CN108453913A - Diamond wire cutting machine alignment device and application method - Google Patents
Diamond wire cutting machine alignment device and application method Download PDFInfo
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- CN108453913A CN108453913A CN201810523052.5A CN201810523052A CN108453913A CN 108453913 A CN108453913 A CN 108453913A CN 201810523052 A CN201810523052 A CN 201810523052A CN 108453913 A CN108453913 A CN 108453913A
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- silicon rod
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- 238000005520 cutting process Methods 0.000 title claims abstract description 89
- 229910003460 diamond Inorganic materials 0.000 title claims abstract description 65
- 239000010432 diamond Substances 0.000 title claims abstract description 65
- 238000000034 method Methods 0.000 title claims abstract description 11
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 89
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 89
- 239000010703 silicon Substances 0.000 claims abstract description 89
- 238000006073 displacement reaction Methods 0.000 claims abstract description 41
- 230000007246 mechanism Effects 0.000 claims description 29
- 230000033001 locomotion Effects 0.000 claims description 8
- 230000008569 process Effects 0.000 abstract description 5
- 230000000694 effects Effects 0.000 description 6
- 230000008901 benefit Effects 0.000 description 3
- 238000001514 detection method Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0064—Devices for the automatic drive or the program control of the machines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
The present invention relates to silicon chip process technology field, a kind of diamond wire cutting machine alignment device and application method are disclosed.The diamond wire cutting machine alignment device includes frame body, can control host along the infrared projector that silicon rod arragement direction moves, the linear displacement transducer moved synchronously with infrared projector, the manual operation end for transmitting a signal to linear displacement transducer, the signal output end connection diamond wire cutting machine of the linear displacement transducer set on the silicon rod mounting table of frame body lower part, set on frame body top.When the infrared ray that infrared projector is sent out is overlapped with the scribing line for needing to block on silicon ingot, controller measures scribing line position by linear displacement transducer, controls corresponding diamond wire cutting head and silicon rod scribe-lane alignment, and cut.The diamond wire cutting machine alignment device high degree of automation of the present invention, it is high to line precision, reduce operation labor intensity.
Description
Technical field
The present invention relates to silicon chip process technology fields, more particularly to a kind of diamond wire cutting machine alignment device and user
Method.
Background technology
Before manufacturing silicon chip, since both ends (the head, tailing) impurity content for being processed silicon rod is more, silicon chip manufacture cannot be met
Demand be typically employed on silicon rod and cross at present, then diamond wire cutting machine is mostly so must first carry out blocking processing
By silicon rod lifting or after steel wire is elevated to certain position, by visually check the setting-out part of silicon rod and steel wire it is whether vertical come into
Row is to line, hence it is evident that there are precision problems, and when causing to block and setting-out deviation is larger, and the degree of automation is low, time-consuming and laborious, processing effect
Rate is low.
Invention content
It is higher, automatic the technical problem to be solved by the present invention is in view of the above shortcomings of the prior art, provide a kind of precision
The higher and efficient diamond wire cutting machine alignment device of change degree.
In order to solve the above technical problems, the technical solution used in the present invention provides a kind of diamond wire cutting machine to traditional thread binding
Set, including frame body, set on frame body lower part silicon rod mounting table, can be along silicon rod arragement direction set on frame body top
Mobile infrared projector, the linear displacement transducer moved synchronously with infrared projector, for transmitting a signal to straight-line displacement
The signal output end connection diamond wire cutting machine at the manual operation end of sensor, the linear displacement transducer controls host.
Further, the linear displacement transducer is grating scale, and the grating scale includes scale grating and grid reading head.
Further, sliding rail is provided with below the silicon rod mounting table, the silicon rod mounting table is by means of sliding rail described in
Sliding rail length direction moves, and the sliding rail length direction is vertical with the infrared projector moving direction.
Further, driving silicon rod mounting table is provided on the silicon rod mounting table to move before and after the sliding rail length direction
Dynamic structure.
Further, the infrared projector is moved by means of driving mechanism.
Further, the driving mechanism includes micromotor and leadscrew-nut mechanism.
Further, the driving mechanism includes micromotor and rack and pinion mechanism.
Further, the infrared projector connects driving mechanism by linear displacement transducer.
Further, the driving mechanism is connected on the crossbeam on frame body top, and the frame body further includes water
The vertical beam of flat underside and both sides, both ends and the vertical beam of the crossbeam are slidably connected and position-limit mechanism, the silicon rod mounting table are arranged
On horizonal base plate.
The application process of the diamond wire cutting machine alignment device, includes the following steps：
1) cutting silicon rod quantity as needed, is arranged the cutting head number of respective links quantity；
2) the first cutting head and infrared projector position are adjusted, the infrared ray for making infrared projector send out and the first silicon rod are drawn
Line overlaps, and determines point on the basis of the position；
3) start driving device driving infrared projector slowly to move, searching is crossed in addition to the first silicon rod on other silicon rods
Position；
4) when detecting infrared line projection and scribing line overlapping on silicon rod, manual operation end sends a signal to straight-line displacement biography
Location information at this time is sent to diamond wire cutting machine again and controls host by sensor, linear displacement transducer；
5) infrared projector continues slowly mobile, by linear displacement transducer and manual operation end, will detect successively
All silicon rods on scribing position be sent to diamond wire cutting machine control host；
6) the corresponding diamond wire cutting head of the control host computer control of diamond wire cutting machine and corresponding silicon rod scribe-lane alignment；
7) corresponding diamond wire cutting head is controlled to be cut.
It is using advantageous effect caused by above-mentioned technical proposal：1, diamond wire cutting machine alignment device and gold are realized
The coordinated signals of rigid line shear, cutting process are improved work efficiency without secondary to line；2, it is automatically right to realize infrared ray
Line can be achieved at the same time working line for multiple silicon rod scribing line, and be cut, and further increases working efficiency, saves manpower
Material resources；3, realize that machine is more accurate to line, accuracy height avoids the waste of silicon rod.
Description of the drawings
Fig. 1 is the structural schematic diagram of diamond wire cutting machine alignment device provided in an embodiment of the present invention；
Fig. 2 is the structural schematic diagram for the diamond wire cutting machine alignment device that further embodiment of this invention provides；
Wherein：1, frame body, 11, horizonal base plate, 12, crossbeam, 121, sliding block,
13, vertical beam,
2, grating scale, 21, scale grating, 22, grating reading head
3, infrared projector, 31, micromotor, 32, leadscrew-nut mechanism, 321, leading screw,
322, nut, 33, bearing block, 34, gear ＆ rack structure, 341, pinion gear, 342, rack, 343, gear-box
4, silicon rod, 5, silicon rod mounting table, 51, cylinder, 52, sliding rail.
Specific implementation mode
In order to make technical problems, technical solutions and advantages to be solved be more clearly understood, tie below
Accompanying drawings and embodiments are closed, the present invention will be described in further detail.It should be appreciated that specific embodiment described herein is only
To explain the present invention, it is not intended to limit the present invention.
In the description of the present invention, term " longitudinal direction ", " transverse direction ", "upper", "lower", "front", "rear", "left", "right", " perpendicular
Directly ", the orientation or positional relationship of the instructions such as "horizontal", "top", "bottom" is to be based on the orientation or positional relationship shown in the drawings, and is only
For ease of description the present invention rather than require the present invention must be with specific azimuth configuration and operation, therefore should not be understood as pair
The limitation of the present invention.
It should be noted that term " first ", " second " are used for description purposes only, it is not understood to indicate or imply phase
To importance or implicitly indicate the quantity of indicated technical characteristic.Define " first " as a result, the feature of " second " can be with
Express or implicitly include one or more this feature.Further, in the description of the present invention, unless otherwise saying
Bright, the meaning of " plurality " is two or more.
Also referring to Fig. 1 and Fig. 2, now to diamond wire cutting machine alignment device provided by the invention and its application process into
Row explanation.An embodiment of the present invention provides a kind of diamond wire cutting machine alignment device, including frame body 1, it is set to frame body 1
The silicon rod mounting table 5 of lower part, can be along the infrared projector 3 that silicon rod arragement direction moves, with infrared throwing set on 1 top of frame body
Linear displacement transducer that shadow instrument 3 moves synchronously, the manual operation end for transmitting a signal to linear displacement transducer, it is described straight
The signal output end connection diamond wire cutting machine of linear movement pick-up controls host.The present embodiment course of work is as follows：Infrared throwing
Shadow instrument 3 can be moved horizontally along silicon rod arragement direction, and send out infrared ray, when infrared ray is overlapped with the scribing line of silicon rod Shangdi, manually
Operating side presses control host Shangdi button and sends out signal to linear displacement transducer, after linear displacement transducer receives signal
It reacts, the displacement information of oneself at this time, which is sent to diamond wire cutting machine, controls host, position at this time under host record
Information, and control corresponding diamond wire cutting head and be moved to corresponding position, prepare cutting.It is infrared as 3 ground of infrared projector moves
Line is successively with scribe-lane alignment on multiple silicon rods, each pair of homogeneous, linear displacement transducer transmission signal, linear displacement transducer work
Go out reaction, diamond wire cutting machine controls corresponding diamond wire cutting head and is moved to and silicon rod scribe-lane alignment position, preparation cutting.
The advantageous effect of the present embodiment is equipped with linear displacement transducer in frame body 1 in this present embodiment, passes through
Scribing position on the silicon rod 4 detected can be sent to diamond wire cutting machine control host, control by linear displacement transducer
Host adjusts the position of diamond wire cutting head according to this location information, and realization is automatically aligned to cutting, without secondary to line, automation
Degree is high, reduces labor intensity, improves to line accuracy.
Linear displacement transducer in the present embodiment can be that grating scale, linear inductosyn or electronic ruler etc. can be with
Object straight-line displacement is measured, and converts the displacement of measurement to the component of electronic signal.
Preferably, as shown in Figure 1, the linear displacement transducer in the present embodiment is preferably grating scale 2, grating scale includes mark
Ruler grating 21 and grid reading head 22.
Since the embodiment of the present invention is mainly with diamond wire cutting machine combination application, higher cutting accuracy is needed, and
The signal of optical grating ruler measurement output is digit pulse, and detection range is big, and accuracy of detection is high, fast response time, therefore uses grating
Ruler can increase the accuracy of detection and response speed of the present embodiment.
As shown in Figure 1,21 level of scale grating of grating scale 2 is fixedly mounted on housiung separator 11 in the present embodiment, light
Grid reading head 22 is connected with infrared projector 3.Grating scale 2 divides for two parts：Scale grating 21 and grating reading head 22, grating are read
It can slide for several 22, infrared projector 3 is mounted on grating reading head 22, such infrared projection in scale grating 21
Instrument 3 can together be slided with grating reading head 22, the infrared ray that 22 positions of grating reading head, that is, infrared projector 3 is sent out
Position, when the infrared ray that infrared projector 3 is sent out is overlapped with the position crossed on silicon rod 4, grating reading head 22 can be by this
When location information be sent to diamond wire cutting machine control host, setting in this way takes full advantage of the self structure of grating scale 2, simple
The overall structure for having changed the present invention, makes infrared projector position is identical with grating scale position to write with being conducive to program.
Preferably, as shown in Figure 1 or 2,5 lower section of the silicon rod mounting table is provided with sliding rail 52, the silicon rod mounting table 5
It is moved along the sliding rail length direction by means of sliding rail 52, the sliding rail length direction and 3 moving direction of the infrared projector
Vertically.In the present embodiment, after the completion of line, directly workbench can be pushed into diamond wire cutting machine, sliding rail 52 can guarantee silicon rod
Left and right directions position is constant, so that silicon rod scribing line is not had to point-blank, when cutting with diamond wire cutting head always secondary to line,
Improve working efficiency.
It is further preferred that as shown in Figure 1, being provided with driving silicon rod mounting table 5 on the silicon rod mounting table 5 along described
The structure that sliding rail length direction is moved forward and backward.As shown in Figure 1 or 2, the structure of 5 movement of silicon rod mounting table is driven in the present embodiment
Preferably cylinder 51, it is further preferred that cylinder 51 be it is multiple, in the present embodiment be preferably 3,51 output end of the cylinder with
One end of silicon rod mounting table 5 connects, and cylinder 51 is connect by solenoid valve with air pump, and solenoid valve is led with diamond wire cutting machine control
Mechatronics, solenoid valve can receive the signal that control host is sent out, and control air pump realizes that silicon rod is placed to control cylinder moving
The auto-feed of platform, after completing to line, diamond wire cutting machine controls host and sends out feeding signal control cylinder moving to solenoid valve,
Realize the auto-feed of silicon rod mounting table 5.Actuating unit can also be preferably gear ＆ rack structure, feed screw nut in the present embodiment
Structure, cam structure, link mechanism or air cylinder structure.The advantageous effect of the present embodiment is：Increase driving structure, line is completed
After, 5 auto-feed of silicon rod mounting table may be implemented and realize silicon rod cutting, keep the present embodiment more intelligent, to fully achieve
It automatically controls.
Preferably, as shown in Figure 1 or 2, the infrared projector 3 is moved by means of driving mechanism.In addition driving mechanism
Effect be：It can make infrared projector 3, automatically be moved along 11 horizontal direction of crossbeam of frame body 1；In this way, passing through
Driving mechanism is connected with the program of control host, may be implemented to automatically control moving left and right for infrared projector 3, is measured successively more
The position crossed on a silicon rod 4 is carried out at the same time multiple silicon rod scribing line and is aligned with cutting head, then cut, improve and imitated to line
Rate.Driving device can be gear-rack drive, feed screw nut driving, actuated by cams or connecting rod driving in the present embodiment, also may be used
To be directly to use cylinder, hydraulic device driving or linear motor driving etc., as long as the straight line fortune of infrared projector can be realized
It is dynamic.
It is further preferred that as shown in Figure 1, a preferred embodiment as above-described embodiment, the driving mechanism
Including micromotor 31 and leadscrew-nut mechanism 32.The screw-nut structure 32 includes leading screw 321 and nut 322, this implementation
Leading screw 321 is preferably ball-screw in example, and nut 322 is set on leading screw 321, and leading screw is connected with 31 output shaft of micromotor,
When motor shaft rotates, drives leading screw 321 to rotate, nut 322 is made to be moved horizontally on leading screw.Leading screw 321 as shown in Figure 1 passes through
Bearing block 322 is mounted in frame body 1, and bearing is equipped in the bearing block 322, and the micromotor is fixedly mounted on rack
On the crossbeam 11 of framework, as shown in Figure 1, being fixed with the slipper upper surface of linear displacement transducer below nut 322, directly
Infrared ray projecting apparatus 3 is fixed in the lower surface of the slipper of linear movement pick-up, and the projecting direction of infrared ray projecting apparatus 3 is vertical
Downwards i.e. perpendicular to silicon rod mounting table 5.Screw-nut structure reduction ratio is big, stable drive, so using this knot in the present embodiment
Structure, and without installing deceleration mechanism so that the diamond wire cutting machine alignment device in the present embodiment is simple in structure, easy for installation.
As another preferred embodiment of above-mentioned driving structure, as shown in Fig. 2, the driving mechanism includes micro electric
Machine 31 and rack and pinion mechanism 34.As shown in Fig. 2, rack 342 is horizontally fixed in rack, pinion gear 341 passes through gear-box 343
It is connected with micromotor 31, when micromotor 31 starts, pinion gear 341 can drive gear-box 343 horizontal on rack 342
Mobile, 343 bottom surface of gear-box as shown in Figure 2 is connected with top surface on linear displacement transducer, linear displacement transducer bottom surface
Infrared projector 3 is connected, the projecting direction of infrared projector 3 straight down, will be micro- by gear ＆ rack structure in the present embodiment
Type motor 31 choose to install conversion of motion be pinion gear 341 along rack 342 linear motion, may be implemented infrared projector
The movement of horizontal direction, and then complete automatically to line.
Preferably, as shown in Figure 1 or 2, another preferred embodiment as the present invention, the driving mechanism are connected to machine
On the crossbeam 12 on 1 top of frame framework, the frame body 1 further includes horizonal base plate 11 and the vertical beam 13 of both sides, the crossbeam 12
Both ends and vertical beam 13 be slidably connected and position-limit mechanism be set, the silicon rod mounting table 5 is on horizonal base plate 11.Such as Fig. 1 institutes
Show, in the present embodiment, the crossbeam 12 of frame body is slidably connected by sliding block 121 and vertical beam 12, the position-limit mechanism be set on
The holding screw of sliding block side after regulating crossbeam position, is locked the position of crossbeam 12 and vertical beam 13 by holding screw, institute
Silicon rod mounting table 5 is stated to be slidably connected along sliding rail front-rear direction with horizonal base plate 11 by sliding rail 52.
The advantageous effect of the present embodiment is：It is slided up and down and is connect with vertical beam 12 by crossbeam 11, infrared throwing can be adjusted
The vertical distance of shadow instrument and silicon rod, in this way can be according to the diameter adjustment infrared projector of silicon rod at a distance from silicon rod so that
The application range of the present invention is more extensive, improves the adaptability of the present invention.
The application process of the diamond wire cutting machine alignment device, includes the following steps：
1) cutting silicon rod quantity as needed, is arranged the cutting head number of respective links quantity；
2) the first cutting head and infrared projector position are adjusted, the infrared ray for making infrared projector send out and the first silicon rod are drawn
Line overlaps, and determines point on the basis of the position；
3) start driving device driving infrared projector slowly to move, searching is crossed in addition to the first silicon rod on other silicon rods
Position；
4) when detecting infrared line projection and scribing line overlapping on silicon rod, manual operation end sends a signal to straight-line displacement biography
Location information at this time is sent to diamond wire cutting machine again and controls host by sensor, linear displacement transducer；
5) infrared projector continues slowly mobile, by linear displacement transducer and manual operation end, will detect successively
All silicon rods on scribing position be sent to diamond wire cutting machine control host；
6) the corresponding diamond wire cutting head of the control host computer control of diamond wire cutting machine and corresponding silicon rod scribe-lane alignment；
7) corresponding diamond wire cutting head is controlled to be cut.
It is mentioned in above application method, the first cutting head refers to close to micromotor 321 one end and first silicon rod 4
It crosses corresponding cutting head, since the diamond wire cutting machine alignment device in the present invention can disposably realize pair of multiple silicon rods
Line, and diamond wire cutting machine host can control corresponding cutting head and be cut, therefore as shown in Figure 1 or 2, on workbench 5
Silicon rod 4, be from left to right followed successively by the first silicon rod, the second silicon rod, third silicon rod ..., corresponding cutting head is first to cut
Cut head, the second cutting head, third cutting head ....
The course of work of the diamond wire cutting machine alignment device is：After determining datum mark as stated above, straight-line displacement passes
Reference point location information is sent to diamond wire cutting machine control host (hereinafter referred to as host) by sensor, and host is to driving device
Micromotor 31 sends out instruction, and infrared projector 3 starts to move, when on the infrared ray and the second silicon rod 4 that infrared projector 3 is sent out
When scribing line overlaps, manual operation end sends out signal to linear displacement transducer, and linear displacement transducer is made instead after receiving signal
It answers, location information at this time is sent to host, so recycle, detected successively on all silicon rods 4 after scribing position, host control
Scribe-lane alignment in the movement of corresponding diamond wire cutting head and silicon rod of each silicon rod is made, then host sends out order-driven to air pump
Cylinder 51 moves, and workbench 5 is shifted onto at diamond wire cutting head, host computer control cutting head is cut.
Aforementioned is to example embodiment for example, and being not necessarily to be construed as the limitation to example embodiment.Although
Some example embodiments have been described, but those skilled in the art will be readily understood that, not depart from this substantially
In the case of the novel teachings and advantage of disclosure of the invention, many modifications in example embodiment are possible.Therefore, it is all this
A little modifications are intended to be included within the scope of the present disclosure as defined by the appended claims.It will be appreciated, therefore, that aforementioned be
To various example embodiments for example, and should not be construed as limited to disclosed specific example embodiment, and
The modification intention of disclosed example embodiment and other example embodiments is included within the scope of the claims.
Claims (10)
1. a kind of diamond wire cutting machine alignment device, it is characterised in that：Silicon rod including frame body, set on frame body lower part
Mounting table can be moved synchronously set on frame body top along the infrared projector that silicon rod arragement direction moves, with infrared projector
Linear displacement transducer, the manual operation end for transmitting a signal to linear displacement transducer, the linear displacement transducer
Signal output end connection diamond wire cutting machine control host.
2. diamond wire cutting machine alignment device according to claim 1, it is characterised in that：The linear displacement transducer is
Grating scale, the grating scale include scale grating and grating reading head.
3. diamond wire cutting machine alignment device according to claim 1, it is characterised in that：It is set below the silicon rod mounting table
It is equipped with sliding rail, the silicon rod mounting table is moved by means of sliding rail along the sliding rail length direction, the sliding rail and the infrared throwing
Shadow instrument moving direction is vertical.
4. diamond wire cutting machine alignment device according to claim 3, it is characterised in that：It is arranged on the silicon rod mounting table
There is the actuating unit that driving silicon rod mounting table is moved forward and backward along the sliding rail.
5. diamond wire cutting machine alignment device according to claim 1, it is characterised in that：The infrared projector by means of
Driving mechanism moves.
6. diamond wire cutting machine alignment device according to claim 5, it is characterised in that：The driving mechanism includes miniature
Motor and leadscrew-nut mechanism.
7. diamond wire cutting machine alignment device according to claim 5, it is characterised in that：The driving mechanism includes miniature
Motor and rack and pinion mechanism.
8. diamond wire cutting machine alignment device according to claim 5, it is characterised in that：The infrared projector passes through straight
Linear movement pick-up connects driving mechanism.
9. diamond wire cutting machine alignment device according to claim 5, it is characterised in that：The driving mechanism is connected to machine
On the crossbeam on frame framework top, the frame body further includes horizonal base plate and the vertical beam of both sides, the both ends of the crossbeam with it is perpendicular
Beam is slidably connected and position-limit mechanism is arranged, and the silicon rod mounting table is set on horizonal base plate.
10. the application method of the diamond wire cutting machine alignment device according to claim 5-9 any claims, feature
It is：Include the following steps：
1) cutting silicon rod quantity as needed, is arranged the cutting head number of respective links quantity；
2) the first cutting head and infrared projector position, the infrared ray for making infrared projector send out and the first silicon rod scribing line weight are adjusted
It closes, determines point on the basis of the position；
3) start driving device driving infrared projector slowly to move, find position of crossing on other silicon rods in addition to the first silicon rod
It sets；
4) when detecting infrared line projection and scribing line overlapping on silicon rod, manual operation end sends a signal to straight-line displacement sensing
Location information at this time is sent to diamond wire cutting machine again and controls host by device, linear displacement transducer；
5) infrared projector continues slowly mobile, by linear displacement transducer and manual operation end, the institute that will detect successively
There is the scribing position on silicon rod to be sent to diamond wire cutting machine control host；
6) the corresponding diamond wire cutting head of the control host computer control of diamond wire cutting machine and corresponding silicon rod scribe-lane alignment；
7) corresponding diamond wire cutting head is controlled to be cut.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810523052.5A CN108453913A (en) | 2018-05-28 | 2018-05-28 | Diamond wire cutting machine alignment device and application method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810523052.5A CN108453913A (en) | 2018-05-28 | 2018-05-28 | Diamond wire cutting machine alignment device and application method |
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| CN108453913A true CN108453913A (en) | 2018-08-28 |
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| CN208305433U (en) * | 2018-05-28 | 2019-01-01 | 邢台晶龙电子材料有限公司 | Diamond wire cutting machine alignment device |
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2018
- 2018-05-28 CN CN201810523052.5A patent/CN108453913A/en active Pending
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|---|---|---|---|---|
| US20130276610A1 (en) * | 2011-01-07 | 2013-10-24 | Bando Kiko Co., Ltd. | Method and apparatus for scribing silicon carbide plate |
| CN103273382A (en) * | 2013-05-30 | 2013-09-04 | 中国科学院长春光学精密机械与物理研究所 | Reading device of grating ruler |
| CN204347441U (en) * | 2015-01-13 | 2015-05-20 | 苏州微影光电科技有限公司 | Write-through lithographic equipment |
| CN106985298A (en) * | 2017-05-31 | 2017-07-28 | 镇江环太硅科技有限公司 | A kind of diamond wire cutting machine alignment device and its application process |
| CN208305433U (en) * | 2018-05-28 | 2019-01-01 | 邢台晶龙电子材料有限公司 | Diamond wire cutting machine alignment device |
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Effective date of registration: 20221109 Address after: No. 1688, Chang'an Road, Xingtai Economic Development Zone, Hebei 054001 Applicant after: JA (XINGTAI) SOLAR Co.,Ltd. Address before: 054001 Xingda Street, Nanyuan District, Xingtai Development Zone, Hebei Applicant before: XINGTAI JINGLONG ELECTRONIC MATERIAL Co.,Ltd. |
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Application publication date: 20180828 |