CN108436313A - Diamond cut fixing device - Google Patents
Diamond cut fixing device Download PDFInfo
- Publication number
- CN108436313A CN108436313A CN201810488385.9A CN201810488385A CN108436313A CN 108436313 A CN108436313 A CN 108436313A CN 201810488385 A CN201810488385 A CN 201810488385A CN 108436313 A CN108436313 A CN 108436313A
- Authority
- CN
- China
- Prior art keywords
- diamond
- rotating seat
- supporting rack
- elevating lever
- fixing device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000010432 diamond Substances 0.000 title claims abstract description 72
- 229910003460 diamond Inorganic materials 0.000 title claims abstract description 70
- 230000003028 elevating effect Effects 0.000 claims abstract description 27
- 238000001179 sorption measurement Methods 0.000 claims abstract description 5
- 238000010521 absorption reaction Methods 0.000 claims abstract description 4
- 238000003698 laser cutting Methods 0.000 abstract description 3
- 230000002093 peripheral effect Effects 0.000 description 6
- 102000008579 Transposases Human genes 0.000 description 4
- 108010020764 Transposases Proteins 0.000 description 4
- 230000007423 decrease Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000004575 stone Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
- B28D7/04—Accessories specially adapted for use with machines or devices of the preceding groups for supporting or holding work or conveying or discharging work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
- B28D7/04—Accessories specially adapted for use with machines or devices of the preceding groups for supporting or holding work or conveying or discharging work
- B28D7/043—Accessories specially adapted for use with machines or devices of the preceding groups for supporting or holding work or conveying or discharging work the supporting or holding device being angularly adjustable
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Abstract
The invention discloses a kind of diamond cut fixing device, including supporting rack, upper rotating seat, the controller of rotating seat rotation, upper elevating lever are used to support the bottom core of diamond, thimble and pressure sensor in control;The bottom of thimble is equipped with the adsorption piece of absorption diamond, and top is fixedly connected with upper elevating lever lower end, and upper elevating lever upper end is fixedly connected with upper rotating seat, and upper rotating seat is fixed at the top of supporting rack and is rotatably connected with supporting rack, and bottom core is set to the underface of thimble.Its advantages of is that diamond is clamped between bottom core and thimble, and external laser cutting head can cut diamond different sides, and diamond clamps firm stable.
Description
Technical field
The present invention relates to diamond cut fixing device, especially a kind of diamond cut fixing device.
Background technology
The former stone of diamond is diamond, and diamond cut needs to cut diamond, and so as to following process, diamond is adding
Different sides are cut in man-hour requirement, and therefore, diamond needs different faces to be exposed to outside to cut, and existing diamond is solid
Determine device cannot achieve the different sides of the different sides of diamond are exposed to it is outer to cut.
Invention content
Present invention aims to solve the deficiencies of the prior art, and provides a kind of a kind of diamond cut fixing devices.
A kind of technical solution of the present invention:
A kind of diamond cut fixing device, including supporting rack, upper rotating seat, the controller of rotating seat rotation in control,
Upper elevating lever is used to support the bottom core of diamond, thimble and pressure sensor;The bottom of thimble is equipped with the adsorption piece of absorption diamond,
Top is fixedly connected with upper elevating lever lower end, and upper elevating lever upper end is fixedly connected with upper rotating seat, and upper rotating seat is fixed at branch
It the top of support and is rotatably connected with supporting rack, bottom core is set to the underface of thimble.
A kind of preferred embodiment is that the upper end side wall of bottom core is equipped with several V-shaped notches along circumferential direction.
It further includes lower rotating seat and lower elevating lever that a kind of preferred embodiment, which is diamond cut fixing device, and lower rotating seat is set to
It the bottom of supporting rack and is rotatablely connected with supporting rack, the lower end of lower elevating lever is fixedly connected with lower rotating seat, upper end and bottom
The removable connection of core.
A kind of preferred embodiment is that diamond cut fixing device further includes left side telescopic rod and right side telescopic rod, and left side is flexible
One end of bar is fixedly connected with supporting rack left side wall, and the other end is connected with left collet;One end of right side telescopic rod is right with supporting rack
Side wall is fixedly connected, and the other end is connected with right collet.
In summary technical solution, beneficial effects of the present invention:Diamond is clamped between bottom core and thimble, and external laser is cut
Cutting head certain can cut diamond downside on one side, and after certain has cut on one side on the downside of diamond, thimble adsorbs diamond, rises
It drops bar to rise, upper rotating seat rotates an angle, and upper elevating lever declines, and diamond is clamped in again between bottom core and thimble, and outside is swashed
Light cutting head can cut another side on the downside of diamond, so recycle, and can complete peripheral wall cutting on the downside of diamond;When need
Will be to when certain cuts on one side on the upside of diamond, diamond be clamped between bottom core and thimble, external laser can be on the upside of diamond
Certain is cut on one side, and after having cut, the decline of lower elevating lever, diamond declines together with lower elevating lever, lower rotating seat rotation
Turn an angle, lower elevating lever rises so that diamond is clipped in again between bottom core and thimble, and external laser can be to another on the upside of diamond
It is cut, is so recycled on one side, it can be to the upside peripheral wall cutting of diamond;V-shaped notch facilitates the peripheral wall of diamond to be exposed to
Outside the core of bottom, facilitate cutting, left collet and right collet can better fixed diamonds.
Above description is only the general introduction of technical solution of the present invention, in order to better understand the technical means of the present invention,
And can be implemented in accordance with the contents of the specification, and in order to allow the above and other objects, features and advantages of the present invention can
It is clearer and more comprehensible, it is special below to lift preferred embodiment, and coordinate attached drawing, detailed description are as follows.
Description of the drawings
Fig. 1 is the schematic diagram of the present invention;
Fig. 2 is schematic diagram when diamond clamps in the present invention.
Specific implementation mode
As depicted in figs. 1 and 2, a kind of 20 cutting fixing device of diamond, including supporting rack 10, upper rotating seat 11, control
The controller (unmarked in figure) that upper rotating seat 11 rotates, upper elevating lever 12 are used to support the bottom core 13 of diamond 20,14 He of thimble
Pressure sensor (unmarked in figure);Pressure sensor is used to detect the pressure between bottom core 13 and thimble 14, so as to better
Clamp diamond 20, the bottom of thimble 14 is equipped with the adsorption piece (unmarked in figure) of absorption diamond 20, top under upper elevating lever 12
End is removable connection, therefore different thimbles 14 can be replaced according to diamond size, and adsorption piece can be vacuum suction,
12 upper end of upper elevating lever is fixedly connected with upper rotating seat 11, and upper rotating seat 11 is fixed at the top of supporting rack 10 and and supporting rack
10 rotatable connections, bottom core 13 are set to the underface of thimble 14.
As depicted in figs. 1 and 2, diamond 20 is clamped between bottom core 13 and thimble 14, and external laser cutting head can be to boring
Certain is cut 20 downside of stone on one side, and after when 20 downside of diamond, certain has cut on one side, thimble 14 adsorbs diamond 20, upper elevating lever
12 rise, and upper rotating seat 11 rotates an angle, and upper elevating lever 12 declines so that diamond 20 is clamped in bottom core 13 and top again later
Between needle 14, external laser cutting head can cut 20 downside another side of diamond, so recycle, can will be under diamond 20
Side peripheral wall cutting is completed;The upper end side wall of bottom core 13 is equipped with several V-shaped notches 131 along circumferential direction.V-shaped notch 131
Facilitate the peripheral wall of diamond 20 to be exposed to outside bottom core 13, facilitates cutting.
As depicted in figs. 1 and 2,20 cutting fixing device of diamond further includes backspin transposase 11 5 and lower elevating lever 16, backspin
Transposase 11 5 is set to the bottom of supporting rack 10 and is rotatablely connected with supporting rack 10, and lower end and the backspin transposase 11 5 of lower elevating lever 16 are fixed
Connection, upper end and the 13 removable connection of bottom core.The upper end of lower elevating lever 16 and the 13 removable connection of bottom core, therefore can replace not
With bottom core 13, adapt to different size of diamond cut, when needing that certain cuts on one side to the upside of diamond 20, diamond 20 presss from both sides
Tightly between bottom core 13 and thimble 14, external laser certain can cut 20 upside of diamond on one side, after having cut, lower liter
The decline of bar 16 is dropped, and diamond 20 declines together with lower elevating lever 16, and backspin transposase 11 5 rotates an angle, descends elevating lever 16 later
Rise so that diamond 20 is clipped in again between bottom core 13 and thimble 14, external laser can cut 20 upside another side of diamond
It cuts, so recycles, it can be to the upside peripheral wall cutting of diamond 20;
As depicted in figs. 1 and 2,20 cutting fixing device of diamond further includes left side telescopic rod 17 and right side telescopic rod 18,
One end of left side telescopic rod 17 is fixedly connected with 10 left side wall of supporting rack, and the other end is connected with left collet 171;Right side telescopic rod 18
One end be fixedly connected with 10 right side wall of supporting rack, the other end is connected with right collet 181.Left collet 171 and right collet 181 can be more
Good fixed diamonds 20.
It is the specific implementation mode of the present invention above, it is noted that for those skilled in the art,
Various improvements and modifications may be made without departing from the principle of the present invention, these improvements and modifications are also considered as this hair
Bright protection domain.
Claims (4)
1. a kind of diamond cut fixing device, which is characterized in that including supporting rack, upper rotating seat, rotating seat rotation in control
Controller, upper elevating lever is used to support the bottom core of diamond, thimble and pressure sensor;The bottom of the thimble is equipped with absorption
The adsorption piece of diamond, top are fixedly connected with upper elevating lever lower end, and the upper elevating lever upper end is fixedly connected with upper rotating seat, institute
It states rotating seat to be fixed at the top of supporting rack and be rotatably connected with supporting rack, the bottom core is set to the underface of thimble.
2. diamond cut fixing device according to claim 1, which is characterized in that the upper end side wall of the bottom core along
Circumferential direction is equipped with several V-shaped notches.
3. diamond cut fixing device according to claim 1, which is characterized in that the diamond cut fixing device
Further include lower rotating seat and lower elevating lever, the lower rotating seat is set to the bottom of supporting rack and is rotatablely connected with supporting rack, described
The lower end of lower elevating lever is fixedly connected with lower rotating seat, upper end and the removable connection of bottom core.
4. diamond cut fixing device according to claim 1, which is characterized in that the diamond cut fixing device
Further include left side telescopic rod and right side telescopic rod, one end of the left side telescopic rod is fixedly connected with supporting rack left side wall, another
End is connected with left collet;One end of the right side telescopic rod is fixedly connected with supporting rack right side wall, and the other end is connected with right collet.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201810488385.9A CN108436313A (en) | 2018-05-21 | 2018-05-21 | Diamond cut fixing device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201810488385.9A CN108436313A (en) | 2018-05-21 | 2018-05-21 | Diamond cut fixing device |
Publications (1)
Publication Number | Publication Date |
---|---|
CN108436313A true CN108436313A (en) | 2018-08-24 |
Family
ID=63204221
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201810488385.9A Withdrawn CN108436313A (en) | 2018-05-21 | 2018-05-21 | Diamond cut fixing device |
Country Status (1)
Country | Link |
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CN (1) | CN108436313A (en) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005125438A (en) * | 2003-10-22 | 2005-05-19 | Toshiba Mach Co Ltd | Gem grinding attachment |
CN1883878A (en) * | 2005-06-20 | 2006-12-27 | 珠海市露雯思钻石磨具有限公司 | Apparatus and method for machining natural diamond |
CN107125860A (en) * | 2017-07-07 | 2017-09-05 | 深圳市翠绿首饰制造有限公司 | Diamond-like platinum structure and processing equipment and method thereof |
CN207310296U (en) * | 2017-09-19 | 2018-05-04 | 肇庆市金利丰钻石有限公司 | A kind of new diamond cutting clamper |
CN208276373U (en) * | 2018-05-21 | 2018-12-25 | 深圳市喜钻珠宝科技有限公司 | The fixed device of diamond cut |
-
2018
- 2018-05-21 CN CN201810488385.9A patent/CN108436313A/en not_active Withdrawn
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005125438A (en) * | 2003-10-22 | 2005-05-19 | Toshiba Mach Co Ltd | Gem grinding attachment |
CN1883878A (en) * | 2005-06-20 | 2006-12-27 | 珠海市露雯思钻石磨具有限公司 | Apparatus and method for machining natural diamond |
CN107125860A (en) * | 2017-07-07 | 2017-09-05 | 深圳市翠绿首饰制造有限公司 | Diamond-like platinum structure and processing equipment and method thereof |
CN207310296U (en) * | 2017-09-19 | 2018-05-04 | 肇庆市金利丰钻石有限公司 | A kind of new diamond cutting clamper |
CN208276373U (en) * | 2018-05-21 | 2018-12-25 | 深圳市喜钻珠宝科技有限公司 | The fixed device of diamond cut |
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Legal Events
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---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
WW01 | Invention patent application withdrawn after publication | ||
WW01 | Invention patent application withdrawn after publication |
Application publication date: 20180824 |