CN108440903A - A kind of halogen-free resin composition and its low fluidity prepreg - Google Patents
A kind of halogen-free resin composition and its low fluidity prepreg Download PDFInfo
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- CN108440903A CN108440903A CN201810120776.5A CN201810120776A CN108440903A CN 108440903 A CN108440903 A CN 108440903A CN 201810120776 A CN201810120776 A CN 201810120776A CN 108440903 A CN108440903 A CN 108440903A
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2217—Oxides; Hydroxides of metals of magnesium
- C08K2003/2224—Magnesium hydroxide
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/02—Flame or fire retardant/resistant
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/22—Halogen free composition
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
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Abstract
The invention discloses a kind of halogen-free resin composition and its low fluidity prepregs.The halogen-free resin composition includes that component and parts by weight are as follows：20~80 parts of composition epoxy resin, 10~50 parts of phenoxy resin, 10~50 parts of fire retardant, 3~30 parts of toughener, 10~80 parts of inorganic filler, 1~10 part of curing agent, 0~5 part of accelerating agent, 0~80 part of additive.The present invention passes through bisphenol-f type phenoxy resin, liquid-state epoxy resin and modification of the aliphatic epoxy resin to ordinary epoxy resin containing long-chain, obtained halogen-free resin composition viscosity is relatively low, with preferable wellability, its low fluidity prepreg made has higher flexibility, Tg and adhesive strength, excellent heat resistance, it is environmentally protective, while not falling resin dust, it can long-term preservation.
Description
Technical field
The present invention relates to printed wiring board resin material fields, and in particular to a kind of halogen-free resin composition and its low stream
Dynamic degree prepreg.
Background technology
As electronic equipment develops to microminaturization, multifunction direction, while requiring printed wiring board (PCB) height close
Collectionization, high performance, and in order to realize the 3 D stereo installation of electronic product, it is increasingly considered and uses rigid-flexible combination
(rigid-flexible) technology, thus rigid-flexible combination PCB development is getting faster.
Low Resin Flow prepreg (No flow prepreg) is come relative to common FR-4 bonding sheets (prepreg)
It says, B-stage resin not gummosis or few gummosis at high temperature under high pressure, while bonding force etc. is functional, is suitable for rigidity PCB
It is used as connecting material between plate and flexible PCB, therefore is widely used in rigid-flexible combination printed wiring board (PCB) and makes.
So far, it in patent CN 102775734A, uses with core shell rubbers modified host resin, although can reach
The effect of toughening, but the reduction of glass transition temperature (Tg) can be caused, it is poor with the binding force of polyimides (PI) film, it is resistance to
It is hot poor, while rubber components are easy to be precipitated and weatherability is poor.It is a large amount of double by introducing in CN 102311614B
Phenol A types phenoxy resin and biphenyl epoxy resin overcome due to introducing core shell rubbers and the phenomenon that so that Tg is reduced, but can make resin
The whole viscosity of glue becomes larger, and the wellability of corresponding reinforcing material is poor.
Therefore, in order to overcome above-mentioned problems of the prior art, the present invention is by introducing the better Bisphenol F of wellability
Type phenoxy resin improves the wellability of resin system, while introducing liquid-state epoxy resin and the aliphatic epoxy resin containing long-chain
Toughening modifying is carried out to ordinary epoxy resin, further improves the wellability of glue, while making prepreg that there is preferably stream
It moves property and does not fall resin dust, can effectively improve the flexibility and Tg of prepreg, there is good processability.
Invention content
The purpose of the present invention is to provide a kind of halogen-free resin composition and its low fluidity prepregs.Halogen of the present invention
Resin combination viscosity is relatively low, have preferable wellability, make low fluidity prepreg have higher flexibility,
Tg and adhesive strength, excellent heat resistance is environmentally protective, while not falling resin dust, can long-term preservation.
In order to achieve the above purpose, the present invention takes following technical scheme：
A kind of halogen-free resin composition, including component and parts by weight it is as follows：20~80 parts of composition epoxy resin, phenol oxygen tree
10~50 parts of fat, 10~50 parts of fire retardant, 3~30 parts of toughener, 10~80 parts of inorganic filler, 1~10 part of curing agent, accelerating agent
0~5 part, 0~80 part of additive.
The toughener, including liquid-state epoxy resin and the aliphatic epoxy resin containing long-chain, the liquid-state epoxy resin
For the lower epoxy resin of molecular weight, viscosity is 300~5000cps, preferably 1500~4500cps, epoxide equivalent is 100~
300g/Eq, preferably 150~230g/Eq.The aliphatic epoxy resin molecular weight containing long-chain is 300~900g/mol, excellent
It is 200~600g/Eq, preferably 350~450g/Eq to select 700~900g/mol, epoxide equivalent.
The matter average molecular weight of the phenoxy resin is 1~100,000, and structural formula is as follows：
Wherein, n=50~150, R1Selected from substituted or unsubstituted C1~C15 alkyl and alkoxy, substitution or unsubstituted
C6~C15 aralkyl and aralkoxy, substituted or unsubstituted C3~C15 naphthenic base, substituted or unsubstituted C2~C15 is not
One kind in saturated hydrocarbyl or conjugation alkyl and bicyclic pentadiene；R2Selected from H atom, phosphorus element-containing group, substitution or
Unsubstituted C1~C15 alkyl and alkoxy, substituted or unsubstituted C6~C15 aralkyl and aralkoxy replace or do not take
In C3~C15 naphthenic base in generation, substituted or unsubstituted C2~C15 unsaturated alkyls or conjugation alkyl and bicyclic pentadiene
One kind.Preferably include in bisphenol A-type phenoxy resin, bisphenol-f type phenoxy resin it is one or more be used in mixed way, bisphenol A-type
Phenoxy resin R1For isopropyl, bisphenol-f type phenoxy resin R1For methylene；Preferably 20~40 parts of the parts by weight of the phenoxy resin.
The composition epoxy resin includes bisphenol A type epoxy resin, bisphenol f type epoxy resin, bisphenol S type epoxy
It is resin, aliphatic category epoxy resin, biphenyl epoxy resin, phenol novolak type epoxy, o-cresol formaldehyde type epoxy resin, linear
Novolac epoxy resin, resorcinol type epoxy resin, four-functional group epoxy resin, isocyanate modified epoxy resin, two are shunk
Glyceramine type epoxy resin, multifunctional phenol -2-glycidyl ether compound, polyfunctional alcohol -2-glycidyl ether compound, benzo
One or more in oxazine resin, bimaleimide resin are used in mixed way；The parts by weight of the composition epoxy resin are excellent
Select 20~50 parts.
The fire retardant includes in phosphorus flame retardant, nitrogenated flame retardant, organic silicon fibre retardant and inorganic combustion inhibitor
It is one or more.Wherein phosphorus flame retardant includes Phos, phosphinic acid compounds, hypophosphorous acid compound, phosphate compound, oxygen
Change phosphorus compound, organic nitrogen-containing phosphorus compound, phosphazene compound, the organic phosphorus compound of the structure containing DOPO and structure containing DOPO
Epoxy resin or formaldehyde-phenol resin derivative.Nitrogenated flame retardant can be melamine class compound, cyanuric acid compound, isocyanide
Acid compound and nitrogenous epoxy or phenolic resin and its derivative etc..Organic silicon fibre retardant can be organic silicon rubber, silicon
Resin etc..Inorganic combustion inhibitor includes magnesium hydroxide, aluminium hydroxide, aluminium oxide, barium monoxide etc..It is hindered in the halogen-free resin composition
It can be any of which fire retardant or in which the mixture of any two and the above fire retardant, preferably phosphorus containing phenolic resin to fire agent；Institute
State preferably 20~40 parts of the parts by weight of fire retardant.
The toughener further includes core shell rubbers, core shell rubbers modified epoxy, CTBN rubber, CTBN rubber modified epoxies
In one or more be used in mixed way；Preferably 5~20 parts of the parts by weight of the toughener.
The inorganic filler is surface-treated through or without silane coupling agent；The inorganic filler includes titanium dioxide
Silicon, aluminium hydroxide, aluminium oxide, magnesium hydroxide, boron nitride, aluminium nitride, talcum powder, calcium carbonate, silicon powder and zinc borate, stannic acid
It is one or more in zinc, to achieve the purpose that reduce cost or improve anti-flammability；The parts by weight of the inorganic filler preferably 30
~50 parts.
In the curing agent, including amine curing agent, phenols curing agent, acids curing agent, acid anhydride type curing agent, cyanate
One or more, preferred amine curing agent, curing agent is 0.95~1.05 with epoxide equivalent ratio；The parts by weight of the curing agent
It is preferred that 1~5 part.
One or more in the accelerating agent, including organic metal salt, imidazoles and its derivative, preferably imidazoles promote
Into agent；Preferably 0~1 part of the parts by weight of the accelerating agent.
It is one or more in described additive, including solvent, coupling agent, dispersant etc., preferred solvent and coupling agent.It is molten
Agent includes one kind in acetone, butanone, propylene glycol, methyl ether, dimethylformamide, methylisobutylketone, cyclohexanone, propylene glycol monomethyl ether
Or it is a variety of.Preferably 20~45 parts of the parts by weight of the additive.
Further, the present invention provides a kind of low fluidity prepreg made using above-mentioned halogen-free resin composition,
Its halogen-free resin composition attached thereto after including reinforcing material and being dried by impregnation.
When making, each component of resin combination is dissolved by glue by solvent, by the full and uniform coating of glue
In on reinforcing material, the reinforcing material uniformly containing dipping solution is then toasted into certain time in 150~170 DEG C of baking ovens, makes nothing
Halogen resin combination semi-solid preparation, to which prepreg be made.
Beneficial effects of the present invention：The present invention is by bisphenol-f type phenoxy resin, liquid-state epoxy resin and containing the fat of long-chain
A kind of halogen-free resin composition and its low fluidity prepreg, institute are developed in modification of race's epoxy resin to ordinary epoxy resin
Halogen-free resin composition viscosity obtained is relatively low, have preferable wellability, make low fluidity prepreg have compared with
High flexibility, Tg and adhesive strength, excellent heat resistance is environmentally protective, while not falling resin dust, can long-term preservation.
Phenoxy resin plays choked flow in entire formula system, can effectively reduce the fluidity of resin combination, from
And achieve the purpose that control the low gummosis of prepreg or not gummosis.Simultaneously because on the molecular backbone of phenoxy resin there are phenyl ring and
Propylidyne, therefore there is excellent mechanical performance, electrical property, creep resistance and strong cohesive force.In two benzene of bisphenol A-type phenoxy resin
It is isopropyl between ring, and bisphenol-f type phenoxy resin is methylene, therefore bisphenol-f type phenoxy resin space steric effect is smaller,
It is good to the wellability of glass fabric with the small characteristic of viscosity.Liquid-state epoxy resin is introduced in entire formula system and containing length
The aliphatic epoxy resin of chain is to improve flexibility and wellability.By phenoxy resin, liquid-state epoxy resin and containing the fat of long-chain
Fat race epoxy resin is used in mixed way, and when reaching certain proportion, can be significantly improved the flexibility after resin system solidification, be made made
Prepreg is not easy to lose powder, and has good processability.
Specific implementation mode
Following specific examples is the further explanation to method provided by the invention and technical solution, but is not construed as
Limitation of the present invention.
The concrete component and content of embodiment 1-7 halogen-free resin compositions are matched according to constituent content in table 1.
The method that halogen-free resin composition makes low fluidity prepreg, includes the following steps：
(1) each component of above-mentioned halogen-free resin composition is weighed respectively by weight；
(2) solvent in composition is sufficiently stirred 3h or more with remaining each component to be uniformly mixed, it is 50 to be configured to solid content
~60% halogen-free low fluidity glue.
(3) above-mentioned glue after being uniformly mixed is full and uniform to be coated on 1080 glass fabrics, it is placed in 120~
3~20min is toasted in 200 DEG C of baking oven to get to low fluidity prepreg.
The low fluidity prepreg made according to the above method：Including glass fabric and by attached after dipping and drying
The resin combination on glass fabric.Anti-flammability reaches UL94V-0 grades.
Above-mentioned low fluidity prepreg 6 is opened into overlapping and copper foil is enclosed on two sides, be placed in 20~30kg of vacuum hotpressing machine,
60~90min is pressed at 190~210 DEG C.The performance of gained doublesided copperclad laminate is shown in Table 1, and used test method is such as
Under：
(1) gummosis amount (Flow-in)：The aforementioned prepregs of 4in. × 4in. 3 are taken, and two are gone out using manual die punching machine
The circular hole of a a diameter of 25mm, by the prepreg (die punching machine goes out 4in. × 4in. prepregs after circular hole) after punching,
It is defined with reference to IPC-TM-650 2.3.17.2 standards, according to [steel plate/fender/steel plate/release film/three pieces prepreg/
15mil substrates/steel plate/fender/steel plate] sequence overlapping after, with 171 ± 3 DEG C of temperature, pressure is the condition of 200 ± 10psi
Sample after hot pressing is measured gummosis amount by hot pressing 7 minutes with light microscope.15mil substrates are the same as IPC-TM-650 2.3.17.2 institutes
Definition.
(2) picking amount：It is 10cm × 10cm sizes that prepreg, which is cut into length and width dimensions, and first its quality is referred to as W0, use
Blade by prepreg with every knife 9cm length, it is parallel to cut 30 knives perpendicular to the same specific change of prepreg, then with 2 times/second
Frequency, hand amplitude about 10cm weighs again after upper and lower whipping 50 times, weight is referred to as W1, calculated using following formula
Go out picking amount, is averaged after being repeated 4 times.
Picking amount (%)=(W0-W1)/W0× 100%；
(3) peel strength is tested using IPC-TM-650 2.4.9；
(4) flammability is tested using U.S.'s UL94 vertical combustions；
(5) thermally stratified layer time (T288) is tested using thermomechanical analysis (TMA)；
(6) glass transition temperature (Tg) is tested using differential scanning calorimetry (DSC)；
(7) heat decomposition temperature (Td) is tested using thermogravimetry (TGA).
Embodiment 1-7：According to each component content in table 1 and halogen-free resin composition is prepared with reference to above-mentioned steps, accordingly
Low fluidity prepreg and copper-clad laminate, the results are shown in Table 1 for respective performances.
Table 1
In conclusion the present invention improves the leaching of resin system by introducing the better bisphenol-f type phenoxy resin of wellability
Lubricant nature, while introducing liquid-state epoxy resin and aliphatic epoxy resin containing long-chain and toughening modifying is carried out to ordinary epoxy resin,
The wellability of glue is further improved, while making prepreg that there is preferable mobility and not falling resin dust, it can be effective
The flexibility and Tg of prepreg are improved, there is good processability.
The explanation of above example is only intended to help to understand the method for the present invention and its core concept.It should be pointed out that for
For those skilled in the art, without departing from the principle of the present invention, if can also be carried out to the present invention
Dry improvement and modification, these improvement and modification are also fallen into the claims in the present invention protection domain.
Claims (10)
1. a kind of halogen-free resin composition, which is characterized in that as follows including component and parts by weight：Composition epoxy resin 20~80
Part, 10~50 parts of phenoxy resin, 10~50 parts of fire retardant, 3~30 parts of toughener, 10~80 parts of inorganic filler, curing agent 1~10
Part, 0~5 part of accelerating agent, 0~80 part of additive；
The matter average molecular weight of the phenoxy resin is 1~100,000, and structural formula is as follows：
Wherein, n=50~150, R1Selected from substituted or unsubstituted C1~C15 alkyl and alkoxy, substituted or unsubstituted C6~
C15 aralkyl and aralkoxy, substituted or unsubstituted C3~C15 naphthenic base, substituted or unsubstituted C2~C15 unsaturated hydrocarbons
One kind in base or conjugation alkyl and bicyclic pentadiene；R2Selected from H atom, the group of phosphorus element-containing, substitution or unsubstituted
C1~C15 alkyl and alkoxy, substituted or unsubstituted C6~C15 aralkyl and aralkoxy, substituted or unsubstituted C3
One in~C15 naphthenic base, substituted or unsubstituted C2~C15 unsaturated alkyls or conjugation alkyl and bicyclic pentadiene
Kind；
The toughener includes liquid-state epoxy resin and the aliphatic epoxy resin containing long-chain.
2. halogen-free resin composition according to claim 1, which is characterized in that the liquid-state epoxy resin viscosity is 300
~5000cps, preferably 1500~4500cps, epoxide equivalent are 100~300g/Eq, preferably 150~230g/Eq；Described contains
The aliphatic epoxy resin molecular weight of long-chain be 300~900g/mol, preferably 700~900g/mol, epoxide equivalent be 200~
600g/Eq, preferably 350~450g/Eq.
3. halogen-free resin composition according to claim 1, which is characterized in that the phenoxy resin includes bisphenol A-type phenol
One or both of oxygen resin, bisphenol-f type phenoxy resin, R in the bisphenol A-type phenoxy resin1For isopropyl, the bis-phenol
R in F type phenoxy resins1For methylene；The parts by weight of the phenoxy resin are preferably 20~40 parts.
4. halogen-free resin composition according to claim 1, which is characterized in that the composition epoxy resin includes bis-phenol
A types epoxy resin, bisphenol f type epoxy resin, bisphenol-s epoxy resin, aliphatic category epoxy resin, biphenyl epoxy resin, benzene
Phenol-type epoxy phenolic resin, o-cresol formaldehyde type epoxy resin, linear phenolic epoxy resin, resorcinol type epoxy resin, four officials
Epoxy resin, isocyanate modified epoxy resin, 2-glycidyl amine type epoxy resin, multifunctional phenol -2-glycidyl can be rolled into a ball
Ether compound, polyfunctional alcohol -2-glycidyl ether compound, benzoxazine colophony, one kind in bimaleimide resin or
It is a variety of；The parts by weight of the composition epoxy resin are preferably 20~50 parts.
5. halogen-free resin composition according to claim 1, which is characterized in that the fire retardant includes phosphorous flame-retardant
It is one or more in agent, nitrogenated flame retardant, organic silicon fibre retardant and inorganic combustion inhibitor；The preferably phosphorous phenol of the fire retardant
Urea formaldehyde；The parts by weight of the fire retardant are preferably 20~40 parts.
6. halogen-free resin composition according to claim 1, which is characterized in that the toughener further include core shell rubbers,
It is one or more in core shell rubbers modified epoxy, CTBN rubber, CTBN rubber modified epoxies；The parts by weight of the toughener are excellent
It is selected as 5~20 parts.
7. halogen-free resin composition according to claim 1, which is characterized in that the inorganic filler passes through or without silane
Coupling agent is surface-treated；The inorganic filler include silica, aluminium hydroxide, aluminium oxide, magnesium hydroxide, boron nitride,
It is one or more in aluminium nitride, talcum powder, calcium carbonate, silicon powder and zinc borate, zinc stannate；The weight of the inorganic filler
Preferably 30~50 parts of part.
8. halogen-free resin composition according to claim 1, which is characterized in that the curing agent include amine curing agent,
It is one or more in phenols curing agent, acids curing agent, acid anhydride type curing agent, cyanate, preferred amine curing agent, curing agent
It is 0.95~1.05 with epoxide equivalent ratio；The parts by weight of the curing agent are preferably 1~5 part.
9. halogen-free resin composition according to claim 1, which is characterized in that the accelerating agent include organic metal salt,
It is one or more in imidazoles and its derivative, preferred imidazoles accelerating agent；The additive includes solvent, coupling agent, divides
It is one or more in powder, preferred solvent and coupling agent；The solvent includes acetone, butanone, propylene glycol, methyl ether, dimethyl
It is one or more in formamide, methylisobutylketone, cyclohexanone, propylene glycol monomethyl ether.
10. a kind of low fluidity prepreg made using claim 1-9 any one of them halogen-free resin compositions,
Including reinforcing material and by being impregnated with the halogen-free resin composition being attached to after drying on reinforcing material.
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109504033A (en) * | 2018-10-30 | 2019-03-22 | 广东翔思新材料有限公司 | A kind of flexibility prepreg and preparation method thereof |
| CN112646091A (en) * | 2020-12-21 | 2021-04-13 | 苏州生益科技有限公司 | Resin composition and low-flow-rate prepreg prepared from same |
| CN112662321A (en) * | 2020-12-21 | 2021-04-16 | 苏州生益科技有限公司 | Resin composition and low-flow-rate prepreg manufactured by using same |
| CN112662131A (en) * | 2020-12-22 | 2021-04-16 | 广东盈骅新材料科技有限公司 | Liquid crystal modified resin composition, composite resin, prepreg and printed wiring board |
| CN112662356A (en) * | 2020-12-21 | 2021-04-16 | 苏州生益科技有限公司 | Resin composition and low-flow-rate prepreg manufactured by using same |
| CN112724598A (en) * | 2020-12-28 | 2021-04-30 | 广东盈骅新材料科技有限公司 | Resin composition, prepreg and preparation method and application thereof |
| CN113121955A (en) * | 2019-12-30 | 2021-07-16 | 浙江华正新材料股份有限公司 | Ultrathin halogen-free flame-retardant glass fiber plate with low roughness and preparation method thereof |
| CN114085491A (en) * | 2021-11-24 | 2022-02-25 | 广东盈骅新材料科技有限公司 | Polyether-ether-ketone modified epoxy resin composition and preparation method thereof |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107286583A (en) * | 2017-06-20 | 2017-10-24 | 苏州生益科技有限公司 | A kind of resin combination and the low flow prepreg made using it |
-
2018
- 2018-02-07 CN CN201810120776.5A patent/CN108440903A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107286583A (en) * | 2017-06-20 | 2017-10-24 | 苏州生益科技有限公司 | A kind of resin combination and the low flow prepreg made using it |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109504033A (en) * | 2018-10-30 | 2019-03-22 | 广东翔思新材料有限公司 | A kind of flexibility prepreg and preparation method thereof |
| CN109504033B (en) * | 2018-10-30 | 2021-01-01 | 广东翔思新材料有限公司 | Flexible prepreg and preparation method thereof |
| CN113121955A (en) * | 2019-12-30 | 2021-07-16 | 浙江华正新材料股份有限公司 | Ultrathin halogen-free flame-retardant glass fiber plate with low roughness and preparation method thereof |
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| CN112646091A (en) * | 2020-12-21 | 2021-04-13 | 苏州生益科技有限公司 | Resin composition and low-flow-rate prepreg prepared from same |
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