CN108459769B - Manufacturing method of curved surface touch module - Google Patents
Manufacturing method of curved surface touch module Download PDFInfo
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- CN108459769B CN108459769B CN201810188251.5A CN201810188251A CN108459769B CN 108459769 B CN108459769 B CN 108459769B CN 201810188251 A CN201810188251 A CN 201810188251A CN 108459769 B CN108459769 B CN 108459769B
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
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- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Position Input By Displaying (AREA)
- Manufacture Of Switches (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
A manufacturing method of a curved-surface touch module aims at the problem that trimming is needed to be carried out on an existing curved-surface touch product after a thermoplastic laminating process, so that product quality control is difficult, a protective layer is used for preventing a conductive film from being damaged in the thermoplastic process, meanwhile, the protective layer is used as a bearing film for half-cutting a touch sensing layer, and after the thermoplastic laminating process is completed, the protective layer is only needed to be removed, and trimming is not needed, so that the process yield can be effectively increased, and the production cost is reduced.
Description
Technical Field
The present invention relates to a method for manufacturing a touch module, and more particularly to a method for manufacturing a curved touch module without trimming.
Background
With the evolution of the times, scientific and technical products are closer to life, the physical buttons on most products are gradually replaced by touch technology, and the touch interface is also developed to the application of curved surface modeling from simple plane modeling along with the appearance of the products. In response to the development of curved touch products, a thermoplastic process is introduced to achieve the required curvature of the product, and a plastic material is mainly used as a substrate of a conductive film, and after the thermoplastic processes such as heating, pressure molding and bonding, trimming (trimming) is also required to improve the appearance quality of the product.
At present, laser cutting is most widely used for trimming products. For any curved surface product, the curved surface problem can be overcome by adjusting the laser focus Distance (DOF) or matching with 3D cutting technology, but the cutting quality is not easy to control, and the heat generated during the cutting process can damage the adhesive material. Therefore, the 3D laser cutting equipment has high cost, long time consumption and low economic effect.
Therefore, there is a need to develop a method for manufacturing a curved touch module, which reduces trimming after the thermoplastic lamination process, so as to effectively solve various defects existing in the prior art.
Disclosure of Invention
The main objective of the present invention is to provide a method for manufacturing a curved touch module, which uses a protection layer to prevent a conductive film from being damaged during a thermoplastic process and to serve as a carrier film for half-cutting a touch sensing layer, so as to eliminate the trimming operation of the existing curved touch product after the thermoplastic lamination process, thereby improving the yield of the process and reducing the production cost.
Therefore, in order to achieve the above object, the present invention provides a method for manufacturing a curved touch module, which includes the steps of providing a first substrate having a curved surface. Meanwhile, a second substrate is provided, the second substrate is a flexible substrate, and a conductive film is disposed on a surface of the second substrate to form a touch sensing layer, the conductive film is made of a conductive material with tensile properties, such as Poly Ethylenedioxythiophene (PEDOT), nano silver wire (SNW), nano carbon tube (CNT), and related composite materials. Then, a protective layer is covered on the conductive film. Then, half-cutting is carried out on the bottom surface of the second substrate, and the cut after half-cutting passes through the touch sensing layer and is terminated at the protective layer. And then the touch sensing layer is arranged opposite to the first substrate, and the bottom surface of the second substrate faces the curved surface of the first substrate. And then, thermoplastically adhering the touch sensing layer to the curved surface of the first substrate to form a curved surface touch module. Finally, the passivation layer is removed.
According to the embodiment of the present invention, in the step of covering the conductive film with the protective layer, the adhesive may be used to form a first adhesion layer between the protective layer and the conductive film.
According to the embodiment of the invention, the step of thermo-molding the touch sensing layer to the curved surface of the first substrate may also use an adhesive to form a second adhesion layer between the second substrate of the touch sensing layer and the curved surface of the first substrate.
According to an embodiment of the present invention, the adhesive used for forming the first adhesion layer and the second adhesion layer can be a heat sensitive adhesive.
According to an embodiment of the present invention, the storage modulus of the adhesive used for forming the first adhesion layer and the second adhesion layer during the thermoplastic lamination process is preferably less than or equal to 0.02 megapascal (MPa), so as to enhance the adhesion of the bonding interface by the overflow phenomenon of the adhesive.
According to an embodiment of the present invention, the material of the first substrate may be glass or plastic composite.
According to the embodiment of the present invention, the material of the second substrate can be ethylene terephthalate (PET) or Polycarbonate (PC) and other plastic films with stretching property.
The manufacturing method of the curved surface touch module provided by the invention is characterized in that the protective layer is used for covering the conductive film before the touch sensing layer is thermoplastically bonded on the first substrate, so that the conductive film can be protected from being damaged in the thermoplasticity process, the protective layer is used as a bearing film for half-cutting the touch sensing layer and then thermoplastically bonded, after the completion, the protective layer is removed without trimming, the production cost can be effectively reduced, and the damage probability of the conductive film in the thermoplasticity bonding process is reduced.
Furthermore, the invention can further use the adhesive as the adhesion layer to help the adhesion between the layers, and the glue overflow phenomenon generated in the thermoplastic process of the adhesive is used to strengthen the two connection interfaces, thereby improving the reliability of the product.
The purpose, technical content, features and effects of the present invention will be more readily understood through the detailed description of the embodiments below. The purpose, technical content, features and effects of the present invention will be more readily understood by the following detailed description of the embodiments with the accompanying drawings.
Drawings
Fig. 1 is a flowchart illustrating a method for manufacturing a curved touch module according to an embodiment of the invention.
Fig. 2 to 9 are cross-sectional views of structures corresponding to steps in a manufacturing method of a curved touch module according to an embodiment of the invention.
FIGS. 10 and 11 are graphs showing the relationship between storage modulus and flash phenomenon of the adhesive used in the embodiment of the present invention.
FIGS. 12 and 13 are schematic views illustrating that no flash occurs and flash occurs after the thermoplastic process of the adhesive forming the second adhesion layer in the embodiment of the invention.
Reference numerals:
1 curved surface touch module
10 first substrate
11 three-dimensional curved surface
20 touch control induction layer
21 second substrate
211 surface (c)
212 bottom surface
22 conductive film
30 protective layer
40 first adhesive layer
50 second adhesion layer
60 hot pressing head
Detailed Description
The invention discloses a manufacturing method of a curved surface touch module, which is beneficial to guiding a thermoplastic manufacturing process into the curved surface touch module to achieve the required curvature of a product; the curved touch module can be applied to various electronic devices such as display equipment, tablet computers, smart phones, notebook computers, desktop computers, televisions, satellite navigation, on-board displays, aviation displays or portable DVD players.
Referring to fig. 1, a flow chart of a method for manufacturing a curved touch module according to an embodiment of the invention is shown; meanwhile, please refer to fig. 2 to 9 in sequence, which are cross-sectional views of structures corresponding to steps in the manufacturing method of the curved touch module according to the embodiment of the present invention. The manufacturing method comprises the following steps:
first, in step S101, as shown in fig. 2, a first substrate 10 is provided, wherein the first substrate 10 may be a protective tempered glass or plastic composite material, and has a three-dimensional curved surface 11.
In step S102, as shown in fig. 3, a second substrate 21 is provided, the second substrate 21 is a flexible substrate, and a transparent conductive film 22 with stretchable property is formed on a surface 211 of the second substrate 21, so that an electrode pattern is formed on the surface 211 of the second substrate 21 to form a touch sensing layer 20; the material of the conductive film 22 can be selected from conductive materials with tensile property such as polydioxyethyl thiophene (PEDOT), nano silver wire (SNW), Carbon Nanotube (CNT) and related composite materials. The material of the second substrate 21 can be ethylene terephthalate (PET) or Polycarbonate (PC) and other plastic films with stretching property.
Then, in step S103, as shown in fig. 4, a protection layer 30 is formed on the touch sensing layer 20 and covers the conductive film 22. In this step, an adhesive may be used to form a first adhesion layer 40 between the protection layer 30 and the conductive film 22; preferably, the adhesive forming the first adhesive layer 40 is a heat sensitive adhesive. Wherein the substrate of the protection layer 30 can be a polyethylene terephthalate (PET) film, a Polycarbonate (PC) film, a Polyolefin (PO) film, and the adhesive can be Polyurethane (PU), silicone, acrylic type.
Next, in step S104, as shown in fig. 5, the protection layer 30 is used as a carrier film, and Half-cut (Half-cut) is performed on the touch sensing layer 20, so that the Half-cut passes through the touch sensing layer 20 and is terminated on the protection layer 30; that is, the touch sensing layer 20 is cut from the bottom surface 212 of the second substrate 21 of the touch sensing layer 20 by half-cutting, the touch sensing layer 20 is cut without cutting the protection layer 30, and after the half-cutting is completed, the touch sensing layer 20 is still attached to the protection layer 30.
In step S105, as shown in fig. 6, the touch sensing layer 20 is disposed opposite to the first substrate 10, and the bottom surface 212 of the second substrate 21 faces the curved surface 11 of the first substrate 10.
Then, in step S106, as shown in fig. 7, a hot pressing head 60 is used to heat and press the protection layer 30, the touch sensing layer 20 and the first substrate 10, so that the touch sensing layer 20 can be thermally adhered to the curved surface 11 of the first substrate 10, and after the thermal molding is completed, the curved surface touch module 1 is formed, as shown in fig. 8. In this step, an adhesive may also be used to form a second adhesion layer 50 between the second substrate 21 of the touch sensing layer 20 and the curved surface 11 of the first substrate 10; preferably, the adhesive forming the second adhesive layer 50 is a heat sensitive adhesive.
Finally, in step S107, as shown in fig. 9, the protective layer 30 is removed; after which no trimming action is necessary.
In the invention, in order to further simplify the manufacturing process, all layers in the curved surface touch module can be simultaneously bonded by utilizing the thermoplastic process, particularly the adhesion degree of the conductive film and the first substrate is enhanced aiming at the bonding of the conductive film and the first substrate, adhesives are used as the adhesion layers among all layers, and the flowability of the adhesives is improved along with the temperature increase, so that the glue overflow phenomenon is easy to occur in the thermoplastic manufacturing process.
FIG. 10 and FIG. 11 are graphs showing the relationship between storage modulus and flash phenomenon of the adhesive used in the embodiment of the present invention; according to the experimental test results, if the storage modulus (storage modulus) G' of the adhesive material at the processing temperature is lower than 0.02 MPa, the adhesive material has a significant flash phenomenon.
Further, as shown in fig. 12 and fig. 13, the adhesive forming the second adhesive layer 50 in the embodiment of the invention is not overflowed after the thermoplastic process and has overflowed after the thermoplastic process, respectively; under high temperature conditions, the expansion and contraction of the base material easily cause the contact interface between the touch sensing layer 20 and the first substrate 10 to bubble and peel (see fig. 12), and the overflowing adhesive material can reinforce the two contact interfaces (see fig. 13).
Therefore, in the manufacturing method of the curved touch module provided by the invention, the storage modulus of the adhesive used for forming the first adhesion layer and the second adhesion layer is preferably less than or equal to 0.02 megapascal (MPa) at the thermoplastic bonding process temperature (about 110-150 ℃), so as to strengthen the bonding interface by the glue overflow phenomenon, thereby improving the product reliability.
In summary, according to the method for manufacturing a curved touch module provided by the present invention, the protective layer covers the surface of the conductive film, so that the damage probability of the conductive film in the thermoplastic process can be reduced, the protective layer is used as a carrier film, the carrier film is half-cut in cooperation with the touch sensing layer, and then the thermoplastic lamination process is performed, after the completion, the protective layer is only removed, and no trimming operation is required, so that the problems of quality control, cost and the like caused by the trimming process in the conventional art can be effectively solved, thereby improving the process yield, reducing the production cost, and improving the competitive advantage. Furthermore, the present invention can further use the adhesive layer that will generate the flash phenomenon to enhance the adhesion between the interfaces of each layer, thereby increasing the reliability of the product.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. Therefore, all the equivalent changes or modifications according to the features and the spirit described in the scope of the application of the present invention should be included in the scope of the application of the present invention.
Claims (9)
1. A method for manufacturing a curved surface touch module is characterized by comprising the following steps:
providing a first substrate, wherein the first substrate is provided with a curved surface;
providing a second substrate, wherein the second substrate is a flexible substrate, and a conductive film is disposed on a surface of the second substrate to form a touch sensing layer, and the conductive film is made of one material selected from the group consisting of poly (ethylenedioxythiophene), a nano silver wire and a nano carbon tube;
covering a protective layer on the conductive film;
performing half-cutting on a bottom surface of the second substrate to enable the cut after half-cutting to pass through the touch sensing layer and terminate at the protective layer;
the touch sensing layer is arranged opposite to the first substrate, and the bottom surface of the second substrate faces the curved surface of the first substrate;
thermoplastically attaching the touch sensing layer to the curved surface of the first substrate to form the curved surface touch module; and
the protective layer is removed.
2. The method as claimed in claim 1, wherein the step of covering the conductive film with a passivation layer comprises using an adhesive to form a first adhesive layer between the passivation layer and the conductive film.
3. The method as claimed in claim 2, wherein the adhesive forming the first adhesive layer is a heat sensitive adhesive.
4. The method according to claim 2, wherein the adhesive forming the first adhesive layer has a storage modulus of 0.02 MPa or less in the thermoplastic bonding step.
5. The method of claim 1, wherein thermo-bonding the touch sensing layer to the curved surface of the first substrate comprises using an adhesive to form a second adhesive layer between the curved surface of the first substrate and the bottom surface of the second substrate.
6. The method according to claim 5, wherein the adhesive forming the second adhesive layer is a heat sensitive adhesive.
7. The method according to claim 5, wherein the adhesive forming the second adhesive layer has a storage modulus of 0.02 MPa or less in the thermoplastic bonding step.
8. The method according to claim 1, wherein the first substrate is made of glass or plastic composite.
9. The method of claim 1, wherein the second substrate is made of ethylene terephthalate or polycarbonate.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810188251.5A CN108459769B (en) | 2018-03-07 | 2018-03-07 | Manufacturing method of curved surface touch module |
| TW107109312A TWI646454B (en) | 2018-03-07 | 2018-03-19 | Manufacturing method of curved touch module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810188251.5A CN108459769B (en) | 2018-03-07 | 2018-03-07 | Manufacturing method of curved surface touch module |
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| Publication Number | Publication Date |
|---|---|
| CN108459769A CN108459769A (en) | 2018-08-28 |
| CN108459769B true CN108459769B (en) | 2021-01-29 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201810188251.5A Active CN108459769B (en) | 2018-03-07 | 2018-03-07 | Manufacturing method of curved surface touch module |
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| CN (1) | CN108459769B (en) |
| TW (1) | TWI646454B (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114023781B (en) * | 2021-10-08 | 2023-06-16 | 业成科技（成都）有限公司 | Curved surface electronic device and manufacturing method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104346017A (en) * | 2013-08-09 | 2015-02-11 | 天津富纳源创科技有限公司 | Preparation method of curved surface touch module |
| CN104345952A (en) * | 2013-08-09 | 2015-02-11 | 天津富纳源创科技有限公司 | Preparation method of curved surface touch module |
| KR101697016B1 (en) * | 2015-08-21 | 2017-01-16 | 김영수 | Apparatus of manufacturing protecting sheet for touch screen panel and method of manufacturing the sheet |
| CN106738837A (en) * | 2016-11-18 | 2017-05-31 | 深圳市承熹机电设备有限公司 | Application of a surface mould and its applying method |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI419022B (en) * | 2010-03-16 | 2013-12-11 | Wintek Corp | Touch panel and the manufacturing method thereof |
| TWM458607U (en) * | 2012-12-10 | 2013-08-01 | Teco Nanotech Co Ltd | Touch member |
| CN203465695U (en) * | 2013-09-27 | 2014-03-05 | 南昌欧菲光科技有限公司 | Touch panel and touch assembly |
| CN105093615B (en) * | 2015-07-29 | 2018-01-26 | 合肥鑫晟光电科技有限公司 | Curved face display panel and preparation method thereof, display device |
-
2018
- 2018-03-07 CN CN201810188251.5A patent/CN108459769B/en active Active
- 2018-03-19 TW TW107109312A patent/TWI646454B/en active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104346017A (en) * | 2013-08-09 | 2015-02-11 | 天津富纳源创科技有限公司 | Preparation method of curved surface touch module |
| CN104345952A (en) * | 2013-08-09 | 2015-02-11 | 天津富纳源创科技有限公司 | Preparation method of curved surface touch module |
| KR101697016B1 (en) * | 2015-08-21 | 2017-01-16 | 김영수 | Apparatus of manufacturing protecting sheet for touch screen panel and method of manufacturing the sheet |
| CN106738837A (en) * | 2016-11-18 | 2017-05-31 | 深圳市承熹机电设备有限公司 | Application of a surface mould and its applying method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108459769A (en) | 2018-08-28 |
| TW201939238A (en) | 2019-10-01 |
| TWI646454B (en) | 2019-01-01 |
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