CN108401101B

CN108401101B - Optical system

Info

Publication number: CN108401101B
Application number: CN201810016049.4A
Authority: CN
Inventors: 胡朝彰; 陈树山
Original assignee: TDK Taiwan Corp
Current assignee: TDK Taiwan Corp
Priority date: 2017-02-08
Filing date: 2018-01-08
Publication date: 2021-03-23
Anticipated expiration: 2038-01-08
Also published as: CN108401101A

Abstract

An optical system includes a fixed portion, a movable portion, a driving assembly, and a sensing coil. The fixing portion includes a base. The movable part comprises an optical component bearing part for bearing an optical component. The driving component comprises at least one first magnetic component and at least one second magnetic component. The second magnetic component is corresponding to the first magnetic component and is used for driving the optical component bearing piece to move relative to the base. The sensing coil is used for sensing the magnetic field change of the first magnetic component, so that the distance between the optical component bearing piece and the base is obtained.

Description

Optical system

Technical Field

The present invention relates to an optical system, and more particularly, to an optical system without a position sensing assembly.

Background

With the development of technology, many electronic devices (e.g., smart phones) have a function of taking pictures or recording videos. Through the camera module arranged on the electronic device, a user can operate the electronic device to obtain various photos.

Generally, a camera module includes a position sensor, a control unit and a lens driving unit, and the lens driving unit is used to drive a lens to move along an optical axis of the lens. When the camera module is shaken, the position sensor can detect the displacement of the lens, and the control unit can control the lens driving unit to drive the lens to displace in the opposite direction according to the displacement so as to achieve the purpose of preventing hand shake. However, the position sensor occupies the internal space of the camera module, so that when the thickness of the electronic device needs to be reduced for miniaturization, the thickness of the camera module cannot be further reduced due to the position sensor.

Therefore, how to avoid the position sensor occupying the internal space of the camera module and reduce the thickness of the camera module is a problem worth to be discussed and solved at present.

Disclosure of Invention

The present invention provides an optical system to solve the above problems.

The embodiment of the invention discloses an optical system, which comprises a fixed part, a movable part, a driving assembly and a sensing coil. The fixing portion includes a base. The movable part comprises an optical component bearing part for bearing an optical component. The driving component comprises at least one first magnetic component and at least one second magnetic component. The second magnetic component is corresponding to the first magnetic component and is used for driving the optical component bearing piece to move relative to the base. The sensing coil is used for sensing the magnetic field change of the first magnetic component, so that the distance between the optical component bearing piece and the base is obtained.

In some embodiments, the first magnetic element comprises a coil having a winding axis parallel to a winding axis of the sensing coil.

In some embodiments, the optical system further includes a first elastic element electrically connected to the sensing coil.

In some embodiments, the movable portion includes a frame, the first magnetic element is disposed on the optical element carrier, and the sensing coil is disposed on the frame.

In some embodiments, the optical system further includes a first elastic component, a circuit board, and two second elastic components. The first elastic component is connected with the optical component bearing component and the frame. The second elastic components are connected with the first elastic components and the circuit board. The sensing coil is electrically connected with the circuit board through a plurality of second elastic components.

In some embodiments, the optical system further includes two second elastic elements connecting the first elastic element and the circuit board, wherein the driving element is electrically connected to the circuit board through the plurality of second elastic elements.

In some embodiments, the first magnetic component is disposed on the optical component carrier, and the sensing coil is disposed on the fixing portion.

In some embodiments, the optical system further includes a circuit board disposed on the base, and the sensing coil is electrically connected to the circuit board.

In some embodiments, the sensing coil and the first magnetic element are disposed on the optical element carrier, and a winding axis of the first magnetic element is parallel to a winding axis of the sensing coil.

In some embodiments, the fixing portion further comprises a housing, and the sensing coil is connected to the housing.

In some embodiments, the bobbin of the sensing coil is not parallel to the optical axis.

In some embodiments, the driving assembly further comprises a magnetic conductive assembly disposed adjacent to the second magnetic assembly.

In some embodiments, the movable portion further includes a frame, the first magnetic element is disposed on the frame, and the first magnetic element has a coil.

An optical system according to an embodiment of the present disclosure employs a sensing coil for detecting a displacement of an optical component carrier relative to a base. Because the optical system does not include any position sensing component and corresponding sensing magnet to occupy the internal space of the optical system, the whole size of the optical system can be reduced to achieve the purpose of miniaturization, and the problem of magnetic interference caused by the position sensing component and the corresponding sensing magnet can be avoided.

In addition, since the optical system is not provided with any position sensing component, the optical system does not need to be additionally provided with a line for providing the position sensing component. In the embodiment of the invention, the sensing coil and the first magnetic component can be electrically connected with the circuit board only through the second elastic component. Therefore, the complexity of wiring of the optical system can be reduced and the manufacturing cost can be reduced, and the size of the optical system can be reduced to achieve the miniaturization.

Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the disclosed principles. The features and advantages of the invention may be realized and obtained by means of the instruments and combinations particularly pointed out in the appended claims. These and other features of the present invention will become more fully apparent from the following description and appended claims, or may be learned by the practice of the invention as set forth hereinafter.

Drawings

FIG. 1 is a schematic perspective view of an optical system according to an embodiment of the present invention

FIG. 2 shows an exploded view of the optical system of FIG. 1

Fig. 3 shows a cross-sectional view taken along line a-a' in fig. 1.

Fig. 4 is a schematic diagram of an optical system with a housing removed according to an embodiment of the invention.

Fig. 5 is a schematic perspective view of an optical system according to another embodiment of the invention.

Fig. 6 shows a cross-sectional view of the optical system along the line B-B' in fig. 5.

FIG. 7A is a schematic diagram of a sensing coil and a second magnetic assembly in the embodiment of FIG. 6.

FIG. 7B is a schematic diagram of a sensing coil and a second magnetic assembly according to another embodiment of the invention.

Fig. 8 is a schematic diagram of an optical system according to another embodiment of the present invention.

Fig. 9 is a perspective view of an optical system according to another embodiment of the invention.

Fig. 10 shows a cross-sectional view of the optical system along the line C-C' in fig. 9.

Fig. 11 is a schematic view of the base, circuit board, and sensing coil of the optical system of fig. 9 from another perspective.

Fig. 12 is a schematic cross-sectional view of an optical system according to another embodiment of the present invention.

Fig. 13 is a partial structural schematic diagram of an optical system according to an embodiment of the present invention.

Fig. 14 is a schematic diagram of a camera system according to another embodiment of the invention.

Fig. 15 is a schematic diagram of a camera system according to another embodiment of the invention.

Fig. 16 is a front view of a camera system according to another embodiment of the present invention.

The reference numbers are as follows:

100. 100A, 100B, 100C, 100D optical system

102 shell

1021 shell opening

1023 the space

104 frame

1041 groove

1043 central opening

106 upper reed

108 optical component carrier

1081 through hole

110 lower reed

112 base

1121 base opening hole

114 circuit board

115 flat coil

115L coil

116A second elastic component

116B second elastic component

118 magnetic permeability component

200 camera system

300 camera system

CLS1 sensing coil

CLS2 sensing coil

CLS3 sensing coil

CLS4 sensing coil

ECM electrical connector

MEG1 first magnetic assembly

MEG2 second magnetic assembly

MEG3 second magnetic assembly

O optical axis

SDP welding point

WD width

WN maximum distance

WR wire

Detailed Description

In order to make the objects, features and advantages of the present disclosure more comprehensible, embodiments accompanied with figures are described in detail below. The configuration of each component in the embodiments is for illustration and is not intended to limit the embodiments of the disclosure. And the reference numbers in the embodiments are partially repeated to simplify the description, and do not indicate the relevance between the different embodiments. Directional terms as referred to in the following examples, for example: up, down, left, right, front or rear, etc., are directions with reference to the attached drawings only. Accordingly, the directional terminology used is intended to be in the nature of words of description rather than of limitation.

Furthermore, relative terms, such as "lower" or "bottom" and "upper" or "top," may be used in embodiments to describe a relative relationship of one component of an icon to another component. It will be appreciated that if the device of the icon is turned upside down, components described as being on the "lower" side will be components on the "upper" side.

As used herein, the term "about" generally means within 20%, preferably within 10%, and more preferably within 5% of a given value or range. The amounts given herein are approximate, meaning that the meaning of "about" or "approximately" may still be implied without particular recitation.

Referring to fig. 1 to 3, fig. 1 is a perspective view of an optical system 100 according to an embodiment of the invention, fig. 2 is an exploded view of the optical system 100 of fig. 1, and fig. 3 is a cross-sectional view taken along line a-a' of fig. 1. The optical system 100 may be a camera system having an optical driving component for carrying an optical component (not shown), and the optical system 100 may be installed in various electronic devices or portable electronic devices (such as a smart phone or a tablet computer) for users to perform image capturing functions. In this embodiment, the optical driving component may be a Voice Coil Motor (VCM) with an Auto Focus (AF) function, but is not limited thereto. In some embodiments, the Optical driving components of the Optical system 100 may also be provided with Auto Focusing (AF) and Optical anti-shake (Optical Image)

Stabilization, OIS).

Referring to fig. 2, fig. 2 is an exploded view of the optical system 100 according to the embodiment of the invention. The optical system 100 includes a housing 102, a frame 104, an upper spring 106, an optical component carrier 108, a first magnetic component MEG1, a sensing coil CLS1, four second magnetic components MEG2, a lower spring 110, a base 112, a circuit board 114, and a flat coil 115 (circuit board). The base 112 can be fixedly connected to the housing 102 to define a fixing portion, and the connecting manner can be riveting, clamping, or welding, but is not limited thereto, as long as the base 112 can be fixedly connected to the housing 102, and the invention falls within the scope of the present invention. The fixing portion may include other components in other embodiments. Furthermore, the optical component carrier 108 and the frame 104 may define a movable portion that moves relative to the fixed portion.

The housing 102 has a hollow structure and is formed with a housing opening 1021, the base 112 is formed with a base opening 1121, the center of the housing opening 1021 corresponds to an optical axis O of an optical component (not shown) carried by the optical component carrier 108, and the base opening 1121 corresponds to an image sensing component (not shown) disposed below the base 112. The housing 102 may have a receiving space 1023 for receiving the frame 104, the upper spring 106, the optical component carrier 108, the first magnetic component MEG1, the sensing coil CLS1, the plurality of second magnetic components MEG2 and the lower spring 110. In addition, the housing 102 may also accommodate the circuit board 114, the flat coil 115 and the base 112. Furthermore, the first magnetic assembly MEG1 may be a coil, and a plurality of second magnetic assemblies MEG2 corresponding to the first magnetic assembly MEG1 may form a driving assembly, which is electrically connected to the circuit board 114 and can drive the optical assembly carrier 108 to move along the optical axis O direction relative to the base 112. Notably, no position sensing component is included within the optical system 100.

As shown in fig. 2, the optical component carrier 108 has a hollow ring structure and a through hole 1081, wherein a corresponding locking thread structure (not shown) is disposed between the through hole 1081 and the optical component, so that the optical component is locked in the through hole 1081. In this embodiment, the first magnetic assembly MEG1 is disposed around the optical assembly carrier 108. In addition, the frame 104 has a plurality of slots 1041 and a central opening 1043. In this embodiment, the frame 104 has four grooves 1041 for accommodating the four second magnetic assemblies MEG2, but the number of the grooves 1041 and the second magnetic assemblies MEG2 is not limited to this embodiment. In this embodiment, the second magnetic element MEG2 may have a long bar shape, but is not limited thereto, and may have a different shape in other embodiments.

The optical assembly carrier 108 and the optical assembly are disposed in the central opening 1043 and are movable relative to the frame 104. More specifically, as shown in fig. 3, the optical assembly carrier 108 can be suspended in the central opening 1043 by connecting the upper spring 106 and the lower spring 110 to the frame 104. When the first magnetic assembly MEG1 is powered on, the four second magnetic assemblies MEG2 and the first magnetic assembly MEG1 generate an electromagnetic driving force (electromagnetic force), so as to drive the optical assembly carrier 108 to move along the optical axis O (Z-axis direction) relative to the frame 104 and the base 112 for Auto Focusing (Auto Focusing). In some embodiments, the second magnetic assembly MEG2 may include at least one multi-pole magnet (multipole magnet) for inducing the corresponding first magnetic assembly MEG1 and driving the optical assembly carrier 108 to move along the optical axis O for focusing.

It should be appreciated that the upper spring plate 106 and the lower spring plate 110 can be a first elastic element, respectively. In this embodiment, the upper spring plate 106 can be four separate spring plates, and the lower spring plate 110 can be integrally formed, but is not limited thereto. For example, the upper spring 106 may be integrally formed in other embodiments.

As shown in fig. 2 and 3, sensing coil CLS1 is disposed on the top of frame 104, and the winding axes of sensing coil CLS1 and first magnetic assembly MEG1 (coil) are substantially parallel to each other, for example, parallel to optical axis O. It is noted that when the first magnetic assembly MEG1 is powered on and the four second magnetic assemblies MEG2 generate an electromagnetic driving force to drive the optical assembly carrier 108 to move along the optical axis O (Z-axis direction) relative to the frame 104, the distance between the sensing coil CLS1 and the first magnetic assembly MEG1 along the Z-axis direction changes. Therefore, the sensing coil CLS1 can sense the magnetic field variation of the first magnetic assembly MEG1 to generate an induced current and output the induced current to a processing unit (e.g., a microprocessor) of the portable electronic device, and then the processing unit can determine the position of the optical assembly carrier 108 relative to the base 112 according to a reference datum and the received induced current. The reference data may comprise a correspondence table of induced currents and positions of the sensing coil CLS1 with respect to the first magnetic assembly MEG1, among others. Since the distance between the sensing coil CLS1 and the chassis 112 is fixed, when the distance of the sensing coil CLS1 with respect to the first magnetic assembly MEG1 is obtained, the position of the optical assembly carrier 108 with the first magnetic assembly MEG1 with respect to the chassis 112 is obtained.

Furthermore, as shown in fig. 2, the circuit board 114 is disposed on the base 112, and the flat coil 115 is disposed on the circuit board 114. The Circuit board 114 may be a Flexible Printed Circuit (FPC), and the flat coil 115 may include four coils 115L corresponding to the second magnetic elements MEG 2.

In addition, as shown in fig. 2, the optical system 100 further includes two second elastic elements 116A and two second elastic elements 116B, wherein each of the second elastic elements has a long bar-shaped structure, such as a column-shaped or linear structure, but not limited thereto. Wherein one end of each second elastic member is connected to the upper spring 106, and the other end of the second elastic member is connected to the circuit board 114. With the above-mentioned structure configuration, the optical component carrier 108 and the optical components (not shown) and the frame 104 carried thereby can move along the X-Y plane direction relative to the base 112 through the flexible second

elastic components

116A and 116B.

In this embodiment, the flat coil 115 is directly contacted and electrically connected to the circuit board 114 (for example, the flat coil 115 is provided with an electrical contact which directly contacts the circuit on the circuit board 114). When the coil in the flat coil 115 is energized, an electromagnetic driving force is induced with the corresponding second magnetic assembly MEG2, thereby driving the optical assembly carrier 108, the optical assembly and the frame 104 to move along the X-Y plane. Therefore, if the Optical system 100 is shaken, the Optical component carrier 108 can be driven by the electromagnetic driving force to move on the X-Y plane to compensate the movement of the Optical system 100 when the Optical system 100 is shaken, thereby achieving the purpose of Optical anti-shake (Optical Image Stabilization).

Referring to fig. 2 and fig. 4 again, fig. 4 is a schematic diagram of the optical system 100 with the housing 102 removed according to an embodiment of the invention. As shown in fig. 4, an input terminal and an output terminal of the sensing coil CLS1 can be directly connected to the upper spring 106 through two electrical connectors ECM (e.g., solder), and then the corresponding two second elastic elements 116A are respectively connected to the two electrical connectors ECM and the circuit board 114. That is, the sensing coil CLS1 can be electrically connected to the circuit board 114 through the two second elastic elements 116A. Similarly, an input terminal and an output terminal of the first magnetic element MEG1 can also be electrically connected to the circuit board 114 through the upper spring 106 and the two second elastic elements 116B (the second elastic elements 116B are not shown in fig. 4 due to the view angle).

Since the optical system 100 of the embodiment of the present invention utilizes the sensing coil CLS1 to sense the magnetic field variation of the first magnetic assembly MEG1 to obtain the position of the optical assembly carrier 108 relative to the base 112, only four second elastic assemblies are needed to transmit the electrical signals of the sensing coil CLS1 and the first magnetic assembly MEG1 to the circuit board 114. Since no position sensing component is provided, the optical system 100 does not need to additionally provide a wire for the position sensing component (e.g., hall component) to be used as a signal transmission, so that the wiring complexity of the optical system 100 can be reduced and the manufacturing cost can be reduced. In addition, the size of the optical system 100 can be reduced without providing a position sensing assembly, so as to achieve the purpose of miniaturization.

Referring to fig. 5 and 6, fig. 5 is a perspective view of an optical system 100A according to another embodiment of the present invention, and fig. 6 shows a cross-sectional view of the optical system 100A along the line B-B' in fig. 5. The optical system 100A of the present embodiment is similar to the optical system 100 of the previous embodiment, and the difference is that in this embodiment, as shown in fig. 6, the first magnetic assembly MEG1 (coil) is disposed at the bottom of the optical assembly carrier 108, and the sensing coil CLS2 is disposed at the top of the optical assembly carrier 108. In this embodiment, the winding axis of the sensing coil CLS2 is approximately parallel to the winding axis of the first magnetic assembly MEG1, and the sensing coil CLS2 partially overlaps the first magnetic assembly MEG1 when viewed from the optical axis O direction. Meaning that the number of winding turns of the sensing coil CLS2 may or may not be equal to the number of winding turns of the first magnetic assembly MEG 1.

When the first magnetic assembly MEG1 is powered on and generates an electromagnetic driving force with the four second magnetic assemblies MEG2 to drive the optical assembly carrier 108 to move along the optical axis O (Z-axis direction) relative to the frame 104, the distance between the sensing coil CLS2 and the second magnetic assembly MEG2 along the Z-axis direction changes, so that the sensing coil CLS2 generates a magnetic field change according to the cold-order law and correspondingly generates an induced current. The induced current may be output to the processing unit, which may then determine the position of the optical component carrier 108 relative to the base 112 based on another reference and the received induced current. The reference data in this embodiment may include a table of the relationship between the induced current and the position of the optical component carrier 108 relative to the base 112.

In addition, please refer to fig. 7A and 7B, fig. 7A is a schematic diagram of the sensing coil CLS1 and the second magnetic assembly MEG2 in the embodiment of fig. 6. Fig. 7B is a schematic diagram of a sensing coil CLS1 and a second magnetic assembly MEG2 according to another embodiment of the invention. As shown in fig. 7A, sensing coil CLS1 is moved along the Z-axis direction relative to second magnetic assembly MEG2, and the magnetic pole direction of second magnetic assembly MEG2 is perpendicular to the Z-axis. It is noted that the width WD of the sensing coil CLS1 along the X-axis direction is less than the maximum distance WN of the N poles of the two second magnetic assemblies MEG 2.

In addition, as shown in fig. 7B, the magnetic pole direction of the second magnetic assembly MEG2 is parallel to the Z-axis direction, for example, two second magnetic assemblies MEG2 are both facing the sensing coil CLS 1. With such a configuration, the sensing capability of sensing coil CLS1 may be improved.

Similar to the previous embodiment, the optical system 100A of this embodiment does not have any position sensing device, so the optical system 100A does not need to provide any additional circuit, and the sensing coil CLS2 and the first magnetic device MEG1 only need to pass through the second elastic device 116A and the second elastic device 116B respectively to be electrically connected to the circuit board 114. The complexity of wiring of the optical system 100A can be reduced and the manufacturing cost can be reduced. Similarly, the optical system 100A can be reduced in size without providing a position sensing component for miniaturization.

Referring to fig. 8, fig. 8 is a schematic diagram of an optical system 100B according to another embodiment of the invention. For ease of illustration, the optical system 100B of fig. 8 depicts only the drive assembly, the optical assembly carrier 108A, and the sensing coil CLS 2. In this embodiment, the optical component carrier 108A has an octagonal structure and the second magnetic component MEG3 has a trapezoidal structure. The four second magnetic assemblies MEG3 are respectively disposed at four corners of the optical assembly carrier 108A, thereby generating an electromagnetic driving force with the first magnetic assembly MEG 1.

The driving method of this embodiment is similar to that of the previous embodiment, and therefore, the description thereof is omitted. It should be noted that the shape design of the optical element carrier 108A and the second magnetic element MEG3 in this embodiment can further reduce the size of the optical system 100B in the X direction and the Y direction, thereby achieving the purpose of miniaturization.

Referring to fig. 9 and 10, fig. 9 is a perspective view of an optical system 100C according to another embodiment of the invention, and fig. 10 shows a cross-sectional view of the optical system 100C along the line C-C' in fig. 9. The optical system 100C of the present embodiment is similar to the optical system 100 of the previous embodiment, and the difference is that in this embodiment, the first magnetic assembly MEG1 is disposed on the optical assembly carrier 108, and the sensing coil CLS3 is disposed at the bottom of the circuit board 114. The circuit board 114 can be defined and included in the fixing portion. As shown in fig. 10, circuit board 114 is disposed on base 112, and sensing coil CLS3 is disposed on a bottom surface of circuit board 114 along the Z-axis direction and electrically connected to circuit board 114. In addition, in other embodiments, circuit board 114 can be disposed on base 112, sensing coil CLS3 can be disposed on circuit board 114, and circuit board 114 is located between sensing coil CLS3 and base 112.

Next, referring to fig. 11, fig. 11 is a schematic view of the base 112, the circuit board 114 and the sensing coil CLS3 of the optical system 100C of fig. 9 viewed from another angle of view. As shown in fig. 11, sensing coil CLS3 is disposed on the bottom surface of circuit board 114, and sensing coil CLS3 is electrically connected to circuit board 114 directly through solder joint SDP. Since the sensing coil CLS3 of this embodiment can be electrically connected to the circuit board 114 without passing through the second elastic element 116A, the signal transmission between the sensing coil CLS3 and the circuit board 114 can reduce the interference from the transmission path to avoid the noise problem.

Referring to fig. 12, fig. 12 is a cross-sectional view of an optical system 100D according to another embodiment of the invention. The optical system 100D of this embodiment is similar to the optical system 100C, except that the sensing coil CLS3 is disposed between the circuit board 114 and the base 112, and the optical system 100D further includes four sensing coils CLS 4. In this embodiment, a plurality of sensing coils CLS4 are connected to the housing 102, for example, fixedly disposed on the inner wall surfaces of the four sides of the housing 102, and the sensing coils CLS4 face the corresponding second magnetic assembly MEG 2. Wherein the winding axis of sensing coil CLS4 is not parallel to optical axis O. In addition, it is noted that the position where sensing coil CLS4 is disposed is not limited to this embodiment. For example, the fixing portion may include another frame (not shown) disposed between the housing 102 and the frame 104 and fixedly connected to the base 112. A plurality of sensing coils CLS4 may be disposed on the frame.

When the optical system 100D is shaken, the optical component carrier 108 and the frame 104 move along the XY plane. For example, when frame 104 in fig. 12 is close to or away from sensing coil CLS4 along the X-axis direction, sensing coil CLS4 generates a magnetic field change and outputs an induced current according to lenz's law. The processing unit then determines the position of the optical component carrier 108 relative to the base 112 along the XY plane based on another reference and the received induced current. The reference data in this embodiment may include a table of the relationship between the induced current and the position of the optical component carrier 108 relative to the base 112 along the XY plane.

Since the optical system 100D of this embodiment is not provided with any position sensor, the optical system 100D can also achieve the purpose of miniaturization. In addition, sensing coil CLS4 can also be a flat coil for further miniaturization. In this embodiment, the optical system 100D can further obtain the displacement of the optical component carrier 108 relative to the base 112 along the XY plane by providing the four sensing coils CLS4 without providing the remaining position sensors.

Referring to fig. 13, fig. 13 is a partial structural schematic diagram of an optical system 100D according to an embodiment of the invention. As shown in fig. 13, sensing coil CLS4 is connected to circuit board 114 by a wire WR. Since there is no displacement between housing 102 and circuit board 114, the problem of easy damage to wire WR between sensing coil CLS4 and circuit board 114 can be avoided.

Referring to fig. 14, fig. 14 is a schematic view of a camera system 200 according to another embodiment of the invention. In this embodiment, the camera system 200 may include two optical systems 100A, and the two optical systems 100A are disposed adjacent to each other. For clarity, only some of the components of optical system 100A are shown in FIG. 14. As shown in fig. 14, the optical system 100A of this embodiment may further include a magnetic conductive element 118 (magnetic conductive plate) disposed between two second magnetic elements MEG2 opposite to each other. By providing the magnetically permeable member 118, magnetic interference between two adjacent optical systems 100A can be reduced.

Furthermore, since no position sensor and no sensing magnet for the position sensor are provided in the optical system 100A, not only the overall size of the camera system 200 can be reduced, but also the problem of magnetic interference between two adjacent optical systems 100A in the camera system 200 can be effectively reduced.

Referring to fig. 15 and 16, fig. 15 is a schematic diagram of a camera system 300 according to another embodiment of the invention, and fig. 16 is a front view of fig. 15. In this embodiment, the camera system 300 may include two optical systems 100D, and the two optical systems 100D are disposed adjacently. The optical system 100D is similar to the optical system 100A, except that the coil 115L between the two optical component carriers 108 is disposed on a movable portion (the movable portion is not shown, and may be, for example, the frame 104 of fig. 6), and the second magnetic component MEG2 between the two optical component carriers 108 is fixedly disposed on a fixed portion (the fixed portion is not shown, and may be, for example, the base 112 of fig. 6).

It is noted that the magnetic pole directions of the two second magnetic assemblies MEG2 located between the two optical assembly carriers 108 are substantially perpendicular to the Z-axis direction. As shown in fig. 16, the N poles of the two second magnetic assemblies MEG2 face each other. With such a configuration, not only the problem of magnetic interference can be reduced, but also the distance between the two optical systems 100D can be further reduced, thereby achieving a further miniaturization.

In summary, the present disclosure provides an optical system, which employs a sensing coil for detecting the displacement of the optical component carrier relative to the base. Because the optical system does not include any position sensing component and corresponding sensing magnet to occupy the internal space of the optical system, the whole size of the optical system can be reduced to achieve the purpose of miniaturization, and the problem of magnetic interference caused by the position sensing component and the corresponding sensing magnet can be avoided.

Although the embodiments of the present disclosure and their advantages have been disclosed above, it should be understood that various changes, substitutions and alterations can be made herein by those skilled in the art without departing from the spirit and scope of the embodiments of the disclosure. Moreover, the scope of the present disclosure is not intended to be limited to the particular embodiments of the process, machine, manufacture, composition of matter, means, methods and steps described in the specification, but rather, any process, machine, manufacture, composition of matter, means, method and steps, presently existing or later to be developed that perform substantially the same function or achieve substantially the same result as the corresponding embodiments described herein may be utilized according to the present disclosure. Accordingly, the scope of the present disclosure includes the processes, machines, manufacture, compositions of matter, means, methods, and steps described above. In addition, each claim constitutes a separate embodiment, and the scope of protection of the present disclosure also includes combinations of the respective claims and embodiments.

Claims

1. An optical system, comprising:

a fixing part including a base;

a movable portion, movable relative to the fixed portion, comprising:

a frame, which can move relative to the fixed part; and

an optical assembly bearing part which can move relative to the frame and the fixed part and is used for bearing an optical assembly;

a drive assembly, comprising:

at least one first magnetic component which is provided with a coil and is fixedly arranged on the optical component bearing piece; and

at least one second magnetic component which is provided with a magnet and is fixedly arranged on the frame, corresponds to the first magnetic component and is used for driving the optical component bearing piece to move relative to the base; and

a sensing coil fixed on the frame for sensing the magnetic field variation of the first magnetic component, thereby obtaining the distance between the optical component bearing seat and the base, wherein when the driving component drives the optical component bearing seat to move relative to the frame and the fixing part, the relative distance between the sensing coil and the magnet is not changed.

2. The optical system of claim 1, wherein a winding axis of the coil is parallel to a winding axis of the sensing coil.

3. The optical system of claim 1, wherein the optical system further comprises a first elastic element electrically connected to the sensing coil.

4. The optical system of claim 1, wherein the optical system further comprises:

a first elastic component connecting the optical component bearing component and the frame;

a circuit board; and

two second elastic components connecting the first elastic component and the circuit board, wherein the sensing coil is electrically connected with the circuit board through a plurality of second elastic components.

5. The optical system of claim 4, wherein the optical system further comprises two second elastic elements connecting the first elastic element and the circuit board, wherein the driving element is electrically connected to the circuit board through a plurality of the second elastic elements.

6. An optical system, comprising:

a fixing part including a base;

a movable portion, comprising:

a frame, which can move relative to the fixed part; and

a drive assembly, comprising:

at least one first magnetic assembly having a coil; and

at least one second magnetic component corresponding to the first magnetic component, having a magnet and fixedly disposed on the frame for driving the optical component carrier to move relative to the base; and

a sensing coil for sensing the magnetic field variation of the first magnetic assembly, thereby obtaining the distance between the optical assembly carrier and the base;

wherein the first magnetic assembly is fixedly arranged on the optical assembly bearing piece, and the sensing coil is arranged on the fixed part;

when the driving component drives the optical component bearing seat to move relative to the frame and the fixing part, the relative distance between the sensing coil and the magnet is not changed.

7. The optical system of claim 6, wherein the optical system further comprises a circuit board disposed on the base, the sensing coil being electrically connected to the circuit board.

8. An optical system, comprising:

a fixing part including a base;

a movable portion, movable relative to the fixed portion, comprising:

a frame, which can move relative to the fixed part; and

a drive assembly, comprising:

wherein the fixing part further comprises a shell, and the sensing coil is connected with the shell;

9. The optical system of claim 8, wherein a winding axis of the sensing coil is non-parallel to the optical axis.

10. The optical system of claim 8, wherein the driving element further comprises a magnetic conductive element disposed adjacent to the second magnetic element.