CN108411149A - Copper alloy for electronic material - Google Patents

Copper alloy for electronic material Download PDF

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Publication number
CN108411149A
CN108411149A CN201810592916.9A CN201810592916A CN108411149A CN 108411149 A CN108411149 A CN 108411149A CN 201810592916 A CN201810592916 A CN 201810592916A CN 108411149 A CN108411149 A CN 108411149A
Authority
CN
China
Prior art keywords
parts
weight
copper alloy
electronic material
present
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201810592916.9A
Other languages
Chinese (zh)
Inventor
陆建平
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Taicang Win - Win Electronic And Electrical Complete Equipment Co Ltd
Original Assignee
Taicang Win - Win Electronic And Electrical Complete Equipment Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taicang Win - Win Electronic And Electrical Complete Equipment Co Ltd filed Critical Taicang Win - Win Electronic And Electrical Complete Equipment Co Ltd
Priority to CN201810592916.9A priority Critical patent/CN108411149A/en
Publication of CN108411149A publication Critical patent/CN108411149A/en
Pending legal-status Critical Current

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Classifications

    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C9/00Alloys based on copper

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Conductive Materials (AREA)

Abstract

The invention discloses a kind of copper alloy for electronic material, including following raw material:Si:10 12 parts by weight;V:0.2 0.8 parts by weight;Fe:5 10 parts by weight;Sm:1 3.5 parts by weight;W:36 parts;Cr:2.2 8.8 parts by weight;B:3 7.6 parts by weight;C:18 24.8 parts by weight;Y:11 20 parts by weight;LaCe:1 3.6 parts by weight;Cu:1550 1866 parts by weight.Beneficial effects of the present invention are:It is with higher intensity.

Description

Copper alloy for electronic material
Technical field
The present invention relates to a kind of copper alloy for electronic material.
Background technology
There is also certain deficiencies for the intensity of existing copper alloy for electronic material.
Invention content
The purpose of the present invention is to provide a kind of copper alloy for electronic material, with higher intensity.
To achieve the above object, the technical scheme is that
A kind of copper alloy for electronic material, including following raw material:
Si:10-12 parts by weight;
V:0.2-0.8 parts by weight;
Fe:5-10 parts by weight;
Sm:1-3.5 parts by weight;
W:3-6 parts;
Cr:2.2-8.8 parts by weight;
B:3-7.6 parts by weight;
C:18-24.8 parts by weight;
Y:11-20 parts by weight;
LaCe:1-3.6 parts by weight;
Cu:1550-1866 parts by weight.
The operation principle of the present invention is that:The addition of LaCe so that impurity is removed in alloy, forms strengthening phase, and then have Higher intensity.
Beneficial effects of the present invention are:It is with higher intensity.
Specific implementation mode
With reference to embodiment, the specific embodiment of the present invention is further described.Following embodiment is only used for more Add and clearly demonstrate technical scheme of the present invention, and not intended to limit the protection scope of the present invention.
The technical solution that the present invention embodies is:
Embodiment 1
A kind of copper alloy for electronic material, including following raw material:
Si:10 parts by weight;
V:0.2 parts by weight;
Fe:5 parts by weight;
Sm:1 parts by weight;
W:3 parts;
Cr:2.2 parts by weight;
B:3 parts by weight;
C:18 parts by weight;
Y:11 parts by weight;
LaCe:1 parts by weight;
Cu:1550 parts by weight.
Embodiment 2
A kind of copper alloy for electronic material, including following raw material:
Si:12 parts by weight;
V:0.8 parts by weight;
Fe:10 parts by weight;
Sm:3.5 parts by weight;
W:6 parts;
Cr:8.8 parts by weight;
B:7.6 parts by weight;
C:24.8 parts by weight;
Y:20 parts by weight;
LaCe:3.6 parts by weight;
Cu:1866 parts by weight.
Embodiment 3
A kind of copper alloy for electronic material, including following raw material:
Si:11 parts by weight;
V:0.5 parts by weight;
Fe:8 parts by weight;
Sm:2.2 parts by weight;
W:5 parts;
Cr6 parts by weight;
B:4 parts by weight;
C:22 parts by weight;
Y:15 parts by weight;
LaCe:2 parts by weight;
Cu:1800 parts by weight.
The above is only a preferred embodiment of the present invention, it is noted that those skilled in the art are come It says, without departing from the technical principles of the invention, several improvements and modifications can also be made, these improvements and modifications are also answered It is considered as protection scope of the present invention.

Claims (1)

1. a kind of copper alloy for electronic material, which is characterized in that including following raw material:
Si:10-12 parts by weight;
V:0.2-0.8 parts by weight;
Fe:5-10 parts by weight;
Sm:1-3.5 parts by weight;
W:3-6 parts;
Cr:2.2-8.8 parts by weight;
B:3-7.6 parts by weight;
C:18-24.8 parts by weight;
Y:11-20 parts by weight;
LaCe:1-3.6 parts by weight;
Cu:1550-1866 parts by weight.
CN201810592916.9A 2018-06-11 2018-06-11 Copper alloy for electronic material Pending CN108411149A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201810592916.9A CN108411149A (en) 2018-06-11 2018-06-11 Copper alloy for electronic material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201810592916.9A CN108411149A (en) 2018-06-11 2018-06-11 Copper alloy for electronic material

Publications (1)

Publication Number Publication Date
CN108411149A true CN108411149A (en) 2018-08-17

Family

ID=63141632

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201810592916.9A Pending CN108411149A (en) 2018-06-11 2018-06-11 Copper alloy for electronic material

Country Status (1)

Country Link
CN (1) CN108411149A (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH059619A (en) * 1991-07-08 1993-01-19 Furukawa Electric Co Ltd:The Production of high-strength copper alloy
CN103361514A (en) * 2012-03-30 2013-10-23 江苏迅达电磁线有限公司 Copper alloy material containing rare earth
CN103789571A (en) * 2012-10-31 2014-05-14 同和金属技术有限公司 Cu-Ni-Co-Si based copper alloy sheet material and method for producing the same
JP2015161009A (en) * 2014-02-28 2015-09-07 Dowaメタルテック株式会社 High strength copper alloy thin sheet material and production method thereof
CN106282647A (en) * 2016-08-29 2017-01-04 芜湖楚江合金铜材有限公司 A kind of rareearth high-quality copper wires and preparation method thereof

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH059619A (en) * 1991-07-08 1993-01-19 Furukawa Electric Co Ltd:The Production of high-strength copper alloy
CN103361514A (en) * 2012-03-30 2013-10-23 江苏迅达电磁线有限公司 Copper alloy material containing rare earth
CN103789571A (en) * 2012-10-31 2014-05-14 同和金属技术有限公司 Cu-Ni-Co-Si based copper alloy sheet material and method for producing the same
JP2015161009A (en) * 2014-02-28 2015-09-07 Dowaメタルテック株式会社 High strength copper alloy thin sheet material and production method thereof
CN106282647A (en) * 2016-08-29 2017-01-04 芜湖楚江合金铜材有限公司 A kind of rareearth high-quality copper wires and preparation method thereof

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WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20180817

WD01 Invention patent application deemed withdrawn after publication