CN108441154B - Bonding method of honeycomb plate - Google Patents
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- CN108441154B CN108441154B CN201810361917.2A CN201810361917A CN108441154B CN 108441154 B CN108441154 B CN 108441154B CN 201810361917 A CN201810361917 A CN 201810361917A CN 108441154 B CN108441154 B CN 108441154B
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J109/00—Adhesives based on homopolymers or copolymers of conjugated diene hydrocarbons
- C09J109/02—Copolymers with acrylonitrile
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
- C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/24—Acids; Salts thereof
- C08K3/26—Carbonates; Bicarbonates
- C08K2003/265—Calcium, strontium or barium carbonate
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/16—Applications used for films
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Laminated Bodies (AREA)
Abstract
The invention provides a bonding method of a honeycomb plate, which is characterized in that a panel and a honeycomb core material which form the honeycomb plate are bonded through adhesive films, and the honeycomb plate is formed after curing, wherein the adhesive films comprise a hot melt adhesive film for bonding the middle part and a non-flowing composite structure adhesive film for bonding the edge part. The bonding method of the invention uses the hot-melt adhesive film with high bonding strength at the middle part of the honeycomb plate, uses the non-flowing composite adhesive film with better toughness and no flowing after curing at the edge part of the honeycomb plate for bonding, the two adhesive films have good compatibility and the same curing condition, can ensure excellent bonding strength, can also effectively prevent the phenomena of glue shortage and glue overflow after curing, greatly improves the reliability of bonding, also saves the fussy construction process aiming at glue overflow, and has very industrial application value.
Description
Technical Field
The invention relates to the field of honeycomb plate manufacturing, in particular to a bonding method of a honeycomb plate.
Background
With the development of aviation and rail transit industries, the application of honeycomb plates is more and more important, the structure is mainly formed by bonding two layers of panels (skins) with a honeycomb core material (sandwich) sandwiched therebetween by an adhesive, and the unique structure has lighter weight, better rigidity and overall stability compared with other materials with the same volume, and has sound insulation and heat insulation performances. The characteristics of light weight, energy conservation and environmental protection of the honeycomb plate enable the honeycomb plate to be widely applied to industries such as aviation, rail transit and the like.
The high-performance honeycomb plate is mainly made of aluminum alloy plates or composite material plates as skins, aluminum, aramid paper or glass cloth honeycombs as sandwich materials, and the aluminum alloy plates, the aramid paper and the glass cloth honeycombs are bonded into a whole by a thermosetting adhesive through a heating and pressurizing method. The initial bonding of honeycomb panels generally adopts structural adhesives such as two-component polyurethane, two-component epoxy resin and the like, but the adhesives have the defects of long curing period, brittle colloid after curing, low peel strength and non-uniform gluing amount, so the adhesives are gradually replaced by hot melt adhesive films.
The aviation and rail transit industries all adopt a film-shaped high-strength and high-toughness epoxy adhesive (epoxy film), and the film-shaped high-strength and high-toughness epoxy adhesive has the greatest advantages of uniform thickness, accurate glue application amount, simple and convenient construction process, high comprehensive performance and high glue joint reliability. However, domestic and foreign products with high market share are produced by adopting a hot-melt coating mode, the fluidity of colloid is high during heating, pressurizing and curing, the glue joint of the upper panel and the honeycomb core is easy to cause the phenomena of glue shortage and glue overflow during bonding, the hardness of the colloid after curing is high, the cleaning difficulty of the overflowing colloid is high, a polishing process is required to be added to clean the overflowing colloid, the construction efficiency is reduced, the construction difficulty is increased, and the reliability of structural bonding is also reduced.
Disclosure of Invention
In order to overcome the defects in the existing bonding process of the honeycomb plate, the invention aims to provide a bonding method of the honeycomb plate, which can avoid the phenomena of glue shortage, glue overflow and the like.
The bonding method of the honeycomb plate provided by the invention comprises the following steps: bonding a panel and a honeycomb core material which form the honeycomb plate through a glue film, and curing to form the honeycomb plate; the adhesive film comprises a hot-melt adhesive film for bonding the middle part and a non-flowing composite structure adhesive film for bonding the edge part; the hot-melt adhesive film comprises the following raw materials in parts by weight: 10-30 parts of liquid nitrile rubber, 20-30 parts of liquid epoxy resin, 30-50 parts of solid epoxy resin, 3-30 parts of curing agent, 1-7 parts of accelerator and 10-25 parts of powder filler; the non-flowing composite structure adhesive film comprises the following raw materials in parts by weight: 20-35 parts of solid nitrile rubber, 30-60 parts of liquid epoxy resin, 2-10 parts of powder filler, 0.5-2 parts of coupling agent, 8-13 parts of curing agent and 1-4 parts of accelerator.
Generally speaking, the hot-melt adhesive film for bonding the honeycomb plate has high bonding strength, the hot-melt adhesive can melt and flow in the heating, pressurizing and curing process, on one hand, the cured adhesive can form a colloid tumor at a honeycomb node, and the adhesive climbs more than or equal to 1mm along the honeycomb direction, so that the bonding reliability can be greatly improved, and the bonding strength can be enhanced, on the other hand, due to the large fluidity of the adhesive, the adhesive shortage and overflow phenomenon can be easily caused at the bonding position of a panel and a honeycomb core material during bonding, on the contrary, the bonding reliability of the structure is greatly reduced, and the cleaning difficulty of the subsequent overflow adhesive is increased. The non-flowing composite structure adhesive film has good self-adhesion and good toughness, the adhesive does not flow around when heated, pressurized and cured, the phenomena of adhesive shortage and adhesive overflow are avoided, the subsequent procedure of cleaning the adhesive overflow can be omitted, the mechanical property after curing can be equivalent to that of the common hot-melting adhesive film, and the bonding effect of the honeycomb plate can not be weakened. Compared with the common hot melt adhesive film, the mechanical property of the hot melt adhesive film is greatly improved, and particularly, the peeling strength of a roller after curing can reach 140Nmm/mm, which is obviously higher than that of the similar adhesive film (50-80 Nmm/mm). The bonding method combines the hot-melt adhesive film and the non-flowing composite structure adhesive film for use, has equivalent curing conditions of the two adhesive films and good compatibility, can achieve excellent bonding effect, can avoid the common phenomena of glue shortage, glue overflow and the like, and is a high-efficiency and high-quality bonding method for the honeycomb panel.
In the bonding method, the thickness of the hot-melt adhesive film is the same as that of the non-flowing composite structure adhesive film, so that the defect or glue overflow phenomenon at the joint of the hot-melt adhesive film and the non-flowing composite structure adhesive film is avoided, and the bonding effect of the adhesive film is ensured. The thickness of the adhesive film can be adjusted according to construction requirements. In the preferable technical scheme of the invention, the thickness of the adhesive film can be 0.1-2 mm.
According to the bonding method, the width of the non-flowing composite structure adhesive film can be selected according to actual needs, and according to the preferred technical scheme, the width of the non-flowing composite structure adhesive film can be 0.5-3cm, namely, the edge part of 0.5-3cm from the edge of the honeycomb panel is bonded by using the non-flowing composite structure adhesive film.
The bonding method of the present invention can be applied to any kind of honeycomb board, wherein the panel material includes but is not limited to aluminum alloy, steel, carbon fiber, etc., and the core material includes but is not limited to aluminum honeycomb, aramid paper honeycomb, PET foam, etc. Generally speaking, before bonding, the honeycomb panel needs to be subjected to corresponding surface treatment on the bonding surface of the panel and the core material to obtain a better bonding effect, the surface treatment mode can be a common treatment mode, for example, the aluminum alloy bonding surface can be subjected to phosphoric acid anodizing treatment or corresponding acid treatment, bonding can be performed within 24 hours after drying, and for example, the stainless steel bonding surface can be subjected to polishing and roughening treatment.
In the bonding method of the invention, the solid nitrile rubber can be common solid nitrile rubber; the solid nitrile rubber can be terminal carboxyl group, and the content of acrylonitrile in the solid nitrile rubber can be 17-40%.
In the bonding method, the liquid nitrile rubber can be common modified or unmodified liquid nitrile rubber; the preferable liquid nitrile rubber has the number average molecular weight of 2500-4500 and the Brookfield viscosity of 20000-60000 cps, and includes but is not limited to amino-terminated liquid nitrile rubber, carboxyl-terminated liquid nitrile rubber, hydroxyl-terminated liquid nitrile rubber, mercapto-terminated liquid nitrile rubber or any combination thereof.
In the bonding method of the invention, the liquid epoxy resin can be common modified or unmodified liquid epoxy resin; the epoxy equivalent of the preferred liquid epoxy resin can be 180-280 g/eq, including but not limited to liquid bisphenol a epoxy resin, polyurethane modified epoxy resin, nitrile modified epoxy resin or any combination thereof.
In the bonding method of the invention, the solid epoxy resin can be common modified or unmodified solid epoxy resin; the preferred solid epoxy resin may have an epoxy equivalent weight of 450 to 1000g/eq and a softening point of 65 to 110 ℃, including but not limited to solid bisphenol a epoxy resin, bisphenol F epoxy resin, or any combination thereof.
In the bonding method of the present invention, the curing agent, the accelerator, the powder filler, the coupling agent, etc. used for the composition of the adhesive film may be any kind commonly used in the art.
In a preferred embodiment according to the present invention, the curing agent includes, but is not limited to, dicyandiamide, modified dicyandiamide, an acid anhydride curing agent, or any combination thereof.
In a preferred embodiment according to the present invention, the accelerator includes, but is not limited to, imidazole-based epoxy resin accelerators, urea-based epoxy resin accelerators, or any combination thereof.
In a preferred embodiment according to the present invention, the powder filler includes, but is not limited to, silica, phthalocyanine blue, titanium dioxide, mica powder, white carbon black, magnesium hydroxide, alumina powder, alumina, or any combination thereof.
In a preferred embodiment according to the present invention, the coupling agent includes, but is not limited to, vinyltriethoxysilane, ethylenediamine propyltriethoxysilane, vinyltrimethoxysilane, gamma-aminopropyltriethoxysilane, or any combination thereof.
In the bonding method of the invention, the preparation of the hot melt type adhesive film and the non-flowing type composite structure adhesive film can be common forming methods, for example, the adhesive film forming is carried out by adopting equipment such as a hot melt adhesive film machine, a continuous screw extrusion film forming machine and the like.
In a preferred embodiment of the present invention, the hot melt adhesive film can be prepared by the following steps:
the method comprises the following steps: uniformly mixing part (for example, 50-80 wt%) of liquid epoxy resin, all solid epoxy resin and liquid nitrile rubber at 100-130 ℃ to obtain a component A for later use, uniformly mixing the rest part of liquid epoxy resin, powder filler, accelerator and curing agent at 30-80 ℃, and uniformly mixing the mixture with the component A at the temperature of not higher than 100 ℃.
Step two: and (3) preparing a hot melt adhesive film from the obtained rubber material by using a hot melt adhesive film machine, wherein the temperature of the rubber roller is 53 +/-10 ℃, and the vehicle speed is 1.5-3 m/min.
Step three: compounding an adhesive film and a backing material on a hot-melt film forming machine, wherein the temperature of a rubber roller is 60 +/-10 ℃, and the speed of the rubber roller is 3-5m/min, so as to obtain the hot-melt adhesive film.
In a preferred technical scheme of the invention, the non-flowing composite structure adhesive film can be prepared by the following method:
the method comprises the following steps: adding solid nitrile rubber, liquid epoxy resin and powder filler into a kneading machine for mixing, stirring at medium speed for 60-100 min, adding a curing agent, an accelerator and a coupling agent into the kneading machine after fully mixing, stirring at low speed for 50-90 min, and simultaneously controlling the glue temperature to be less than 70 ℃, and fully mixing to obtain the required glue stock.
Step two: and (3) adopting a continuous screw extrusion film forming machine, and carrying out extrusion composite molding on the backing material and the colloid to obtain the adhesive film.
In the bonding method of the present invention, the curing process includes: curing for 0.5-3 hours under the conditions of pressure of 0.1-0.5 MPa and temperature of 120-150 ℃. Under the same curing condition, the hot-melt adhesive film and the non-flowing composite adhesive film can be cured and formed into a whole, so that the honeycomb plate with excellent bonding performance is obtained.
The bonding method of the invention uses the hot-melt adhesive film with high bonding strength at the middle part of the honeycomb plate, uses the non-flowing composite adhesive film with better toughness and no flowing after curing at the edge part of the honeycomb plate for bonding, and the two adhesive films have good compatibility and the same curing condition, thereby ensuring excellent bonding strength, effectively preventing the phenomena of glue shortage and glue overflow after curing, greatly improving the reliability of bonding and omitting the complicated construction process aiming at glue overflow. In a word, the bonding method of the invention has the advantages of uniform glue application amount, convenient construction, high glue joint reliability, good bonding performance of the prepared honeycomb plate and greatly improved overall quality, so the bonding method of the honeycomb plate of the invention has industrial application value.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, technical solutions of exemplary embodiments of the present invention will be further described below.
The starting materials used in the following examples are commercially available products unless otherwise specified, and the procedures, instruments and equipment used in the following examples are those commonly used in the art unless otherwise specified.
Examples
1. Preparation of hot-melt adhesive film
The hot-melt adhesive film comprises the following components in percentage by weight: 20% of amino-terminated liquid nitrile rubber-ABTN 1300X16, 20% of bisphenol A type epoxy resin E-51, 30% of bisphenol A type epoxy resin CYD-012, 13% of modified dicyandiamide-100S, 3% of methylimidazole, 4% of fumed silica and 10% of calcium carbonate.
The preparation process comprises the following steps:
the method comprises the following steps: uniformly mixing 70 wt% of bisphenol A epoxy resin E-51, all bisphenol A epoxy resin CYD-012 and amino-terminated liquid nitrile rubber at the temperature of 100-130 ℃ to serve as a component A for later use, then sequentially mixing the rest part of epoxy resin E-51 with fumed silica, calcium carbonate, modified dicyandiamide and methylimidazole at the temperature of 30-80 ℃, and then uniformly mixing with the component A at the temperature of not higher than 100 ℃.
Step two: and preparing a hot melt adhesive film from the obtained rubber material by using a hot melt adhesive film machine, wherein the temperature of a rubber roller is 53 +/-10 ℃, and the vehicle speed is 1.5-3 m/min.
Step three: compounding an adhesive film and a backing material on a hot-melt film forming machine, wherein the temperature of a rubber roller is 60 +/-10 ℃, and the speed of the rubber roller is 3-5m/min, so as to obtain the hot-melt adhesive film.
The main technical indexes of the obtained hot-melt adhesive film are shown in table 1.
TABLE 1 Main technical indexes of hot-melt adhesive film
As can be seen from Table 1, the shear strength and the roller peel strength of the hot melt adhesive film after curing are higher and are obviously superior to those of the existing hot melt adhesive film.
2. Preparation of non-flowing composite structure adhesive film
The non-flowing composite structure adhesive film comprises the following components in percentage by weight: 33% of solid nitrile-butadiene rubber-4155, 25% of bisphenol A type epoxy resin E-39D, 16% of bisphenol A type epoxy resin E-44, 7% of fumed silica, 3.5% of calcium carbonate, 2% of vinyltriethoxysilane, 10.5% of dicyandiamide, 2.5% of methylimidazole and 0.5% of modified zinc urea-diethyldithiocarbamate.
The preparation process comprises the following steps:
the method comprises the following steps: adding solid nitrile rubber, epoxy resin, fumed silica, calcium carbonate and sulfur powder into a kneading machine for mixing, stirring at a medium speed for 80min, fully mixing, adding dicyandiamide, methylimidazole, modified urea and vinyl triethoxysilane into the kneading machine, stirring at a low speed for 70min, and simultaneously controlling the glue temperature to be less than 70 ℃, and fully mixing to obtain the required glue stock.
Step two: and a continuous screw extrusion film forming machine is adopted, and the adhesive film with the thickness of 0.1-2mm can be obtained by extruding and compounding the backing material and the colloid.
The main technical indexes of the obtained non-flowing composite structure adhesive film are shown in table 2.
TABLE 2 Main technical indexes of non-flowing composite structural adhesive film
As can be seen from Table 2, the non-flowing composite adhesive film has higher properties such as shear strength, roller peel strength and the like after being cured, and the bonding effect of the honeycomb panel cannot be influenced after the non-flowing composite adhesive film is partially substituted for a hot-melt adhesive film.
3. Bonding of honeycomb panels
And paving the middle part of the bonding surface of the panel and the core material to be bonded with a prepared hot-melt adhesive film, and paving a non-flowing composite structure adhesive film on the edge part of 0.5-3cm of the panel, wherein the thickness of the adhesive film is the same as that of the hot-melt adhesive film. When the two adhesive films are spread, the connecting parts should be tightly attached without overlapping so as to ensure the reliability of adhesive bonding in the thermosetting process. And (3) accurately positioning the panel covered with the adhesive film and the honeycomb core material, directly bonding the panel and the honeycomb core material, and then curing the panel and the honeycomb core material at constant temperature and constant pressure for 1 hour under the conditions that the pressure is 0.3MPa and the temperature is 135 ℃ to obtain the bonded honeycomb plate.
Although the preferred embodiments of the present invention have been disclosed for illustrative purposes, those skilled in the art will appreciate that various modifications, additions and substitutions are possible, without departing from the scope and spirit of the invention as disclosed in the accompanying claims.
Claims (13)
1. A bonding method of a honeycomb plate is characterized in that a panel and a honeycomb core material which form the honeycomb plate are bonded through adhesive films, and the honeycomb plate is formed after curing, wherein the adhesive films comprise hot melt adhesive films for bonding the middle part and non-flowing composite structure adhesive films for bonding the edge part;
the hot-melt adhesive film comprises the following raw materials in parts by weight: 10-30 parts of liquid nitrile rubber, 20-30 parts of liquid epoxy resin, 30-50 parts of solid epoxy resin, 3-30 parts of curing agent, 1-7 parts of accelerator and 10-25 parts of powder filler;
the non-flowing composite structure adhesive film comprises the following raw materials in parts by weight: 20-35 parts of solid nitrile rubber, 30-60 parts of liquid epoxy resin, 2-10 parts of powder filler, 0.5-2 parts of coupling agent, 8-13 parts of curing agent and 1-4 parts of accelerator.
2. The bonding method according to claim 1, wherein the thickness of the hot-melt adhesive film and the thickness of the non-flowing composite adhesive film are both 0.1-2 mm.
3. The bonding method according to claim 1, wherein the width of the non-flowing composite adhesive film is 0.5-3 cm.
4. The bonding method according to claim 1, wherein the panel material is aluminum alloy, steel or carbon fiber, and the core material is aluminum honeycomb, aramid paper honeycomb or PET foam.
5. The bonding method according to claim 1, wherein the liquid nitrile rubber is one or more of amino-terminated liquid nitrile rubber, carboxyl-terminated liquid nitrile rubber, hydroxyl-terminated liquid nitrile rubber and mercapto-terminated liquid nitrile rubber.
6. The bonding method according to claim 1, wherein the liquid epoxy resin is one or more of liquid bisphenol a epoxy resin, polyurethane modified epoxy resin, and nitrile modified epoxy resin.
7. The bonding method according to claim 1, wherein the solid epoxy resin is a mixture of one or more of a solid bisphenol a type epoxy resin and a bisphenol F type epoxy resin.
8. The bonding method according to claim 1, wherein the curing agent is one or a mixture of dicyandiamide, modified dicyandiamide, and acid anhydride curing agents.
9. The bonding method according to claim 1, wherein the accelerator is one or more of imidazole epoxy resin accelerator and urea epoxy resin accelerator.
10. The bonding method according to claim 1, wherein the powder filler is one or more of silica, phthalocyanine blue, titanium dioxide, mica powder, magnesium hydroxide and aluminum oxide.
11. The bonding method according to claim 1, wherein the powdery filler is white carbon black or alumina powder.
12. The bonding method according to claim 1, wherein the coupling agent is one or more selected from the group consisting of vinyltriethoxysilane, ethylenediamine propyltriethoxysilane, vinyltrimethoxysilane, and γ -aminopropyltriethoxysilane.
13. The bonding method according to any one of claims 1 to 12, wherein the curing process comprises: curing for 0.5-3 hours under the conditions of pressure of 0.1-0.5 MPa and temperature of 120-150 ℃.
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| CN110181897B (en) * | 2019-07-02 | 2021-08-06 | 中车长春轨道客车股份有限公司 | Aramid paper honeycomb composite part and preparation method and application thereof |
| CN111286282A (en) * | 2020-03-26 | 2020-06-16 | 上海海鹰粘接科技有限公司 | Novel epoxy adhesive film and preparation method thereof |
| CN112239632A (en) * | 2020-09-21 | 2021-01-19 | 际华集团股份有限公司系统工程中心 | Heat absorption adhesive film and preparation method thereof |
| CN114605935B (en) * | 2022-03-30 | 2024-02-20 | 深圳市图特美高分子材料有限公司 | Adhesive film for acoustic honeycomb composite board and preparation method thereof |
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| CN101818038A (en) * | 2010-01-28 | 2010-09-01 | 北京高盟新材料股份有限公司 | Method for preparing film adhesive for aluminum honeycomb panel sandwich structure |
| CN106926516A (en) * | 2015-12-31 | 2017-07-07 | 比亚迪股份有限公司 | Composite honeycomb battenboard and preparation method thereof |
| CN107502255A (en) * | 2017-08-25 | 2017-12-22 | 佛山市壹诺板材科技有限公司 | A kind of aluminium honeycomb composite plate epoxy adhesive and its preparation method and application method |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101818038A (en) * | 2010-01-28 | 2010-09-01 | 北京高盟新材料股份有限公司 | Method for preparing film adhesive for aluminum honeycomb panel sandwich structure |
| CN106926516A (en) * | 2015-12-31 | 2017-07-07 | 比亚迪股份有限公司 | Composite honeycomb battenboard and preparation method thereof |
| CN107502255A (en) * | 2017-08-25 | 2017-12-22 | 佛山市壹诺板材科技有限公司 | A kind of aluminium honeycomb composite plate epoxy adhesive and its preparation method and application method |
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