CN108412060A - A kind of open type thermal buffer part and its method - Google Patents
A kind of open type thermal buffer part and its method Download PDFInfo
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- CN108412060A CN108412060A CN201810021012.0A CN201810021012A CN108412060A CN 108412060 A CN108412060 A CN 108412060A CN 201810021012 A CN201810021012 A CN 201810021012A CN 108412060 A CN108412060 A CN 108412060A
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- 238000000034 method Methods 0.000 title abstract description 6
- 239000000463 material Substances 0.000 claims abstract description 69
- 238000009792 diffusion process Methods 0.000 claims abstract description 38
- 238000006243 chemical reaction Methods 0.000 claims abstract description 9
- 230000009466 transformation Effects 0.000 claims description 15
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
- 239000010949 copper Substances 0.000 claims description 8
- 229910052802 copper Inorganic materials 0.000 claims description 8
- 239000004794 expanded polystyrene Substances 0.000 claims description 7
- 125000004122 cyclic group Chemical group 0.000 claims description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 5
- 229910002804 graphite Inorganic materials 0.000 claims description 5
- 239000010439 graphite Substances 0.000 claims description 5
- 230000008859 change Effects 0.000 claims description 4
- 239000011159 matrix material Substances 0.000 claims description 3
- 230000001052 transient effect Effects 0.000 claims description 3
- 230000017105 transposition Effects 0.000 claims description 3
- 239000012530 fluid Substances 0.000 abstract description 6
- 238000004134 energy conservation Methods 0.000 abstract description 3
- 230000007613 environmental effect Effects 0.000 abstract description 3
- 230000001154 acute effect Effects 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 5
- 230000003139 buffering effect Effects 0.000 description 4
- 150000001336 alkenes Chemical class 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 239000011449 brick Substances 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005265 energy consumption Methods 0.000 description 2
- 238000005187 foaming Methods 0.000 description 2
- 239000004615 ingredient Substances 0.000 description 2
- 239000011229 interlayer Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- 229920006389 polyphenyl polymer Polymers 0.000 description 2
- 241000272525 Anas platyrhynchos Species 0.000 description 1
- 229910000906 Bronze Inorganic materials 0.000 description 1
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 238000004378 air conditioning Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 210000000038 chest Anatomy 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 238000013016 damping Methods 0.000 description 1
- 238000009795 derivation Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004146 energy storage Methods 0.000 description 1
- 235000013350 formula milk Nutrition 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 208000021760 high fever Diseases 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Classifications
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- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04B—GENERAL BUILDING CONSTRUCTIONS; WALLS, e.g. PARTITIONS; ROOFS; FLOORS; CEILINGS; INSULATION OR OTHER PROTECTION OF BUILDINGS
- E04B1/00—Constructions in general; Structures which are not restricted either to walls, e.g. partitions, or floors or ceilings or roofs
- E04B1/62—Insulation or other protection; Elements or use of specified material therefor
- E04B1/74—Heat, sound or noise insulation, absorption, or reflection; Other building methods affording favourable thermal or acoustical conditions, e.g. accumulating of heat within walls
- E04B1/76—Heat, sound or noise insulation, absorption, or reflection; Other building methods affording favourable thermal or acoustical conditions, e.g. accumulating of heat within walls specifically with respect to heat only
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/20—Design optimisation, verification or simulation
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2119/00—Details relating to the type or aim of the analysis or the optimisation
- G06F2119/08—Thermal analysis or thermal optimisation
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02A—TECHNOLOGIES FOR ADAPTATION TO CLIMATE CHANGE
- Y02A30/00—Adapting or protecting infrastructure or their operation
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]
- Y02B30/90—Passive houses; Double facade technology
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Architecture (AREA)
- Evolutionary Computation (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Geometry (AREA)
- Acoustics & Sound (AREA)
- Computer Hardware Design (AREA)
- Electromagnetism (AREA)
- Civil Engineering (AREA)
- Structural Engineering (AREA)
- Laminated Bodies (AREA)
- Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
Abstract
The invention discloses a kind of open type thermal buffer part and its method, specifically includes the material with anisotropic thermal diffusivity and carry out stretching conversion step；The step of board-like material after above-mentioned stretching is carried out cyclical deformation, obtains the thermal diffusion coefficient after its coordinate transform.The present invention can with the acute variation of smooth exterior temperature, be rapidly reached extraneous mean temperature and be not isolated from the outside, can be exchanged with the external world.The case where present invention is passive device, energy conservation and environmental protection, heat source and low-temperature receiver are all taken from external environment, can be widely applied to convert cyclical heat pulse to uniform hot-fluid.
Description
Technical field
The invention belongs to light to convert field, relate more specifically to a kind of thermal buffer part having an open structure.
Background technology
The case where heat buffering is generally used for significantly converting there are ambient temperature, ideal thermal buffer part can be in temperature
Heat is absorbed when spending higher to ensure that inner space avoids excessively high temperature, and heat is released when temperature is relatively low
To provide necessary temperature to inner space.Inner space is exactly that we want the region for avoiding extreme temperature from influencing, usually
In indoor or various chests.
At present to be provided in indoor or case there are two types of the methods of more stable temperature, one is with active equipment, such as
Air-conditioning, artificial regulation and control internal temperature.Another is to use heat-barrier material so that internal temperature does not receive extraneous interference.
The shortcomings that the first active equipment is energy consumption, with greater need for a kind of nothing in the case of the energy conservation and environmental protection advocated at present
Source, energy-efficient equipment.
The shortcomings that second of heat-barrier material is that complete use is thermally isolated with extraneous samming to reach an agreement, Er Qieyi
A small gap or duck eye can significantly affect the performance of heat buffering, but the scene of the completely isolated reality in a space is difficult wide
General application, for example either any constant temperature space is required equipped with the door and window or opening communicated with external environment in room.
Invention content
1, goal of the invention.
The present invention provides a kind of open type thermal buffer part and its novel hot buffer technology of manufacturing method, existing to solve
There is the problems such as high energy consumption in hot buffer technology, be isolated from the outside, be easy to be influenced by hole.The hot buffer technology of the present invention is nothing
Source, very little is influenced by hole, and be consistent with the external world's samming while smooth exterior temperature fluctuation.
2, the technical solution adopted in the present invention.
The present invention proposes a kind of hot way to play for time of open type, carries out in accordance with the following steps：
Step 1, a kind of material with anisotropic thermal diffusivity carry out stretching conversion:
Perpendicular to x-axis, spacing is Δ, stretches it on the surface of the material of anisotropic thermal diffusivity under cartesian coordinate system
The spacing on the surface of each two opposite sex thermal diffusivity becomes the board-like material of M Δs afterwards, and M is stretching factor；
Board-like material after above-mentioned stretching is carried out cyclical deformation by step 2, obtains the thermal diffusion system after its coordinate transform
Number：
In view of transient heat conduction, in addition to thermal conductivity κ, it is contemplated that thermal capacitance c and mass density ρ, with thermal diffusion coefficient α
The change of=κ/ρ c carrys out reaction coordinate transformation：
αbFor the thermal diffusion coefficient of the common calorifics material before transformation, Λ is transformation matrix：
ΛTFor its transposition,
Thermal diffusion coefficient after transformation can be expressed as：
Wherein, α⊥For the thermal diffusion coefficient in cyclic annular normal direction, α//For the thermal diffusion coefficient in cyclic annular tangential direction；It draws
Stretch the anisotropic degree that factor M determines material thermal diffusion coefficient.
In further specific implementation mode, further includes step 3, anisotropic thermal expansion is had according to thermal diffusion coefficient selection
Hot padded coaming is arranged in the material for the rate of dissipating.
In further specific implementation mode, the material with anisotropic thermal diffusivity can have for one kind
The material alternatively layered of anisotropic thermal diffusivity material or two or more different thermal diffusion coefficients is arranged.
In further specific implementation mode, it is graphite that described one kind, which having anisotropic thermal diffusivity material,.
In further specific implementation mode, the material of described two kinds of different thermal diffusion coefficients is copper and foaming polyphenyl second
Alkene.
A kind of open type thermal buffer part makes above-mentioned hot way to play for time be made.
In further specific implementation mode, the material with anisotropic thermal diffusivity can have for one kind
The material alternatively layered of anisotropic thermal diffusivity material or two or more different thermal diffusion coefficients is arranged.
In further specific implementation mode, it is graphite that described one kind, which having anisotropic thermal diffusivity material,.
In further specific implementation mode, the material of described two kinds of different thermal diffusion coefficients is copper and foaming polyphenyl second
Alkene.
3, technique effect caused by the present invention.
(1) effective solution of the present invention heat-barrier material require stringent sealing but actual environment be again unable to reach it is strictly close
This contradiction of envelope, and one or more openings of the present invention, are more advantageous to buffer layer and are deposited with thermal energy with external heat exchange
Storage.
(2) present invention can be with the acute variation of smooth exterior temperature.By the heat accumulation in external high temperature, when outer low temperature, puts
The physical mechanism of heat provides the temperature of relative smooth for buffer structure inside.
(3) present invention can be rapidly reached extraneous mean temperature.It is not thermally isolated with the external world, it can be by each period
Temperature change mean value as heat source come for inside heating (mean value less than internal temperature then be freeze), to make it reach rapidly
To extraneous samming.
(4) present invention is not isolated from the outside, and can be exchanged with the external world.An open environment is needed in many cases
Keep the temperature of inside constant simultaneously, such as indoor openings, windowing.It is an advantage of the invention that having while not being isolated from the outside
There is hot buffering effect, this is thermally isolated device and is unable to reach.
(5) present invention is passive device, energy conservation and environmental protection.Heat source and low-temperature receiver are all taken from external environment, can answer extensively
The case where for converting cyclical heat pulse to uniform hot-fluid
For from the principle of heat transfer, the thermal diffusion coefficient of closed heat-barrier material is very low, can effectively prevent heat
Amount flows into the inside of closed heat-barrier material structure from the outside, but if heat-barrier material closure is bad, hot-fluid can be from aperture
Flow into inside configuration.Material used in the present invention has prodigious tangential diffusivity, and the diffusivity is much larger than air at aperture
Diffusivity, therefore hot-fluid can preferentially enter the buffer layer of the present invention.And radial thermal diffusivity is very little, so hot-fluid is suitable
In being limited in buffer layer, efficiently solves hot-fluid and flow to buffer structure inner space.
Description of the drawings
Fig. 1 is the method flow diagram of invention.
Fig. 2 is that the ingredient of device packing material part constitutes figure.
Fig. 3 is the structure top view of embodiment.
Fig. 4 is the structure top view of comparison scheme.
Fig. 5 is the temperature variation of device inside central point.
Specific implementation mode
Embodiment 1
In order to enable the auditor especially public of Patent Office that the technical spirit of the present invention is more clearly understood and have
Beneficial effect, applicant will elaborate by way of examples below, but be not to this hair to the description of embodiment
The limitation of bright scheme, the made only formal but not substantive equivalent transformation of any design according to the present invention are all answered
It is considered as technical scheme of the present invention scope.
Below to illustrate specific implementation mode.
Present invention uses novel artificial calorifics materials to have made cricoid thermal buffer part, and parameter can be by converting
Stretching conversion in calorifics is derived.The material finally derived can use two (more) natures for planting different thermal diffusion coefficients
Material (such as 1 bronze medal and 2 expanded polystyrene (EPS)s) is alternately arranged (12121212) composition or the anisotropic existing for nature
Thermal diffusivity material (such as：Graphite) composition.
As shown in Figure 1, specific steps are as follows：
S1, isotropic calorifics material
In view of two of the close proximity (separation delta → 0) under cartesian coordinate system perpendicular to the equiform of x-axis
Surface (is made of) A and A ' common isotropic calorifics material,
S2, stretching conversion
A stretching conversion is done along x-axis, transformation for mula is as follows：
Wherein (x, y, z) and (x ', y ', z ') are indicated respectively after transformation and coordinate system before, M are stretching factor, are drawn
The spacing on latter two surface stretched becomes M Δs.
S3, bending constitute the column structure of relative closure, and cross section can retain one or more openings, the heat after transformation
Diffusion coefficient,.
In view of transient heat conduction, in addition to thermal conductivity κ, we are contemplated that thermal capacitance c and mass density ρ, here I
React our coordinate transform with the change of thermal diffusion coefficient α=κ/ρ c：
αbFor the thermal diffusion coefficient of the common calorifics material before transformation.Λ is transformation matrix：
ΛTFor its transposition.Thermal diffusion coefficient after transformation can be expressed as：
Wherein, α⊥For the thermal diffusion coefficient in cyclic annular normal direction, α//For the thermal diffusion coefficient in cyclic annular tangential direction.It draws
Stretch the anisotropic degree that factor M determines material thermal diffusion coefficient.M will take a larger value (such as copper under normal circumstances
Combination with expanded polystyrene (EPS) can be more than the high anisotropy for 100) ensureing that obtained material has calorifics.
Although we have obtained a tablet along x-axis after stretching conversion, we can bend it into arbitrary shape
Shape meets actual demand, for example bends to annulus or Fang Huan.The thermal buffer part of the present invention can there are one or multiple open
Mouthful, opening can be air or other materials (door, window).The advantage of opening is that reinforce buffer layer hands over external heat
It changes.The structure is filled with the calorifics material with high anisotropy of above-mentioned derivation by annular section.This material can be by two
Kind is constituted with close adhesion or extruding after the big isotropic materials arranged in alternating of thermal diffusivity difference, such as high fever
The material of diffusivity can be copper, and the material of low thermal diffusivity can be expanded polystyrene (EPS).
Fig. 2 show the ingredient composition and structure chart of device packing material.Black 1 with white 2 respectively represent two kinds it is different
The material of thermal diffusion coefficient.1：High thermal diffusion coefficient material (copper), thermal conductivity 401Wm-1·K-1；2：Low thermal diffusivity coefficient
Material (expanded polystyrene (EPS)), thermal conductivity 0.03Wm-1·K-1.For clear view, we only draw 9 layers, actual fabrication
In can make more numbers of plies as desired.
Fig. 3 show the structure top view of embodiment.Material shown in FIG. 1 is fabricated to the rectangular wall of opening.It is unilateral
Heat source 3 is in the top of open side.Structure centre 4 is at temperature sensing.
Fig. 4 show the structure top view of comparison scheme.The rectangular walling material of opening is brick 5, thermal conductivity 0.6W
m-1·K-1.Unilateral heat source 3 is as the unilateral heat source 3 in embodiment in comparison scheme.It is similarly in structure at temperature sensing
The heart 4.
In addition to the difference of material, embodiment with comparison scheme other structures size be as.Including heat source：
Minus 10 degree to 50 degree of periodical heat source (60 degree of the temperature difference), period are 24 hours.The length of side of wall construction is 1 meter, wall thickness 0.1
Rice.All it is thermal insulation in addition to one side is contacted with heat source, on other directions.
Fig. 5 show the variation of the wall construction internal temperature with software emulation.It can be seen that brick wall is used, it can be by structure
The interior temperature difference is reduced to 24 degree (8 degree of -32 degree), and uses hot buffer structure wall, and the temperature difference in structure is 4 degree (18 degree of -22 degree).
In this embodiment, our thermal buffer part can be as the wall in house or the interlayer of wall, device
Anisotropic calorifics material be made of two kinds of materials arranged in alternating of layers of copper and expanded polystyrene (EPS) layer.Window and door are considered as
Opening, and the anisotropic material of the present invention can not had to.Environment temperature outside house can be very low at night, and at noon
Can be very high, the temperature difference is sometime up to 50 more to be spent.Since common wall is for the buffering effect very little of heat, the especially presence of door and window
More increase inside and outside heat exchange so that commonly people within doors can not feel well (temperature is excessively high or too low).If used
The hot buffer structure of the present invention as wall or wall body interlayer, daytime can thermal energy storage in hot buffer structure (1,2),
So that inner temperature of room is unlikely to excessively high, and at night, the thermal energy in hot buffer structure can neutralize external low temperature to make again
Inner temperature of room is obtained still suitable for (will not be too low).So that all there is no feel to be subcooled or overheat in 24 hours by people within doors
The case where.
Real-time hot damping characteristics may be implemented, to reach a passive temperature in the novel thermal buffer part of the present invention
Spend adjustment effect.Be thermally isolated or active device is compared, this technology is more energy efficient, more meets the tune of the indoor temperature with door and window
Section.
The above embodiment is a preferred embodiment of the present invention, but embodiments of the present invention are not by above-described embodiment
Limitation, it is other it is any without departing from the spirit and principles of the present invention made by changes, modifications, substitutions, combinations, simplifications,
Equivalent substitute mode is should be, is included within the scope of the present invention.
In the description of the present invention, it is to be understood that, the term of indicating position or position relationship is based on shown in attached drawing
Orientation or positional relationship, be merely for convenience of description of the present invention and simplification of the description, do not indicate or imply the indicated equipment
Or element must have a particular orientation, with specific azimuth configuration and operation, therefore be not considered as limiting the invention.
Claims (9)
1. a kind of hot way to play for time of open type, it is characterised in that carry out in accordance with the following steps：
Step 1, a kind of material with anisotropic thermal diffusivity carry out stretching conversion:
Perpendicular to x-axis, spacing is Δ, every after stretching on the surface of the material of anisotropic thermal diffusivity under cartesian coordinate system
The spacing on the surface of two anisotropic thermal diffusivities becomes the board-like material of M Δs, and M is stretching factor；
Board-like material after above-mentioned stretching is carried out cyclical deformation by step 2, obtains the thermal diffusion coefficient after its coordinate transform：
In view of transient heat conduction, in addition to thermal conductivity κ, it is contemplated that thermal capacitance c and mass density ρ, with thermal diffusion coefficient α=κ/
The change of ρ c carrys out reaction coordinate transformation：
αbFor the thermal diffusion coefficient of the common calorifics material before transformation, Λ is transformation matrix：
ΛTFor its transposition,
Thermal diffusion coefficient after transformation can be expressed as：
Wherein, α⊥For the thermal diffusion coefficient in cyclic annular normal direction, α//For the thermal diffusion coefficient in cyclic annular tangential direction；Stretch because
Sub- M determines the anisotropic degree of material thermal diffusion coefficient.
2. the hot way to play for time of open type according to claim 1, it is characterised in that further include step 3, according to thermal diffusion system
Hot padded coaming is arranged in material of the number selection with anisotropic thermal diffusivity.
3. the hot way to play for time of open type according to claim 1, it is characterised in that described has anisotropic thermal diffusion
The material of rate can be a kind of material with anisotropic thermal diffusivity material or two or more different thermal diffusion coefficients
Alternatively layered is arranged.
4. the hot way to play for time of open type according to claim 3, it is characterised in that：Described one kind having anisotropic heat
Diffusivity material is graphite.
5. the hot way to play for time of open type according to claim 3, it is characterised in that：The different thermal diffusion coefficients of described two kinds
Material be copper and expanded polystyrene (EPS).
6. a kind of open type thermal buffer part, it is characterised in that：It is made using hot way to play for time as described in claim 1.
7. open type thermal buffer part according to claim 6, it is characterised in that：Described has anisotropic thermal diffusion
The material of rate can be a kind of material with anisotropic thermal diffusivity material or two or more different thermal diffusion coefficients
Alternatively layered is arranged.
8. open type thermal buffer part according to claim 7, it is characterised in that described one kind having anisotropic heat
Diffusivity material is graphite.
9. open type thermal buffer part according to claim 7, it is characterised in that：The different thermal diffusion coefficients of described two kinds
Material be copper and expanded polystyrene (EPS).
Priority Applications (1)
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| CN201810021012.0A CN108412060B (en) | 2018-01-10 | 2018-01-10 | Open thermal buffer and method thereof |
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| CN201810021012.0A CN108412060B (en) | 2018-01-10 | 2018-01-10 | Open thermal buffer and method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112325955A (en) * | 2020-11-11 | 2021-02-05 | 麦克传感器股份有限公司 | Multipurpose heat conduction type flow switch and its preparation method |
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| CN101134678A (en) * | 2006-05-04 | 2008-03-05 | Sgl碳股份公司 | High-temperature resistant composite material |
| US20110165407A1 (en) * | 2010-01-07 | 2011-07-07 | Weidinger Juergen | Elastomeric low temperature insulation |
| CN102661005A (en) * | 2012-05-17 | 2012-09-12 | 上海理想家园工程营造有限公司 | Level-A fireproof thermal insulation polyphenyl foam particle and processing method thereof |
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2018
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|---|---|---|---|---|
| JPH073359A (en) * | 1992-12-23 | 1995-01-06 | Nouv De Metallisation Ind Sa:Soc | Heat barrier, its preparation and material used |
| CN101134678A (en) * | 2006-05-04 | 2008-03-05 | Sgl碳股份公司 | High-temperature resistant composite material |
| US20110165407A1 (en) * | 2010-01-07 | 2011-07-07 | Weidinger Juergen | Elastomeric low temperature insulation |
| CN102661005A (en) * | 2012-05-17 | 2012-09-12 | 上海理想家园工程营造有限公司 | Level-A fireproof thermal insulation polyphenyl foam particle and processing method thereof |
| CN103669622A (en) * | 2013-12-09 | 2014-03-26 | 南京工业大学 | Anisotropic phase change energy storage composite board |
| CN103700638A (en) * | 2013-12-26 | 2014-04-02 | 北京航天时代光电科技有限公司 | Phase change material thermal buffering device and method for dissipating heat of high-power device |
| CN104153471A (en) * | 2014-08-10 | 2014-11-19 | 复旦大学 | Composite layered structure thermal insulation material high in thermal insulation efficiency |
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| Title |
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| 刘一超: "变换光学及其应用", 《中国博士学位论文数据库基础科学辑》 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112325955A (en) * | 2020-11-11 | 2021-02-05 | 麦克传感器股份有限公司 | Multipurpose heat conduction type flow switch and its preparation method |
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| CN108412060B (en) | 2020-01-14 |
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