CN108406160A - A kind of preparation method and its device of the compound medicine core solder cake of double helix state - Google Patents
A kind of preparation method and its device of the compound medicine core solder cake of double helix state Download PDFInfo
- Publication number
- CN108406160A CN108406160A CN201810096892.8A CN201810096892A CN108406160A CN 108406160 A CN108406160 A CN 108406160A CN 201810096892 A CN201810096892 A CN 201810096892A CN 108406160 A CN108406160 A CN 108406160A
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- Prior art keywords
- medicine core
- wheel
- narrowband
- core solder
- double helix
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/3006—Ag as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P23/00—Machines or arrangements of machines for performing specified combinations of different metal-working operations not covered by a single other subclass
- B23P23/04—Machines or arrangements of machines for performing specified combinations of different metal-working operations not covered by a single other subclass for both machining and other metal-working operations
Abstract
The present invention provides the preparation methods and its device of a kind of compound medicine core solder cake of double helix state, planar double-helix shape is formed by narrowband medicine core solder and the winding of narrowband material consecutive intervals, the narrowband medicine core solder is silver-bearing copper zinc-manganese solder, and the narrowband material is corronil.Narrowband medicine core solder and narrowband material consecutive intervals are intertwined by the present invention, and it is mutually clamped discoid, so that the present invention has preferable rigidity and structural stability, the invention is easy to operate, be easy to mass production, the compound medicine core solder cake of low-cost double helix state and convenient for packaging and transport.
Description
Technical field
The present invention relates to be related to brazing material manufacturing field, and in particular to a kind of system of the compound medicine core solder cake of double helix state
Preparation Method and its device.
Background technology
Traditional soldering processes are that operator's silk or strip solder glue brazing flux soldering work piece, operator's labor intensity is big,
Brazing flux, which volatilizees, seriously affects the health of operator, and solder dosage can not ensure, be susceptible to welding shortcoming, thereupon
Be to do over again, reprocess or even scrap, cause the waste of solder and raw material, increase manufacturing cost；In addition, joint quality relies on more
In the individual level of operator, the stability of the consistency and quality of welding is influenced, manual soldering has been unable to meet enterprise to pricker
Weld high-precision technology requirement, the needs for being also not suitable with modern manufacturing industry high-volume, producing at high speed.
Sandwich composite soldering is being closed for high-grade accurate sintered-carbide tool or large area hard for rising in recent years
A kind of novel stress-removal solder of gold soldering.The core of this solder is made of fine copper, cupromanganese or ormolu, outside is wrapped
Silver-base solder is covered, the volume ratio of three kinds of materials of the most frequently used solder is respectively 1 in the market:2:1.In brazing process, core material is not
Fusing, only external silver-base solder fusing；Infusible high-plasticity copper alloy increases weld thickness, passes through in brazing process
The elastic-plastic deformation of the copper alloy of high-ductility can be effectively relieved inside soldered fitting due to hard alloy and base steel thermal expansion
Coefficient mismatches the thermal stress generated, the bond strength that residual stress improves brazed seam is reduced, so that the crackle of hard alloy
Tendency substantially reduces.
Currently, common sandwich composite soldering on the market, that there are moulding process is relative complex, is limited to by processing conditions
Greatly, the shortcomings of the cost is relatively high.
Conventional brazing technique is to glue before brazing flux is used or heated that brazing flux is coated in work in advance using sandwich composite soldering
On part, solder glues brazing flux or the in advance operation of coating brazing flux, increases process and operating time before weldering, and in soldering processes again
Increase a variable, to affect welding consistency and quality stability, in order to ensure brazing quality, it has to add
Add excessive brazing flux, causes brazing flux waste, the also more difficult cleaning of brazing flux residue, perishable connector；Such soldering processes are complicated, produce
Efficiency is low, is not easy to accurately control the dosage of brazing flux, brazing flux often occurs and adds excessive or non-uniform phenomenon, the welding quality of connector
The level for more depending on operator, is also easy to produce defect.
Invention content
The object of the present invention is to provide the preparation method and its device of a kind of compound medicine core solder cake of double helix state, the inventions
It is easy to operate, be easy to mass production, the compound medicine core solder cake of low-cost double helix state.
The present invention to solve above-mentioned technical problem the technical solution adopted is that：A kind of compound medicine core solder cake of double helix state
Preparation method, it includes the following steps：
Step 1: by silver, copper, zinc, manganese with mass ratio for 50：20：24：8~48：14：20：6 carry out melting, are cast into a diameter of
The rodlike brazing filler metal alloy ingot casting of 46 ~ 54mm cuts riser and then prune ladle barrow and descales, for use；
Step 2: solder extrusion equipment is warming up to 420 ~ 500 DEG C, the good ingot casting of vehicle is placed in Muffle furnace and is preheated, preheating temperature
Degree is 460 ~ 480 DEG C, and preheated ingot casting is put into the mould cylinder of extrusion equipment, the solder wire of a diameter of 2 ~ 3 mm is squeezed into,
And it is drawn to the solder wire of a diameter of 0.5 ~ 1 mm；
Step 3: by copper, nickel with mass ratio for 3：1~4：1 is prepared into narrowband material；
Step 3: it is the narrowbands 1.1~1.8mm medicine core solder that the solder wire that step 2 prepares, which is rolled into width,；
Step 4: the narrowband medicine core solder and narrowband material that prepare are individually positioned on device, respectively by narrowband medicine core pricker
Material and narrowband material interval winding, form Double-spiral, final cutting is prepared into the compound medicine core solder cake of double helix state.
A kind of device of preparation method for the compound medicine core solder cake of double helix state, including rack and in the horizontal direction from
The left-to-right conveying mechanism being successively set in the rack, heating mechanism, guiding mechanism simultaneously expect mechanism and coiler, institute
Conveying mechanism is stated to include the support plate I being arranged in the rack and be vertically successively set on the support from top to down
The first material transfer wheel on plate I and the second material transfer wheel；The heating mechanism includes the support plate II being arranged in the rack and sets
Set the heater box in the support plate II；
The guiding mechanism includes the support plate III being arranged in the rack and is vertically successively set on from top to down
The first guidance set in the support plate III and the second guidance set；The support plate III is vertically equipped with sliding slot,
First guidance set includes two upper directive wheels I being oppositely arranged and lower directive wheel I, and second guidance set includes two
A upper directive wheel II being oppositely arranged and lower directive wheel II, the upper directive wheel I, lower directive wheel I, upper directive wheel II and lower guiding
Wheel II is arranged in the sliding slot；
It is described and expect that mechanism includes the support plate IV being arranged in the rack and is set gradually from left to right in the horizontal direction
In the support plate IV and material wheel I and material wheel II and simultaneously material wheel III, described and material wheel I are located at same level with simultaneously material wheel III
On face, described and material wheel II is located at described and material wheel I lower section；
The coiler includes coiled strip component and binder component, the coiled strip component include motor and with the motor output end
Connected swivel plate, the one end of the swivel plate far from the motor are equipped with buffer layer I, and the buffer layer I is far from the rotation
One end of plate is equipped with spool, is arranged with sheath assembly on the peripheral surface of the spool, described sleeve pipe component include first sleeve and
Rotatable the second casing being set in the first sleeve, second casing are set on the peripheral surface of the spool,
The side wall of the first sleeve is equipped with solid material and stitches, and the outer wall of second casing is equipped with cutter；The binder component includes
Cylinder and the holding pad being connected with the cylinder output end, the one end of the holding pad far from the cylinder are provided with buffer layer
II, the buffer layer II is cylinder type.
Further, the upper directive wheel I, lower directive wheel I, upper directive wheel II and lower directive wheel II are respectively positioned on same vertical
On direction.
Further, described sleeve pipe component is removably set on the peripheral surface of the spool.
Further, the buffer layer I is spring or cystosepiment.
Further, it is provided with cavity in the barrel of the buffer layer II, spring is equipped in the cavity.
Further, the height of the buffer layer II is more than the height of the first sleeve.
Further, the internal diameter of the buffer layer II is more than the diameter of the first sleeve.
Beneficial effects of the present invention are mainly manifested in the following aspects：
It is placed on the first material transfer wheel by the way that the first material transfer wheel and the second material transfer wheel, narrowband medicine core solder disk is arranged, narrowband material
Disk is placed on the second material transfer wheel, is then heated by heater box in support plate II, by support plate III after heating
First guidance set and the second guidance set carry out linear correction to narrowband medicine core solder and narrowband material respectively, by adjusting upper
The distance between distance and upper directive wheel II and lower directive wheel II between directive wheel I and lower directive wheel I so that narrowband medicine core solder
Gap between upper directive wheel I and lower directive wheel I, narrowband material pass through gap between upper directive wheel II and lower directive wheel II from
And realize the purpose that linear correction is carried out to narrowband medicine core solder and narrowband material；
By being arranged and expecting that mechanism, narrowband medicine core solder and narrowband material pass sequentially through simultaneously material wheel I and material wheel II and simultaneously material wheel III
Realize the purpose that the two is preferably superimposed；
By the way that coiler is arranged, by being arranged with sheath assembly on spool, sheath assembly includes first sleeve and rotatable
The second casing being set in the first sleeve, the bottom end of the second casing is equipped with pedestal, is provided on the pedestal and institute
The through-hole that the second casing is connected is stated, the upper surface of the pedestal is equipped with the card slot for fixing the first sleeve；
In this way when being wound to narrowband medicine core solder and narrowband material, can by the narrowband medicine core solder being superimposed and
Narrowband material is inserted into solid material seam, then controls motor and spool is driven to be rotated, when the number of turns of winding reaches target call, lead to
It crosses control cylinder to move down holding pad, by buffer layer II at the beginning of the compound medicine core solder cake of the double helix state of winding
Finished product is flattened, and is avoided the excessive double helix state to winding of pressure by the way that buffer layer I and buffer layer II is arranged and is answered
Closing medicine core solder cake, just finished product damages；After having pressed with the compound medicine core solder cake of double helix state sheath assembly from
It is taken out on spool, by rotating first sleeve repeatedly, by rotating first sleeve repeatedly, the bottom end of first sleeve is located at pedestal
In card slot,
Cutter on second sleeve outer wall will be inserted into solid material seam and be superimposed under the action of the rotation repeatedly of first sleeve
Narrowband medicine core solder and narrowband material cut-out, to completely take out the compound medicine core solder cake of double helix state；
Narrowband medicine core solder and narrowband alloy material consecutive intervals are intertwined by the use of the new type, and are mutually clamped into disk
Shape so that solder cake of the present invention has preferable rigidity and structural stability, convenient for packaging and transport；Spiral shell of the present invention
Shape solder simple production process is revolved, mass production is easy to, compared with traditional sheet solder, specific surface area increases, same
Deng heat input under the conditions of be easier to reach fusion temperature, and the solder is medicine core, containing brazing flux, it can be achieved that brazing flux in medicine core
Accurate quantification adds, and reduces brazing flux dosage in brazing process, reduces the pollution to environment；Do not have to separately add brazing flux when use, have
The advantages that production efficiency is high, of low cost, easy to use.
Description of the drawings
Fig. 1 is the structural schematic diagram of the present invention；
Fig. 2 is the structural schematic diagram of the coiler of the present invention；
Fig. 3 is the structural schematic diagram of the buffer layer II of the present invention；
Fig. 4 is the structural schematic diagram of the coiled strip component of the present invention；
Fig. 5 is the structural schematic diagram of the sheath assembly of the present invention；
Fig. 6 is the structural schematic diagram of the compound medicine core solder cake of double helix state of the present invention；
It is marked in figure：1, rack, 2, support plate I, 201, the first material transfer wheel, the 202, second material transfer wheel, 3, support plate II, 301, plus
Hot tank, 4, support plate III, 401, upper directive wheel I, 402, lower directive wheel I, 403, upper directive wheel II, 404, lower directive wheel II,
405, sliding slot, 5, support plate IV, 501 and material wheel I, 502 and material wheel II, 503 and material wheel III, 6, swivel plate, 601, motor,
602, buffer layer I, 603, spool, 7, holding pad, 701, cylinder, 702, buffer layer II, 8, first sleeve, 801, solid material seam,
802, the second casing, 8021, cutter, 9, narrowband medicine core solder, 10, narrowband material.
Specific implementation mode
The embodiment of the present invention is described in detail in conjunction with attached drawing, the present embodiment based on the technical solution of the present invention, is given
Detailed embodiment and specific operating process are gone out, but protection scope of the present invention is not limited to following embodiments.
With reference to the accompanying drawings it is found that a kind of preparation method of the compound medicine core solder cake of double helix state, it includes the following steps：
Step 1: by silver, copper, zinc, manganese with mass ratio for 50：20：24：8~48：14：20：6 carry out melting, are cast into a diameter of
The rodlike brazing filler metal alloy ingot casting of 46 ~ 54mm cuts riser and then prune ladle barrow and descales, for use；
Step 2: solder extrusion equipment is warming up to 420 ~ 500 DEG C, the good ingot casting of vehicle is placed in Muffle furnace and is preheated, preheating temperature
Degree is 460 ~ 480 DEG C, and preheated ingot casting is put into the mould cylinder of extrusion equipment, the solder wire of a diameter of 2 ~ 3 mm is squeezed into,
And it is drawn to the solder wire of a diameter of 0.5 ~ 1 mm；
Step 3: by copper, nickel with mass ratio for 3：1~4：1 is prepared into narrowband material 10；
Step 3: it is the narrowbands 1.1~1.8mm medicine core solder 9 that the solder wire that step 2 prepares, which is rolled into width,；
Step 4: the narrowband medicine core solder 9 and narrowband material 10 that prepare are individually positioned on device, respectively by narrowband medicine core
Solder 9 and the interval of narrowband material 10 winding, form Double-spiral, and final cutting is prepared into the compound medicine core solder cake of double helix state,
The narrowband material 10 and narrowband medicine core solder 9 are flat cydariform, the width of the narrowband material 10 and narrowband medicine core solder 9 with
The ratio of thickness is respectively less than 5.
A kind of device of preparation method for the compound medicine core solder cake of double helix state, including rack 1 and in the horizontal direction
It is set gradually from left to right the conveying mechanism in the rack 1, heating mechanism, guiding mechanism and expects mechanism and coiler,
The conveying mechanism includes the support plate I 2 being arranged in the rack 1 and is vertically successively set on from top to down described
The first material transfer wheel 201 in support plate I 2 and the second material transfer wheel 202；The heating mechanism includes being arranged in the rack 1
Support plate II 3 and the heater box 301 being arranged in the support plate II 3；By the way that the first material transfer wheel 201 and the second material transfer wheel is arranged
202, medicine core solder 9 disk in narrowband is placed on the first material transfer wheel 201, and material 10 disk in narrowband is placed on the second material transfer wheel 202, so
It is heated afterwards by heater box 301 in support plate II 3;
The guiding mechanism includes the support plate III 4 being arranged in the rack 1 and vertically sets gradually from top to down
The first guidance set in the support plate III 4 and the second guidance set；The support plate III 4 is vertically equipped with and slides
Slot 405, first guidance set include two upper directive wheels I 401 being oppositely arranged and lower directive wheel I 402, and described second leads
Include two upper directive wheels II 403 being oppositely arranged and lower directive wheel II 404, the upper directive wheel I 401, lower guiding to component
It takes turns I 402, upper directive wheel II 403 and lower directive wheel II 404 is located on same vertical direction, the upper directive wheel I 401, lower guiding
It takes turns I 402, upper directive wheel II 403 and lower directive wheel II 404 is arranged in the sliding slot 405；The upper directive wheel I 401, under
Directive wheel I 402, upper directive wheel II 403 and lower directive wheel II 404 can the slidings in sliding slot 405；Narrowband after heating
Medicine core solder 9 and narrowband material 10 are by the first guidance set in support plate III 4 and the second guidance set respectively to narrowband medicine
Core solder 9 and narrowband material 10 carry out linear correction, pass through the upper directive wheel I 401 of adjustment and lower directive wheel I 402 in sliding slot 405
Between distance and the distance between upper directive wheel II 403 and lower directive wheel II 404 so that narrowband medicine core solder 9 pass through upper guiding
The gap between I 401 and lower directive wheel I 402 is taken turns, narrowband material 10 passes through the seam between upper directive wheel II 403 and lower directive wheel II 404
Gap carries out narrowband medicine core solder 9 and narrowband material 10 to realize the purpose of linear correction；
It is described and expect that mechanism includes the support plate IV 5 being arranged in the rack 1 and is set gradually from left to right in the horizontal direction
In the support plate IV 5 and material wheel I 501 and material wheel II 502 and simultaneously material wheel III 503, described and material wheel I 501 and and material wheel
III 503 are located in same level, and described and material wheel II 502 is located at described and material wheel I 501 lower section；By being arranged and expecting machine
Structure, narrowband medicine core solder 9 and narrowband material 10 pass sequentially through simultaneously material wheel I 501 and material wheel II 502 simultaneously and simultaneously material wheel III 503 is real
The purpose that now the two is preferably superimposed；
The coiler includes coiled strip component and binder component, the coiled strip component include motor 601 and with the motor 601
The connected swivel plate 6 of output end, the one end of the swivel plate 6 far from the motor 601 are equipped with buffer layer I 602, the buffer layer
I 602 be spring or cystosepiment, and the one end of the buffer layer I 602 far from the swivel plate 6 is equipped with spool 603, the spool 603
Peripheral surface on be arranged with sheath assembly, described sleeve pipe component is removably set on the peripheral surface of the spool 603, described
Sheath assembly includes first sleeve 8 and rotatable the second casing 802 being set in the first sleeve 8, described second set
Pipe 802 is set on the peripheral surface of the spool 603, and the side wall of the first sleeve 8 is equipped with solid material and stitches 801, described second
The outer wall of casing 802 is equipped with cutter 8021；The binder component includes cylinder 701 and is connected with 701 output end of the cylinder
Holding pad 7, the one end of the holding pad 7 far from the cylinder 701 is provided with buffer layer II 702, and the buffer layer II 702 is
Cylinder type is provided with cavity structure in the barrel of the buffer layer II 702, and spring is equipped in the cavity, described slow
The height for rushing layer II 702 is more than the height of the first sleeve 8, and the cylinder internal diameter of the buffer layer II 702 is more than the first set
The diameter of pipe 8；
By the way that coiler is arranged, by being arranged with sheath assembly on spool 603, sheath assembly includes first sleeve 8 and can
The second casing 802 of rotation being set in the first sleeve 8, the bottom end of the second casing 802 are equipped with pedestal, on the pedestal
It is provided with the through-hole being connected with second casing, the upper surface of the pedestal is equipped with for fixing the first sleeve 8
Card slot；In this way when being wound to narrowband medicine core solder 9 and narrowband material 10, the narrowband medicine core pricker that can will be superimposed
Material 9 and narrowband material 10 are inserted into solid material seam 801, then control motor 601 and spool 603 is driven to be rotated, when the number of turns of winding
When reaching target call, the first finished product of the compound medicine core solder cake of double helix state；Holding pad 7 is moved down by controlling cylinder 701,
It is flattened by finished product at the beginning of the compound medicine core solder cake of double helix state of II 702 pairs of windings of buffer layer, it is slow by being arranged
It rushes layer I 602 and buffer layer II 702 avoids finished product at the beginning of the compound medicine core solder cake of the excessive double helix state to winding of pressure
It damages；The sheath assembly with the compound medicine core solder cake of double helix state takes out from spool 603 after having pressed, and passes through
First sleeve 8 is rotated repeatedly, by rotating first sleeve 8 repeatedly, the bottom end of first sleeve 8 is located in the card slot of pedestal, and second
Cutter 8021 on 802 outer wall of casing will be inserted into solid material seam 801 and be superimposed upon under the action of the rotation repeatedly of first sleeve 8
Narrowband medicine core solder 9 and narrowband material 10 together is cut off, to completely take out the compound medicine core solder cake of double helix state.
It should also be noted that, herein, such as I, II, III relational terms are used merely to an entity or operation
It is distinguished with another entity or operation, without necessarily requiring or implying between these entities or operation, there are any this
Actual relationship or sequence.Moreover, the terms "include", "comprise" or its any other variant are intended to nonexcludability
Including so that the process, method, article or equipment including a series of elements includes not only those elements, but also wrap
Include other elements that are not explicitly listed, or further include for this process, method, article or equipment intrinsic want
Element.In the absence of more restrictions, the element limited by sentence "including a ...", it is not excluded that wanted including described
There is also other identical elements in the process, method, article or equipment of element.
Claims (8)
1. a kind of preparation method of the compound medicine core solder cake of double helix state, it is characterised in that：It includes the following steps：
Step 1: by silver, copper, zinc, manganese with mass ratio for 50：20：24：8~48：14：20：6 carry out melting, are cast into a diameter of
The rodlike brazing filler metal alloy ingot casting of 46 ~ 54mm cuts riser and then prune ladle barrow and descales, for use；
Step 2: solder extrusion equipment is warming up to 420 ~ 500 DEG C, the good ingot casting of vehicle is placed in Muffle furnace and is preheated, preheating temperature
Degree is 460 ~ 480 DEG C, and preheated ingot casting is put into the mould cylinder of extrusion equipment, the solder wire of a diameter of 2 ~ 3 mm is squeezed into,
And it is drawn to the solder wire of a diameter of 0.5 ~ 1 mm；
Step 3: by copper, nickel with mass ratio for 3：1~4：1 is prepared into narrowband material；
Step 3: it is the narrowbands 1.1~1.8mm medicine core solder that the solder wire that step 2 prepares, which is rolled into width,；
Step 4: the narrowband medicine core solder and narrowband material that prepare are individually positioned on device, respectively by narrowband medicine core pricker
Material and narrowband material interval winding, form Double-spiral, final cutting is prepared into the compound medicine core solder cake of double helix state.
2. a kind of device of preparation method for the compound medicine core solder cake of double helix state as described in claim 1, including machine
Frame and the conveying mechanism being set gradually from left to right in the horizontal direction in the rack, heating mechanism, guiding mechanism simultaneously expect machine
Structure and coiler, it is characterised in that：The conveying mechanism includes the support plate I being arranged in the rack and vertically
The the first material transfer wheel and the second material transfer wheel being successively set on from top to down in the support plate I；The heating mechanism includes setting
Support plate II in the rack and the heater box being arranged in the support plate II；
The guiding mechanism includes the support plate III being arranged in the rack and is vertically successively set on from top to down
The first guidance set in the support plate III and the second guidance set；The support plate III is vertically equipped with sliding slot,
First guidance set includes two upper directive wheels I being oppositely arranged and lower directive wheel I, and second guidance set includes two
A upper directive wheel II being oppositely arranged and lower directive wheel II, the upper directive wheel I, lower directive wheel I, upper directive wheel II and lower guiding
Wheel II is arranged in the sliding slot；
It is described and expect that mechanism includes the support plate IV being arranged in the rack and is set gradually from left to right in the horizontal direction
In the support plate IV and material wheel I and material wheel II and simultaneously material wheel III, described and material wheel I are located at same level with simultaneously material wheel III
On face, described and material wheel II is located at described and material wheel I lower section；
The coiler includes coiled strip component and binder component, the coiled strip component include motor and with the motor output end
Connected swivel plate, the one end of the swivel plate far from the motor are equipped with buffer layer I, and the buffer layer I is far from the rotation
One end of plate is equipped with spool, is arranged with sheath assembly on the peripheral surface of the spool, described sleeve pipe component include first sleeve and
Rotatable the second casing being set in the first sleeve, second casing are set on the peripheral surface of the spool,
The side wall of the first sleeve is equipped with solid material and stitches, and the outer wall of second casing is equipped with cutter；The binder component includes
Cylinder and the holding pad being connected with the cylinder output end, the one end of the holding pad far from the cylinder are provided with buffer layer
II, the buffer layer II is cylinder type.
3. a kind of device of preparation method for the compound medicine core solder cake of double helix state according to claim 2, special
Sign is：The upper directive wheel I, lower directive wheel I, upper directive wheel II and lower directive wheel II are respectively positioned on same vertical direction.
4. a kind of device of preparation method for the compound medicine core solder cake of double helix state according to claim 2, special
Sign is：Described sleeve pipe component is removably set on the peripheral surface of the spool.
5. a kind of device of preparation method for the compound medicine core solder cake of double helix state according to claim 2, special
Sign is：The buffer layer I is spring or cystosepiment.
6. a kind of device of preparation method for the compound medicine core solder cake of double helix state according to claim 2, special
Sign is：It is provided with cavity in the barrel of the buffer layer II, spring is equipped in the cavity.
7. a kind of device of preparation method for the compound medicine core solder cake of double helix state according to claim 2, special
Sign is：The height of the buffer layer II is more than the height of the first sleeve.
8. a kind of device of preparation method for the compound medicine core solder cake of double helix state according to claim 2, special
Sign is：The internal diameter of the buffer layer II is more than the diameter of the first sleeve.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810096892.8A CN108406160B (en) | 2018-01-31 | 2018-01-31 | Preparation method and device of double-helix composite flux-cored brazing filler metal cake |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810096892.8A CN108406160B (en) | 2018-01-31 | 2018-01-31 | Preparation method and device of double-helix composite flux-cored brazing filler metal cake |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108406160A true CN108406160A (en) | 2018-08-17 |
| CN108406160B CN108406160B (en) | 2020-08-28 |
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|---|---|---|---|
| CN201810096892.8A Active CN108406160B (en) | 2018-01-31 | 2018-01-31 | Preparation method and device of double-helix composite flux-cored brazing filler metal cake |
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