CN108422076A - A kind of ultrasonic bonding generator - Google Patents
A kind of ultrasonic bonding generator Download PDFInfo
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- CN108422076A CN108422076A CN201810460072.2A CN201810460072A CN108422076A CN 108422076 A CN108422076 A CN 108422076A CN 201810460072 A CN201810460072 A CN 201810460072A CN 108422076 A CN108422076 A CN 108422076A
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/26—Auxiliary equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/08—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using ultrasonic vibrations
Abstract
The present invention relates to ultrasonic welding technique fields, and disclose a kind of ultrasonic bonding generator, including waveform translation circuit, signal generating circuit, waveform processing circuit, full-bridge driving transformer circuit, power amplification circuit, impedance-matching transformer, match circuit and energy converter, the signal generating circuit is generating the signal of certain frequency, the impedance-matching transformer includes voltage acquisition module and current acquisition module, to acquire the voltage signal and current signal of impedance-matching transformer output end, the voltage signal and current signal are transferred to signal generating circuit after waveform translation circuit becomes square wave, signal generating circuit changes output signal frequency according to the voltage signal and current signal phase difference of impedance-matching transformer output end.Frequency-tracking range of the present invention is wide, and adaptive load ability is strong, is not easy by temperature, pressure variations influence；Environmentally friendly, energy saving, saving cost, is applicable in medium-sized and small enterprises, universality is strong.
Description
Technical field
The present invention relates to ultrasonic welding technique field, specially a kind of ultrasonic bonding generator.
Background technology
Ultrasonic welding is the mechanical oscillation using ultrasonic wave, makes welded part under a certain pressure, passes through the connection of atom key
Close, realize solid diffusivity, due to only occur in welding process it is micro- fusing can between metal, it is nonmetallic between realize welding,
Thus have the advantages that less than other welding methods, ultrasonic welding can the welding of parting category and plastics welding.Ultrasonic welding is main
Principle is that alternating current is converted into high-frequency electrical energy with supersonic generator, and the high-frequency electrical energy converted is converted again by energy converter
As the mechanical movement of equal frequencies, subsequent mechanical movement is transmitted to weldering by a set of amplitude rod devices that can change amplitude
The vibrational energy received is transmitted to the joint portion of workpiece to be welded by head, soldering tip, in the material welding that will eventually be welded.
Ultrasonic bonding generator on the market at present is especially applied to the generator of metal ultrasonic welding, big portion
Point be the generator for continuing to use the welding of early stage plastics, there is frequency-tracking narrow range, adaptive load ability is relatively low, be easy by temperature,
The variations such as pressure, load influence and reduce welding quality, or even are stopped；Well-known ultrasonic bonding is set in the world for some
It is standby, it is with high costs, be not suitable for medium-sized and small enterprises practicality, for some small-sized welding harness, especially 0.75MM2（Square millimeter）
Harness, welding effect is undesirable instead.
Invention content
（One）The technical issues of solution
In view of the deficiencies of the prior art, the present invention provides a kind of ultrasonic bonding generator, it is wide to have a frequency-tracking range, bears
Carry adaptable, environmental protection and energy saving, cost is relatively low, and universality is strong, and the good advantage of specific products working ability solves the above-mentioned back of the body
The problem of being mentioned in scape technology.
（Two）Technical solution
To achieve the above object, the present invention provides the following technical solutions：A kind of ultrasonic bonding generator, including waveform transformation electricity
Road, signal generating circuit, waveform processing circuit, full-bridge driving transformer circuit, power amplification circuit, impedance-matching transformer electricity
Road, match circuit and energy converter；
The impedance-matching transformer includes voltage acquisition module and current acquisition module, defeated to acquire impedance-matching transformer
The voltage signal and current signal of outlet, the voltage acquisition module output end and current acquisition module output end become with waveform
Change circuit input end be connected, the waveform translation circuit to by voltage acquisition module and current acquisition module acquisition just profound wave
Signal becomes square-wave signal, and the just profound wave signal that voltage acquisition module acquires is become the first square wave and believed by waveform translation circuit
Number, the just profound wave signal that current acquisition module acquires is become into the second square-wave signal；
The signal generating circuit input terminal is connected with waveform translation circuit output end, and waveform translation circuit is by the first square-wave signal
With the second square wave signal transmission to signal generating circuit；The signal generating circuit is generating the signal of certain frequency, and root
According to the phase adjusted output signal frequency of the first square-wave signal and the second square-wave signal that the transmission of waveform translation circuit comes；
The waveform processing circuit input terminal is connected with signal generating circuit output end, the full-bridge driving transformer circuit input
End is connected with waveform processing circuit output end, the power amplification circuit input terminal and full-bridge driving transformer circuit output end phase
Even, the impedance-matching transformer circuit input end is connected with power amplification circuit output end, the match circuit input terminal and
Impedance-matching transformer circuit output end is connected, and the match circuit output end is connected with energy converter.
Preferably, the signal generating circuit includes phase-locked loop circuit, frequency dividing circuit and delay circuit, the phaselocked loop electricity
Road input terminal is connected with waveform translation circuit output end, and the frequency dividing circuit input terminal is connected with phase-locked loop circuit output end, institute
It states frequency dividing circuit and includes the first output end, second output terminal and third output end, the delay circuit input terminal and frequency dividing circuit
First output end be connected, the delay circuit output end, frequency dividing circuit second output terminal and frequency dividing circuit third output end with
Waveform processing circuit input terminal is connected.
Preferably, the phase-locked loop circuit includes the tenth resistance, eleventh resistor, twelfth resistor, the 17th resistance, the
18 resistance, the 20th resistance, the 23rd point of rent, the 24th resistance, the 27th resistance, the first potentiometer, the second electricity
Position device, third potentiometer, the 4th potentiometer, the 5th triode, the 31st capacitance, the 33rd capacitance, the 36th capacitance,
37th capacitance, the 38th capacitance, the first zener diode, the 6th diode, the 8th diode, two pole of the 13rd voltage stabilizing
Pipe, CD4046BCN chips and phase show that table, the 3rd pin of CD4046BCN chips and the 14th pin convert electricity with waveform
Road output end is connected, and the 3rd pin of CD4046BCN chips connects+15V voltages, the CD4046BCN cores by twelfth resistor
The 14th pin of piece connects+15V voltages by eleventh resistor, connects between the 6th pin of the CD4046BCN chips and the 7th pin
33 capacitances, the 11st pin of CD4046BCN chips connect GND, the CD4046BCN chips the 5th by the 20th resistance
Pin and the 8th pin connect GND, the 12nd pin of the 24th resistance one termination CD4046BCN chips, first potentiometer
1st pin is connected with the 24th resistance other end, and the 3rd pin of the first potentiometer is connected with the 1st pin of the second potentiometer,
The 2nd pin of first potentiometer is connected with the 3rd pin of the first potentiometer, the 2nd pin of the second potentiometer and the second current potential
The 3rd pin of device is connected, and the 3rd pin of the second potentiometer meets GND, and the 16th pin of CD4046BCN chips passes through the tenth electricity
Resistance connects+15V power supplys, and the first zener diode anode meets GND, and cathode connects the 16th pin of CD4046BCN chips, the third
18 capacitances are in parallel with the first zener diode, and described 17th resistance one end is connected with the 2nd pin of CD4046BCN chips, separately
One end is connected with the 5th transistor base, and shown 31st capacitance one end is connected with the 17th resistance other end, another termination
GND, the 5th transistor collector connect+15V voltages, and emitter is connected with the 1st pin of the 4th potentiometer, the 4th current potential
The 3rd pin of device meets GND by the 27th resistance, and the 2nd pin of the 4th potentiometer is connected with the 6th diode cathode, described
6th diode cathode is connected with the 9th pin of CD4046BCN chips, and the 9th pin of CD4046BCN chips passes through the 37th
Capacitance meets GND, and the 13rd zener diode cathode connects+15V voltages by the 18th resistance, and anode meets GND, and the described 8th
Diode cathode is connected with the 13rd zener diode anode, and cathode is connected with the 9th pin of CD4046BCN chips, the third
The 3rd pin of potentiometer is connected with the 9th pin of CD4046BCN chips, the 2nd pin of third potentiometer and third potentiometer the 3rd
Pin is connected, and the 1st pin of third potentiometer is connected with the 23rd resistance one end, the 23 resistance other end and phase
Position shows that table is connected, and the 4th pin of CD4046BCN chips is connected with frequency dividing circuit input terminal.
Preferably, frequency dividing circuit includes CD4013 chips, the 3rd pin of CD4013 chips and CD4046BCN chips the 4th
Pin is connected, and the 4th pin of CD4013 chips, the 6th pin and the 7th pin connect GND, the 2nd pin of CD4013 chips
For its first output end, the 13rd pin of CD4013 chips is its second output terminal, and the 12nd pin of CD4013 chips is
Its third output end, the 5th pin of CD4013 chips are connected with the 2nd pin of CD4013 chips, and the CD4013 chips the 9th are managed
Foot is connected with the 12nd pin of CD4013 chips.
Preferably, the delay circuit includes MC14528B chips, the 21st resistance and the 36th capacitance, described
The 2nd pin of MC14528B chips connects+15V voltages by the 21st resistance, and GND is met by the 36th capacitance, described
The 5th pin of MC14528B chips connects the 2nd pin of CD4013 chips, and the 7th pin of MC14528B chips is its output end.
（Three）Advantageous effect
Compared with prior art, the present invention provides a kind of safe hardware clamping device, has following advantageous effect：This
Invention frequency-tracking range is wide, positive and negative 90 degree of ropes phase range；Adaptive load ability is strong, is not easy by temperature, pressure variations influence；Ring
It protects, is energy saving, saving cost, being applicable in medium-sized and small enterprises, universality is strong；For some small-sized welding harness, especially 0.75 is flat
The harness of square millimeter, processing effect are good.
Description of the drawings
Fig. 1 is the structure diagram of the present invention；
Fig. 2 is way circuit figure of the present invention；
Fig. 3 is waveform translation circuit circuit diagram of the present invention；
Fig. 4 is signal generating circuit circuit diagram of the present invention；
Fig. 5 is waveform processing circuit circuit diagram of the present invention；
Fig. 6 is power amplification circuit circuit diagram of the present invention；
Fig. 7 is match circuit circuit diagram of the present invention.
In figure：R10, the tenth resistance, R11, eleventh resistor, R12, twelfth resistor, R17, the 17th resistance, R18,
18 resistance, R20, the 20th resistance, R21, the 21st resistance, R23, the 23rd point of rent, R24, the 24th resistance,
R27, the 27th resistance, R36, the 36th capacitance, RP1, the first potentiometer, RP2, the second potentiometer, RP3, third current potential
Device, RP4, the 4th potentiometer, Q5, the 5th triode, C31, the 31st capacitance, C33, the 33rd capacitance, C36, the 30th
Six capacitances, C37, the 37th capacitance, C38, the 38th capacitance, D1, the first zener diode, D6, the 6th diode, D8,
8th diode, D13, the 13rd zener diode, U2, CD4013 chip, U3, CD4046BCN chip, U4, MC14528B core
Piece, Y1, energy converter.
Specific implementation mode
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation describes, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
Please refer to Fig.1-7, a kind of ultrasonic bonding generator, including at waveform translation circuit, signal generating circuit, waveform
Manage circuit, full-bridge driving transformer circuit, power amplification circuit, impedance-matching transformer circuit, match circuit and energy converter；
The impedance-matching transformer includes voltage acquisition module and current acquisition module, defeated to acquire impedance-matching transformer
The voltage signal and current signal of outlet, the voltage acquisition module output end and current acquisition module output end become with waveform
Change circuit input end be connected, the waveform translation circuit to by voltage acquisition module and current acquisition module acquisition just profound wave
Signal becomes square-wave signal, and the just profound wave signal that voltage acquisition module acquires is become the first square wave and believed by waveform translation circuit
Number, the just profound wave signal that current acquisition module acquires is become into the second square-wave signal；
The signal generating circuit input terminal is connected with waveform translation circuit output end, and waveform translation circuit is by the first square-wave signal
With the second square wave signal transmission to signal generating circuit；The signal generating circuit to generate the square-wave signal of certain frequency,
And according to waveform translation circuit transmission come the first square-wave signal and the second square-wave signal obtain phase adjusted output square-wave signal frequently
Rate；
The waveform processing circuit input terminal is connected with signal generating circuit output end, the full-bridge driving transformer circuit input
End is connected with waveform processing circuit output end, the power amplification circuit input terminal and full-bridge driving transformer circuit output end phase
Even, the impedance-matching transformer circuit input end is connected with power amplification circuit output end, the match circuit input terminal and
Impedance-matching transformer circuit output end is connected, and the match circuit output end is connected with energy converter.
The signal generating circuit includes phase-locked loop circuit, frequency dividing circuit and delay circuit, the phase-locked loop circuit input
End is connected with waveform translation circuit output end, and the frequency dividing circuit input terminal is connected with phase-locked loop circuit output end, the frequency dividing
Circuit includes the first output end, second output terminal and third output end, and the delay circuit input terminal and frequency dividing circuit first are defeated
Outlet be connected, the delay circuit output end, frequency dividing circuit second output terminal and frequency dividing circuit third output end at waveform
Circuit input end is managed to be connected.
The phase-locked loop circuit includes the tenth resistance R10, eleventh resistor R11, twelfth resistor R12, the 17th resistance
R17, the 18th resistance R18, the 20th resistance R20, the 23rd point of rent R23, the 24th resistance R24, the 27th resistance
R27, the first potentiometer RP1, the second potentiometer RP2, third potentiometer RP3, the 4th potentiometer RP4, the 5th triode Q5, third
11 capacitance C31, the 33rd capacitance C33, the 36th capacitance C36, the 37th capacitance C37, the 38th capacitance C38,
First zener diode D1, the 6th diode D6, the 8th diode D8, the 13rd zener diode D13, CD4046BCN chip
U3 and phase show table, the 3rd pins of CD4046BCN chips U3 and the 14th pin with waveform translation circuit output end phase
Even, the 3rd pins of CD4046BCN chips U3 meet+15V voltages, the CD4046BCN chips U3 by twelfth resistor R12
14th pin connects+15V voltages by eleventh resistor R11, connects between the 6th pins of CD4046BCN chips U3 and the 7th pin
33rd capacitance C33, the 11st pins of CD4046BCN chips U3 meet GND by the 20th resistance R20, described
The 5th pins of CD4046BCN chips U3 and the 8th pin meet GND, the 24th resistance R24 mono- termination CD4046BCN chips U3
12nd pin, the 1st pins of the first potentiometer RP1 are connected with the 24th resistance R24 other ends, first potentiometer
The 3rd pins of RP1 are connected with the 1st pins of the second potentiometer RP2, the 2nd pins of the first potentiometer RP1 and the first potentiometer RP1
3rd pin is connected, and the 2nd pins of the second potentiometer RP2 are connected with the 3rd pins of the second potentiometer RP2, second potentiometer
The 3rd pins of RP2 meet GND, and the 16th pins of CD4046BCN chips U3 connect+15V power supplys by the tenth resistance, and described first is steady
Pressure diode cathode meets GND, and cathode connects the 16th pins of CD4046BCN chips U3, the 38th capacitance C38 and the first voltage stabilizing
Diode D1 is in parallel, and described 17th one end resistance R17 is connected with the 2nd pins of CD4046BCN chips U3, the other end and the five or three
Pole pipe Q5 base stages are connected, and shown 31st one end capacitance C31 is connected with the 17th resistance R17 other ends, another termination GND,
The 5th triode Q5 collectors connect+15V voltages, and emitter is connected with the 1st pins of the 4th potentiometer RP4, the 4th electricity
Device RP4 the 3rd pins in position meet GND, the 2nd pins of the 4th potentiometer RP4 and the 6th diode D6 by the 27th resistance R27
Anode is connected, and the 6th diode D6 cathode are connected with the 9th pins of CD4046BCN chips U3, the CD4046BCN chips U3
9th pin meets GND by the 37th capacitance C37, and the 13rd zener diode D13 cathode pass through the 18th resistance R18
Connect+15V voltages, anode meets GND, and the 8th diode D8 anodes are connected with the 13rd zener diode D13 anodes, cathode with
The 9th pins of CD4046BCN chips U3 are connected, the 3rd pins of third potentiometer RP3 and the 9th pin phases of CD4046BCN chips U3
Even, the 2nd pins of third potentiometer RP3 are connected with the 3rd pins of third potentiometer RP3, and the third potentiometer RP3 the 1st is managed
Foot is connected with the 23rd one end resistance R23, and the 23 resistance R23 other ends show that table is connected with phase, described
The 4th pins of CD4046BCN chips U3 are connected with frequency dividing circuit input terminal.
Frequency dividing circuit includes CD4013 chips U2, the 3rd pins of CD4013 chips U2 and CD4046BCN chips U3 the 4th
Pin is connected, and the 4th pins of CD4013 chips U2, the 6th pin and the 7th pin meet GND, the CD4013 chips U2 the 2nd
Pin is its first output end, and the 13rd pins of CD4013 chips U2 are its second output terminal, the CD4013 chips U2 the
12 pins are its third output end, and the 5th pins of CD4013 chips U2 are connected with the 2nd pins of CD4013 chips U2, described
The 9th pins of CD4013 chips U2 are connected with the 12nd pins of CD4013 chips U2.
The delay circuit includes MC14528B chips U4, the 21st resistance R21 and the 36th capacitance C36, described
The 2nd pins of MC14528B chips U4 connect+15V voltages by the 21st resistance R21, and GND is met by the 36th capacitance C36,
The 5th pins of MC14528B chips U4 connect the 2nd pins of CD4013 chips U2, and the 7th pins of MC14528B chips U4 are it
Output end.
Operation principle：The first potentiometer and the second potentiometer in phase-locked loop circuit are used for setting phase-locked loop circuit output letter
Number frequency, square-wave signal by being transferred to full-bridge driving transformer circuit after waveform processing circuit, waveform processing circuit to
The quality and amplification square-wave signal for improving square-wave signal, drive full-bridge driving transformer circuit, full-bridge driving transformer circuit to drive
Dynamic power amplification circuit, impedance-matching transformer circuit includes voltage acquisition module and current acquisition module, to acquire impedance
The voltage signal and current signal of matching transformer output end, the voltage signal and current signal pass through waveform as feedback signal
Translation circuit becomes being transferred to signal generating circuit after square-wave signal, and signal generating circuit is according to voltage signal and current signal
Phase dynamic adjusts the frequency of its output signal, makes voltage signal and current signal in same phase, when impedance matching transformation
For the voltage and current of device output end in same phase, output power is maximum.
The full-bridge driving transformer circuit and impedance-matching transformer circuit used in the present invention are customed product, but its
What is used is the prior art, and innovative technology is not present, and those skilled in the art is easy for being appreciated that
Technology.
It should be noted that herein, relational terms such as first and second and the like are used merely to a reality
Body or operation are distinguished with another entity or operation, are deposited without necessarily requiring or implying between these entities or operation
In any actual relationship or order or sequence.Moreover, the terms "include", "comprise" or its any other variant are intended to
Non-exclusive inclusion, so that the process, method, article or equipment including a series of elements is not only wanted including those
Element, but also include other elements that are not explicitly listed, or further include for this process, method, article or equipment
Intrinsic element.In the absence of more restrictions, the element limited by sentence "including a ...", it is not excluded that
There is also other identical elements in process, method, article or equipment including the element.
It although an embodiment of the present invention has been shown and described, for the ordinary skill in the art, can be with
Understanding without departing from the principles and spirit of the present invention can carry out these embodiments a variety of variations, modification, replace
And modification, the scope of the present invention is defined by the appended.
Claims (5)
1. a kind of ultrasonic bonding generator, including waveform translation circuit, signal generating circuit, waveform processing circuit, full-bridge drive
Dynamic transformer circuit, power amplification circuit, impedance-matching transformer circuit, match circuit and energy converter, it is characterised in that：It is described
Impedance-matching transformer includes voltage acquisition module and current acquisition module, to acquire the electricity of impedance-matching transformer output end
Press signal and current signal, the voltage acquisition module output end and current acquisition module output end defeated with waveform translation circuit
Enter end to be connected, the waveform translation circuit becomes to the just profound wave signal for acquiring voltage acquisition module and current acquisition module
Square-wave signal, and the just profound wave signal that voltage acquisition module acquires is become the first square-wave signal by waveform translation circuit, by electric current
The just profound wave signal of acquisition module acquisition becomes the second square-wave signal；
The signal generating circuit input terminal is connected with waveform translation circuit output end, and waveform translation circuit is by the first square-wave signal
With the second square wave signal transmission to signal generating circuit；The signal generating circuit is generating the signal of certain frequency, and root
According to the phase adjusted output signal frequency of the first square-wave signal and the second square-wave signal that the transmission of waveform translation circuit comes；
The waveform processing circuit input terminal is connected with signal generating circuit output end, the full-bridge driving transformer circuit input
End is connected with waveform processing circuit output end, the power amplification circuit input terminal and full-bridge driving transformer circuit output end phase
Even, the impedance-matching transformer circuit input end is connected with power amplification circuit output end, the match circuit input terminal and
Impedance-matching transformer circuit output end is connected, and the match circuit output end is connected with energy converter.
2. a kind of ultrasonic bonding generator according to claim 1, it is characterised in that：The signal generating circuit includes
Phase-locked loop circuit, frequency dividing circuit and delay circuit, the phase-locked loop circuit input terminal are connected with waveform translation circuit output end, institute
It states frequency dividing circuit input terminal with phase-locked loop circuit output end to be connected, the frequency dividing circuit includes the first output end, second output terminal
With third output end, the delay circuit input terminal is connected with the first output end of frequency dividing circuit, and the delay circuit output end divides
Frequency circuit second output terminal and frequency dividing circuit third output end are connected with waveform processing circuit input terminal.
3. a kind of ultrasonic bonding generator according to claim 2, it is characterised in that：The phase-locked loop circuit includes the
Ten resistance, eleventh resistor, twelfth resistor, the 17th resistance, the 18th resistance, the 20th resistance, the 23rd point rent, the
24 resistance, the 27th resistance, the first potentiometer, the second potentiometer, third potentiometer, the 4th potentiometer, the five or three pole
Pipe, the 31st capacitance, the 33rd capacitance, the 36th capacitance, the 37th capacitance, the 38th capacitance, the first voltage stabilizing
Diode, the 6th diode, the 8th diode, the 13rd zener diode, CD4046BCN chips and phase show table, described
The 3rd pin of CD4046BCN chips and the 14th pin are connected with waveform translation circuit output end, the CD4046BCN chips the 3rd
Pin connects+15V voltages by twelfth resistor, and the 14th pin of CD4046BCN chips connects+15V electricity by eleventh resistor
Pressure, the 33rd capacitance of connecting between the 6th pin of CD4046BCN chips and the 7th pin, the CD4046BCN chips the 11st
Pin meets GND by the 20th resistance, and the 5th pin of CD4046BCN chips and the 8th pin connect GND, the 24th electricity
The 12nd pin of one termination CD4046BCN chips of resistance, the 1st pin of the first potentiometer are connected with the 24th resistance other end,
The 3rd pin of first potentiometer is connected with the 1st pin of the second potentiometer, the 2nd pin of the first potentiometer and the first current potential
The 3rd pin of device is connected, and the 2nd pin of the second potentiometer is connected with the 3rd pin of the second potentiometer, second potentiometer the 3rd
Pin meets GND, and the 16th pin of CD4046BCN chips connects+15V power supplys, first zener diode by the tenth resistance
Anode meets GND, and cathode connects the 16th pin of CD4046BCN chips, and the 38th capacitance is in parallel with the first zener diode, institute
The 17th resistance one end to be stated with the 2nd pin of CD4046BCN chips to be connected, the other end is connected with the 5th transistor base, and shown
31 capacitance one end are connected with the 17th resistance other end, another termination GND, and the 5th transistor collector connects+15V electricity
Pressure, emitter are connected with the 1st pin of the 4th potentiometer, and the 3rd pin of the 4th potentiometer meets GND by the 27th resistance,
The 2nd pin of 4th potentiometer is connected with the 6th diode cathode, the 6th diode cathode and CD4046BCN chips the
9 pins are connected, and the 9th pin of CD4046BCN chips connects GND, the 13rd zener diode by the 37th capacitance
Cathode connects+15V voltages by the 18th resistance, and anode meets GND, and the 8th diode cathode and the 13rd zener diode are just
Extremely it is connected, cathode is connected with the 9th pin of CD4046BCN chips, the 3rd pin of third potentiometer and CD4046BCN chips the 9th
Pin be connected, the 2nd pin of third potentiometer is connected with the 3rd pin of third potentiometer, the 1st pin of third potentiometer and
23rd resistance one end is connected, and the 23 resistance other end and phase display table are connected, the CD4046BCN chips the
4 pins are connected with frequency dividing circuit input terminal.
4. a kind of ultrasonic bonding generator according to claim 3, it is characterised in that：Frequency dividing circuit includes CD4013 cores
Piece, the 3rd pin of CD4013 chips are connected with the 4th pin of CD4046BCN chips, the 4th pin of CD4013 chips, the 6th
Pin and the 7th pin meet GND, and the 2nd pin of CD4013 chips is its first output end, the CD4013 chips the 13rd
Pin is its second output terminal, and the 12nd pin of CD4013 chips is its third output end, the 5th pin of CD4013 chips
It is connected with the 2nd pin of CD4013 chips, the 9th pin of CD4013 chips is connected with the 12nd pin of CD4013 chips.
5. a kind of ultrasonic bonding generator according to claim 4, it is characterised in that：The delay circuit includes
MC14528B chips, the 21st resistance and the 36th capacitance, the 2nd pin of MC14528B chips pass through the 21st electricity
Resistance connects+15V voltages, meets GND by the 36th capacitance, the 5th pin of MC14528B chips connects the pipe of CD4013 chips the 2nd
Foot, the 7th pin of MC14528B chips are its output end.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810460072.2A CN108422076A (en) | 2018-05-15 | 2018-05-15 | A kind of ultrasonic bonding generator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810460072.2A CN108422076A (en) | 2018-05-15 | 2018-05-15 | A kind of ultrasonic bonding generator |
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| Publication Number | Publication Date |
|---|---|
| CN108422076A true CN108422076A (en) | 2018-08-21 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810460072.2A Pending CN108422076A (en) | 2018-05-15 | 2018-05-15 | A kind of ultrasonic bonding generator |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
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