CN108445371B - 绝缘栅双极型晶体管使用寿命预分拣方法 - Google Patents
绝缘栅双极型晶体管使用寿命预分拣方法 Download PDFInfo
- Publication number
- CN108445371B CN108445371B CN201810050644.XA CN201810050644A CN108445371B CN 108445371 B CN108445371 B CN 108445371B CN 201810050644 A CN201810050644 A CN 201810050644A CN 108445371 B CN108445371 B CN 108445371B
- Authority
- CN
- China
- Prior art keywords
- igbt
- accelerated aging
- module
- short
- service life
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2607—Circuits therefor
- G01R31/2608—Circuits therefor for testing bipolar transistors
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2642—Testing semiconductor operation lifetime or reliability, e.g. by accelerated life tests
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
Description
Claims (3)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201810050644.XA CN108445371B (zh) | 2018-01-18 | 2018-01-18 | 绝缘栅双极型晶体管使用寿命预分拣方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201810050644.XA CN108445371B (zh) | 2018-01-18 | 2018-01-18 | 绝缘栅双极型晶体管使用寿命预分拣方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN108445371A CN108445371A (zh) | 2018-08-24 |
CN108445371B true CN108445371B (zh) | 2021-02-19 |
Family
ID=63191086
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201810050644.XA Active CN108445371B (zh) | 2018-01-18 | 2018-01-18 | 绝缘栅双极型晶体管使用寿命预分拣方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN108445371B (zh) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109444609B (zh) * | 2018-12-18 | 2024-03-01 | 北京交通大学 | 牵引变流器使用寿命预测方法及装置 |
CN110221189B (zh) * | 2019-06-05 | 2020-07-17 | 合肥工业大学 | 一种igbt模块键合线在线状态监测的方法 |
CN111060798B (zh) * | 2019-12-18 | 2021-10-15 | 中国测试技术研究院流量研究所 | 一种mos管自动功率老化测试系统及测试方法 |
CN111856233B (zh) * | 2020-07-03 | 2021-04-27 | 武汉大学 | 基于键合引线退化的igbt模块可靠性评估方法及装置 |
CN112098789B (zh) * | 2020-08-04 | 2023-06-13 | 株洲中车时代半导体有限公司 | Igbt模块寿命的统计方法、装置、电子设备及存储介质 |
CN112213660A (zh) * | 2020-08-25 | 2021-01-12 | 广西电网有限责任公司南宁供电局 | 一种预测ups系统中电力电子器件剩余寿命的方法 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5641998B2 (ja) * | 2011-03-25 | 2014-12-17 | 三菱電機株式会社 | 半導体装置の寿命推定方法 |
CN103620429A (zh) * | 2011-06-21 | 2014-03-05 | 科电公司 | 用于估计功率半导体器件的寿命终点的方法 |
CN102654557B (zh) * | 2012-04-19 | 2015-03-25 | 中国航空综合技术研究所 | 一种绝缘栅双极型晶体管性能退化试验方法 |
CN104360697B (zh) * | 2014-09-24 | 2016-10-05 | 河北工业大学 | 一种三相逆变系统igbt模块功率-温度控制及检测装置 |
CN105301485A (zh) * | 2015-07-29 | 2016-02-03 | 重庆大学 | 多igbt快速功率循环加速老化装置 |
JP2017058146A (ja) * | 2015-09-14 | 2017-03-23 | 三菱電機株式会社 | 寿命推定回路およびそれを用いた半導体装置 |
CN105373660A (zh) * | 2015-11-12 | 2016-03-02 | 成都嘉石科技有限公司 | 基于等效电路的晶体管可靠性表征方法 |
CN106740260B (zh) * | 2016-11-28 | 2019-07-12 | 北京新能源汽车股份有限公司 | 一种绝缘栅极双极型晶体管igbt的控制方法及装置 |
-
2018
- 2018-01-18 CN CN201810050644.XA patent/CN108445371B/zh active Active
Non-Patent Citations (3)
Title |
---|
电子元件的老化与筛选;梁艺凡;《光谱实验室》;20130331;第865-867页 * |
电子元器件的选用和老化方法的讨论;胡俊达 等;《电子质量》;20031130;第7-8页,第16页 * |
电子器件可靠性试验简介;黄志刚;《半导体光电》;19920930;第282-287页 * |
Also Published As
Publication number | Publication date |
---|---|
CN108445371A (zh) | 2018-08-24 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN108445371B (zh) | 绝缘栅双极型晶体管使用寿命预分拣方法 | |
CN109738773B (zh) | 一种非平稳工况下igbt模块寿命预测方法 | |
CN109188232B (zh) | 一种igbt模块状态评估与剩余寿命预测模型的构建方法 | |
CN110632490A (zh) | 一种igbt模块状态监测装置及方法 | |
CN110658435B (zh) | 一种igbt结温监测装置及方法 | |
CN109143012B (zh) | Igbt剩余寿命预估方法 | |
CN105242189A (zh) | 基于集射极饱和压降与焊料层空洞率的igbt健康状态监测方法 | |
CN102680819A (zh) | 电力电子器件的加速寿命测试电路及测试方法 | |
CN113759225A (zh) | Igbt剩余寿命预测和状态评估实现方法 | |
CN113219315A (zh) | 基于结温归一化的逆变器igbt老化在线监测方法及系统 | |
CN116736063A (zh) | 一种基于加权lstm的igbt状态评估方法 | |
Luo et al. | A fault detection method for partial chip failure in multichip IGBT modules based on turn-off delay time | |
CN111260113A (zh) | SiC MOSFET模块全生命周期结温在线预测方法 | |
CN113359000B (zh) | 一种在线老化测试装置 | |
CN114217202A (zh) | 一种基于多个电参数的igbt模块键合线状态监测评估方法 | |
Yang et al. | Failure Mode Classification of IGBT Modules Under Power Cycling Tests Based on Data-Driven Machine Learning Framework | |
CN116879702B (zh) | SiC MOSFET功率循环退化机理的在线诊断方法、系统、装置 | |
US9502315B2 (en) | Electrical component testing in stacked semiconductor arrangement | |
Zhang et al. | Analysis of fault precursor parameters under accelerated aging tests for IGBT modules | |
CN114210605B (zh) | 碳化硅功率半导体器件测试方法 | |
CN115600423A (zh) | 一种电机控制器寿命评估方法 | |
US20220215150A1 (en) | Method and system for comprehensively evaluating reliability of multi-chip parallel igbt module | |
CN113919116A (zh) | 基于garch模型的igbt剩余使用寿命预测方法 | |
CN209690455U (zh) | 功率半导体器件的在线状态监测和故障判定系统 | |
Cheng et al. | A Novel Aircraft Secondary Power Fault Prediction Method Research based on Data Mining |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
CB03 | Change of inventor or designer information |
Inventor after: Liu Li Inventor after: Zhan Zhixiong Inventor after: Xu Cheng Inventor after: Liu Yi Inventor after: Hu Jingge Inventor after: Huang Meng Inventor after: Sun Jianjun Inventor after: Dai Tao Inventor after: Yao Hui Inventor after: Qiao Min Inventor after: Yuan Jie Inventor after: Li Jianbo Inventor after: Yu Xingwei Inventor after: Lu Zhifei Inventor after: Yang Yong Inventor before: Dai Tao Inventor before: Zhan Zhixiong Inventor before: Xu Cheng Inventor before: Liu Yi Inventor before: Hu Jingge Inventor before: Huang Meng Inventor before: Sun Jianjun Inventor before: Liu Li Inventor before: Yao Hui Inventor before: Qiao Min Inventor before: Yuan Jie Inventor before: Li Jianbo Inventor before: Yu Xingwei Inventor before: Lu Zhifei Inventor before: Yang Yong |
|
CB03 | Change of inventor or designer information | ||
GR01 | Patent grant | ||
GR01 | Patent grant |