CN108453330B - Substrate for brazing and preparation method thereof and brazing method - Google Patents
Substrate for brazing and preparation method thereof and brazing method Download PDFInfo
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- CN108453330B CN108453330B CN201710086733.5A CN201710086733A CN108453330B CN 108453330 B CN108453330 B CN 108453330B CN 201710086733 A CN201710086733 A CN 201710086733A CN 108453330 B CN108453330 B CN 108453330B
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- GZCWPZJOEIAXRU-UHFFFAOYSA-N tin zinc Chemical compound [Zn].[Sn] GZCWPZJOEIAXRU-UHFFFAOYSA-N 0.000 claims description 3
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Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The present disclosure relates to a substrate for soldering, which includes a substrate body (1), a groove (2) formed on at least a portion of a surface of the substrate body (1), and a nanoparticle layer (4) deposited on a surface area of the substrate body (1) where the groove (2) is formed, a method of manufacturing the same, and a method of soldering. The present disclosure can improve wetting performance and wetting speed of a substrate surface for soldering by depositing a nanoparticle layer on a substrate body surface having a groove on a micrometer level on the surface. When the substrate for brazing disclosed by the invention is used for brazing, the strength and reliability of a brazed joint can be improved.
Description
Technical Field
The disclosure relates to the technical field of semiconductors, in particular to a substrate for brazing and a preparation method thereof as well as a brazing method.
Background
The brazing technology is one of the main means for connecting dissimilar materials, and is widely applied to the fields of aerospace, war industry, vacuum equipment and the like. Among them, the wettability and spreadability of the solder to the materials to be joined are the most important characteristics that determine the quality and applicability of soldering. The document "D.Q Yu, J ZHao, L Wang.improvement on the microstructural, mechanical and wetting properties of Sn-Ag-Cu lead-free adhesives with the addition of rare earth elements [ J ]. Journal of alloys and compounds,2004,376(1): 170-175" discloses a method for adding rare earth elements to a brazing filler metal, which can solve the problem of wetting of the brazing filler metal on a substrate to a certain extent. However, the method is suitable for a limited variety of brazing filler metals, and intermetallic compounds are generated during the brazing process, which affects the brazing quality.
Therefore, it is one of the main directions of research to improve the wettability and spreadability of the solder by changing the surface structure of the substrate while keeping the elemental composition of the solder unchanged.
Disclosure of Invention
The purpose of the present disclosure is: the substrate for brazing provided by the present disclosure and the substrate for brazing prepared by the method of the present disclosure have high wettability and wetting speed.
To achieve the above object, a first aspect of the present disclosure: a substrate for brazing is provided comprising a substrate body, a groove formed in at least a portion of a surface of the substrate body, and a nanoparticle layer deposited on a grooved surface region of the substrate body.
Optionally, the maximum depth of the groove is 5-200 microns, and the maximum width is 10-200 microns.
Optionally, the length of the groove is greater than 1 mm.
Optionally, the profile of the groove is at least one selected from the group consisting of an arc, a "", "V" and "U" shape in a direction perpendicular to the length of the groove.
Alternatively, the grooves may be formed in a plurality of strips parallel to each other and/or crossing each other along the length direction of the grooves.
Optionally, the included angle of the mutually crossed grooves is 60-90 degrees, and the deepest distance between two adjacent parallel grooves is 10-500 micrometers.
Optionally, the nanoparticle layer has a thickness of 0.1 to 5 microns, a porosity of 5 to 90% by volume, and the nanoparticles in the nanoparticle layer have a diameter of less than 1000 nm.
Optionally, the material of the substrate body and the material of the nanoparticles are each independently a metal material, a semiconductor material, a ceramic material, or a ceramic matrix composite.
In a second aspect of the present disclosure: there is provided a method for producing a substrate for brazing, the method comprising: forming a groove on at least a portion of a surface of a substrate body, the groove having a maximum depth and a maximum width of less than 1000 microns; and depositing a nano-particle layer on the surface area of the substrate body, in which the groove is formed, to obtain the substrate for soldering.
Optionally, the maximum depth of the groove is 5-200 microns, and the maximum width is 10-200 microns.
Optionally, the length of the groove is greater than 1 mm.
Optionally, the profile of the groove in a direction perpendicular to the length of the groove is at least one selected from the group consisting of an arc, a "", "V" and "U" shape.
Optionally, the grooves are formed in a plurality of strips parallel to each other and/or intersecting each other along the length of the grooves.
Optionally, the included angle of the mutually crossed grooves is 60-90 degrees, and the deepest distance between two adjacent parallel grooves is 10-500 micrometers.
Optionally, the nanoparticle layer has a thickness of 0.1 to 5 microns, a porosity of 5 to 90% by volume, and the nanoparticles in the nanoparticle layer have a diameter of less than 1000 nm.
Optionally, the groove is formed on the surface of the substrate body by at least one mode selected from mechanical processing, laser processing, electrolysis, chemical etching, photoetching, imprinting and 3D printing; wherein the surface roughness of the substrate body is less than 5 microns.
Optionally, the method further includes: cleaning impurities after the groove is formed on the surface of the substrate body; wherein the impurities comprise particulate matter.
Optionally, the nanoparticle layer is deposited by at least one selected from laser deposition, magnetron sputtering, spin coating, physical vapor deposition, and chemical vapor deposition.
Optionally, the material of the substrate body and the material of the nanoparticles are each independently a metal material, a semiconductor material, a ceramic material, or a ceramic matrix composite.
A third aspect of the disclosure: there is provided a method of brazing a substrate for brazing provided in a first aspect of the present disclosure, the method including: applying a brazing filler metal to a surface area of the substrate for brazing on which the nanoparticle layer is deposited and brazing.
Optionally, the brazing conditions include: the brazing temperature is 150-450 ℃, and the brazing filler metal is at least one selected from tin-lead alloy, tin-zinc alloy, lead-bismuth alloy, cadmium-zinc alloy, tin-silver alloy, tin-copper alloy, tin-lead-silver alloy, tin-lead-bismuth alloy, tin-lead-copper alloy and zinc-aluminum-copper alloy; or the brazing temperature is 650-1150 ℃, and the brazing filler metal is at least one selected from copper-silver alloy, copper-silver-titanium alloy, copper-indium-titanium alloy, gold-silver-copper alloy and nickel-bismuth-boron alloy.
The present disclosure can improve wetting performance and wetting speed of a substrate surface for soldering by depositing a nanoparticle layer on a surface region of a substrate body having a groove on a micrometer level on the surface. When the substrate for brazing disclosed by the invention is used for brazing, the strength and reliability of a brazed joint can be improved.
Additional features and advantages of the disclosure will be set forth in the detailed description which follows.
Drawings
The accompanying drawings, which are included to provide a further understanding of the disclosure and are incorporated in and constitute a part of this specification, illustrate embodiments of the disclosure and together with the description serve to explain the disclosure without limiting the disclosure. The drawings are only schematic and do not limit the actual size of the structures and the relationship between the structures. In the drawings:
fig. 1 is a schematic structural diagram of one embodiment of a surface groove of a substrate body according to the present disclosure.
Fig. 2 is a schematic structural diagram of another embodiment of a surface groove of a substrate body according to the present disclosure.
Fig. 3 is a schematic flow chart of one embodiment of the step of cleaning impurities in the method for manufacturing a substrate for soldering according to the present disclosure.
FIG. 4 is a partial schematic structural view of one embodiment of a substrate for brazing according to the present disclosure.
FIG. 5 is a graph of the particle size distribution of nanoparticles in a nanoparticle layer of the present disclosure (particle diameter on the abscissa, in nm; and the ordinate, in percent of the number of nanoparticles (%)).
FIG. 6 is a partial schematic structural view of another embodiment of a substrate for brazing according to the present disclosure.
Description of the reference numerals
1 substrate body 2 groove 3 dilute acid
4 nanoparticle layer 5 nanoparticles
Detailed Description
The following detailed description of specific embodiments of the present disclosure is provided in connection with the accompanying drawings. It should be understood that the detailed description and specific examples, while indicating the present disclosure, are given by way of illustration and explanation only, not limitation.
Unless otherwise stated, the length of the groove and the width of the groove in the present disclosure both refer to the distance that the groove extends along the direction parallel to the surface of the substrate body, and the direction that the width of the groove extends is perpendicular to the direction that the length of the groove extends, and the length of the groove is greater than the width of the groove. The depth of the groove refers to the distance that the groove extends perpendicular to the substrate surface into the substrate body.
As shown in fig. 4 and 6, the first aspect of the present disclosure: a substrate for soldering is provided, which includes a substrate body 1, a groove 2 formed on at least a portion of a surface of the substrate body 1, and a nanoparticle layer 4 deposited on a surface area of the substrate body 1 where the groove 2 is formed.
According to the first aspect of the disclosure, the nanoparticle layer is deposited on the surface of the substrate body with the groove on the surface, a large number of micron and nanometer level gaps and channels can be formed on the surface of the substrate for brazing, the capillary force of the gaps and the channels on the liquid can effectively increase the driving force required by the liquid wetting process, and the wetting performance (the contact angle of the liquid is reduced, the contact area of the liquid and the substrate is increased) and the wetting speed of the liquid on the surface of the substrate can be improved.
According to the first aspect of the present disclosure, the grooves refer to elongated recesses formed on the surface of the substrate body, and may be arranged periodically or non-periodically, and the specific shape may be as shown in fig. 1 and fig. 2. As shown in fig. 1, the maximum depth (h) of the grooves is preferably 5 to 200 micrometers, and the maximum width (w) is preferably 10 to 200 micrometers. By arranging the groove, the liquid attached to the surface of the substrate for brazing can be spread in three dimensions along the length direction, the width direction and the depth direction of the groove, the spreading driving force of the liquid on the surface of the substrate for brazing is increased, and the wetting property and the spreading speed of the substrate are improved.
According to the first aspect of the present disclosure, as shown in fig. 1, 2, 4 and 6, the profile of the groove may be at least one selected from an arc shape, a "V" shape and a "U" shape, and may be a wave shape or a random shape in a direction perpendicular to the length of the groove. The arc shown is preferably greater than 10 ° and less than 90 °, more preferably greater than 50 ° and less than 90 °. The profile of the groove is in a shape of 'V' and a shape of 'U', which can improve the speed of spreading liquid along the depth (h) direction of the groove, increase the capillary force of a micro channel, but reduce the deposited nano particles on the side wall of the groove, reduce the thickness of a nano particle layer, reduce the gaps and channels of nano level, and reduce the capillary force of the nano gaps and channels, therefore, the groove with the profile of 'V' and arc, more preferably 'V' is preferably adopted in the disclosure.
According to the first aspect of the present disclosure, the length of the groove is not particularly limited, and according to different manufacturing processes, for example, the groove may penetrate through the whole substrate body, or may be larger than 1 mm. For example, as shown in fig. 2, the grooves may be formed as a plurality of strips parallel to each other and/or intersecting with each other, preferably intersecting with each other, along the length direction of the grooves, so as to facilitate spreading of the liquid between the intersecting grooves and increase the spreading speed, and more preferably intersecting with each other and parallel with each other, for example, formed in a grid shape, so as to facilitate spreading of the liquid, molding of the grooves, and neatly and easily mass-producing the substrate body. It is further preferred that the intersecting grooves have an angle of 60-90 deg., such as 60 deg. or 90 deg., so that the grooves can exactly equally divide the surface of the substrate body, such as forming a regular triangular, square or hexagonal pattern between the grooves. In addition, as shown in fig. 1, the distance (d) between the deepest parts of two adjacent parallel grooves can be 10-500 micrometers, and if the contour of the groove perpendicular to the length direction is in a shape of "" or wave or irregular, the distance (d) is the distance between the middle parts of the bottoms of the adjacent grooves, so that the same drop of liquid (with the diameter of about 3600 micrometers) can span a plurality of grooves, the spreading speed of the drop is increased, and the strength and the reliability of a soldered joint are improved.
According to a first aspect of the present disclosure, the nanoparticle layer is a layer formed by depositing nanoparticles, the nanoparticles are particles having a particle diameter of 1000 nm or less, and the properties of the formed nanoparticle layer are different depending on the deposition method. As shown in fig. 4 and 6, the nanoparticle layer may have a thickness of 0.1 to 5 μm, a porosity of 5 to 90% by volume, and the diameter of the nanoparticles in the nanoparticle layer is preferably less than 500 nm. The larger the diameter of the nanoparticles is, the larger the porosity is, the larger the gap formed between the nanoparticles is, the smaller the liquid diffusion resistance is, the more favorable the liquid diffusion is, but the surface area of the nanoparticles is reduced, the capillary force is reduced, and the adhesion force of the nanoparticle layer on the surface of the substrate body is reduced, so that the thickness of the nanoparticle layer is preferably 0.3-2 micrometers, the porosity is 25-55%, the diameter of the nanoparticles is 10-500 nanometers, more preferably, the diameter of the nanoparticles is normally distributed between 10-500 nanometers, and further preferably, more than 80% by volume of the nanoparticles is 10-300 nanometers. The porosity is the percentage of the pore volume in the nanoparticle layer to the total volume of the nanoparticle layer.
According to the first aspect of the present disclosure, the substrate is well known to those skilled in the art, and the present disclosure is not repeated, the material of the substrate body may be a metal material, a semiconductor material, a ceramic material, or a ceramic matrix composite, the material of the nanoparticle may be the same as or different from the material of the substrate or the material of the solder, and those skilled in the art may select the material as needed. The metal material may be at least one selected from aluminum, aluminum alloy, copper, iron, molybdenum and silicon steel, the semiconductor material may be silicon or gallium arsenide, etc., the ceramic material may be at least one selected from aluminum oxide, silicon nitride and aluminum carbide, and the ceramic matrix composite material generally includes a ceramic material and other materials.
In a second aspect of the present disclosure: there is provided a method for producing a substrate for brazing, the method comprising: forming a groove on at least a portion of a surface of a substrate body, the groove having a maximum depth and a maximum width of less than 1000 microns; and depositing a nano-particle layer on the surface area of the substrate body, in which the groove is formed, to obtain the substrate for soldering.
According to the second aspect of the disclosure, the nanoparticle layer is deposited on the surface of the substrate body with the groove on the surface, a large number of micron and nanometer level gaps and channels can be formed on the substrate surface for brazing, the capillary force of the gaps and the channels on the liquid can effectively increase the driving force required by the liquid wetting process, and the wetting performance (the contact angle of the liquid is reduced, the contact area of the liquid and the substrate is increased) and the wetting speed of the liquid on the substrate surface are improved.
According to the second aspect of the present disclosure, the grooves refer to elongated recesses formed on the surface of the substrate body, and may be arranged periodically or non-periodically, and the specific shape may be as shown in fig. 1 and 2. As shown in fig. 1, the maximum depth (h) of the grooves is preferably 5 to 200 micrometers, and the maximum width (w) is preferably 10 to 200 micrometers. By arranging the groove, the liquid attached to the surface of the substrate for brazing can be spread in three dimensions along the length direction, the width direction and the depth direction of the groove, the spreading driving force of the liquid on the surface of the substrate for brazing is increased, and the wetting property and the spreading speed of the substrate are improved.
According to the second aspect of the present disclosure, as shown in fig. 1, 2, 4 and 6, the groove may have a profile in a direction perpendicular to the length of the groove, which is at least one selected from an arc shape, a "V" shape and a "U" shape, and may have a wave shape or a random shape. The arc shown is preferably greater than 10 ° and less than 90 °, more preferably greater than 50 ° and less than 90 °. The profile of the groove is in a shape of 'V' and a shape of 'U', which can improve the speed of spreading liquid along the depth (h) direction of the groove, increase the capillary force of a micro channel, but reduce the deposited nano particles on the side wall of the groove, reduce the thickness of a nano particle layer, reduce the gaps and channels of nano level, and reduce the capillary force of the nano gaps and channels, therefore, the groove with the profile of 'V' and arc, more preferably 'V' is preferably adopted in the disclosure.
According to the second aspect of the present disclosure, the shape of the groove extending along the length direction of the present disclosure may be an arc shape, or may be a straight line shape or a zigzag shape, for example, as shown in fig. 2, along the direction of the length of the groove, the groove may be formed as a plurality of mutually parallel and/or mutually intersecting, preferably mutually intersecting, which facilitates spreading of liquid between intersecting grooves, increases the spreading speed, more preferably mutually intersecting and mutually parallel, for example, is formed as a grid shape, which facilitates spreading of liquid, facilitates molding of the groove, and neatly scribes a substrate body conveniently in batch. It is further preferred that the intersecting grooves have an angle of 60-90 °, such as 60 ° or 90 °, so that the grooves can exactly equally divide the surface of the substrate body, such as a regular triangle, square, or hexagon pattern formed by the intersections between the grooves. In addition, as shown in fig. 1, the distance (d) between the deepest parts of two adjacent parallel grooves can be 10-500 micrometers, and if the contour of the groove perpendicular to the length direction is in a shape of "" or wave or irregular, the distance (d) is the distance between the middle parts of the bottoms of the adjacent grooves, so that the same drop of liquid (with the diameter of about 3600 micrometers) can span a plurality of grooves, the spreading speed of the drop is increased, and the strength and the reliability of a soldered joint are improved.
According to a second aspect of the present disclosure, the nanoparticle layer is a layer formed by depositing nanoparticles, the nanoparticles are particles having a particle diameter of 1000 nm or less, and the properties of the formed nanoparticle layer are different depending on the deposition method. As shown in fig. 4 and 6, the nanoparticle layer may have a thickness of 0.1 to 5 μm, a porosity of 5 to 90% by volume, and the diameter of the nanoparticles in the nanoparticle layer is preferably less than 500 nm. The larger the diameter of the nanoparticles is, the larger the porosity is, the larger the gap formed between the nanoparticles is, the smaller the liquid diffusion resistance is, the more favorable the liquid diffusion is, but the surface area of the nanoparticles is reduced, the capillary force is reduced, and the adhesion force of the nanoparticle layer on the surface of the substrate body is reduced, so that the thickness of the nanoparticle layer is preferably 0.3-2 micrometers, the porosity is 55-90%, the diameter of the nanoparticles is between 10 and 500 nanometers, more preferably, the diameter of the nanoparticles is normally distributed between 10 and 500 nanometers, and further preferably, more than 80% by volume of the nanoparticles is between 10 and 300 nanometers. The porosity is the percentage of the pore volume in the nanoparticle layer to the total volume of the nanoparticle layer.
According to the second aspect of the present disclosure, the groove may be formed on the surface of the substrate body in at least one manner selected from the group consisting of machining, laser machining, electrolysis, chemical etching, photolithography, imprinting, and 3D printing; wherein the surface roughness of the substrate body is less than 5 microns. The length of the groove is not particularly limited in the present disclosure, and according to different preparation processes, for example, the groove may penetrate through the whole substrate body, or may be larger than 1mm, and the whole pattern of the formed groove may be stripe-shaped, grid-shaped, and the like. The surface roughness of the substrate body of the present disclosure was observed with a laser confocal microscope (model Olympus, LEXT OLS4100) and measured by its supporting software.
According to the second aspect of the present disclosure, if the substrate body is machined by machining or laser machining, impurities such as an oxide layer, particles, and stains may adhere to a surface region of the substrate body where the groove is formed, and the impurities may affect deposition of the nanoparticle layer and a subsequent brazing process, and therefore, the method may further include: cleaning impurities after the groove is formed on the surface of the substrate body; wherein, the impurities generally comprise particles, and can also comprise an oxide layer, stains and the like. The step of cleaning the impurities may be brushing with a cotton swab or cloth, purging with a blower, soaking and washing with a dilute acid (e.g., dilute hydrochloric acid, dilute sulfuric acid, etc.), or the like, and those skilled in the art may also perform the treatment according to the actual situation.
According to a second aspect of the present disclosure, depositing the nanoparticle layer is well known to those skilled in the art, for example, the manner of depositing the nanoparticle layer may be at least one selected from laser deposition, magnetron sputtering, spin coating, physical vapor deposition, and chemical vapor deposition.
According to the second aspect of the present disclosure, the substrate body is well known to those skilled in the art, and the present disclosure is not repeated, for example, the material of the substrate body may be a metal material, a semiconductor material, a ceramic material or a ceramic matrix composite material, the material of the nanoparticle may be the same as or different from the material of the substrate or the material of the brazing filler metal, and those skilled in the art may select the material as needed. The metal material may be at least one selected from aluminum, aluminum alloy, copper, iron, molybdenum and silicon steel, the semiconductor material may be silicon or gallium arsenide, etc., the ceramic material may be at least one selected from aluminum oxide, silicon nitride and aluminum carbide, and the ceramic matrix composite material generally includes a ceramic material and other materials.
A third aspect of the disclosure: there is provided a method of brazing a substrate for brazing provided in a first aspect of the present disclosure, the method including: applying a brazing filler metal to a surface area of the substrate for brazing on which the nanoparticle layer is deposited and brazing.
According to a third aspect of the present disclosure, the brazing is a method of using a metal material having a melting point lower than that of the substrate material as a brazing filler metal, heating the weldment and the brazing filler metal to a temperature higher than the melting point of the brazing filler metal and lower than the melting temperature of the substrate material, wetting the substrate with the liquid brazing filler metal, filling the joint gap, and achieving the connection of the weldment by interdiffusion with the substrate. The brazing conditions may include: the brazing temperature is 150-450 ℃, and the brazing filler metal can be at least one selected from tin-lead alloy, tin-zinc alloy, lead-bismuth alloy, cadmium-zinc alloy, tin-silver alloy, tin-copper alloy, tin-lead-silver alloy, tin-lead-bismuth alloy, tin-lead-copper alloy and zinc-aluminum-copper alloy; or the brazing temperature can be 650-1150 ℃, and the brazing filler metal can be at least one selected from copper-silver alloy, copper-silver-titanium alloy, copper-indium-titanium alloy, gold-silver-copper alloy and nickel-bismuth-boron alloy.
The present disclosure will be further explained by way of examples with reference to the accompanying drawings, but the present disclosure is not limited thereto in any way.
The method for testing the particle size of the nanoparticles in the embodiment of the disclosure is to observe the surface morphology of a substrate by adopting a scanning electron microscope (model is Zeiss, Supra 55) and measure and count the particle size of the nanoparticles by ImageJ software; the contact angle measuring method adopts a high-temperature high-vacuum contact angle measuring instrument (the model is Dataphysics, OCA25HTV) to directly measure; the spreading speed test method comprises measuring the flowing distance of the metal material in a certain time by using a microscope (model is Olympus, SZ61), recording the spreading time, and further calculating the spreading speed; the method for testing the porosity of the nanoparticle layer comprises the steps of measuring the surface appearance of a substrate by adopting an atomic force microscope (model is Bruker, SCD005) and calculating the porosity of the nanoparticle layer by using Nanoscope Analysis software; the method for testing the shearing strength of the brazed joint comprises the step of testing the shearing strength of the brazed joint by adopting a heat-force simulation experiment machine (the model is Gleeble 1500D), wherein the shearing rate is fixed to be 1mm/min, and the shearing strength of the joint is obtained.
Example 1
As shown in FIG. 1, periodic grooves 2 were formed on the surface of a polished Cu substrate body (roughness less than 5 μm) by picosecond laser ablation, with a laser second width of 10ps, a pulse energy of 50 μ J and a scanning speed of 1 m/s. The two walls and the lower part of the groove are smoothly transited and narrowed, the cross section outline of the groove is approximately U-shaped, the maximum width (w) of the groove 2 is 40 mu m, the maximum depth (h) of the groove 2 is 40 mu m, and the distance (d) between the adjacent grooves is 60 mu m. As shown in fig. 2, the grooves are arranged crosswise, and the angle between the grooves in the length direction is 90 °.
As shown in fig. 3, the Cu substrate body having the groove formed therein was immersed in a dilute hydrochloric acid solution 3 (concentration: 3.5 wt%) for 60 seconds to remove surface particles and oxides, and was ultrasonically cleaned in an alcohol solution, and the substrate body a was designated.
As shown in fig. 4, a Cu nanoparticle layer 4 with a thickness of 5 μm and a porosity of 50% by volume is deposited on the surface area of the substrate body a on which the groove 2 is processed by an ultrafast laser deposition method, during the deposition process, the laser pulse width is 10ps, the pulse energy is 60 μ J, the target material is 99.99% pure Cu material, the diameter of the nanoparticles 5 is 20nm to 500nm, the distribution is normal distribution as shown in fig. 5, and the average particle size of the nanoparticles is 150nm, thereby obtaining the substrate a for brazing.
The contact angle of the SnPbAg solder (62Sn36Pb2Ag, the same below) on the nanoparticle layer-forming surface of the substrate a for brazing was measured to be 5 °, significantly smaller than its contact angle (20 °) on the polished Cu substrate body, at a temperature of 180 ℃; the spreading speed of the SnPbAg solder on the surface of the substrate A for brazing forming the nano particle layer is measured to be 1.9mm/s, which is significantly larger than the spreading speed (0.6mm/s) on the polished Cu substrate body, and the shear strength of the soldered joint is 60MPa, which is significantly higher than the soldering strength (50MPa) of the polished Cu substrate body.
Example 2
As shown in fig. 6, periodic grooves 2 are formed on the surface of the polished alumina ceramic substrate body by photolithography. The profile of the cross section of the groove is in a shape of Chinese character 'ji', and the grooves are arranged in parallel. The maximum width of the grooves 2 is 200 μm, the maximum depth of the grooves 2 is 200 μm, and the maximum distance between adjacent grooves is 300 μm.
And putting the alumina ceramic substrate body with the groove on the surface into an alcohol solution for ultrasonic cleaning, and removing surface stains, wherein the mark is the substrate body B.
And coating an alumina ceramic nanoparticle layer 4 with the thickness of 0.3 mu m and the porosity of 20 percent by volume on the surface of the substrate body B of the processed groove 2 by using a glue homogenizing method, wherein the diameter of the nanoparticle 5 is 20nm-50nm, and the distribution is normal distribution, so as to obtain the substrate B for brazing.
The contact angle of the silver copper titanium solder (63Ag35Cu2Ti) on the surface of the substrate B for brazing forming the nanoparticle layer was measured to be 2 °, significantly smaller than its contact angle (20 °) on the polished alumina substrate body at a temperature of 950 ℃. The spreading speed of the silver-copper-titanium solder on the surface of the substrate B for brazing forming the nano particle layer is measured to be 67 mu m/s and is obviously greater than the spreading speed (12.5 mu m/s) of the silver-copper-titanium solder on a polished alumina substrate body, and the shear strength of a brazed joint is 66MPa and is obviously higher than the brazing strength (20MPa) of the polished alumina substrate body.
Example 3
Basically the same preparation method as in example 1 was followed, except that the groove was formed in a "V" shape, i.e. both walls of the groove narrowed down at a fixed angle of 70 °, and the other parameters of the prepared substrate for brazing were the same and were designated as substrate C for brazing.
At a temperature of 180 ℃, the contact angle of the SnPbAg solder on the surface of the substrate C for brazing forming the nanoparticle layer was measured to be 3 °, significantly smaller than its contact angle (20 °) on the polished Cu substrate body; the spreading speed of the SnPbAg solder on the surface of the substrate C for brazing forming the nano-particle layer was measured to be 2.9mm/s, which is significantly larger than that (0.8mm/s) of the substrate C for brazing, and the shear strength of the brazed joint was 65 MPa.
Example 4
Substantially the same as the preparation method of example 1 except that the thickness of the nanoparticle layer in the nanoparticle layer deposited on the substrate for brazing was 0.3 μm, the substrate D for brazing was obtained.
At a temperature of 180 ℃, the contact angle of the SnPbAg solder on the surface of the substrate D for brazing forming the nanoparticle layer was measured to be 2 °, significantly smaller than its contact angle (20 °) on the polished Cu substrate body; the spreading speed of the SnPbAg solder on the surface of the substrate D for brazing forming the nanoparticle layer was measured to be 3.5mm/s, which is significantly greater than that of the polished Cu substrate body (0.8mm/s), and the shear strength of the brazed joint was 66 MPa.
Example 5
Substantially the same as the preparation method of example 1 except that the thickness of the nanoparticle layer in the nanoparticle layer deposited on the substrate for brazing was 0.1 μm, the substrate D for brazing was obtained.
At a temperature of 180 ℃, the contact angle of the SnPbAg solder on the surface of the substrate D for brazing forming the nanoparticle layer was measured to be 8 °, significantly smaller than its contact angle (20 °) on the polished Cu substrate body; the spreading speed of the SnPbAg solder on the surface of the substrate D for brazing forming the nanoparticle layer was measured to be 1.6mm/s, which is significantly greater than that of the polished Cu substrate body (0.8mm/s), and the shear strength of the brazed joint was 59 MPa.
Example 6
Substantially the same as the preparation method of example 1 except that the thickness of the nanoparticle layer in the nanoparticle layer deposited on the substrate for brazing was 2 μm, the substrate for brazing E was obtained.
At a temperature of 180 ℃, the contact angle of the SnPbAg solder on the surface of the substrate E for brazing forming the nanoparticle layer was measured to be 3 °, significantly smaller than its contact angle (20 °) on the polished Cu substrate body; the spreading speed of the SnPbAg solder on the surface of the substrate E for brazing forming the nano-particle layer was measured to be 3.2mm/s, which is significantly larger than that of the substrate E for brazing (0.8mm/s), and the shear strength of the brazed joint was 64 MPa.
Comparative example 1
The substrate body A prepared in example 1 was measured at a temperature of 180 ℃ to obtain a contact angle of the SnPbAg solder on the grooved surface of the substrate body A of 10 degrees, the spreading speed of the SnPbAg solder on the surface of the substrate body A of 1.5mm/s and the shear strength of the soldered joint of 58 MPa.
Comparative example 2
A Cu nanoparticle layer having a thickness of 5 μm and a porosity of 50% by volume was deposited on the surface of a polished Cu substrate body (roughness less than 5 μm) by ultrafast laser vacuum deposition according to the method of example 1, the nanoparticles having a diameter of 20nm to 500nm and a distribution of a normal distribution as shown in fig. 5, to obtain a substrate DA for soldering.
At the temperature of 180 ℃, the contact angle of the SnPbAg solder on the surface of the substrate DA for brazing deposited with the nano-particle layer is measured to be 8 degrees, the spreading speed of the SnPbAg solder on the substrate DA for brazing deposited with the nano-particle layer is measured to be 1.2mm/s, and the shear strength of a brazed joint is 52 MPa.
As can be seen from comparison between examples and comparative examples, the substrate provided by the present disclosure has good wetting performance, small contact angle, fast wetting speed, and good strength and reliability of joints formed by brazing. As can be seen from the comparison between example 3 and example 1, the grooves with V-shaped cross-sectional profiles are formed on the surface of the substrate for brazing, which contributes to the improvement of surface wettability and joint strength. From a comparison of examples 4-6 with example 1, it can be seen that the nanoparticle layer has a thickness between 0.3 and 2 microns, and better surface wetting properties and joint strength.
The preferred embodiments of the present disclosure are described in detail with reference to the accompanying drawings, however, the present disclosure is not limited to the specific details of the above embodiments, and various simple modifications may be made to the technical solution of the present disclosure within the technical idea of the present disclosure, and these simple modifications all belong to the protection scope of the present disclosure.
It should be noted that, in the foregoing embodiments, various features described in the above embodiments may be combined in any suitable manner, and in order to avoid unnecessary repetition, various combinations that are possible in the present disclosure are not described again.
In addition, any combination of various embodiments of the present disclosure may be made, and the same should be considered as the disclosure of the present disclosure, as long as it does not depart from the spirit of the present disclosure.
Claims (16)
1. A substrate for brazing, comprising a substrate body (1), a groove (2) formed in at least a part of a surface of the substrate body (1), and a nanoparticle layer (4) deposited on a surface area of the substrate body (1) where the groove (2) is formed; the depth of the groove is 5-200 microns, and the width of the maximum opening of the groove is 10-200 microns; the thickness of the nanoparticle layer is 0.1-5 microns, and the porosity is 5-90%;
the profile of the groove is at least one selected from arc and V shape along the direction vertical to the length direction of the groove; the nanoparticles in the nanoparticle layer have a diameter of less than 1000 nanometers.
2. The substrate for brazing as claimed in claim 1, wherein the length of the groove is greater than 1 mm.
3. The substrate for brazing according to claim 1, wherein the groove is formed in a plurality of parallel to and/or crossing each other in a length direction of the groove.
4. The substrate for brazing according to claim 3, wherein the included angle of the mutually crossing grooves is 60-90 °, and the distance between the deepest points of two adjacent parallel grooves is 10-500 μm.
5. The substrate for brazing according to claim 1, wherein the material of the substrate body and the material of the nanoparticles are each independently a metallic material, a semiconductor material, a ceramic material, or a ceramic matrix composite material.
6. A production method of a substrate for brazing, the production method comprising:
forming a groove on at least one part of the surface of the substrate body, wherein the depth of the groove and the width of the maximum opening of the groove are both less than 1000 microns; and
depositing a nano particle layer on the surface area of the substrate body, wherein the groove is formed, so as to obtain a substrate for brazing;
the profile of the groove in a direction perpendicular to the length of the groove is at least one selected from the group consisting of an arc and a "V"; the thickness of the nanoparticle layer is 0.1-5 microns; the porosity is 5-90%; the nanoparticles in the nanoparticle layer have a diameter of less than 1000 nanometers.
7. The production method according to claim 6, wherein the depth of the groove is 5 to 200 μm, and the width of the groove where the opening is largest is 10 to 200 μm.
8. The method of claim 6, wherein the grooves have a length greater than 1 millimeter.
9. The production method according to claim 6, wherein the grooves are formed in a plurality of strips parallel to and/or intersecting each other in a direction along a length of the grooves.
10. The method of claim 9, wherein the intersecting grooves have an included angle of 60-90 °, and the deepest distance between two adjacent parallel grooves is 10-500 μm.
11. The production method according to claim 6, wherein the groove is formed on the surface of the substrate body by at least one means selected from the group consisting of machining, laser machining, electrolysis, chemical etching, photolithography, imprinting, and 3D printing; wherein the surface roughness of the substrate body is less than 5 microns.
12. The production method according to claim 6 or 11, further comprising: cleaning impurities after the groove is formed on the surface of the substrate body; wherein the impurities comprise particulate matter.
13. The production method according to claim 6, wherein the nanoparticle layer is deposited by at least one selected from the group consisting of laser deposition, magnetron sputtering, spin coating, physical vapor deposition, and chemical vapor deposition.
14. The production method according to claim 6, wherein the material of the substrate body and the material of the nanoparticles are each independently a metallic material, a semiconductor material, a ceramic material, or a ceramic matrix composite material.
15. A method of brazing using the substrate for brazing as claimed in any one of claims 1 to 5, the method comprising: applying a brazing filler metal to a surface area of the substrate for brazing on which the nanoparticle layer is deposited and brazing.
16. The method of brazing according to claim 15, wherein the brazing conditions include:
the brazing temperature is 150-450 ℃, and the brazing filler metal is at least one selected from tin-lead alloy, tin-zinc alloy, lead-bismuth alloy, cadmium-zinc alloy, tin-silver alloy, tin-copper alloy, tin-lead-silver alloy, tin-lead-bismuth alloy, tin-lead-copper alloy and zinc-aluminum-copper alloy; or
The brazing temperature is 650-1150 ℃, and the brazing filler metal is at least one selected from copper-silver alloy, copper-silver-titanium alloy, copper-indium-titanium alloy, gold-silver-copper alloy and nickel-bismuth-boron alloy.
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| CN110576231B (en) * | 2019-08-12 | 2021-08-31 | 湖南浩威特科技发展有限公司 | High-silicon aluminum alloy semi-solid brazing method and high-silicon aluminum alloy brazing joint |
| CN110773859A (en) * | 2019-11-04 | 2020-02-11 | 深圳市汇城精密科技有限公司 | Method for welding metal materials |
| CN112620846A (en) * | 2020-11-19 | 2021-04-09 | 西安热工研究院有限公司 | Method for promoting wettability of brazing filler metal in electronic packaging |
| CN112620856A (en) * | 2020-12-17 | 2021-04-09 | 广东省科学院中乌焊接研究所 | Pretreatment method before dissimilar metal material welding, dissimilar metal material welding product and welding method thereof |
| CN113369619B (en) * | 2021-06-18 | 2023-03-10 | 华中科技大学 | Dissimilar alloy laser welding and brazing method based on pulse laser pretreatment |
| CN114749750B (en) * | 2021-12-31 | 2024-01-30 | 上海工程技术大学 | Forming control method of braze welding joint for 3D printing product |
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