CN108417702B - Deep ultraviolet LED packaging structure with heat dissipation function - Google Patents
Deep ultraviolet LED packaging structure with heat dissipation function Download PDFInfo
- Publication number
- CN108417702B CN108417702B CN201810100524.6A CN201810100524A CN108417702B CN 108417702 B CN108417702 B CN 108417702B CN 201810100524 A CN201810100524 A CN 201810100524A CN 108417702 B CN108417702 B CN 108417702B
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- Prior art keywords
- heat dissipation
- fixed
- deep ultraviolet
- ultraviolet led
- packaging structure
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 48
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 28
- 239000000758 substrate Substances 0.000 claims abstract description 21
- 239000002184 metal Substances 0.000 claims abstract description 18
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 9
- 239000000741 silica gel Substances 0.000 claims abstract description 9
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 9
- 238000003466 welding Methods 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 3
- 239000003292 glue Substances 0.000 claims description 2
- 230000002146 bilateral effect Effects 0.000 claims 2
- 238000000605 extraction Methods 0.000 abstract description 7
- 230000007547 defect Effects 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 16
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 239000012790 adhesive layer Substances 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 238000001816 cooling Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000011324 bead Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000000499 gel Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000005022 packaging material Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/642—Heat extraction or cooling elements characterized by the shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
The invention relates to an LED packaging structure, in particular to a deep ultraviolet LED packaging structure with a heat dissipation function, which comprises a transparent support and a transparent cover plate, wherein a groove is formed in the transparent support, a first metal layer is fixed at the bottom of the groove, a second metal layer matched with the groove is fixed at the bottom of the transparent cover plate, a containing cavity is formed in the transparent support, an LED substrate is fixed at the bottom of the containing cavity, a deep ultraviolet LED is arranged on the LED substrate, an organic silica gel layer is coated between the LED substrate and the deep ultraviolet LED, a through hole is formed in the organic silica gel layer, a main heat dissipation plate is arranged in the LED substrate, the bottom of the main heat dissipation plate is fixed with one end of a vertical heat dissipation plate, the other end of the vertical heat dissipation plate extends out of the bottom of the transparent support and is fixed with a horizontal heat dissipation; the technical scheme provided by the invention can effectively overcome the defects of poor heat dissipation performance, low light extraction efficiency and the like in the prior art.
Description
Technical Field
The invention relates to an LED packaging structure, in particular to a deep ultraviolet LED packaging structure with a heat dissipation function.
Background
Generally, the function of the package is to provide sufficient protection to the chip, preventing the chip from long-term exposure to air or failure due to mechanical damage, so as to improve the stability of the LED chip. For LED packaging, it is also necessary to have good light extraction efficiency and good heat dissipation, and good packaging can make the LED have better luminous efficiency and heat dissipation environment, thereby improving the life of the LED.
The current development of the domestic LED packaging industry is mature, and a complete LED packaging industry chain is formed. In the regional distribution, the bead triangle area is the area with the most concentrated and largest industrial scale for the LED packaging enterprises in mainland China, the number of the enterprises exceeds 2/3 in China, and accounts for 68% of the total amount of the enterprises in China, and besides the slight shortage of the field of the upstream LED epitaxial chip, a plurality of packaging materials and manufacturers and agents of packaging equipment are gathered, and the matching is the most perfect. In the second place, the number of enterprises accounts for about 17% of the whole country, and the number of other areas accounts for 15%.
The existing deep ultraviolet LED packaging structure has poor heat dissipation performance, so that heat generated during the operation of an LED chip cannot be dissipated in time, and the service life of the LED chip is greatly influenced. In addition, the light extraction efficiency of the existing LED package structure is low, and the light energy generated when the LED chip works cannot be well utilized.
Disclosure of Invention
The invention provides a deep ultraviolet LED packaging structure with a heat dissipation function, aiming at solving the technical problems in the prior art, and the deep ultraviolet LED packaging structure can effectively overcome the defects of poor heat dissipation performance, low light extraction efficiency and the like in the prior art.
In order to achieve the purpose, the invention is realized by the following technical scheme: a deep ultraviolet LED packaging structure with heat dissipation function comprises a transparent bracket and a transparent cover plate, the transparent bracket is provided with a groove, the bottom of the groove is fixed with a first metal layer, the bottom of the transparent cover plate is fixed with a second metal layer matched with the groove, an accommodating cavity is arranged in the transparent bracket, an LED substrate is fixed at the bottom in the accommodating cavity, the deep ultraviolet LED is arranged on the LED substrate, an organic silica gel layer is coated between the LED substrate and the deep ultraviolet LED, the organic silicon adhesive layer is provided with a through hole, the LED substrate is internally provided with a main heat dissipation plate, the bottom of the main heat dissipation plate is fixed with one end of the vertical heat dissipation plate, the other end of the vertical heating panel extends out of the bottom of the transparent support and is fixed with the horizontal heating panel, support frames are fixed to the bottom of the containing cavity and located on two sides of the LED substrate, a reflecting plate is fixed to the top of each support frame, and supporting legs are arranged at the bottom of the transparent support.
Preferably, the first metal layer and the second metal layer are fixed by resistance welding.
Preferably, the organic silica gel layer is fixed by UV gel.
Preferably, the inner wall of the accommodating cavity and the reflector plate are coated with reflective coatings.
Preferably, the support frames are arranged in a left-right symmetrical mode.
Preferably, the supporting feet are arranged in a left-right symmetrical mode.
Compared with the prior art, the deep ultraviolet LED packaging structure with the heat dissipation function can utilize the main heat dissipation plate to conduct heat generated by the deep ultraviolet LED chip on the LED substrate during working to the vertical heat dissipation plate and the horizontal heat dissipation plate, so that the heat in the accommodating cavity is conducted to the outside, and the heat dissipation performance of the packaging structure is effectively improved; the arrangement of the reflector can effectively improve the light extraction efficiency, so that the light energy generated by the deep ultraviolet LED chip during working can be effectively utilized.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below. It is obvious that the drawings in the following description are only some embodiments of the invention, and that for a person skilled in the art, other drawings can be derived from them without inventive effort.
FIG. 1 is a schematic structural view of the present invention; in the figure: 1. A transparent support; 2. a groove; 3. a first metal layer; 4. a transparent cover plate; 5. a second metal layer; 6. an accommodating chamber; 7. an LED substrate; 8. a deep ultraviolet LED; 9. an organic silica gel layer; 10. a through hole; 11. a primary heat sink; 12. a vertical heat dissipation plate; 13. a horizontal heat dissipation plate; 14. A support frame; 15. a reflector; 16. support the feet.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention. It is to be understood that the embodiments described are only a few embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
A deep ultraviolet LED packaging structure with a heat dissipation function comprises a transparent support 1 and a transparent cover plate 4, wherein a groove 2 is arranged at the upper end of the transparent support 1, a first metal layer 3 is fixed at the bottom of the groove 2, a second metal layer 5 matched with the groove 2 is fixed at the bottom of the transparent cover plate 4, a containing cavity 6 is arranged in the transparent support 1, an LED substrate 7 is fixed at the bottom in the containing cavity 6, a deep ultraviolet LED8 is arranged on the LED substrate 7, an organic silicon adhesive layer 9 is coated between the LED substrate 7 and a deep ultraviolet LED8, a through hole 10 is formed in the organic silicon adhesive layer 9, a main heat dissipation plate 11 is arranged in the LED substrate 7, the bottom of the main heat dissipation plate 11 is fixed with one end of a vertical heat dissipation plate 12, the other end of the vertical heat dissipation plate 12 extends out of the bottom of the transparent support 1 and is fixed with a horizontal heat dissipation plate 13, supporting frames 14 are fixed at the two sides of, the bottom of the transparent bracket 1 is provided with a supporting leg 16.
The first metal layer 3 and the second metal layer 5 are fixed through resistance welding, the organic silica gel layer 9 is fixed through UV glue, the inner wall of the accommodating cavity 6 and the reflecting plate 15 are coated with reflecting coatings, the supporting frames 14 are arranged in a left-right symmetrical mode, and the supporting legs 16 are arranged in a left-right symmetrical mode.
The first metal layer 3 and the second metal layer 5 are fixed by resistance welding, so that the sealing performance between the transparent cover plate 4 and the transparent support 1 can be effectively improved. Utilize main heat dissipation board 11 can be with on the LED base plate 7 dark ultraviolet LED chip 8 during operation heat conduction vertical cooling plate 12 and the horizontal cooling plate 13 of producing to the heat conduction outside of holding the inside of chamber 6 has effectively improved packaging structure's heat dispersion. The arrangement of the reflector 15 can effectively improve the light extraction efficiency, so that the light energy generated by the deep ultraviolet LED chip 8 during operation can be effectively utilized.
The deep ultraviolet LED packaging structure with the heat dissipation function can utilize the main heat dissipation plate to conduct heat generated by the deep ultraviolet LED chip on the LED substrate during working to the vertical heat dissipation plate and the horizontal heat dissipation plate, and conduct heat inside the nano cavity to the outside, so that the heat dissipation performance of the packaging structure is effectively improved; the arrangement of the reflector can effectively improve the light extraction efficiency, so that the light energy generated by the deep ultraviolet LED chip during working can be effectively utilized.
The above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and nature of the corresponding technical solutions.
Claims (6)
1. The utility model provides a deep ultraviolet LED packaging structure with heat dissipation function which characterized in that: the LED lamp comprises a transparent support (1) and a transparent cover plate (4), wherein a groove (2) is formed in the upper end of the transparent support (1), a first metal layer (3) is fixed at the bottom of the groove (2), a second metal layer (5) matched with the groove (2) is fixed at the bottom of the transparent cover plate (4), a containing cavity (6) is formed in the transparent support (1), an LED substrate (7) is fixed at the bottom in the containing cavity (6), a deep ultraviolet LED (8) is arranged on the LED substrate (7), an organic silica gel layer (9) is coated between the LED substrate (7) and the deep ultraviolet LED (8), a through hole (10) is formed in the organic silica gel layer (9), a main heat dissipation plate (11) is arranged in the LED substrate (7), the bottom of the main heat dissipation plate (11) is fixed with one end of a vertical heat dissipation plate (12), and the other end of the vertical heat dissipation plate (12) extends out of the bottom of the transparent support (1) and is, support frames (14) are fixed on two sides of the LED substrate (7) at the bottom in the accommodating cavity (6), a reflecting plate (15) is fixed on the top of each support frame (14), and supporting legs (16) are arranged at the bottom of the transparent support (1).
2. The deep ultraviolet LED packaging structure with heat dissipation function of claim 1, wherein: the first metal layer (3) and the second metal layer (5) are fixed through resistance welding.
3. The deep ultraviolet LED packaging structure with heat dissipation function of claim 1, wherein: the organic silica gel layer (9) is fixed through UV glue.
4. The deep ultraviolet LED packaging structure with heat dissipation function of claim 1, wherein: and the inner wall of the accommodating cavity (6) and the reflector (15) are coated with reflective coatings.
5. The deep ultraviolet LED packaging structure with heat dissipation function of claim 1, wherein: the support frames (14) are arranged in a bilateral symmetry mode.
6. The deep ultraviolet LED packaging structure with heat dissipation function of claim 1, wherein: the supporting legs (16) are arranged in a bilateral symmetry mode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810100524.6A CN108417702B (en) | 2018-02-01 | 2018-02-01 | Deep ultraviolet LED packaging structure with heat dissipation function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810100524.6A CN108417702B (en) | 2018-02-01 | 2018-02-01 | Deep ultraviolet LED packaging structure with heat dissipation function |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108417702A CN108417702A (en) | 2018-08-17 |
| CN108417702B true CN108417702B (en) | 2020-02-04 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810100524.6A Active CN108417702B (en) | 2018-02-01 | 2018-02-01 | Deep ultraviolet LED packaging structure with heat dissipation function |
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| Country | Link |
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| CN (1) | CN108417702B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109786535B (en) * | 2018-12-17 | 2020-06-26 | 旭宇光电（深圳）股份有限公司 | Deep ultraviolet light-emitting device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN200959342Y (en) * | 2006-09-11 | 2007-10-10 | 亿光电子工业股份有限公司 | LED device |
| CN101271948A (en) * | 2008-04-29 | 2008-09-24 | 深圳市量子光电子有限公司 | LED encapsulation structure and forming method thereof |
| JP4198102B2 (en) * | 2004-09-17 | 2008-12-17 | 株式会社リコー | Semiconductor device, image reading unit, and image forming apparatus |
| CN106299086A (en) * | 2016-09-30 | 2017-01-04 | 广州莱迪光电股份有限公司 | A kind of cooling LED encapsulating structure |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20150138779A1 (en) * | 2012-08-10 | 2015-05-21 | Goldeneye, Inc. | Lightweight low profile solid state panel light source |
-
2018
- 2018-02-01 CN CN201810100524.6A patent/CN108417702B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4198102B2 (en) * | 2004-09-17 | 2008-12-17 | 株式会社リコー | Semiconductor device, image reading unit, and image forming apparatus |
| CN200959342Y (en) * | 2006-09-11 | 2007-10-10 | 亿光电子工业股份有限公司 | LED device |
| CN101271948A (en) * | 2008-04-29 | 2008-09-24 | 深圳市量子光电子有限公司 | LED encapsulation structure and forming method thereof |
| CN106299086A (en) * | 2016-09-30 | 2017-01-04 | 广州莱迪光电股份有限公司 | A kind of cooling LED encapsulating structure |
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| Publication number | Publication date |
|---|---|
| CN108417702A (en) | 2018-08-17 |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20200103 Address after: 317000 Dafang, Dongcheng Town, Linhai City, Taizhou City, Zhejiang Province Applicant after: Zhejiang Daming Photoelectric Technology Co., Ltd Address before: 215300 room 2515, building 291, Qianjin East Road, Kunshan Development Zone, Suzhou, Jiangsu. Applicant before: Suzhou Xin Kai Kang electronic materials Co., Ltd. |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Deep ultraviolet LED packaging structure with heat dissipation function Effective date of registration: 20210922 Granted publication date: 20200204 Pledgee: Agricultural Bank of China (Limited by Share Ltd.) branch of Lin Hai City Pledgor: Zhejiang Daming Photoelectric Technology Co.,Ltd. Registration number: Y2021330001741 |