CN107674222A - A kind of aramid fiber composite material preparation method of interfacial adhesion enhancing - Google Patents
A kind of aramid fiber composite material preparation method of interfacial adhesion enhancing Download PDFInfo
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- CN107674222A CN107674222A CN201711062101.1A CN201711062101A CN107674222A CN 107674222 A CN107674222 A CN 107674222A CN 201711062101 A CN201711062101 A CN 201711062101A CN 107674222 A CN107674222 A CN 107674222A
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/14—Polycondensates modified by chemical after-treatment
- C08G59/1433—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
- C08G59/1477—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing nitrogen
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/04—Reinforcing macromolecular compounds with loose or coherent fibrous material
- C08J5/046—Reinforcing macromolecular compounds with loose or coherent fibrous material with synthetic macromolecular fibrous material
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
- C08J2363/02—Polyglycidyl ethers of bis-phenols
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2463/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
- C08L77/10—Polyamides derived from aromatically bound amino and carboxyl groups of amino-carboxylic acids or of polyamines and polycarboxylic acids
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- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
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- Polymers & Plastics (AREA)
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- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- General Chemical & Material Sciences (AREA)
- Reinforced Plastic Materials (AREA)
- Epoxy Resins (AREA)
Abstract
The invention discloses a kind of aramid fiber reinforced composite preparation method of interfacial adhesion enhancing.It is characterized in that：Isocyanates and epoxy resin are pressed into proportion-controllable and technological reaction first, prepare the modified epoxy that molecular backbone contains five-membered ring structure；Add liquid-state epoxy resin and curing agent is mediated to obtain the prepreg resin system that adhesive property synchronously improves with toughness；Then prepare resin glued membrane, and with aramid fiber or fabric are compound obtains prepreg, finally molding prepares the aramid fiber reinforced composite of interfacial adhesion enhancing.The toughness of the modified epoxy resin system of the present invention improves, the adhesive property of resin matrix and aramid fiber strengthens, and prepared prepeg process performance is good, and machine-shaping window is wide, the interlaminar shear strength of composite is obviously improved, and can be used for aramid fiber structural composite material.
Description
Technical field：
The invention belongs to the preparation field of composite, more particularly to a kind of aramid fiber composite material system of interfacial adhesion enhancing
Preparation Method.
Background technology：
Aramid fiber reinforced composite has the advantages such as high specific strength, specific modulus, chemical stability and designability, is described as
One of three big high performance materials.But aramid fiber surface is smooth, there is larger chemical inertness, the wellability with resin matrix
Poor, interface shear strength is low, and large effect is caused to the failure mode and macro-mechanical property of composite.Improve virtue
The approach of synthetic fibre fibrous composite interface performance：First, the toughening modifying of epoxy resin, is allowed to match with the toughness of aramid fiber,
Improve the transmission of load between matrix and fiber, improve composite material interface performance.Patent CN104059590A discloses a kind of increasing
The epoxyn of tough modification, epoxy resin is realized by adding epoxidized polybutadiene and DOTP
Toughness reinforcing, the toughness matching effect of resin and aramid fiber is improved, improve the interface performance of resin and aramid fiber, but increase
Adding for modeling agent makes the modulus of resin be decreased with heat resistance；Second, the adhesive property of resin matrix is improved, it is high by adding
The method for bonding component or polar group being introduced in strand, utilize the boundary of chemical bonding or polarity effect increase composite
Face bonds.Polyurethane flexible segment is introduced into epoxy resin structural by patent CN103113604A, to the same of resin matrix toughness reinforcing
When, strengthen the cohesive force between modified resin system and reinforcing fiber using highly polar carbamate groups, but this
The interfacial adhesion of kind method composite improves limited.
The content of the invention：
The defects of interfacial bond property difference it is an object of the invention to overcome aramid fiber reinforced composite, pass through isocyanic acid
Ester has obtained the modified epoxy that a kind of adhesive property synchronously improves with toughness, applied to prepreg to epoxy resin modification
In resin system, widened prepreg machine-shaping window, improve composite resin matrix matched with the toughness of fiber and
Interface com-patibilising effect, realize being obviously improved for aramid fiber reinforced composite interlaminar shear strength.
The main technical schemes of the present invention：(1) by diisocyanate and epoxy resin according to-NCO:Epoxy molar ratio 1：
2~1：5, under catalyst action, react 2~6h in 150~200 DEG C and obtain modified epoxy, relative to 100 parts of modified rings
Oxygen tree fat, the mass fraction of catalyst is 0.02~0.5 part；(2) in above-mentioned modified epoxy, liquid epoxies is added
Mediated with latent curing agent system, prepreg epoxy-resin systems are prepared, wherein with liquid epoxies and modified epoxy tree
The total dosage of fat is 100 parts of calculating, and the mass fraction of liquid epoxies is 30~60 parts, and the mass fraction of latent curing agent is
9~30 parts；(3) resin system for obtaining step (2) uses adhesive film machine film, is presoaked via compounding machine and aramid fiber multiple
Close, obtain aramid fiber prepreg, molding prepares aramid fiber reinforced composite.
Described modified epoxy, no isocyanuric acid ester characteristic peak is detected using REAL TIME INFRARED THERMAL IMAGE and existed, using differential
Scanning calorimetry test is under high temperature (150 DEG C~200 DEG C) without side reaction exothermic peak.
Described diisocyanate is methyl diphenylene diisocyanate (MDI), isocyanates is the isocyanide of hexa-methylene two
Acid esters (HDI), toluene di-isocyanate(TDI) (TDI), dibenzyl diisocyanate (DBDI), IPDI (IPDI)
In one or more；
The described epoxy resin with isocyanates reaction is bisphenol A type epoxy resin, bisphenol f type epoxy resin, bis-phenol
One or more in AD types epoxy resin, phenol aldehyde type epoxy resin；
Described catalyst is N, N'- dimethyl Bians amine, triethylamine, 2-methylimidazole, 2-ethyl-4-methylimidazole,
One or more combinations in ZnI, zinc polycarboxylate, zinc chloride/trimethylamine complex.
Bisphenol-type epoxy resin, cycloaliphatic epoxy resin, the glycidyl amine of the preferred low viscosity of liquid epoxies
One or more of combinations in type, glycidyl ester type epoxy resin or epoxide diluent.
The latent curing system is dicyandiamide, modified dicyandiamine, imidazoles, carbamide derivative, diamino-diphenyl first
One or more in alkane, diaminodiphenylsulfone.
The present invention characteristic and advantage be：
1st, by rational raw material proportioning and technological design, make isocyanates and isocyanuric acid ester caused by epoxy reaction complete
Portion's Zhuanization Wei oxazolidones, add the distance of solidfied material rigidity crosslinking points, reduce crosslink density, so as to effectively improve tree
The toughness of aliphatic radical body；
2nd, by introducing highly polar oxazolidones five-membered ring structure, the polarity and bonding of resin matrix are significantly increased
Property, the interfacial bond property being favorably improved between aramid fiber and resin matrix；
3rd, chain extending reaction improves the molecular weight of modified epoxy, improves the initial viscosity of prepreg resin system, widens
The high temperature viscosity technique platform of resin matrix, effectively prevent the gummosis in process while wetting fibre；
4th, prepreg epoxy-resin systems prepared by the present invention, the toughness of resin matrix and aramid fiber can be significantly improved
Matching and interface compatibility, finally improve the Interlaminar shear strengths of composite.
Brief description of the drawings：
Fig. 1 is the molecular structure characterization test of different resins；
Fig. 2 is the rheological curve of different resins matrix；
Fig. 3 is the fracture toughness (K of different resins pour massIC)；
Fig. 4 is the interlaminar shear strength of different aramid fiber reinforced composites.
Embodiment
More detailed description is done to the present invention below by way of specific embodiment：
The fracture toughness of resin-cast body is tested using standard ASTMD5045 in the present invention；The interlayer shear of composite
Intensity is tested using standard JC/T773；The rheological property of modified epoxy is tested by rotational rheometer in the present invention.
Embodiment 1
By methyl diphenylene diisocyanate and bisphenol A epoxide resin according to NCO：Epoxy mol ratio is 1：2, add catalysis
Agent 2-methylimidazole, 2h are reacted in 200 DEG C, obtain modified epoxy, relative to 100 parts of modified epoxies, catalyst
Mass fraction is 0.02 part；Added in above-mentioned modified epoxy three-functionality-degree glycidyl amine epoxy resin and dicyandiamide and
3- phenyl -1,1- dimethyl urea curing systems are mediated to obtain prepreg epoxy-resin systems, wherein with three-functionality-degree glycidol
Amine epoxy resin is 100 parts of calculating with the total dosage of modified epoxy, and three-functionality-degree glycidyl amine epoxy resin is 30 parts, double
Cyanamide is 8 parts, and 3- phenyl -1,1- dimethyl urea is 1 part；Obtained resin system is used into adhesive film machine film, via compounding machine
It is compound with aramid fiber preimpregnation, aramid fiber prepreg is obtained, the prepreg of cutting is placed in mould, 130 DEG C × 2h is obtained
Composite board.
The reaction end monitoring of modified epoxy is as follows in the present invention：Isocyanurate ring in product is detected using REAL TIME INFRARED THERMAL IMAGE
Characteristic peaks mark isocyanurate ring, and (IS ring) Bei oxazolidones rings (OX rings) are completely covered, with differential scanning calorimetry height
Temperature area (150 DEG C~200 DEG C), can't detect the exothermic heat of reaction peak of isocyanuric acid ester；Test the fracture toughness of resin-cast body
For 2.7MPa.m1/2, the interlaminar shear strength of test compound material sheet material is 55MPa.
Embodiment 2
By toluene di-isocyanate(TDI) and bisphenol F epoxy resin according to NCO：Epoxy mol ratio is 1：5, add catalyst n, N-
Dimethyl Bian amine, 6h is reacted in 150 DEG C, modified epoxy is obtained, relative to 100 parts of modified epoxies, the matter of catalyst
It is 0.5 part to measure fraction；Bis-phenol A glycidyl ether and dicyandiamide and diamino-diphenyl first are added in above-mentioned modified epoxy
Alkane curing system is mediated to obtain prepreg epoxy-resin systems, wherein always being used with bis-phenol A glycidyl ether and modified epoxy
It is 60 parts to measure as 100 parts of calculating, bis-phenol A glycidyl ether, and dicyandiamide is 10 parts, and diaminodiphenyl-methane is 10 parts；Will
The resin system arrived uses adhesive film machine film, compound via compounding machine and aramid fiber preimpregnation, obtains aramid fiber prepreg, will
The prepreg of cutting is placed in mould, and 130 DEG C × 2h obtains composite board.
The reaction end monitoring of modified epoxy is as follows in the present invention：Isocyanurate ring in product is detected using REAL TIME INFRARED THERMAL IMAGE
Characteristic peaks mark isocyanurate ring, and (IS ring) Bei oxazolidones rings (OX rings) are completely covered, with differential scanning calorimetry height
Temperature area (150 DEG C~200 DEG C), can't detect the exothermic heat of reaction peak of isocyanuric acid ester；Test the fracture toughness of resin-cast body
For 4.1MPa.m1/2, the interlaminar shear strength of test compound material sheet material is 50MPa.
Embodiment 3
By hexamethylene diisocyanate and phenol aldehyde type epoxy resin according to NCO：Epoxy mol ratio is 1：2.5, addition is urged
Agent 2-ethyl-4-methylimidazole, 3h are reacted in 170 DEG C, obtain modified epoxy, relative to 100 parts of modified epoxies,
The mass fraction of catalyst is 0.3 part；Liquid novolac epoxy resin and dicyandiamide and miaow are added in above-mentioned modified epoxy
Azoles curing agent is mediated to obtain prepreg epoxy-resin systems, wherein with liquid novolac epoxy resin and the total dosage of modified epoxy
For 100 parts of calculating, liquid novolac epoxy resin is 50 parts, and dicyandiamide is 10 parts, and imidazoles is 2 parts；Obtained resin system is adopted
It is compound via compounding machine and aramid fiber preimpregnation with adhesive film machine film, aramid fiber prepreg is obtained, the prepreg of cutting is put
In mould, 130 DEG C × 2h obtains composite board.
The reaction end monitoring of modified epoxy is as follows in the present invention：Isocyanurate ring in product is detected using REAL TIME INFRARED THERMAL IMAGE
Characteristic peaks mark isocyanurate ring, and (IS ring) Bei oxazolidones rings (OX rings) are completely covered, with differential scanning calorimetry height
Temperature area (150 DEG C~200 DEG C), can't detect the exothermic heat of reaction peak of isocyanuric acid ester；Test the fracture toughness of resin-cast body
For 3.4MPa.m1/2, the interlaminar shear strength of test compound material sheet material is 52MPa.
Comparative example
By methyl diphenylene diisocyanate and bisphenol A epoxide resin according to NCO：Epoxy mol ratio is 1：2, add catalysis
Agent 2-methylimidazole, 3h are reacted in 130 DEG C, obtain modified epoxy, relative to 100 parts of modified epoxies, catalyst
Mass fraction is 0.02 part, and the preparation of other resin systems proportioning and composite is identical with embodiment 1.
The reaction end monitoring of modified epoxy is as follows in the present invention：Isocyanurate ring in product is detected using REAL TIME INFRARED THERMAL IMAGE
Characteristic peaks, which mark, has isocyanurate ring (IS ring) Yu oxazolidones rings (OX rings), with differential scanning calorimetry high-temperature region
Domain (150 DEG C~200 DEG C), detects the exothermic heat of reaction peak of isocyanuric acid ester at 155 DEG C be present；Test the disconnected of resin-cast body
It is 2.2MPa.m to split toughness1/2, the interlaminar shear strength of test compound material sheet material is 44MPa.
Claims (6)
- A kind of 1. aramid fiber composite material preparation method of interfacial adhesion enhancing, it is characterised in that：(1) by diisocyanate and epoxy Resin is according to-NCO:Epoxy molar ratio 1：2~1：5, under catalyst action, react 2~6h in 150~200 DEG C and changed Property epoxy resin, relative to 100 parts of modified epoxies, the mass fraction of catalyst is 0.02~0.5 part；(2) in above-mentioned modified epoxy, add liquid epoxies and mediated with latent curing agent system, prepare prepreg Epoxy-resin systems, wherein using liquid epoxies and the total dosage of modified epoxy as 100 parts of calculating, liquid epoxies Mass fraction is 30~60 parts, and the mass fraction of latent curing agent is 9~20 parts；(3) resin system for obtaining step (2) uses adhesive film machine film, compound via compounding machine and reinforcing fiber preimpregnation, obtains To aramid fiber prepreg, molding prepares aramid fiber reinforced composite.
- 2. preparation method according to claim 1, it is characterised in that：Described diisocyanate is diphenylmethane diisocyanate Ester, isocyanates are that hexamethylene diisocyanate, toluene di-isocyanate(TDI), dibenzyl diisocyanate, isophorone two are different One or more in cyanate.
- 3. preparation method according to claim 1, it is characterised in that：The described epoxy resin with di-isocyanate reaction is double One or more in phenol A types epoxy resin, bisphenol f type epoxy resin, bisphenol-A D-ring oxygen tree fat, phenol aldehyde type epoxy resin.
- 4. preparation method according to claim 1, it is characterised in that：Described catalyst is N, N'- dimethyl Bians amine, three second Amine, 2-methylimidazole, 2-ethyl-4-methylimidazole, zinc iodide, zinc polycarboxylate, one kind in zinc chloride/trimethylamine complex or more Kind combination.
- 5. preparation method according to claim 1, it is characterised in that：The liquid epoxies is bisphenol-type epoxy resin, fat One or more of groups in ring race epoxy resin, glycidic amine type, glycidyl ester type epoxy resin or epoxide diluent Close.
- 6. preparation method according to claim 1, it is characterised in that：The latent curing system is dicyandiamide, modified double cyanogen One or more in amine, carbamide derivative, diaminodiphenyl-methane, diaminodiphenylsulfone.
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108589301A (en) * | 2018-05-17 | 2018-09-28 | 北京化工大学 | Sizing agent is as the application of aramid fiber surface modification inorganic agent, aramid fiber-resin composite materials and preparation method |
| CN110093016A (en) * | 2019-05-31 | 2019-08-06 | 北京化工大学 | A kind of preparation method of low dielectric composite material |
| CN110527255A (en) * | 2019-09-09 | 2019-12-03 | 东莞泰合复合材料有限公司 | A kind of epoxy resin-base, composite material, vehicle frame and preparation method thereof |
| CN114991730A (en) * | 2022-06-13 | 2022-09-02 | 中海石油(中国)有限公司 | Thick oil thermal recovery simulation interlayer and manufacturing method thereof |
| CN115449110A (en) * | 2022-10-09 | 2022-12-09 | 南京林业大学 | Aramid fiber reinforced epoxy resin-based composite material and preparation method thereof |
| CN116535822A (en) * | 2023-06-29 | 2023-08-04 | 泰和新材集团股份有限公司 | Resin glue solution for aramid composite material IV type bottle and preparation method |
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| CN106987013A (en) * | 2017-05-17 | 2017-07-28 | 中威北化科技有限公司 | The preparation method for the intermediate temperature setting epoxy prepreg that glass transition temperature is improved |
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| CN106987013A (en) * | 2017-05-17 | 2017-07-28 | 中威北化科技有限公司 | The preparation method for the intermediate temperature setting epoxy prepreg that glass transition temperature is improved |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108589301A (en) * | 2018-05-17 | 2018-09-28 | 北京化工大学 | Sizing agent is as the application of aramid fiber surface modification inorganic agent, aramid fiber-resin composite materials and preparation method |
| CN110093016A (en) * | 2019-05-31 | 2019-08-06 | 北京化工大学 | A kind of preparation method of low dielectric composite material |
| CN110093016B (en) * | 2019-05-31 | 2020-06-09 | 北京化工大学 | Preparation method of low dielectric composite material |
| CN110527255A (en) * | 2019-09-09 | 2019-12-03 | 东莞泰合复合材料有限公司 | A kind of epoxy resin-base, composite material, vehicle frame and preparation method thereof |
| CN114991730A (en) * | 2022-06-13 | 2022-09-02 | 中海石油(中国)有限公司 | Thick oil thermal recovery simulation interlayer and manufacturing method thereof |
| CN115449110A (en) * | 2022-10-09 | 2022-12-09 | 南京林业大学 | Aramid fiber reinforced epoxy resin-based composite material and preparation method thereof |
| CN115449110B (en) * | 2022-10-09 | 2023-07-21 | 南京林业大学 | Aramid fiber reinforced epoxy resin matrix composite material and preparation method thereof |
| CN116535822A (en) * | 2023-06-29 | 2023-08-04 | 泰和新材集团股份有限公司 | Resin glue solution for aramid composite material IV type bottle and preparation method |
| CN116535822B (en) * | 2023-06-29 | 2023-10-17 | 泰和新材集团股份有限公司 | Resin glue solution for aramid composite material IV type bottle and preparation method |
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