CN108422103A - It is a kind of to be cut by laser the cutting equipment shielded comprehensively and its cutting method - Google Patents
It is a kind of to be cut by laser the cutting equipment shielded comprehensively and its cutting method Download PDFInfo
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- CN108422103A CN108422103A CN201810462692.XA CN201810462692A CN108422103A CN 108422103 A CN108422103 A CN 108422103A CN 201810462692 A CN201810462692 A CN 201810462692A CN 108422103 A CN108422103 A CN 108422103A
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- Prior art keywords
- laser
- speculum
- cutting
- cut
- comprehensively
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention discloses a kind of cutting equipments for being cut by laser and shielding comprehensively, including operating platform, laser and cutting head, further include the CCD for being positioned over operating platform side, after the CCD and the first Jing Chang of homonymy and after first Jing Chang and the second Jing Chang of homonymy, first Jing Chang is used for cutting process for coating removal processing, second Jing Chang.A kind of cutting method for being cut by laser and shielding comprehensively is also disclosed, including two processes of coating removal processing and laser cutting, described two processes constitute the single side shielded comprehensively and cut total process.Based on the first Jing Chang for coating removal processing, second Jing Chang is used for the technical characteristic of cutting process, the cutting equipment that present invention laser cutting is shielded comprehensively has the characteristics that single positioning, single cut, shorten total time to which processing time overturns and repositions than sample, time and operating cost are saved, processing efficiency is improved.
Description
Technical field
The present invention relates to laser cutting technique more particularly to a kind of cutting equipment that laser cutting is shielded comprehensively and its cutting sides
Method.
Background technology
At present on mobile phone market, most popular is that comprehensive screen design clearly indicates, because of its beautiful appearance by wide
Big mobile phone user's likes.In the technology shielded of cutting comprehensively, presently used technology is laser cutting, however because shielding comprehensively
Structure problem, the method that present laser cutting technique can only be cut with tow sides are cut so that sample is cutting one side
It must take out later, be turned to another side, again sample introduction, repositioned, may result in cutting efficiency reduction in this way, it is difficult to
Realize production automation.
Invention content
It is an object of the invention to overcome the deficiencies of existing technologies, provide a kind of single positioning single side laser cutting comprehensive screen
Cutting equipment and its cutting method.
To achieve the above object, the present invention uses following technical scheme：
It is a kind of to be cut by laser the cutting equipment shielded comprehensively, including operating platform, laser and cutting head, further include being positioned over
The CCD of operating platform side, be set to after the CCD and the first Jing Chang of homonymy and after first Jing Chang and
Second Jing Chang of homonymy, first Jing Chang are used for cutting process for coating removal processing, second Jing Chang.
Its further technical solution is：First Jing Chang includes the first laser set on the CCD homonymies distal end
Device, the first beam expanding lens being set to after the first laser device, first beam expanding lens are the first speculum, institute later
The the first speculum horizontal direction stated is equipped with the second speculum, is equipped with galvanometer after second speculum, described shakes
Mirror and the second speculum vertical direction close to；The first laser device, the first beam expanding lens, the first speculum, galvanometer,
Field lens is set to the CCD homonymies, and is gradually shortened apart from operating platform distance, wherein first speculum and second is instead
Mirror is penetrated on same level direction, constitutes the right angle reflection of laser.
Its further technical solution is：Second Jing Chang includes the second laser set on the CCD homonymies distal end
Device is the second beam expanding lens on the left of the second laser, is third speculum on the left of second beam expanding lens, described the
Three speculum vertical direction are equipped with the 4th speculum, are the 5th speculum on the right side of the 4th speculum, the described the 5th is anti-
It penetrates mirror vertical direction and is equipped with cutting head；The second laser, the 4th speculum, cutting head are set to the CCD homonymies,
And be gradually shortened apart from operating platform distance, wherein the second laser, the second beam expanding lens, third speculum are set on same
In horizontal direction, the 4th speculum, the 5th speculum are set on same level direction.
Its further technical solution is：First speculum is anti-by right angle of laser progress with the second speculum
It penetrates.
Its further technical solution is：The third speculum is anti-by right angle of laser progress with the 4th speculum
It penetrates, laser is carried out secondary right angle reflection by the 4th speculum and the 5th speculum.
It is a kind of to be cut by laser the cutting method shielded comprehensively, including coating removal handles and two processes of laser cutting, described two
A process constitutes the single side shielded comprehensively and cuts total process.
Its further technical solution is：The coating removal processing procedure is completed in first mirror field, the laser
Cutting process is completed in second mirror field.
Its further technical solution is：One-time positioning operation is only carried out during the single side cutting is total.
Its further technical solution is：A cutting operation is only carried out during the single side cutting is total.
Its further technical solution is：Comprehensive screen includes mobile phone screen, tv display screen, computer display screen.
Advantageous effect compared with prior art：
The cutting equipment and its cutting method that a kind of laser cutting of the present invention is shielded comprehensively, cut compared to traditional display screen
Device and method have following remarkable advantage：
Based on the first Jing Chang for coating removal processing, the second Jing Chang is used for the technical characteristic of cutting process, and laser of the present invention is cut
Cutting the cutting equipment shielded comprehensively has the characteristics that single positioning, single cut, overturns than sample to processing time and determines again
Position total time shortens, and saves time and operating cost, improves processing efficiency.Based on cutting method be only the one side shielded comprehensively into
The technical characteristic of row single side cutting, the cutting method that laser cutting of the invention is shielded comprehensively do not need traditional two-sided cutting behaviour
Make, ensure that the finish and accuracy of screen shape comprehensively.
It is below in conjunction with the accompanying drawings and specific real in order to be more clearly understood that above-mentioned purpose, the characteristics and advantages of the present invention
Applying mode, the present invention is described in further detail.
Description of the drawings
Fig. 1 is the structural schematic diagram of device therefor of the present invention.
Reference numeral
1 first mirror field, 10 CCD
11 first laser device, 12 first beam expanding lens
13 first speculum, 14 second speculum
15 galvanometer, 16 field lens
2 second mirror field, 21 second laser
22 second beam expanding lens, 23 third speculum
The 5th speculum of 24 the 4th speculum 25
26 cutting head, 3 operating platform
4 samples
Specific implementation mode
Many details are elaborated in following specific descriptions to facilitate a thorough understanding of the present invention, still the present invention is gone back
Other may be used different from the other modes of this description to realize, therefore, protection scope of the present invention is not by described below
Specific embodiment limitation.
It is a kind of to be cut by laser the cutting equipment shielded comprehensively, including operating platform 3, laser group and cutting head 26, further include
It is positioned over the CCD10 of 3 side of operating platform, is set to after CCD10 and the first mirror field 1 of homonymy and after the first mirror field 1
And the second mirror field 2 of homonymy, the first mirror field 1 are used for cutting process for coating removal processing, the second mirror field 2.CCD10 is Charged Couple
Element, for detecting the position to be cut shielded comprehensively, so as to adjust the position of cutting head 26.
As shown in Figure 1, the first Jing Chang packets 1 include the first laser device 11 set on CCD10 homonymies distal end, it is set to first laser device
The first beam expanding lens 12 after 11, the first beam expanding lens 12 is later the first speculum 13, in 13 horizontal direction of the first speculum
Equipped with the second speculum 14, be equipped with after the second speculum 14 galvanometer 15, galvanometer 15 and 14 vertical direction of the second speculum close to；
First laser device 11, the first beam expanding lens 12, the first speculum 13, galvanometer 15, field lens 16 are set to CCD10 homonymies, and apart from behaviour
Make 3 distance of platform to be gradually shortened, wherein the first speculum 13 and the second speculum 14 are set on same level direction, constitutes laser
Right angle reflection.
Second mirror field 2 includes the second laser 21 set on CCD10 homonymies distal end, and 21 left side of second laser is expanded for second
Beam mirror 22,22 left side of the second beam expanding lens are third speculum 23, and 23 vertical direction of third speculum is equipped with the 4th speculum 24, the
Four speculums, 24 right side is the 5th speculum 25, and 25 vertical direction of the 5th speculum is equipped with cutting head 26；Second laser 21,
Four speculums 24, cutting head 26 are set to CCD10 homonymies, and are gradually shortened apart from 3 distance of operating platform, wherein second laser
21, the second beam expanding lens 22, third speculum 23 are set on same level direction, and the 4th speculum 24, the 5th speculum 25 are set to
On same level direction.
Laser is carried out a right angle and reflected by the first speculum 13 and the second speculum 14.Third speculum 23 and the 4th is instead
It penetrates mirror 24 and laser is subjected to the reflection of right angle, it is anti-that laser with the 5th speculum 25 is carried out secondary right angle by the 4th speculum 24
It penetrates.
It is a kind of to be cut by laser the cutting method shielded comprehensively, including two processes of coating removal processing and laser cutting, two processes
It constitutes the single side shielded comprehensively and cuts total process.
As shown in Figure 1, coating removal processing procedure is：Sample 4 is placed on frock clamp, motor performance platform 3 moves sample 4
After the completion of CCD10 is moved in the following, CCD10 positions sample 4, operating platform 3 moves, and sample 4 is moved on to machining area.The
The laser that one laser 11 comes out enters the first beam expanding lens 12, and the first beam expanding lens 12 expands laser, from the first beam expanding lens
12 laser out reaches the first speculum 13, and the first speculum 13 reflects the laser light to the second speculum 14, the second speculum
14 reflect the laser light to galvanometer 15, and laser out passes through field lens 16 later from galvanometer 15, get to progress coating removal processing on sample 4.
As shown in Figure 1, laser cutting process is：Sample 4 after operating platform 3 handles coating removal is moved to second laser
The machining area of device 21, the laser that second laser 21 comes out enter the second beam expanding lens 22, and the second beam expanding lens 22 carries out laser
Amplification is expanded, the laser after expanding enters third speculum 23, using the 4th speculum 24, then passes through the 5th speculum
25, laser reflection is entered cutting head 26 by the 5th speculum 25, and laser is out processed sample 4 from cutting head 26.
Coating removal processing procedure is completed in the first mirror field 1, and laser cutting process is completed in the second mirror field 2.
One-time positioning operation is only carried out during single side cutting is total.
A cutting operation is only carried out during single side cutting is total.
Screen includes mobile phone screen, tv display screen, computer display screen comprehensively.
In conclusion cutting equipment and its cutting method that a kind of laser cutting of the present invention is shielded, are based on the first mirror comprehensively
Field is handled for coating removal, and the second Jing Chang is used for the technical characteristic of cutting process, and the present invention is cut by laser the cutting equipment shielded comprehensively
Have the characteristics that single positioning, single cut, shortens total time to which processing time overturns and repositions than sample, when saving
Between and operating cost, improve processing efficiency.It is only to carry out the technology spy of single side cutting in the one side shielded comprehensively based on cutting method
Sign, the cutting method that laser cutting of the invention is shielded comprehensively do not need traditional two-sided cutting operation, ensure that screen shape comprehensively
Finish and accuracy.
It is above-mentioned only with embodiment come the technology contents further illustrated the present invention, in order to understand, but do not represent the present invention
Embodiment be only limitted to this, it is any to extend according to the technology done of the present invention or recreation, protected by the present invention.This hair
Bright protection domain is subject to claims.
Claims (10)
1. a kind of being cut by laser the cutting equipment shielded, including operating platform, laser and cutting head comprehensively, it is characterised in that：Also
CCD including being positioned over operating platform side, is set to after the CCD and the first Jing Chang of homonymy and set on described first
After Jing Chang and the second Jing Chang of homonymy, first Jing Chang are for coating removal processing, and second Jing Chang is used for cut place
Reason.
2. the cutting equipment that a kind of laser cutting according to claim 1 is shielded comprehensively, it is characterised in that：First mirror
Field includes the first laser device set on the CCD homonymies distal end, and first after the first laser device expands
Mirror, first beam expanding lens are the first speculum later, and the first speculum horizontal direction is equipped with the second speculum,
Be equipped with galvanometer after second speculum, the galvanometer and the second speculum vertical direction close to；Described
First laser device, the first beam expanding lens, the first speculum, galvanometer, field lens are set to the CCD homonymies, and apart from operating platform
Distance is gradually shortened, wherein first speculum and the second speculum are set on same level direction, constitutes the right angle of laser
Reflection.
3. the cutting equipment that a kind of laser cutting according to claim 1 is shielded comprehensively, it is characterised in that：Second mirror
Field includes the second laser set on the CCD homonymies distal end, is the second beam expanding lens on the left of the second laser, described
The second beam expanding lens on the left of be third speculum, the third speculum vertical direction is equipped with the 4th speculum, described the
It is the 5th speculum on the right side of four speculums, the 5th speculum vertical direction is equipped with cutting head；The second laser,
4th speculum, cutting head are set to the CCD homonymies, and are gradually shortened apart from operating platform distance, wherein described the
Dual-laser device, the second beam expanding lens, third speculum are set on same level direction, the 4th speculum, the 5th speculum
On same level direction.
4. the cutting equipment that a kind of laser cutting according to claim 2 is shielded comprehensively, it is characterised in that：Described first is anti-
It penetrates mirror and the second speculum and laser is subjected to a right angle reflection.
5. the cutting equipment that a kind of laser cutting according to claim 3 is shielded comprehensively, it is characterised in that：The third is anti-
It penetrates mirror and the 4th speculum and laser is subjected to a right angle reflection, the 4th speculum carries out laser with the 5th speculum
Secondary right angle reflection.
6. a kind of being cut by laser the cutting method shielded comprehensively, it is characterised in that：Including coating removal processing and two processes are cut by laser,
Two processes constitute the single side shielded comprehensively and cut total process.
7. the cutting method that a kind of laser cutting according to claim 6 is shielded comprehensively, it is characterised in that：At the coating removal
Reason process is completed in first mirror field, and the laser cutting process is completed in second mirror field.
8. the cutting method that a kind of laser cutting according to claim 6 is shielded comprehensively, it is characterised in that：The single side is cut
One-time positioning is only carried out during cutting always.
9. the cutting method that a kind of laser cutting according to claim 6 is shielded comprehensively, it is characterised in that：The single side is cut
A cutting operation is only carried out during cutting always.
10. the cutting method that a kind of laser cutting according to claim 6 is shielded comprehensively, it is characterised in that：Described is comprehensive
Screen includes mobile phone screen, tv display screen, computer display screen.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810462692.XA CN108422103A (en) | 2018-05-15 | 2018-05-15 | It is a kind of to be cut by laser the cutting equipment shielded comprehensively and its cutting method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810462692.XA CN108422103A (en) | 2018-05-15 | 2018-05-15 | It is a kind of to be cut by laser the cutting equipment shielded comprehensively and its cutting method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108422103A true CN108422103A (en) | 2018-08-21 |
Family
ID=63163256
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810462692.XA Pending CN108422103A (en) | 2018-05-15 | 2018-05-15 | It is a kind of to be cut by laser the cutting equipment shielded comprehensively and its cutting method |
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| CN (1) | CN108422103A (en) |
Citations (6)
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|---|---|---|---|---|
| CN102520823A (en) * | 2011-12-20 | 2012-06-27 | Tcl显示科技（惠州）有限公司 | Method for processing touch screen of mobile phone |
| CN102717195A (en) * | 2012-06-07 | 2012-10-10 | 江阴德力激光设备有限公司 | Method and device for cutting toughened glass by aid of dual-wavelength laser |
| CN103056530A (en) * | 2012-12-28 | 2013-04-24 | 苏州德龙激光股份有限公司 | Device and method for processing one glass solution (OGS) touch screens |
| CN103811682A (en) * | 2012-11-14 | 2014-05-21 | 乐金显示有限公司 | Method Of Cutting Flexible Display Device And Method Of Fabricating Flexible Display Device Using The Same |
| CN107030397A (en) * | 2017-05-19 | 2017-08-11 | 东莞市盛雄激光设备有限公司 | The cutter device and cutting method of a kind of composite substrate |
| CN208358055U (en) * | 2018-05-15 | 2019-01-11 | 英诺激光科技股份有限公司 | It is a kind of to be cut by laser the cutting equipment shielded comprehensively |
-
2018
- 2018-05-15 CN CN201810462692.XA patent/CN108422103A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102520823A (en) * | 2011-12-20 | 2012-06-27 | Tcl显示科技（惠州）有限公司 | Method for processing touch screen of mobile phone |
| CN102717195A (en) * | 2012-06-07 | 2012-10-10 | 江阴德力激光设备有限公司 | Method and device for cutting toughened glass by aid of dual-wavelength laser |
| CN103811682A (en) * | 2012-11-14 | 2014-05-21 | 乐金显示有限公司 | Method Of Cutting Flexible Display Device And Method Of Fabricating Flexible Display Device Using The Same |
| CN103056530A (en) * | 2012-12-28 | 2013-04-24 | 苏州德龙激光股份有限公司 | Device and method for processing one glass solution (OGS) touch screens |
| CN107030397A (en) * | 2017-05-19 | 2017-08-11 | 东莞市盛雄激光设备有限公司 | The cutter device and cutting method of a kind of composite substrate |
| CN208358055U (en) * | 2018-05-15 | 2019-01-11 | 英诺激光科技股份有限公司 | It is a kind of to be cut by laser the cutting equipment shielded comprehensively |
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