CN106675478A - Resin composition and intermediate temperature structure glue film - Google Patents
Resin composition and intermediate temperature structure glue film Download PDFInfo
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- CN106675478A CN106675478A CN201611037344.5A CN201611037344A CN106675478A CN 106675478 A CN106675478 A CN 106675478A CN 201611037344 A CN201611037344 A CN 201611037344A CN 106675478 A CN106675478 A CN 106675478A
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- STQRLTMDNIXJKF-VEWKROIGSA-N C/C=C(/Cc(cccc1)c1OCC1OC1)\C(\OCC1OC1)=C(/C)\Cc(cccc1)c1OCC1OC1 Chemical compound C/C=C(/Cc(cccc1)c1OCC1OC1)\C(\OCC1OC1)=C(/C)\Cc(cccc1)c1OCC1OC1 STQRLTMDNIXJKF-VEWKROIGSA-N 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/21—Paper; Textile fabrics
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/35—Heat-activated
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2463/00—Presence of epoxy resin
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention discloses a resin composition and an intermediate temperature structure glue film prepared by using the resin composition. The resin composition comprises 25-50 parts of component A, 25-50 parts of component B, 10-25 parts of component C, 5-40 parts of component D and 5-15 parts of component E, wherein the component A is selected from at least one of multifunctional epoxy resin; the component B is selected from at least one of bisphenol epoxy, phenolic aldehyde epoxy and other modified epoxy; and the component C is one of imidazole, dicyandiamide and derivatives and microcapsule resting type curing agent system; the component D is a reinforcing and toughening system; and the component E is other filler systems. The components A-E are uniformly mixed to obtain the resin composition, and the obtained resin composition can be prepared into a 100-500g/m<2>intermediate temperature structure glue film through a hot melt method; the glue film is excellent in adhesion strength, suitable for the glue joint of the plate-plate and plate-core structures of the metal or composite material.
Description
Technical field
The present invention relates to polymeric material field, and in particular to a kind of resin combination and the middle temperature structure prepared using it
Glued membrane.
Technical background
The stress concentration of mechanical connection is avoided that in the splicing of aerospace field, metal or composite material structural member, is carried
The integrity and rigidity of high structure, improves its anti-fatigue performance, while architecture quality can also be mitigated, reduces manufacturing cost.
Currently, middle temperature structural film adhesive is selected in the splicing of the most constructions part such as transporter, civil aircraft and helicopter, its
Reason and meaning mainly have it is following some：(1) in terms of the performance requirement, thermal structure need to be used except small part structural member is glued
Outside glued membrane, middle temperature structural film adhesive can meet the splicing of the structure members such as most of transporter, civil aircraft and helicopter will
Ask；(2) high temperature can be avoided to being glued intercrystalline corrosion and its anti-fatigue performance of aluminium alloy body using the solidification of middle temperature glued membrane
Decline；(3) reduce be glued temperature, can make composite material structural member reduce in second bonding its structural member stick up bend deformation and
Internal stress, it is ensured that the high accuracy of profile, so as to ensure its high-performance, this is for the splicing of multiple structure, it appears more attach most importance to
Will.Therefore, the splicing for entering row metal or composite material structural member with middle temperature structure glue can better ensure that corresponding airline structural member
High-performance and safety on transporter, civil aircraft and helicopter.
And small part aerospace component need to have higher requirements because of its application characteristic to its high temperature bonding intensity, the current knot
The splicing of structure is still more to be glued from thermal structure glued membrane.Therefore, a intermediate temperature setting is developed, still possesses good under high temperature
The structural film adhesive of adhesive strength, then can give full play to middle temperature structural film adhesive its cost, material property in aerospace component splicing
Advantage in terms of stability, structural member precision and reliability, with greater significance.
The content of the invention：
In view of this, it is an object of the invention to provide a kind of resin combination and the middle temperature structure glue prepared using it
Film, the glued membrane has excellent adhesive strength (especially adhesive strength under high temperature) and fatigue resistance, can be applicable to aeronautic structure
In part in metal or composite the structural member such as board-to-board, plate-core splicing.
A kind of resin combination, in terms of parts by weight, including following component：25~50 parts of component A, 25~50 parts of B
Component, 10~25 parts of component C, 5~40 parts of D components and 5~15 parts of component E；Wherein,
The component A is that one or more in polyfunctional epoxy resin, the B component is biphenol type epoxy, phenolic aldehyde ring
One or more in oxygen or other modified epoxies, the component C is imidazole curing agent, dicyandiamide and its derivatives class firming agent
And the one kind in microcapsule class latent curing agent system, the D components are activeness and quietness system, and the component E is filling
Agent system.
In preferred technical scheme, described polyfunctional epoxy resin is selected from：
(1) following general formula of molecular structure (I), the trifunctional epoxy resin shown in (II)：
R in its formula of (I)1Hydrogen, halogen atom, alkane, alkene, alkynes or aromatic compound are represented, leads to R in formula II2
Represent hydrogen, halogen atom, alkane, alkene, alkynes or aromatic compound；Or,
(2) following general formula of molecular structure (III), (IV), the four-functional group epoxy resin shown in (V)：
Wherein, R in formula III is led to3Hydrogen, halogen atom, alkane, alkene, alkynes or aromatic compound are represented, leads to formula IV
Middle R4Represent hydrogen, halogen atom, alkane, alkene, alkynes or aromatic compound, R in formula (V)5Represent hydrogen, halogen atom, alkane,
Alkene, alkynes or aromatic compound.
In preferred technical scheme, described bisphenol-type epoxy resin may be selected from bisphenol A type epoxy resin, bisphenol-f type ring
One or more in oxygen tree fat and bisphenol-s epoxy resin；
In preferred technical scheme, the optional freely following general formula of molecular structure (VI) of described novolac epoxy resin, (VII)
Shown novolac epoxy resin：
Wherein, m=1-3, n=3-7 in formula (VII) in formula VI is led to.
In preferred technical scheme, other described modified epoxies include modifying epoxy resin by organosilicon, fluorination ring
Oxygen tree fat, Maleimide-modified epoxy resin, rubber elastomer modified epoxy and polyurethane elastomer modified epoxy
One or more in resin.
In preferred technical scheme, described curative systems include imidazole curing agent, dicyandiamide and its derivatives class
Firming agent and microcapsule class firming agent, and coordinate corresponding curing accelerator regarding real needs.
In preferred technical scheme, the activeness and quietness system component includes polyurethane, liquid rubber elastomer, thermoplasticity
One or more in resin, polysiloxane copolymer, nucleocapsid elastic microsphere and nanoparticle etc..
In preferred technical scheme, described filler system is included in thixotropic agent, reinforcing agent, coupling agent and diluent
One or more, can select according to the actual requirements.
Further, present invention also offers a kind of middle temperature structural film adhesive prepared using the resin combination, is by institute
State resin combination Jing hot melts and be applied as resin film and form, and its weight per unit area can be in 100~500g/m2, knot
Structure glued membrane can cover carrier or not cover carrier, and its carrier can select polyester felt, nylon cloth, glass-fiber-fabric.
Middle temperature structural film adhesive of the present invention, can carry out material or the knots such as board-to-board, plate-core with metal or composite
The splicing of component, with excellent adhesive shear strength.Condition of cure is 1~3h of solidification, solidifying pressure at 100 DEG C~130 DEG C
0.1~0.7MPa.
In resin combination of the present invention, with polyfunctional epoxy resin or novolac epoxy resin as matrix resin,
Can guarantee system there is good thermostability；Biphenol type epoxy or modified epoxy, you can improve system to metal or multiple
The bonding force of condensation material, while and being conducive to the raising of toughness；And rubber elastomer, thermoplastic resin, nucleocapsid elastic microsphere with
And nanoparticle etc., advantageously ensure that the good fracture toughness of resin system.Further, middle temperature structural film adhesive of the present invention,
After intermediate temperature setting, its metal (2024-T3 aluminiums, 1.6mm is thick) list lap shear strength at room temperature up to 38.5MPa,
90 DEG C of down cut intensity still have 28.0MPa, and honeycomb climbing drum peel strength reaches 70N.m/m, shows that the middle temperature structural film adhesive possesses excellent
Different adhesive strength.
Specific embodiment
Hereinafter, the present invention is expanded on further in conjunction with specific embodiments.It should be understood that these embodiments are merely to illustrate the present invention
Rather than restriction the scope of the present invention.
Embodiment 1
A kind of resin combination, in terms of parts by weight, its composition is as follows：
Component A：30 parts of four-functional group epoxy resins, 15 parts of trifunctional epoxy resin；
B component：20 parts of bisphenol S epoxies, 30 parts of polyurethane modified epoxies；
Component C：12 parts of dicyandiamide/imidazoles slaine curative systems；
D components：25 parts of Toughened With High Performance Thermoplastics agent；
Component E：6 parts of thixotropic agent, 3 parts of silane couplers.
Its preparation method is as follows：
Component A and D components are added in mixing apparatus, being warming up to 120 DEG C of insulated and stirred 60min makes D components fully dissolve
And mix homogeneously, B, component E are added, in 100 DEG C of insulated and stirred 30min, component C, insulated and stirred are added after being cooled to 70 DEG C
20min, makes system mix homogeneously, obtains resin combination.
The method for preparing middle temperature structural film adhesive using above-mentioned resin combination is as follows：
Above-mentioned resin combination hot melt is applied as into resin film, its weight per unit area is controlled to 275 ± 25g/m2,
And use 25g/m2Glass-fiber-fabric as resin membrane carrier, by glass-fiber-fabric containing being immersed in resin film, that is, obtain weight per unit area 300
±25g/m2Middle temperature structural film adhesive.
Performance test：
1st, using 2024-T3 aluminiums (thickness 1.6mm, 0.5mm), 5052 aluminum honeycombs enter row metal list lap shear strength,
Prepared by honeycomb planar stretch and drum peel sample, HBZ197 is pressed in aluminium material surface process《Structural adhesive bonding aluminium alloy phosphoric acid
Technological specification》Carry out, solidification temperature condition is 120 DEG C of insulations 2h, 0.2~0.3MPa of pressure.
2nd, according to ASTM D1002, ASTM C297 and ASTM D1781 row metal list lap shear strength, honeycomb are entered respectively
Planar stretch and climbing drum peel strength are tested, and data are as shown in table 1 below.
The middle temperature structural film adhesive performance data of table 1
As it can be seen from table 1 middle temperature structural film adhesive prepared by the resin combination not only has at room temperature preferably cutting
Shearing stress and peel strength, the shear strength at its 90 DEG C still reaches 28.0MPa.
Embodiment 2
A kind of resin combination, in terms of parts by weight, its composition is as follows：
Component A：30 parts of trifunctional epoxy resin；
B component：15 parts of novolac epoxy resins, 35 parts of rubber elastomer modified epoxies；
Component C：10 parts of dicyandiamide/imidazoles slaine curative systems；
D components：20 parts of nucleocapsid elastic microsphere toughener；
Component E：5 parts of thixotropic agent, 3 parts of silane couplers.
Method in embodiment 1 prepares resin combination, middle temperature structural film adhesive and test sample, and its mechanical property is such as
Shown in table 2 below：
The middle temperature structural film adhesive performance data of table 2
From table 2 it can be seen that middle temperature structural film adhesive prepared by the resin combination being made up of embodiment 2, also shows
Excellent shear strength and peel strength, the shear strength at its 90 DEG C still reaches 26.5MPa.
It should be understood by those skilled in the art that several specific embodiments of the present invention are the foregoing is only, the present invention
It is not limited to that.It should be pointed out that for the person of ordinary skill of the art, many deformations and improvement can also be made,
All deformations or improvement without departing from described in claim are regarded as protection scope of the present invention.
Claims (10)
1. a kind of resin combination, it is characterised in that
In terms of parts by weight, including：25~50 parts of component A, 25~50 parts of B component, 10~25 parts of component C, 5~40 parts
D components and 5~15 parts of component E；
Wherein,
The component A is one or more in polyfunctional epoxy resin；
The B component is one or more in bisphenol-type epoxy resin, novolac epoxy resin or other modified epoxies；
The component C is curative systems；
The D components are activeness and quietness system；
The component E is filler system.
2. resin combination as claimed in claim 1, it is characterised in that described polyfunctional epoxy resin is selected from：
(1) following general formula of molecular structure (I), the trifunctional epoxy resin shown in (II)：
R in its formula of (I)1Hydrogen, halogen atom, alkane, alkene, alkynes or aromatic compound are represented, leads to R in formula II2Represent
Hydrogen, halogen atom, alkane, alkene, alkynes or aromatic compound；Or,
(2) following general formula of molecular structure (III), (IV), the four-functional group epoxy resin shown in (V)：
Wherein, R in formula III is led to3Hydrogen, halogen atom, alkane, alkene, alkynes or aromatic compound are represented, leads to R in formula IV4Generation
Table hydrogen, halogen atom, alkane, alkene, alkynes or aromatic compound, R in formula (V)5Represent hydrogen, halogen atom, alkane, alkene,
Alkynes or aromatic compound.
3. resin combination as claimed in claim 1, it is characterised in that described bisphenol-type epoxy resin is selected from bisphenol A-type
One or more in epoxy resin, bisphenol f type epoxy resin and bisphenol-s epoxy resin.
4. resin combination as claimed in claim 1, it is characterised in that described novolac epoxy resin is selected from such as following molecule
Novolac epoxy resin shown in general structure (VI), (VII)：
Wherein, m=1-3, n=3-7 in formula (VII) in formula VI is led to.
5. resin combination as claimed in claim 1, it is characterised in that other described modified epoxies include organosilicon
Modified epoxy, fluorinated epoxy resin, Maleimide-modified epoxy resin, rubber elastomer modified epoxy and poly-
One or more in urethane Modified Epoxy Resin by Elastomers.
6. resin combination as claimed in claim 1, it is characterised in that described curative systems include imidazoles solidification
Agent, dicyandiamide and its derivatives class firming agent and microcapsule class firming agent, and coordinate corresponding curing accelerator.
7. resin combination as claimed in claim 1, it is characterised in that the activeness and quietness system component include polyurethane,
One kind or many in liquid rubber elastomer, thermoplastic resin, polysiloxane copolymer, nucleocapsid elastic microsphere and nanoparticle
Kind.
8. resin combination as claimed in claim 1, it is characterised in that described filler system includes thixotropic agent, strengthens
One or more in agent, coupling agent and diluent.
9. a kind of middle temperature structural film adhesive, it is characterised in that the middle temperature structural film adhesive is by any one of claim 1~8 institute
The resin combination stated is applied as resin film and forms, and its weight per unit area can be in 100~500g/m2。
10. middle temperature structural film adhesive as claimed in claim 9, it is characterised in that the structural film adhesive covers carrier, and its carrier is selected
Polyester felt or nylon cloth or glass-fiber-fabric.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201611037344.5A CN106675478B (en) | 2016-11-23 | 2016-11-23 | Resin composition and medium-temperature structural adhesive film thereof |
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| CN201611037344.5A CN106675478B (en) | 2016-11-23 | 2016-11-23 | Resin composition and medium-temperature structural adhesive film thereof |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107556954A (en) * | 2017-09-12 | 2018-01-09 | 四川力通复合材料科技有限公司 | A kind of aramid fiber cellular composite material epoxy structural rubber and preparation method thereof |
| CN108084663A (en) * | 2017-12-29 | 2018-05-29 | 广东铁科灌浆科技有限公司 | High resiliency leak stopping modified epoxy grouting material and preparation method thereof |
| CN108219724A (en) * | 2017-12-22 | 2018-06-29 | 上海康达化工新材料股份有限公司 | A kind of amine terminated polyether is modified intermediate temperature setting epoxy jelly membrane and preparation method thereof |
| CN108395860A (en) * | 2018-04-12 | 2018-08-14 | 江苏恒神股份有限公司 | The preparation method of low-temperature setting structural film adhesive |
| CN109233710A (en) * | 2018-06-25 | 2019-01-18 | 安徽众博新材料有限公司 | Insulating material with high glass transition temperature and high-temperature cohesiveness and preparation method thereof |
| CN110452649A (en) * | 2019-08-18 | 2019-11-15 | 上海回天新材料有限公司 | A kind of epoxyn for aluminum honeycomb structural bond |
| CN114752314A (en) * | 2022-04-11 | 2022-07-15 | 中国航发北京航空材料研究院 | High-durability high-temperature curing epoxy structure adhesive film and preparation method thereof |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102498184A (en) * | 2009-08-31 | 2012-06-13 | 塞特克技术公司 | High performance adhesive compositions |
-
2016
- 2016-11-23 CN CN201611037344.5A patent/CN106675478B/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102498184A (en) * | 2009-08-31 | 2012-06-13 | 塞特克技术公司 | High performance adhesive compositions |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107556954A (en) * | 2017-09-12 | 2018-01-09 | 四川力通复合材料科技有限公司 | A kind of aramid fiber cellular composite material epoxy structural rubber and preparation method thereof |
| CN108219724A (en) * | 2017-12-22 | 2018-06-29 | 上海康达化工新材料股份有限公司 | A kind of amine terminated polyether is modified intermediate temperature setting epoxy jelly membrane and preparation method thereof |
| CN108084663A (en) * | 2017-12-29 | 2018-05-29 | 广东铁科灌浆科技有限公司 | High resiliency leak stopping modified epoxy grouting material and preparation method thereof |
| CN108084663B (en) * | 2017-12-29 | 2019-11-29 | 广东铁科灌浆科技有限公司 | High resiliency leak stopping modified epoxy grouting material and preparation method thereof |
| CN108395860A (en) * | 2018-04-12 | 2018-08-14 | 江苏恒神股份有限公司 | The preparation method of low-temperature setting structural film adhesive |
| CN109233710A (en) * | 2018-06-25 | 2019-01-18 | 安徽众博新材料有限公司 | Insulating material with high glass transition temperature and high-temperature cohesiveness and preparation method thereof |
| CN109233710B (en) * | 2018-06-25 | 2021-04-02 | 安徽众博新材料有限公司 | Insulating material with high glass transition temperature and high-temperature cohesiveness and preparation method thereof |
| CN110452649A (en) * | 2019-08-18 | 2019-11-15 | 上海回天新材料有限公司 | A kind of epoxyn for aluminum honeycomb structural bond |
| CN114752314A (en) * | 2022-04-11 | 2022-07-15 | 中国航发北京航空材料研究院 | High-durability high-temperature curing epoxy structure adhesive film and preparation method thereof |
| CN114752314B (en) * | 2022-04-11 | 2024-02-13 | 中国航发北京航空材料研究院 | High-durability high-temperature cured epoxy structural adhesive film and preparation method thereof |
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| Publication number | Publication date |
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| CN106675478B (en) | 2020-04-28 |
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