CN108413639B - Composite temperature fluctuation suppression structure with refrigerator as cold source - Google Patents

Composite temperature fluctuation suppression structure with refrigerator as cold source Download PDF

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Publication number
CN108413639B
CN108413639B CN201810307044.7A CN201810307044A CN108413639B CN 108413639 B CN108413639 B CN 108413639B CN 201810307044 A CN201810307044 A CN 201810307044A CN 108413639 B CN108413639 B CN 108413639B
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China
Prior art keywords
refrigerator
heat capacity
temperature fluctuation
suppression structure
fluctuation suppression
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CN201810307044.7A
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CN108413639A (en
Inventor
高波
罗二仓
潘长钊
张海洋
陈燕燕
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Technical Institute of Physics and Chemistry of CAS
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Technical Institute of Physics and Chemistry of CAS
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Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25BREFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B9/00Compression machines, plants or systems, in which the refrigerant is air or other gas of low boiling point
    • F25B9/14Compression machines, plants or systems, in which the refrigerant is air or other gas of low boiling point characterised by the cycle used, e.g. Stirling cycle
    • F25B9/145Compression machines, plants or systems, in which the refrigerant is air or other gas of low boiling point characterised by the cycle used, e.g. Stirling cycle pulse-tube cycle
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25BREFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2500/00Problems to be solved
    • F25B2500/11Reducing heat transfers
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F2013/001Particular heat conductive materials, e.g. superconductive elements

Abstract

The invention relates to a composite temperature fluctuation suppression structure taking a refrigerator as a cold source, which comprises the following components: a refrigerator that provides a cold source; a refrigerator cold end flange connected to the refrigerator; a sample flange connected to the sample; and a composite temperature fluctuation suppression structure is arranged between the refrigerator cold section flange and the sample flange. The invention combines the advantages of the heat capacity method and the thermal resistance method, adopts the lamellar heat capacity material to reduce the temperature fluctuation without basically causing the temperature rise, and adopts the slender thermal resistance material with high heat conduction to reduce the temperature fluctuation without basically causing the temperature rise; the heat capacity materials are connected with other parts by adopting low-temperature glue with high heat conductivity coefficient or direct welding, so that the defect of uncontrollable contact thermal resistance caused by threaded connection is avoided.

Description

Composite temperature fluctuation suppression structure with refrigerator as cold source
Technical Field
The present invention relates to a temperature fluctuation suppressing structure, and more particularly, to a composite temperature fluctuation suppressing structure using a refrigerator as a cold source.
Background
The GM refrigerator or GM pulse tube refrigerator is the only 4K temperature zone refrigerator commercially available at present, and has important applications in the fields of low-temperature physics, medicine and the like, especially in low-temperature systems using the refrigerator as a cold source, the GM refrigerator or GM pulse tube refrigerator is increasingly applied due to the advantages of no need of low-temperature liquid, convenient operation, long running time and the like.
The GM refrigerator or GM pulse tube refrigerator needs periodic pressure wave driving to generate refrigeration effect, the temperature of the internal working medium will show periodic fluctuation along with the change of pressure, and the specific heat capacity of copper and other materials is very small at low temperature, so that the temperature outside the cold end heat exchanger of the GM refrigerator or GM pulse tube refrigerator has larger fluctuation (about 200mK-500 mK), therefore, the low-temperature sample cannot be directly installed at the cold end of the refrigerator for testing. In order to effectively attenuate the cold end temperature of the refrigerator, the current common practice is divided into two types, namely a heat capacity method, namely adding low-temperature Gao Bire materials such as a liquid helium cavity, a lead block and the like between the cold end of the refrigerator and a sample; another approach is the thermal resistance method, i.e., adding a low thermal conductivity material between the cold end of the refrigerator and the sample. The heat capacity method increases the load and complexity of the cold end of the refrigerator, and the temperature fluctuation suppression effect is limited; the thermal resistance method can lead the sample to have larger temperature difference with the refrigerator, so that the lowest temperature of the sample is increased.
Aiming at the defects of the current method for suppressing the temperature fluctuation of the cold end of the refrigerator, a simple and effective method is required to be provided to realize the efficient suppression of the temperature fluctuation of the sample.
Disclosure of Invention
The invention aims to solve the problems of large volume, heavy weight, complex structure, difficult control of total thermal resistance, lowest temperature rise and the like in the traditional sample structure taking a refrigerator as a cold source and a temperature fluctuation suppression method thereof.
The invention provides a composite temperature fluctuation suppression structure taking a refrigerator as a cold source, which comprises the following components: a refrigerator that provides a cold source; a refrigerator cold end flange connected to the refrigerator; a sample flange connected to the sample; and a composite temperature fluctuation suppression structure is arranged between the refrigerator cold section flange and the sample flange.
The composite temperature fluctuation suppression structure comprises a first heat capacity material, a thermal resistance material and a second heat capacity material.
Wherein the first heat capacity material is HoCu 2 、Er 3 Ni、Er 0.5 Pr 0.5 Or magnetic materials such as ErNi.
The first heat capacity material is a material with higher specific heat capacity at low temperature such as lead.
Wherein the second heat capacity material is HoCu 2 、Er 3 Ni、Er 0.5 Pr 0.5 Or magnetic materials such as ErNi.
The second heat capacity material is a material with higher specific heat capacity at low temperature, such as lead.
Wherein the first heat capacity material is the same as the second heat capacity material.
Wherein the first heat capacity material is different from the second heat capacity material.
The thermal resistance material is high-purity oxygen-free copper, high-purity aluminum, sapphire or graphene and other materials with high thermal conductivity at low temperature.
Wherein the refrigerator is a pulse tube refrigerator with low vibration, and provides a working temperature of 2.2K-300K for the sample.
The invention provides a composite temperature fluctuation suppression structure, which can realize high-efficiency suppression of temperature fluctuation under small temperature difference by adopting a simple structure.
Drawings
FIG. 1 is a schematic diagram of a composite temperature fluctuation suppression structure according to the present invention.
Detailed Description
In order to facilitate understanding of the invention, embodiments of the invention are described below with reference to the accompanying drawings, it being understood by those skilled in the art that the description below is for ease of explanation of the invention only and is not intended to limit the scope of the invention in any way.
The invention provides a composite temperature fluctuation suppression structure, and fig. 1 is a schematic diagram of the suppression structure of the invention. As shown in fig. 1, the composite temperature fluctuation suppression structure of the present invention includes: the refrigerator comprises a refrigerator 1, a refrigerator cold end flange 2, a first heat capacity material 3-1, a thermal resistance material 3-2, a second heat capacity material 3-3 and a sample flange 4. The refrigerator 1 is a cold source required by sample measurement; 3-1, 3-2 and 3-3 are formed into a composite structure to inhibit temperature fluctuations from being transmitted to the sample flange 4; so that the sample flange 4 provides a constant temperature for the sample without fluctuations.
In the embodiment shown in fig. 1, refrigerator 1 is a low vibration pulse tube refrigerator that provides a sample with an operating temperature of 2.2K to 300K, where the temperature of the refrigerator cold end flange initially fluctuates by about 200mK to 500mK. The refrigerator 1 may preferably be a GM refrigerator, or other refrigerator forms using pressure wave driving, such as a GM pulse tube refrigerator, a VM pulse tube refrigerator, a stirling refrigerator, and a stirling pulse tube refrigerator.
The first heat capacity material 3-1 is in a sheet shape and is adhered to the cold end flange 2 of the refrigerator through low-temperature adhesive with high heat conductivity coefficient. The first heat capacity material 3-1 and the cold end flange 2 of the refrigerator can be bonded by adopting low-temperature glue with high heat conductivity coefficient, and can also be connected by adopting other welding modes such as soldering, silver soldering and the like.
The shape of the first heat capacity material 3-1 can be round or other polygons, the thickness of the first heat capacity material is preferably 0.01mm-10mm, and the equivalent diameter of the first heat capacity material can be any size smaller than the cold end flange 2 of the refrigerator; the first heat capacity material is preferably HoCu 2 、Er 3 Ni、Er 0.5 Pr 0.5 Or magnetic materials such as ErNi; and the material can also be other materials with higher specific heat capacity at low temperature, such as lead.
The first heat capacity material 3-1 has higher specific heat at low temperature and low thermal diffusivity, so that temperature fluctuation transferred from the upper surface to the lower surface of the first heat capacity material can be effectively attenuated, the temperature fluctuation can be attenuated to about 10mK, and the average temperature of the upper surface and the lower surface of the first heat capacity material 3-1 is basically not different due to the thin thickness of the first heat capacity material.
The thermal resistance material 3-2 is connected with the first heat capacity material 3-1, and the thermal resistance material 3-2 and the first heat capacity material 3-1 can be connected by adopting other welding modes such as soldering, silver soldering and the like, or can be bonded by adopting low-temperature glue with high heat conductivity coefficient.
The thermal resistance material 3-2 and the heat capacity material 3-1 are welded together, the thermal resistance material 3-2 is made of an elongated strip material with high thermal conductivity at low temperature, the high thermal conductivity can ensure that the average temperature is not increased basically, the elongated wire shape ensures that the sectional area is small and the length is long, so that the temperature fluctuation is restrained, and the temperature fluctuation can be further attenuated to about 1mK when the temperature fluctuation is transmitted from the upper end to the lower end of the thermal resistance material 3-2.
The thermal resistance material 3-2 may be in the form of filaments, preferably having a diameter of 0.1mm to 5mm, or in the form of flakes, having a thickness of 0.1mm to 5mm, and having a length of 1mm to 1m; when in use, one root can be used, or a plurality of roots can be wound into a bundle form, and the number of the roots is 1-10000. The thermal resistance material 3-2 can be high-purity oxygen-free copper, and also can be high-purity aluminum, sapphire, graphene and other materials with high thermal conductivity at low temperature; the thermal resistance material 3-2 may have a C-shape, a linear shape, an S-shape, or the like, and the interface may have any appropriate shape such as a semicircular shape, a circular shape, or an elliptical shape.
The second heat capacity material 3-3 can be selected from HoCu 2 、Er 3 Ni、Er 0.5 Pr 0.5 Or magnetic materials such as ErNi, and the like, and also can be materials with higher specific heat capacity at low temperature such as lead, and the like; the second heat capacity material 3-3 may be circular or other polygonal in shape, and may have a thickness of 0.1mm to 10mm and an equivalent diameter of any size smaller than that of the sample flange 4. The second heat capacity material 3-3 is in a flake shape, the upper surface of the second heat capacity material 3-3 is connected with the thermal resistance material 3-2, the thermal resistance material 3-2 and the second heat capacity material 3-3 can be connected in other welding modes such as soldering, silver soldering and the like, and can also be bonded by low-temperature glue with high heat conductivity coefficient; the lower surface of the second heat capacity material 3-3 is stuck on the sample flange 4 through low-temperature glue with high heat conductivity coefficient. The second heat capacity material 3-3 and the sample flange 2 are not limited to be bonded by low-temperature glue with high heat conductivity coefficient, and can be connected by adopting other welding modes such as tin soldering, silver soldering and the like. As with the first heat capacity material 3-1, the temperature fluctuations after passing through the heat capacity material 3-3 can be further attenuated to below 0.1mK, while the overall average temperature is substantially consistent with the cold end flange 3-1 of the refrigerator.
The first heat capacity material 3-1 and the second heat capacity material 3-3 may be the same material or may be different materials; when the first heat capacity material 3-1, the thermal resistance material 3-2 and the second heat capacity material 3-3 are adopted to form a composite structure to connect the cold end flange 2 of the refrigerator and the sample flange 4, 1 group or multiple groups can be adopted, and the number of the groups can be 1-100.
The invention combines the advantages of the heat capacity method and the thermal resistance method, adopts the lamellar heat capacity material to reduce the temperature fluctuation without basically causing the temperature rise, and adopts the slender thermal resistance material with high heat conduction to reduce the temperature fluctuation without basically causing the temperature rise; the heat capacity materials are connected with other parts by adopting low-temperature glue with high heat conductivity coefficient or direct welding, so that the defect of uncontrollable contact thermal resistance caused by threaded connection is avoided.
It will be appreciated that although the invention has been described above in terms of preferred embodiments, the above embodiments are not intended to limit the invention. Many possible variations and modifications of the disclosed technology can be made by anyone skilled in the art without departing from the scope of the technology, or the technology can be modified to be equivalent. Therefore, any simple modification, equivalent variation and modification of the above embodiments according to the technical substance of the present invention still fall within the scope of the technical solution of the present invention.

Claims (10)

1. A composite temperature fluctuation suppression structure using a refrigerator as a cold source comprises: a refrigerator that provides a cold source; a refrigerator cold end flange connected to the refrigerator; a sample flange connected to the sample; the method is characterized in that: a composite temperature fluctuation suppression structure is arranged between the cold end flange of the refrigerator and the sample flange;
the composite temperature fluctuation suppression structure comprises a first heat capacity material, a thermal resistance material and a second heat capacity material which are sequentially connected, wherein the first heat capacity material is bonded with a cold end flange of the refrigerator by adopting low-temperature glue with high thermal conductivity, and the thermal resistance material is an elongated strip material with high thermal conductivity at low temperature.
2. The composite of claim 1Temperature fluctuation suppresses structure, its characterized in that: the first heat capacity material is HoCu 2 、Er 3 Ni、Er 0.5 Pr 0.5 Or ErNi, or any of the magnetic materials.
3. The composite temperature fluctuation suppression structure according to claim 1, wherein: the first heat capacity material is a material with high specific heat capacity at low temperature.
4. A composite temperature fluctuation suppressing structure according to claim 3, wherein: the first heat capacity material is lead.
5. The composite temperature fluctuation suppression structure according to claim 1, wherein: the second heat capacity material is HoCu 2 、Er 3 Ni、Er 0.5 Pr 0.5 Or ErNi, or any of the magnetic materials.
6. The composite temperature fluctuation suppression structure according to claim 1, wherein: the second heat capacity material is lead.
7. The composite temperature fluctuation suppression structure according to claim 1, wherein: the first heat capacity material is the same as the second heat capacity material.
8. The composite temperature fluctuation suppression structure according to claim 1, wherein: the first heat capacity material is different from the second heat capacity material.
9. The composite temperature fluctuation suppression structure according to claim 1, wherein: the thermal resistance material is any one of high-purity oxygen-free copper, high-purity aluminum, sapphire or graphene.
10. The composite temperature fluctuation suppression structure according to claim 1, wherein: the refrigerator is a pulse tube refrigerator with low vibration, and provides the working temperature of 2.2K-300K for the sample.
CN201810307044.7A 2018-04-08 2018-04-08 Composite temperature fluctuation suppression structure with refrigerator as cold source Active CN108413639B (en)

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Publication number Priority date Publication date Assignee Title
CN112178967B (en) * 2020-09-16 2022-02-08 上海卫星装备研究所 Multi-angle mounting structure suitable for cold screen

Citations (5)

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Publication number Priority date Publication date Assignee Title
US4479367A (en) * 1981-12-28 1984-10-30 Santa Barbara Research Center Thermal filter
JPH07260266A (en) * 1994-03-24 1995-10-13 Sumitomo Heavy Ind Ltd Cryogenic refrigerator
JPH0882450A (en) * 1994-09-12 1996-03-26 Takakuni Hashimoto Cold accumulator for cryogenic refrigerator
CN1472764A (en) * 2002-07-11 2004-02-04 内桥艾斯泰克股份有限公司 Alloy temperature fuse and wire material therefor
CN101577989A (en) * 2008-05-08 2009-11-11 于�玲 Self-control thermostatic electric heating insulated board

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4479367A (en) * 1981-12-28 1984-10-30 Santa Barbara Research Center Thermal filter
JPH07260266A (en) * 1994-03-24 1995-10-13 Sumitomo Heavy Ind Ltd Cryogenic refrigerator
JPH0882450A (en) * 1994-09-12 1996-03-26 Takakuni Hashimoto Cold accumulator for cryogenic refrigerator
CN1472764A (en) * 2002-07-11 2004-02-04 内桥艾斯泰克股份有限公司 Alloy temperature fuse and wire material therefor
CN101577989A (en) * 2008-05-08 2009-11-11 于�玲 Self-control thermostatic electric heating insulated board

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
代杰.高精度低温温度测量与控制系统实验研究.中国优秀硕士学位论文全文数据库工程科技Ⅱ辑.2016,(第12期),A005-30页. *
高精度低温温度测量与控制系统实验研究;代杰;中国优秀硕士学位论文全文数据库工程科技Ⅱ辑(第12期);A005-30页 *

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