CN108417535A - A kind of production technology of adjustable circuit circuit board - Google Patents
A kind of production technology of adjustable circuit circuit board Download PDFInfo
- Publication number
- CN108417535A CN108417535A CN201810305554.0A CN201810305554A CN108417535A CN 108417535 A CN108417535 A CN 108417535A CN 201810305554 A CN201810305554 A CN 201810305554A CN 108417535 A CN108417535 A CN 108417535A
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- CN
- China
- Prior art keywords
- function module
- circuit
- circuit board
- production technology
- adjustable
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Abstract
The present invention provides a kind of production technology of adjustable circuit circuit board, the circuit circuit board carries adjustable structure, the adjustable structure includes following function module, monitoring signals function module, signal Analysis function module, the function module for receiving external control signal, the network storage function module for transmitting signal, sending out signals function module and the derived informational function module of processing；The production technology includes the following steps：1）Make silicon wafer；2）Make integrated circuit；3）Integrated antenna package.The production technology of the adjustable circuit circuit board of the present invention, the circuit circuit board produced can be easy to be accurately positioned mistake, obtain flexible debugging function.
Description
Technical field
The present invention relates to a kind of production technologies of adjustable circuit circuit board, belong to technical field of integrated circuits.
Background technology
Integrated circuit（integrated circuit）It is a kind of microelectronic device or component.Using certain technique,
Together the elements such as transistor, diode, resistance, capacitance and inductance needed for a circuit and wiring interconnection, it is produced on one
On fritter or a few fritter semiconductor wafers or dielectric substrate, it is then encapsulated in a shell, becomes with required circuit function
Microstructure；Wherein all elements have formed a whole in structure, to make electronic component towards microminaturization, low work(
Major step has been strided forward in terms of consumption and high reliability.It uses alphabetical " ic " in circuit（Also useful letter symbol " n " etc.）It indicates.
Integrated circuit board can be divided into Analogous Integrated Electronic Circuits plate and digital two major classes by its function, the difference of structure.Simulation
For generating, amplifying and handling various analog signals（The fingerbreadth degree signal that borderland changes at any time.Such as transistor radio
The tape signal etc. of audio signal, videocorder）, and number is used for generating, amplify and handling various digital signals（Refer in time
With the signal of discrete value in amplitude.Such as the audio signal and vision signal that VCD, DVD are reset）.
The demand debugged with the continuous improvement of hardware complexity and concurrent software constantly increases, and adjustable designs
As the important content in IC design.
Invention content
The goal of the invention of the present invention is to overcome the deficiencies of the prior art and provide a kind of production work of adjustable circuit circuit board
Skill.
The production technology of the adjustable circuit circuit board of the present invention, the circuit circuit board carry adjustable structure,
The adjustable structure includes following function module, and monitoring signals function module, receives outside at signal Analysis function module
Function module, the network storage function module for transmitting signal, sending out signals function module and the processing for controlling signal are led
The informational function module gone out；
The production technology includes the following steps：
1）Silicon wafer is made, including using polysilicon as raw material, prepares monocrystalline silicon, then slice, edge grinding, polishing, package
And transport；
2）Integrated circuit, including figure conversion, doping and film are made, figure conversion is the side using lithography and etching
Method will design in the pattern transfer to silicon wafer on mask plate, and the doping is that various impurity are entrained in the position of needs
It sets, the film is that film is made in silicon wafer；
3）Integrated antenna package：The plastics of integrated circuit insulation or ceramic material are packaged.
The step 1）Including following four step：
1）Silicon ore is changed into high-purity gas；
2）High-purity gas is changed into polysilicon
3）Polysilicon is changed into monocrystalline silicon, and is made and oozes stray crystal stick；
4）Wafer is made in crystal bar.
The production technology of the adjustable circuit circuit board of the present invention, the circuit circuit board produced can be easy to be accurately positioned
Mistake obtains flexible debugging function.
Specific implementation mode
The production technology of the adjustable circuit circuit board of the present invention, the circuit circuit board carry adjustable structure,
The adjustable structure includes following function module, and monitoring signals function module, receives outside at signal Analysis function module
Function module, the network storage function module for transmitting signal, sending out signals function module and the processing for controlling signal are led
The informational function module gone out；
The production technology includes the following steps：
1）Silicon wafer is made, including using polysilicon as raw material, prepares monocrystalline silicon, then slice, edge grinding, polishing, package
And transport；
2）Integrated circuit, including figure conversion, doping and film are made, figure conversion is the side using lithography and etching
Method will design in the pattern transfer to silicon wafer on mask plate, and the doping is that various impurity are entrained in the position of needs
It sets, the film is that film is made in silicon wafer；
3）Integrated antenna package：The plastics of integrated circuit insulation or ceramic material are packaged.
The step 1）Including following four step：
1）Silicon ore is changed into high-purity gas；
2）High-purity gas is changed into polysilicon
3）Polysilicon is changed into monocrystalline silicon, and is made and oozes stray crystal stick；
4）Wafer is made in crystal bar.
Claims (2)
1. a kind of production technology of adjustable circuit circuit board, which is characterized in that the circuit circuit board carries adjustable
Structure, the adjustable structure include following function module, and monitoring signals function module, connects signal Analysis function module
Receive the function module of external control signal, the network storage function module for transmitting signal, sending out signals function module and
The derived informational function module of processing；
The production technology includes the following steps：
1）Silicon wafer is made, including using polysilicon as raw material, prepares monocrystalline silicon, then slice, edge grinding, polishing, package
And transport；
2）Integrated circuit, including figure conversion, doping and film are made, figure conversion is the side using lithography and etching
Method will design in the pattern transfer to silicon wafer on mask plate, and the doping is that various impurity are entrained in the position of needs
It sets, the film is that film is made in silicon wafer；
3）Integrated antenna package：The plastics of integrated circuit insulation or ceramic material are packaged.
2. the production technology of adjustable circuit circuit board according to claim 1, which is characterized in that the step 1）Packet
Include following four step：
1）Silicon ore is changed into high-purity gas；
2）High-purity gas is changed into polysilicon
3）Polysilicon is changed into monocrystalline silicon, and is made and oozes stray crystal stick；
4）Wafer is made in crystal bar.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810305554.0A CN108417535A (en) | 2018-04-08 | 2018-04-08 | A kind of production technology of adjustable circuit circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810305554.0A CN108417535A (en) | 2018-04-08 | 2018-04-08 | A kind of production technology of adjustable circuit circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108417535A true CN108417535A (en) | 2018-08-17 |
Family
ID=63134965
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810305554.0A Pending CN108417535A (en) | 2018-04-08 | 2018-04-08 | A kind of production technology of adjustable circuit circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108417535A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1163483A (en) * | 1996-04-19 | 1997-10-29 | 松下电器产业株式会社 | Semiconductor integrated circuit and system using said circuit |
| CN1864260A (en) * | 2003-10-08 | 2006-11-15 | 加拿大硅锗半导体公司 | Module integration integrated circuits |
| CN103036636A (en) * | 2011-09-29 | 2013-04-10 | 美国博通公司 | Signal distribution and radiation in a wireless enabled integrated circuit (ic) |
-
2018
- 2018-04-08 CN CN201810305554.0A patent/CN108417535A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1163483A (en) * | 1996-04-19 | 1997-10-29 | 松下电器产业株式会社 | Semiconductor integrated circuit and system using said circuit |
| CN1864260A (en) * | 2003-10-08 | 2006-11-15 | 加拿大硅锗半导体公司 | Module integration integrated circuits |
| CN103036636A (en) * | 2011-09-29 | 2013-04-10 | 美国博通公司 | Signal distribution and radiation in a wireless enabled integrated circuit (ic) |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180817 |