CN108436304B

CN108436304B - Anti-drop cutting platform and laser cutting machine

Info

Publication number: CN108436304B
Application number: CN201810564588.1A
Authority: CN
Inventors: 魏宝东; 王国良
Original assignee: Anhui Meinolf Technology Co ltd
Current assignee: Anhui Meinolf Technology Co ltd
Priority date: 2018-06-04
Filing date: 2018-06-04
Publication date: 2023-09-22
Anticipated expiration: 2038-06-04
Also published as: CN108436304A

Abstract

The invention provides an anti-drop cutting platform and a laser cutting machine, and relates to the technical field of cutting machines. The anti-drop cutting platform comprises a base, a cutting bottom plate, a driving assembly and a plurality of support columns. The cutting bottom plate sets up on the base, and a plurality of support columns set up on the cutting bottom plate at intervals to can slide relative cutting bottom plate, the top surface of a plurality of support columns forms the carrying surface, and is used for carrying the dailies, and drive assembly installs on the base, and is used for selectively driving one of them or a plurality of support columns to slide relative cutting bottom plate, in order to form the air current passageway between two support columns adjacent with it. The anti-falling cutting platform can prevent the sample from falling and can ensure that the sample is not polluted.

Description

Anti-drop cutting platform and laser cutting machine

Technical Field

The invention relates to the technical field of cutting machines, in particular to an anti-falling cutting platform and a laser cutting machine.

Background

The existing laser cutting machine adopts a saw-tooth steel belt to lift a steel plate for laser cutting, the steel plate is horizontally placed on a saw-tooth table top before cutting, and the edge of the steel plate is simply positioned and clamped. The laser cutter is activated and the cut large sheet of steel will remain on the table and small samples smaller than the gap between the two saw-tooth belts will fall into the scrap box underneath.

The cutting deck of this construction has the following disadvantages: 1) When the cutting route passes through the contact point of the sample and the sawtooth tip, the sawtooth belt blocks the cutting air flow, the melted steel plate and the table top cannot be effectively blown away by the air flow, and the sample and the molten matters of the sawtooth tip can be remained on the steel plate to pollute the sample; 2) If the sample falls under the table, contamination of the sample and subsequent difficulties in automatic pick-up will also result.

Therefore, developing an anti-drop cutting platform that can effectively solve the above problems is a technical problem that needs to be solved urgently at present.

Disclosure of Invention

The invention aims to provide an anti-falling cutting platform which can prevent a sample wafer from falling and can ensure that the sample wafer is not polluted.

The invention further aims to provide the laser cutting machine, and the falling-preventing cutting platform provided by the invention can not only prevent the sample wafer from being polluted, but also facilitate the sample wafer taking.

The invention solves the technical problems by adopting the following technical scheme:

the invention provides an anti-drop cutting platform which comprises a base, a cutting bottom plate, a driving assembly and a plurality of support columns, wherein the base is provided with a plurality of support columns;

the cutting bottom plate is arranged on the base, a plurality of support columns are arranged on the cutting bottom plate at intervals and can slide relative to the cutting bottom plate, the top surfaces of the support columns form carrying surfaces and are used for carrying sample wafers, the top surfaces of each support column are provided with connecting layers, and the connecting layers are used for being matched with the sample wafers.

The drive assembly is mounted on the base and is used for selectively driving one or more support columns to slide relative to the cutting bottom plate so as to form an air flow channel between two adjacent support columns.

Further, the driving assembly comprises a first driving piece, a sliding shaft and a second driving piece, wherein the sliding shaft is in sliding connection with the base, the first driving piece is connected with the sliding shaft and used for driving the sliding shaft to slide relative to the base, and the second driving piece is arranged on the sliding shaft and used for driving the supporting column to slide relative to the cutting bottom plate.

Further, the bottom surface of every the support column all is provided with first adsorbed layer, be provided with the second adsorbed layer on the second driving piece, first adsorbed layer can with the second adsorbed layer actuation.

Further, the driving assembly further comprises a third driving piece, the third driving piece is arranged on the sliding shaft and connected with the second driving piece, and the third driving piece is used for driving the second driving piece to slide relative to the sliding shaft.

Further, the anti-drop cutting platform further comprises a controller, the first driving piece, the second driving piece and the third driving piece are respectively and electrically connected with the controller, and the controller is used for respectively controlling the first driving piece, the second driving piece and the third driving piece to act.

Further, the number of the second driving parts is multiple, and the second driving parts are arranged on the sliding shaft side by side and are respectively used for driving the supporting columns.

Further, a plurality of through holes are formed in the cutting bottom plate, a plurality of first clamping structures are respectively arranged at the through holes, a second clamping structure and a third clamping structure are respectively arranged on each supporting column at intervals, and the first clamping structure is selectively clamped with the second clamping structure or clamped with the third clamping structure.

Further, the first clamping structure is an annular elastic sheet, and the second clamping structure and the third clamping structure are a circle of clamping grooves respectively.

Further, the cutting bottom plate includes the first cutting portion, second cutting portion and the third cutting portion that set up adjacently in proper order, first cutting portion the second cutting portion reaches the third cutting portion all is provided with a plurality of the support column, first cutting portion the second cutting portion reaches a plurality of on the third cutting the equal array arrangement of support column, a plurality of first cutting portion the interval of support column is greater than a plurality of second cutting portion the interval of support column, a plurality of second cutting portion the interval of support column is greater than a plurality of third cutting portion the interval of support column.

Further, the invention provides a laser cutting machine which comprises a cutting machine and the anti-drop cutting platform.

The anti-drop cutting platform comprises a base, a cutting bottom plate, a driving assembly and a plurality of support columns.

The cutting machine is arranged opposite to the anti-falling cutting platform and is used for cutting the sample wafer.

The embodiment of the invention has the beneficial effects that:

according to the anti-drop cutting platform disclosed by the invention, the sample can be carried on the carrying surface formed by the top surfaces of the plurality of support columns so as to be convenient to cut, the driving assembly can drive the support columns to slide relative to the cutting bottom plate so as to form the air flow channel between the two adjacent support columns, so that melts such as melted sample and the like can be effectively blown away by the air flow when the sample is cut, the sample is prevented from being polluted, and the plurality of support columns can carry the sample so as to prevent the sample from dropping after being cut, and the anti-drop cutting platform is convenient to take.

According to the laser cutting machine disclosed by the invention, the sample is arranged on the carrying surface, the driving assembly can drive the support columns to slide relative to the cutting bottom plate, so that an air flow channel is formed between two adjacent support columns, molten samples such as the sample melted when the cutter cuts the sample can be effectively blown away by air flow, the sample is prevented from being polluted, and the plurality of support columns can carry the sample, so that the sample is prevented from falling after being cut, and the laser cutting machine is convenient to take.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate a certain embodiment of the present invention and therefore should not be considered as limiting the scope, and that other related drawings can be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a schematic structural diagram of an anti-drop cutting platform according to an embodiment of the present invention.

Fig. 2 is a schematic structural diagram of a driving assembly of an anti-drop cutting platform according to an embodiment of the present invention.

Fig. 3 is a schematic structural diagram of a driving assembly of the anti-drop cutting platform according to the preferred embodiment.

Fig. 4 is a schematic structural diagram of a cutting bottom plate of the anti-drop cutting platform according to an embodiment of the present invention.

Fig. 5 is a schematic structural view of a cutting bottom plate of the anti-drop cutting platform according to the preferred embodiment.

Fig. 6 is an enlarged view at a in fig. 4.

Fig. 7 is a schematic structural diagram of a support column of an anti-drop cutting platform according to an embodiment of the present invention.

Icon: 100-an anti-drop cutting platform; 110-a base; 112-a frame body; 113-a guide rail; 120-cutting the bottom plate; 121-a first cutting portion; 122-a second cut; 123-a third cut; 124-through holes; 125-a first clamping structure; 130-a drive assembly; 132-sliding shaft; 1321-slide; 133-a second drive; 1331-a second adsorbent layer; 140-supporting columns; 141-a connection layer; 142-a first adsorption layer; 143-a second clamping structure; 144-third clamping structure.

Detailed Description

For the purpose of making the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are some embodiments of the present invention, but not all embodiments of the present invention. The components of the embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.

Thus, the following detailed description of the embodiments of the invention, as presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.

It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further definition or explanation thereof is necessary in the following figures.

In the description of the present invention, it should be noted that, the azimuth or positional relationship indicated by the term "upper" or the like is based on the azimuth or positional relationship shown in the drawings, or the azimuth or positional relationship that is commonly put when the inventive product is used, only for convenience of describing the present invention and simplifying the description, but does not indicate or imply that the apparatus or element to be referred to must have a specific azimuth, be configured and operated in a specific azimuth, and thus should not be construed as limiting the present invention.

Furthermore, the terms "first," "second," and the like, are used merely to distinguish between descriptions and should not be construed as indicating or implying relative importance.

In the description of the present invention, it should also be noted that, unless specified and limited otherwise, the terms "disposed" and "connected" are to be construed broadly, and for example, "connected" may be a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.

An embodiment of the present invention will be described in detail below with reference to the accompanying drawings, and features of the following examples may be combined with each other without conflict.

The embodiment provides a laser cutting machine, and it includes cutting machine and anti-drop cutting platform, and the cutting machine sets up relatively with anti-drop cutting platform, and anti-drop cutting platform is used for carrying on the sample that needs the cutting, and the cutting machine is used for cutting this sample.

Due to the adoption of the anti-drop cutting platform, the sample wafer can be prevented from being polluted when the cutting machine is used for cutting, and the sample wafer can be conveniently taken after the cutting is finished.

Fig. 1 is a schematic structural diagram of an anti-drop cutting platform 100 according to the present embodiment. Referring to fig. 1, the anti-drop cutting platform 100 disclosed in the present embodiment includes a base 110, a cutting bottom 120, a driving assembly 130 and a plurality of support columns 140.

The cutting floor 120 is disposed on the base 110, the plurality of support columns 140 are disposed on the cutting floor 120 at intervals and can slide relative to the cutting floor 120, top surfaces of the plurality of support columns 140 form a carrying surface and are used for carrying a sample wafer, and the driving assembly 130 is mounted on the base 110 and is used for selectively driving one or more support columns 140 to slide relative to the cutting floor 120 so as to form an air flow channel between two adjacent support columns 140.

It can be appreciated that the carrying surface is used for carrying a sample, and can conveniently cut, and the driving assembly 130 can drive the support columns 140 to slide relative to the cutting bottom plate 120, so that an air flow channel is formed between two adjacent support columns 140, and therefore melts such as the sample when the sample is cut can be effectively blown away by the air flow, the sample is prevented from being polluted, and the plurality of support columns 140 can carry the sample, so that the sample is not dropped after being cut, and the sample is convenient to use.

In this embodiment, the base 110 includes a frame 112 and two guide rails 113, and the two guide rails 113 are respectively disposed on the frame 112 and are disposed parallel to each other.

The frame 112 is used for mounting the cutting floor 120, and the two guide rails 113 are used for being matched with the driving assembly 130.

Fig. 2 is a schematic structural diagram of the driving assembly 130 of the anti-drop cutting platform 100 according to the present embodiment. Referring to fig. 2, the driving assembly 130 includes a first driving member (not shown), a sliding shaft 132 and a second driving member 133.

The sliding shaft 132 is slidably connected to the base 110, the first driving member is connected to the sliding shaft 132 and is used for driving the sliding shaft 132 to slide relative to the base 110, and the second driving member 133 is disposed on the sliding shaft 132 and is used for driving the support column 140 to slide relative to the cutting bottom plate 120.

In this embodiment, two ends of the sliding shaft 132 are respectively provided with a sliding block 1321, and the two sliding blocks 1321 are respectively slidably connected to the two guide rails 113. The first driving member may be a motor or the like to drive the sliding shaft 132 to slide with respect to the guide rail 113.

In this embodiment, the second driving member 133 is a hydraulic cylinder.

In order to ensure stable connection between the second driving member 133 and the support column 140, in this embodiment, a second adsorption layer 1331 is disposed on the second driving member 133, and the second adsorption layer 1331 is used for matching with the support column 140.

In one embodiment, the driving assembly 130 further includes a third driving member (not shown) disposed on the sliding shaft 132 and connected to the second driving member 133, where the third driving member is configured to drive the second driving member 133 to slide relative to the sliding shaft 132.

The third driving member may be provided as a motor or the like.

In order to realize intelligent control, in this embodiment, the anti-drop cutting platform 100 further includes a controller (not shown), where the first driving member, the second driving member 133 and the third driving member are respectively and electrically connected to the controller, and the controller is configured to respectively control the actions of the first driving member, the second driving member 133 and the third driving member.

It will be appreciated that the controller can control the first driving member to move so as to drive the sliding shaft 132 to slide relative to the guide rail 113, and can control the third driving member to move so as to drive the second driving member 133 to slide relative to the sliding shaft 132, thereby aligning the second driving member 133 with the support column 140 at different positions. When the second driving member 133 moves to a designated position, the controller can also control the second driving member 133 to act to drive the support column 140 to slide relative to the cutting floor 120.

Fig. 3 is a schematic structural diagram of the driving assembly 130 of the anti-drop cutting platform 100 according to the preferred embodiment. Referring to fig. 3, it should be understood that in other preferred embodiments, the structure of the driving assembly 130 may vary, for example, the driving assembly 130 includes a plurality of second driving members 133. The second driving members 133 are disposed on the sliding shaft 132 in parallel, and are respectively used for driving the supporting columns 140.

This structure allows the plurality of second driving members 133 to be simultaneously operated.

Fig. 4 is a schematic structural diagram of the cutting bottom plate 120 of the anti-drop cutting platform 100 according to the present embodiment. Referring to fig. 4, in this embodiment, the cutting base 120 includes a first cutting portion 121, a second cutting portion 122, and a third cutting portion 123 that are disposed adjacent to each other in this order.

The first cutting part 121, the second cutting part 122 and the third cutting part 123 are all provided with a plurality of support columns 140, the plurality of support columns 140 on the first cutting part 121, the second cutting part 122 and the third cutting part are all arranged in an array, the distance between the plurality of support columns 140 of the first cutting part 121 is larger than the distance between the plurality of support columns 140 of the second cutting part 122, and the distance between the plurality of support columns 140 of the second cutting part 122 is larger than the distance between the plurality of support columns 140 of the third cutting part 123.

It is understood that the first cutting portion 121, the second cutting portion 122 and the third cutting portion 123 may be used for cutting different sizes of sample pieces, respectively, to improve efficiency.

Fig. 5 is a schematic structural diagram of the cutting bottom plate 120 of the anti-drop cutting platform 100 according to the preferred embodiment. Referring to fig. 5, it should be understood that in other preferred embodiments, the plurality of support columns 140 on the cutting floor 120 may be arranged in an array and maintain the same spacing.

Fig. 6 is an enlarged view at a in fig. 4. Referring to fig. 4 and 6 in combination, in the present embodiment, a plurality of through holes 124 are formed in the cutting base 120, the plurality of through holes 124 are respectively provided with a first clamping structure 125, and the plurality of first clamping structures 125 are respectively used for being matched with the support columns 140.

Optionally, the first clamping structure 125 is an annular spring.

Fig. 7 is a schematic structural diagram of a support column 140 of the anti-drop cutting platform 100 according to the present embodiment. Referring to fig. 7, in the present embodiment,

the top surface of each support column 140 is provided with a connecting layer 141, and the connecting layer 141 is used for matching with the sample wafer.

It will be appreciated that if most of the coupons are metallic, such as steel, the tie layer 141 may be provided as a magnetic layer. The connection layer 141 may be an adhesive layer or a resistance increasing layer having an anti-slip effect.

In this embodiment, the bottom surface of each support column 140 is provided with a first adsorption layer 142, and the first adsorption layer 142 can be attracted to the second adsorption layer 1331.

It is understood that the first adsorption layer 142 and the second adsorption layer 1331 may also be provided as magnetic layers capable of being mutually matched, respectively.

Each support column 140 is provided with a second clamping structure 143 and a third clamping structure 144 at intervals, and the first clamping structure 125 is selectively clamped with the second clamping structure 143 or the third clamping structure 144.

In this embodiment, the second locking structure 143 and the third locking structure 144 are each a round of locking groove.

It should be appreciated that in other preferred embodiments, the structures of the second and third clamping structures 143, 144 may also be adapted according to the first clamping structure 125.

To sum up, according to the anti-drop cutting platform 100 disclosed in this embodiment, the carrying surface formed by the top surfaces of the plurality of support columns 140 can carry sample wafers, so as to facilitate cutting, and the driving assembly 130 can drive the support columns 140 to slide relative to the cutting bottom plate 120, so that an air flow channel is formed between two adjacent support columns 140, and therefore melts such as sample wafers when cutting sample wafers can be effectively blown away by air flow, so that the sample wafers are not polluted, and the plurality of support columns 140 can carry sample wafers, so that the sample wafers are not dropped after being cut, and are convenient to take.

The embodiment discloses a laser cutting machine, it adopts the anti-drop cutting platform 100 that this embodiment discloses, the sample setting is on the face of carrying, can slide through drive assembly 130 drive support column 140 relative cutting bottom plate 120, with form the air current passageway between two adjacent support columns 140 with it, thereby the melt such as sample that melts when making cutter cutting sample all can be blown away by the air current effectually, guarantee that the sample is not polluted, and, a plurality of support columns 140 can carry the sample, in order to make the sample not drop after being cut, conveniently take.

The above description is only of the preferred embodiments of the present invention and is not intended to limit the present invention, but various modifications and variations can be made to the present invention by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. The anti-drop cutting platform is characterized by comprising a base, a cutting bottom plate, a driving assembly and a plurality of support columns;

the cutting bottom plate is arranged on the base, the supporting columns are arranged on the cutting bottom plate at intervals and can slide relative to the cutting bottom plate, the top surfaces of the supporting columns form carrying surfaces and are used for carrying sample wafers, the top surface of each supporting column is provided with a connecting layer which is used for being matched with the sample wafer, and the bottom surface of each supporting column is provided with a first adsorption layer;

the cutting bottom plate is provided with a plurality of through holes, a plurality of through holes are respectively provided with a first clamping structure, each supporting column is respectively provided with a second clamping structure and a third clamping structure at intervals, and the first clamping structure is selectively clamped with the second clamping structure or the third clamping structure;

the driving assembly is arranged on the base and is used for selectively driving one or more supporting columns to slide relative to the cutting bottom plate so as to form an air flow channel between two adjacent supporting columns;

the driving assembly comprises a first driving piece, a sliding shaft and a second driving piece, wherein the sliding shaft is in sliding connection with the base, the first driving piece is connected with the sliding shaft and used for driving the sliding shaft to slide relative to the base, the second driving piece is arranged on the sliding shaft and used for driving the supporting column to slide relative to the cutting bottom plate, a second adsorption layer is arranged on the second driving piece, and the first adsorption layer can be attracted with the second adsorption layer.

2. The anti-drop cutting deck as defined in claim 1, wherein the drive assembly further comprises a third drive member disposed on the sliding shaft and coupled to the second drive member, the third drive member being configured to drive the second drive member to slide relative to the sliding shaft.

3. The anti-drop cutting platform of claim 2, further comprising a controller, wherein the first driving member, the second driving member, and the third driving member are respectively electrically connected to the controller, and the controller is configured to respectively control the actions of the first driving member, the second driving member, and the third driving member.

4. The anti-drop cutting deck as defined in claim 1, wherein the number of said second driving members is plural, and the plural second driving members are disposed side by side on said sliding shaft and are respectively used for driving said supporting columns.

5. The anti-drop cutting deck as defined in claim 1, wherein the first engagement structure is an annular spring, and the second engagement structure and the third engagement structure are each a loop of engagement groove.

6. The anti-drop cutting platform according to claim 1, wherein the cutting bottom plate comprises a first cutting part, a second cutting part and a third cutting part which are sequentially and adjacently arranged, wherein a plurality of support columns are arranged on the first cutting part, the second cutting part and the third cutting part, the plurality of support columns on the first cutting part, the second cutting part and the third cutting part are arranged in an array, the spacing between the plurality of support columns of the first cutting part is larger than the spacing between the plurality of support columns of the second cutting part, and the spacing between the plurality of support columns of the second cutting part is larger than the spacing between the plurality of support columns of the third cutting part.

7. A laser cutting machine comprising a cutting machine and an anti-drop cutting platform according to any one of claims 1 to 6, the cutting machine being arranged opposite the anti-drop cutting platform and being arranged to cut the dailies.