TW200802518A - Rotary chip attach - Google Patents
Rotary chip attachInfo
- Publication number
- TW200802518A TW200802518A TW95142566A TW95142566A TW200802518A TW 200802518 A TW200802518 A TW 200802518A TW 95142566 A TW95142566 A TW 95142566A TW 95142566 A TW95142566 A TW 95142566A TW 200802518 A TW200802518 A TW 200802518A
- Authority
- TW
- Taiwan
- Prior art keywords
- wafer
- ics
- place
- rotary
- web
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
Landscapes
- Die Bonding (AREA)
Abstract
A rotary chip attach process and manufacturing approach takes chips (e.g., integrated circuits (ICs)) from a wafer in a rotary process. A chip wafer with a positioning unit is placed over the top of a sprocketed wheel that picks the ICs directly from the wafer and moves them in a semi-continuous in-step motion to a web that will accept the ICs. The sprocketed wheel includes chips that are preferably the same type as used in a typical pick-and-place robotic system, with vacuum heads adapted to pierce the wafer flat membrane (if needed), grab and IC and place and IC as desired. This positioning system keeps the IC's placement in an accurate position on the web, which can be made to move continuously with a plurality of sprocketed wheel placement units in place.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US73812005P | 2005-11-18 | 2005-11-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW200802518A true TW200802518A (en) | 2008-01-01 |
Family
ID=40332824
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW95142566A TW200802518A (en) | 2005-11-18 | 2006-11-17 | Rotary chip attach |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TW200802518A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107991518A (en) * | 2018-01-09 | 2018-05-04 | 昆山康信达光电有限公司 | It is a kind of can circumferential spinning current probe structure |
| CN112967985A (en) * | 2020-09-28 | 2021-06-15 | 重庆康佳光电技术研究院有限公司 | Transfer structure, manufacturing method thereof, chip transfer method, display panel and device |
| CN116631929A (en) * | 2023-07-24 | 2023-08-22 | 广东工业大学 | Chip transfer method, system, equipment and medium based on swing arm die bonder |
-
2006
- 2006-11-17 TW TW95142566A patent/TW200802518A/en unknown
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107991518A (en) * | 2018-01-09 | 2018-05-04 | 昆山康信达光电有限公司 | It is a kind of can circumferential spinning current probe structure |
| CN107991518B (en) * | 2018-01-09 | 2023-09-05 | 康信达科技(苏州)有限公司 | Current probe structure capable of circumferential spinning |
| CN112967985A (en) * | 2020-09-28 | 2021-06-15 | 重庆康佳光电技术研究院有限公司 | Transfer structure, manufacturing method thereof, chip transfer method, display panel and device |
| CN116631929A (en) * | 2023-07-24 | 2023-08-22 | 广东工业大学 | Chip transfer method, system, equipment and medium based on swing arm die bonder |
| CN116631929B (en) * | 2023-07-24 | 2024-01-05 | 广东工业大学 | Chip transfer method, system, equipment and medium based on swing arm die bonder |
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