CN108452855A - The processing method of micro-fluidic chip - Google Patents
The processing method of micro-fluidic chip Download PDFInfo
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- CN108452855A CN108452855A CN201810335107.XA CN201810335107A CN108452855A CN 108452855 A CN108452855 A CN 108452855A CN 201810335107 A CN201810335107 A CN 201810335107A CN 108452855 A CN108452855 A CN 108452855A
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- fluidic chip
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L3/00—Containers or dishes for laboratory use, e.g. laboratory glassware; Droppers
- B01L3/50—Containers for the purpose of retaining a material to be analysed, e.g. test tubes
- B01L3/502—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures
- B01L3/5027—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip
- B01L3/502707—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip characterised by the manufacture of the container or its components
Abstract
The present invention provides a kind of processing method of micro-fluidic chip, it prepares high-precision substrate mold first with precision photolithography technique, then, using deep etching process, forms substrate mold.To cover metal layer on substrate mold, using precise electrotyping technique, high-precision metal mold is processed.Then integral type precise injection molding technology is utilized, the microchannel chip consistent with photoetching sealing rubber die concavity and convexity is obtained.The method of the present invention is for the first time by the micro fabrication based on photoetching, etching and electroforming, the Shooting Technique industrially used is combined, the processing that the thermoplastic material micro-fluidic chip of different runner height is carried out using precision die realizes the micro-fluidic chip mass processing of high production capacity and low cost.
Description
Technical field
The present invention relates to micro-fluidic chip fields, more particularly, to a kind of processing method of micro-fluidic chip.
Background technology
Micro-fluidic chip has become important directions and the forward position of present analysis Instrument Development, the hair of microfluidic chip technology
Exhibition, it is backing to need advanced micro-fabrication technology.Micro-fluidic based on silicon, glass is of high cost, and high-precision processes work
Skill is complicated, it is difficult to realize mass production demand.Micro-fluidic based on polymer material is at low cost, is current miniflow
Control the widely used material of technical field chip manufacture.
Currently, the micro-fluidic chip based on dimethyl silicone polymer (PDMS) has been widely studied.Researcher utilizes soft
Photoetching process processes the PDMS micro-fluidic chips for having micron dimension.First, researcher using thick photoresist (such as：SU-8
Thick glue) and conventional lithographic techniques process the mold with micron accuracy, high-aspect-ratio on silicon-based substrate surface.Then, will
PDMS precursors and its cast of crosslinking agent mixed solution are in this die surface.It is handled by elevated cure, mold separation, prepares knot
The elastic PDMS micro-fluidic structures chip of structure complementation.The PDMS micro-fluidic structures chip passes through a step reversible keying with glass substrate
Step ultimately forms the micro-fluidic chip of encapsulation.
It is existing insufficient although PDMS micro-fluidic R＆D costs are low, laboratory processing technology is simple
Including：
(1) PDMS is thermoelastic polymer material, such material is not suitable for technical grade injection molding, packaging technology.Add by hand
The PDMS micro-fluidic chip poor reliability of work；
(2) PDMS micro-fluidic chips batch machining is with high costs.
The characteristic size of micro-fluidic chip is between tens~hundreds of microns, and surface roughness is in nanometer scale.Conventional heat
Molding, Shooting Technique, it is necessary first to prepare metal die, then mass processes the micro-fluidic chip based on thermoplastic material.Often
Mechanical processing, the metal die dimensional accuracy of electrical fire flower process processing are in hundred micron dimensions, and surface roughness is in sub-micron
Magnitude cannot be satisfied strict demand of the microfluidic applications for homogeneity and precision.General disc manufacturing technology, including accurate mould
Tool manufacture and precise injection molding technique, die size precision and surface roughness are in nanometer scale.But compact disc mold precision mould
Has the size of manufacturing process in hundred nanometer scales, much smaller than the size requirement of micro-fluidic chip.Existing chip preparing process distance
Mass generation still has distance, limits extensive use of the micro-fluidic chip in clinical examination field.
Invention content
To solve the above-mentioned problems, the present invention provides a kind of micro-fluidic chip of height dimension between 2-200 microns
Processing method the described method comprises the following steps：Step 1：Using photoetching process, the micro-fluidic chip being drawn on mask is set
Pattern is counted, is transferred in mold base in a manner of patterned；Step 2：Using deep etching process to not being photo-etched in substrate
The part of glue protection performs etching, and forms substrate mold；Step 3：Metal layer is covered on the substrate mold, utilizes accurate electricity
Casting process processes metal die；With step 4：On the metal die, using integral type injection molding technology, injection molding obtains micro-
Fluidic chip.
In one embodiment, when the micro-fluidic chip height dimension is when between 2-50 microns, it is using material
The substrate of silicon, quartz or glass is as the mold base.
In one embodiment, the use of material is surface when the micro-fluidic chip height dimension is more than 50 microns
The substrate of the silicon of deposited metal film, quartz or glass is as the mold base.
In one embodiment, the thickness of the metallic film is 2-10 microns.
In one embodiment, the metallic film material is aluminium.
In one embodiment, it is metallic chromium layer or nickel layer that metal layer is covered on the substrate mold.
In one embodiment, the Metal mould material is nickel.
In one embodiment, metal layer is covered on the substrate mold to realize by being deposited or sputtering mode.
In the present invention, first, high-precision metal mold is prepared using deep etching process, then Shooting Technique is utilized to process
Fluid channel substrate.Basic principle is：First with precision photolithography technique, the micro-fluidic chip design drawing that will be drawn on mask
Case is transferred to mold base (material in a manner of patterned：Silicon, quartz or glass) on, to prepare high-precision substrate mould
Tool.Then, the part for not being photo-etched glue protection in substrate is performed etching using deep etching process, forms substrate mold.
On mold metal layer (material is covered in a manner of being deposited or sputter etc.：Chromium or nickel), utilize precise electrotyping technique (material：Nickel), add
Work goes out high-precision metal mold.Metal die structure and the concavity and convexity of photoresist mould structure are complementary.Then integral type essence is utilized
Close injection molding technology obtains the fluid channel substrate consistent with photoetching sealing rubber die concavity and convexity.This method combines the essence of micro fabrication
True property and Shooting Technique it is bulk：The metal die prepared by micro fabrication, the angle at microstructure side wall inclination angle is controllable,
The angle at usually control microstructure side wall inclination angle is less than 90 degree, convenient for demoulding；Surface smoothness, can be to greatest extent in nanometer scale
Ensure translucency, and avoid non-specific adsorption, microstructure height size is adjustable between 2-200 microns；Meanwhile high-precision metal
The specification of nickel mold meets the requirement of cd injection molding machine so that polymeric micro-fluidic chip can be in conventional optical disc injection molding machine
Upper batch machining.
In short, the present invention discloses a kind of processing method of micro-fluidic chip, this method will be based on photoetching, etching and electricity for the first time
The micro fabrication of casting, and the Shooting Technique industrially used are combined, and the heat of different runner height is carried out using precision die
The processing of moulding material micro-fluidic chip realizes the micro-fluidic chip mass processing of high production capacity and low cost.
Description of the drawings
It in order to more clearly explain the technical solutions in the embodiments of the present application, below will be to needed in the embodiment
Attached drawing is briefly described, it should be apparent that, the accompanying drawings in the following description is only some embodiments described in the application, right
For those of ordinary skill in the art, without creative efforts, it can also be obtained according to these attached drawings
Its attached drawing.
Fig. 1 is the flow process chart of micro-structure of the height dimension of the present invention between 2-50 microns；
Fig. 2 is height dimension of the present invention in the flow process chart more than 50 and less than the micro-structure between 200 microns；
Fig. 3 is the glass mold micro-structure cross-section diagram processed according to the method for the present invention；
Fig. 4 is the micro-fluidic chip metal die schematic diagram processed according to the method for the present invention；With
Fig. 5 is the micro-fluidic chip schematic diagram processed according to the method for the present invention.
Specific implementation mode
In order to make art technology field personnel more fully understand the technical solution in the application, below in conjunction with following knot
Closing embodiment, the invention will be further described, it is clear that and described embodiments are only a part of embodiments of the present application, without
It is whole embodiment.Based on the embodiment in the application, those of ordinary skill in the art are not before making creative work
The all other embodiment obtained is put, shall fall within the protection scope of the present application.It is right with reference to the accompanying drawings and embodiments
The present invention is further described.
Embodiment one：The micro-structure processing flow of relatively small thickness
As shown in Figure 1, if micro-structure thickness is smaller, such as 2-49 microns, photoresist may be used as deep etching work
The mask of skill.The first step, in the uniform spin coating photoresist in the front of substrate such as silicon, quartz and glass, positivity, negative photoresist are equal
It can.Second step, with there is the mask plate of target pattern to be exposed, ensures area to be etched after photoetching, developing process after development
There is no photoresist above domain.Third walks, and there is the substrate of photoetching agent pattern to be put into deep etching cavity surface and carries out deep etching
(atmosphere：Argon gas and C4F8, time：3900 seconds, air pressure：0.1 pa, power：20 watts).After the completion of deep etching, substrate is put
To going in glue, the photoresist of surface residual is removed.Substrate is sequentially placed acetone, in alcohol and deionized water by the 4th step
It is cleaned by ultrasonic, die surface is deposited or sputters one layer of chromium or nickel, and height is obtained after precise electrotyping as seed layer
Precision metal die.5th, which is used for the batch injection molding of micro-fluidic chip after precise electrotyping,
Such as the parameter to work is：Drying temperature is 80 DEG C, and about 3 hours drying times, mold temperature is 70 DEG C, and defective material amount is 4 millimeters,
Melt adhesive temperature is 260 DEG C, back pressure 10MPa, injection pressure 100MPa, about 3~4 ton/square inch of clamp force, injection moulding speed
For medium speed, feed back rotating speed is 60 revs/min, and screw rod Category criteria screw diameter is 50mm.
In this processing flow, by controlling radio-frequency power, air pressure, gas flow, two crucial processing can be controlled
Parameter：Etch rate and side wall inclination angle.Etch rate determines the roughness on the surface that is etched：Etch rate is bigger, and structure is got over
Inhomogenous, surface is more coarse, but etching speed is fast；Conversely, etch rate is smaller, structure is more uniform, and surface is more smooth, but etches
Speed is slow.Therefore, it is necessary to control, radio-frequency power, air pressure, gas flow is next while meeting surface property requirement and process velocity.Side
Angle of the wall inclination angle between base plane direction and side wall, side wall inclination angle determine the complexity of demoulding, and usually, side wall inclines
Angle is smaller, and demoulding is easier, but side wall inclination angle is too small can also significantly reduce homogeneity of the fluid channel along longitudinal direction, therefore also needs
It controls radio-frequency power, air pressure, gas flow while meeting demolding performace and dimensional accuracy.
In this technological process, substrate temperature is not excessively high in order to control, and entire etching process can be divided into tens cycles,
Each cycle includes etching, passivation, and cooling three processes.
Embodiment two：The processing flow of larger thickness micro-structure
As shown in Fig. 2, if micro-structure thickness is larger, such as 50-200 microns, photoetching compound protective layer be not enough to
The destruction for keeping off deep etching, may be used mask of the metal material such as aluminium as deep etching process at this time.The first step, in base
The uniform spin coating photoresist in front of piece such as silicon, quartz or glass, positivity, negative photoresist.The metal foil of surface deposition
2 microns to 10 microns of the thickness range of film such as aluminium.Second step, after photoetching, developing process, with the mask for having layout
Photoresist layer is patterned, ensures to wait that the metal surface for needing the region etched does not have photoresist after development.Third walks, and leads to
Wet etching is crossed, the film metal for not being photo-etched glue protection is removed, the film metal for being photo-etched glue protection is retained, thus by light
Pattern transfer in photoresist is to metal film surfaces.Surface there is the substrate of metal pattern to be put into deep etching cavity by the 4th step
Middle progress deep etching (atmosphere：Argon gas and C4F8, time：9700 seconds, air pressure：0.1 pa, power：20 watts).Deep etching is completed
Afterwards, substrate is put into glue, removes the photoresist of surface residual.Substrate is sequentially placed acetone by the 5th step, alcohol and
It is cleaned by ultrasonic in deionized water, is deposited in the die surface or sputters one layer of chromium or nickel, as seed layer.6th step, should
Metal die is used for the batch injection molding of micro-fluidic chip after precise electrotyping, such as running parameter is：Drying temperature
It it is 80 DEG C, about 3 hours drying times, mold temperature is 70 DEG C, and defective material amount is 4 millimeters, and melt adhesive temperature is 260 DEG C, and back pressure is
10MPa, injection pressure 100MPa, about 3~4 ton/square inch of clamp force, injection moulding speed is medium speed, and feed back rotating speed is
60 revs/min, screw rod Category criteria screw diameter is 50mm.
In this processing flow, by controlling radio-frequency power, air pressure, gas flow, two crucial processing can be controlled
Parameter：Etch rate and side wall inclination angle.Etch rate determines the roughness on the surface that is etched：Etch rate is bigger, and structure is got over
Inhomogenous, surface is more coarse, but etching speed is fast；Conversely, etch rate is smaller, structure is more uniform, and surface is more smooth, but etches
Speed is slow.Therefore, it is necessary to control, radio-frequency power, air pressure, gas flow is next while meeting surface property requirement and process velocity.Side
Wall inclination angle determines the complexity of demoulding, and usually, side wall inclination angle is smaller, and demoulding is easier, but side wall inclination angle is too small can also show
The homogeneity for reducing fluid channel along longitudinal direction is write, therefore is also required to control radio-frequency power, air pressure, gas flow while meeting
Demolding performace and dimensional accuracy.
In this technological process, substrate temperature is not excessively high in order to control, and entire etching process can be divided into tens cycles,
Each cycle includes etching, passivation, and cooling three processes.
Embodiment three：The test of mold and the micro-fluidic chip processed and characterization
Fig. 3 show the glass mold cross-section diagram processed according to the above method.Control atmosphere：Argon gas and C4F8, when
Between：3900 seconds, air pressure：0.1 pa, power：20 watts, obtained micro-structure：Depth is 22.1 microns, side inclination angle<90°.
Fig. 4 show the high-precision metal nickel mold prepared using the substrate mold, specification and cd injection molding machine
Adaptation, can be mounted on conventional optical disc injection molding machine；Since the side wall inclination angle of acquired metal die is less than 90 degree, it is conducive to note
The fluid channel substrate automatic demoulding of modeling.
Fig. 5 is clear for the chip micro-structure processed using the metal die of Fig. 4, and surface is smooth, is suitable for micro-fluidic core
Most application fields of piece.
It should be understood that the present invention disclosed is not limited only to specific method, scheme and the substance of description, because these
It is alterable.It will also be understood that purpose of the terminology used here just for the sake of the specific embodiment scheme of description, rather than
It is intended to limit the scope of the invention, the scope of the present invention is limited solely by the attached claims.
Those skilled in the art, which will also be appreciated that or be able to confirm that, uses no more than routine experiment, institute herein
Many equivalents of the specific embodiment of the present invention stated.These equivalents are also contained in the attached claims.
Claims (8)
1. a kind of processing method of micro-fluidic chip of height dimension between 2-200 microns, the described method comprises the following steps：
Step 1：Using photoetching process, the micro-fluidic chip layout that will be drawn on mask is shifted in a manner of patterned
Onto mold base；
Step 2：The part for not being photo-etched glue protection in substrate is performed etching using deep etching process, forms substrate mold；
Step 3：Metal layer is covered on the substrate mold, using precise electrotyping technique, processes metal die；With
Step 4：On the metal die, using integral type injection molding technology, injection molding obtains micro-fluidic chip.
2. processing method according to claim 1, it is characterised in that：When the micro-fluidic chip height dimension is micro- in 2-50
When between rice, using the substrate that material is silicon, quartz or glass as the mold base.
3. processing method according to claim 1, it is characterised in that：When the micro-fluidic chip height dimension is micro- more than 50
Meter Shi, using the substrate of silicon, quartz or glass that material is surface deposited metal film as the mold base.
4. processing method according to claim 3, it is characterised in that：The thickness of the metallic film is 2-10 microns.
5. processing method according to claim 3, it is characterised in that：The metallic film material is aluminium.
6. processing method according to claim 1, it is characterised in that：It is metal that metal layer is covered on the substrate mold
Layers of chrome or nickel layer.
7. processing method according to claim 1, it is characterised in that：The Metal mould material is nickel.
8. processing method according to claim 1, it is characterised in that：Metal layer is covered on the substrate mold passes through steaming
Plating or sputtering mode are realized.
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| CN109550526A (en) * | 2018-12-04 | 2019-04-02 | 西北农林科技大学 | A kind of micro-fluidic chip prepares mold and its preparation process and application |
| CN110152748A (en) * | 2019-06-12 | 2019-08-23 | 河北工业大学 | A method of it is cut for microlayer model in micro-fluidic chip |
| CN110773245A (en) * | 2019-11-01 | 2020-02-11 | 上海速创诊断产品有限公司 | Microfluidic chip and processing method thereof |
| CN110963457A (en) * | 2018-09-29 | 2020-04-07 | 中国科学院微电子研究所 | High-precision micro-channel network manufacturing method |
| CN111135880A (en) * | 2019-12-09 | 2020-05-12 | 中国科学院微电子研究所 | Tractor, traction system, gravity measuring method of traction system and flow channel structure manufacturing method |
| CN111216288A (en) * | 2020-02-28 | 2020-06-02 | 中国科学技术大学 | Micro-channel mold surface treatment method and micro-channel chip manufacturing method |
| CN112099313A (en) * | 2020-09-22 | 2020-12-18 | 苏州微赛智能科技有限公司 | Photoresist coating system and photoresist coating method |
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