22 武汉华星光电技术有限公司 The preparation method and cutter device of display device
CN110693618A (en) * 2019-10-15 2020-01-17 浙江隐齿丽医学技术有限公司 Method and device for determining cutting direction of shell-shaped tooth appliance and electronic equipment

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