CN108396297A - Sputter ring - Google Patents
Sputter ring Download PDFInfo
- Publication number
- CN108396297A CN108396297A CN201810554409.6A CN201810554409A CN108396297A CN 108396297 A CN108396297 A CN 108396297A CN 201810554409 A CN201810554409 A CN 201810554409A CN 108396297 A CN108396297 A CN 108396297A
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- Prior art keywords
- conductive bumps
- microprocessor
- ring
- sputter
- distance
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Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
The present invention provides a kind of sputter rings, are related to semiconductor chip processing technique field, and sputter ring provided by the invention includes ring ontology, and ring ontology has the first end and the second end for forming ring port, wherein：First end is equipped with the first conductive bumps, and the one end being connect with first end on the first conductive bumps is the first inner end, and the circumferential size of the first conductive bumps end is less than the circumferential size of the first inner end；The second end is equipped with the second conductive bumps, and the one end being connect with the second end on the second conductive bumps is the second inner end, and the circumferential size of the second conductive bumps end is less than the circumferential size of the second inner end.Sputter ring provided by the invention increases the first conductive bumps and the distance between the second conductive bumps end and board, can effectively reduce the first conductive bumps and the second conductive bumps touch the probability of board.
Description
Technical field
The present invention relates to semiconductor chip processing technique fields, more particularly, to a kind of sputter ring.
Background technology
In the production process of semiconductor chip, either 8 cun of production lines, 12 cun of production lines can all be used in target as sputter
Ring, ring also assist in sputtering wherein.It after ring is installed on sputtering machine table, is acted on by current electrifying, makes around to generate
Atom above sputtering target material can be uniformly adhered in monocrystalline carrier by magnetic field in magnetic field, and ring is mounted on board
On, when aperture position is powered, other regions cannot be contacted with board, cannot there is conduction.
And existing ring is on sputtering machine table when working, due to high temperature and pressure, ring port is easily deformed that (heat expansion is cold
Contracting), cause ring to touch and leaks electricity on board cavity.
Invention content
The purpose of the present invention is to provide a kind of sputter rings, can effectively reduce the first conductive bumps and the second conduction
Probability of the projection contacts to board.
To achieve the above object, the present invention provides following technical scheme：
The present invention provides a kind of sputter ring, including ring ontology, and the ring ontology, which has, forms ring port
First end and the second end, wherein：
The first end is equipped with the first conductive bumps, is connect with the first end on first conductive bumps
One end is the first inner end, and the circumferential size of first conductive bumps end is less than the circumferential size of first inner end；
The second end is equipped with the second conductive bumps, is connect with the second end on second conductive bumps
One end is the second inner end, and the circumferential size of second conductive bumps end is less than the circumferential size of second inner end.
Further, the longitudinal section of first conductive bumps is in convex shape structure；
The longitudinal section of second conductive bumps is in convex shape structure.
Further, axis the radially extending along the ring ontology of first conductive bumps；
Axis the radially extending along the ring ontology of second conductive bumps.
Further, multiple third conductive bumps are additionally provided on the ring ontology, the third conductive bumps are in cylinder
Shape.
Further, the spacing distance between two of the arbitrary neighborhood third conductive bumps is identical.
Further, the third conductive bumps are five.
Further, further include the first range sensor and first microprocessor, wherein：
First range sensor is set on the first end, for acquire first conductive bumps and board it
Between the first range information, first range sensor connect with the first microprocessor, for by first distance
Information is sent to the first microprocessor；
The first microprocessor is additionally operable to receive first range information and controls the electricity for being connect with power supply
Whether source for first conductive bumps and first conductive bumps provides electric power.
Further, further include the first alarm being connect with the first microprocessor.
Further, further include second distance sensor and the second microprocessor, wherein：
The second distance sensor is set on the second end, for acquire second conductive bumps and board it
Between second distance information, the second distance sensor connect with second microprocessor, for by the second distance
Information is sent to second microprocessor；
Second microprocessor is additionally operable to receive the second distance information and controls the electricity for being connect with power supply
Whether source for first conductive bumps and second conductive bumps provides electric power.
Further, further include the second alarm being connect with second microprocessor.
Sputter ring provided by the invention can generate following advantageous effect：
When above-mentioned sputter ring works, sputter ring is installed to sputter, then to passing through the first conduction
Protrusion and the second conductive bumps are powered to sputter ring so that generate magnetic field around sputter ring.In this process
Middle sputter ring understands temperature distortion, and the distance between first end and the second end can become larger thereon, due to the first conductive stud
The circumferential size for playing end is less than the circumferential size of the first inner end, the circumferential size of the second conductive bumps end is less than the second inner end
Circumferential size, the tip dimensions of the first conductive bumps and the second conductive bumps reduce, and reduce after the deformation of sputter ring the
One conductive bumps and the second conductive bumps touch the probability of board.
For compared with the existing technology, the first conductive bumps and the second conductive bumps in sputter ring provided by the invention
Tip dimensions become smaller, increase the first conductive bumps and the distance between the second conductive bumps end and board so that sputtering
After the deformation of machine ring, the first conductive bumps and the second conductive bumps still can have a certain distance between board, effectively subtract
Small first conductive bumps and the second conductive bumps touch the probability of board, and ring generated deformation before secondary clamping
Without deliberately going to correct, clamping efficiency, safety higher are improved.
Description of the drawings
It, below will be to specific in order to illustrate more clearly of the specific embodiment of the invention or technical solution in the prior art
Embodiment or attached drawing needed to be used in the description of the prior art are briefly described, it should be apparent that, in being described below
Attached drawing is some embodiments of the present invention, for those of ordinary skill in the art, before not making the creative labor
It puts, other drawings may also be obtained based on these drawings.
Fig. 1 is the structural schematic diagram of sputter ring provided in an embodiment of the present invention；
Fig. 2 is the operation principle block diagram of sputter ring provided in an embodiment of the present invention.
Icon：1- ring ontologies；11- first ends；The first conductive bumps of 111-；12- the second ends；121-
Two conductive bumps；13- third conductive bumps；The first range sensors of 2-；3- first microprocessors；4- power supplys；5- first
Alarm；6- second distance sensors；The second microprocessors of 7-；The second alarms of 8-.
Specific implementation mode
Technical scheme of the present invention is clearly and completely described below in conjunction with attached drawing, it is clear that described implementation
Example is a part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, ordinary skill
The every other embodiment that personnel are obtained without making creative work, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that term "center", "upper", "lower", "left", "right", "vertical",
The orientation or positional relationship of the instructions such as "horizontal", "inner", "outside" be based on the orientation or positional relationship shown in the drawings, merely to
Convenient for the description present invention and simplify description, do not indicate or imply the indicated device or element must have a particular orientation,
With specific azimuth configuration and operation, therefore it is not considered as limiting the invention.In addition, term " first ", " second ",
" third " is used for description purposes only, and is not understood to indicate or imply relative importance.
In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " installation ", " phase
Even ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or be integrally connected；It can
Can also be electrical connection to be mechanical connection；It can be directly connected, can also indirectly connected through an intermediary, Ke Yishi
Connection inside two elements.For the ordinary skill in the art, above-mentioned term can be understood at this with concrete condition
Concrete meaning in invention.
The specific implementation mode of the present invention is described in detail below in conjunction with attached drawing.It should be understood that this place is retouched
The specific implementation mode stated is merely to illustrate and explain the present invention, and is not intended to restrict the invention.
Fig. 1 is the structural schematic diagram of sputter ring provided in an embodiment of the present invention；Fig. 2 is provided in an embodiment of the present invention
The operation principle block diagram of sputter ring.
The purpose of the present embodiment is that a kind of sputter ring is provided, as shown in Figure 1, including ring ontology 1, ring ontology
1 has the first end 11 and the second end 12 for forming ring port, wherein：
First end 11 is equipped with the first conductive bumps 111, one connect with first end 11 on the first conductive bumps 111
End is the first inner end, and the circumferential size of 111 end of the first conductive bumps is less than the circumferential size of the first inner end；
The second end 12 is equipped with the second conductive bumps 121, one connect with the second end 12 on the second conductive bumps 121
End is the second inner end, and the circumferential size of 121 end of the second conductive bumps is less than the circumferential size of the second inner end.
When above-mentioned sputter ring works, sputter ring is installed to sputter, then to passing through the first conduction
Protrusion and the second conductive bumps are powered to sputter ring so that generate magnetic field around sputter ring.In this process
Middle sputter ring understands temperature distortion, and the distance between first end and the second end can become larger thereon, due to the first conductive stud
The circumferential size for playing end is less than the circumferential size of the first inner end, the circumferential size of the second conductive bumps end is less than the second inner end
Circumferential size, the tip dimensions of the first conductive bumps and the second conductive bumps reduce, and reduce after the deformation of sputter ring the
One conductive bumps and the second conductive bumps touch the probability of board.
For compared with the existing technology, the first conductive bumps and the second conductive stud in sputter ring provided in this embodiment
The tip dimensions risen become smaller, and increase the first conductive bumps and the distance between the second conductive bumps end and board so that splash
After penetrating the deformation of machine ring, the first conductive bumps and the second conductive bumps still can have a certain distance between board, effectively
Reduce the first conductive bumps and the second conductive bumps touch the probability of board, and ring generated change before secondary clamping
Shape improves clamping efficiency, safety higher without deliberately going to correct.
It should be noted that the concrete structure of the first conductive bumps 111 and the second conductive bumps 121 can be a variety of shapes
Formula.Such as：The longitudinal section of first conductive bumps 111 and the second conductive bumps 121 can be in half elliptic structure, the first conductive stud
Rise 111 and second the longitudinal sections of conductive bumps 121 can be in convex shape structure, the first conductive bumps 111 and the second conductive bumps
121 longitudinal section can be in truncated cone-shaped, etc..
In at least one embodiment, as shown in Figure 1, in order to facilitate the first conductive bumps 111 and the second conductive bumps 121
Processing, the longitudinal sections of the first conductive bumps 111 is in convex shape structure, and the longitudinal section of the second conductive bumps 121 is also in convex shape
Structure.Before processing above-mentioned first conductive bumps, 111 and second conductive bumps 121, the first conductive bumps 111 and the second conductive stud
It rises 121 cylinder, when processing, the first conductive bumps 111 and 121 end of the second conductive bumps can be removed by turning
Material, process is simply, conveniently.
On the basis of the above embodiments, the connection of the first conductive bumps 111 and first end 11, second are led for convenience
The connection of electric protrusion 121 and the second end 12, the first conductive bumps 111 can be welded on first end 11, the second conductive stud
Playing 121 can be welded on the second end 12.
Specifically, in order to enable generated magnetic field is more orderly after above-mentioned sputter ring is powered, ring ontology 1 is in annulus
Shape.
In some embodiments, as shown in Figure 1, the axis of the first conductive bumps 111 prolongs along the radial direction of ring ontology 1
It stretches；Axis the radially extending along ring ontology 1 of second conductive bumps 121.So that above-mentioned sputter ring is more beautiful.
In some embodiments, as shown in Figure 1, ring ontology 1 is installed on board for convenience, on ring ontology 1
Multiple third conductive bumps 13 are additionally provided with, third conductive bumps 13 are cylindrical.Board is equipped with and multiple third conductive bumps
13 correspond multiple through-holes of cooperation, and through-hole is equipped with the dead ring passed through for third conductive bumps 13.When needing ring
When part ontology 1 is installed on board, each third conductive bumps 13 passes through the dead ring on a through-hole, multiple dead rings pair
Multiple third conductive bumps 13 play the role of limit, realize the assembly of ring ontology 1 and board.
On the basis of the above embodiments, at least one embodiment, the material of dead ring can be ceramics.At some
In other embodiments, the material of dead ring can be rubber.
On the basis of the above embodiments, as shown in Figure 1, the axis of third conductive bumps 13 is also along ring ontology 1
It radially extends, i.e., multiple third conductive bumps 13 are distributed around the axle center of ring ontology 1 in dispersion shape.
In some embodiments, as shown in Figure 1, in order to enable ring ontology 1 be assembled on board after more stablize, appoint
Spacing distance between two third conductive bumps 13 for anticipating adjacent is identical, is effectively guaranteed the stability of ring ontology 1, and
So that above-mentioned ring ontology 1 is more beautiful.
Specifically, the number of third conductive bumps 13 can be three, four, five, six, etc..
In at least one embodiment, as shown in Figure 1, in order to further such that ring ontology 1 be assembled on board after more
The stabilization added, and avoid the processing of ring ontology 1 excessively complicated, third conductive bumps 13 are five.
In some embodiments, as depicted in figs. 1 and 2, in order to enable above-mentioned sputter ring is more safe when using,
Above-mentioned sputter ring further includes the first range sensor 2 and first microprocessor 3, wherein：First range sensor 2 is set to the
On one end 11, for acquire the first range information between the first conductive bumps 111 and board, the first range sensor 2 and
First microprocessor 3 connects, for the first range information to be sent to first microprocessor 3；First microprocessor 3 is used for and electricity
Source 4 connects, and is additionally operable to receive the first range information and controls whether power supply 4 is the first conductive bumps 111 and the second conducting wire protrusion
Electric power is provided.First range sensor 2 can be electrically connected with first microprocessor 3, and first microprocessor 3 can be believed with power supply 4
Number connection.
When the distance between the first conductive bumps 111 and board are excessively close, i.e., the first conductive bumps 111 will contact board
When, it is that the first conductive bumps 111 and the second conductive bumps 121 provide electric power that first microprocessor 3, which controls power supply 4 not, is avoided out
It now leaks electricity accident；When the distance between the first conductive bumps 111 and board are normal or farther out, i.e. the first conductive bumps 111 are not
When with the trend for contacting board, it is the first conductive bumps 111 and the second conductive stud that first microprocessor 3, which controls power supply 4 normally,
It plays 121 and electric power is provided, ensure the normal work of ring ontology 1.The setting energy of first range sensor 2 and first microprocessor 3
It is enough to control whether power supply 4 is that the first conductive bumps 111 and second are led according to the distance between the first conductive bumps 111 and board
Electric protrusion 121 provides electric power, effectively avoids electric leakage accident so that above-mentioned sputter ring is more safe when using.
Specifically, first microprocessor 3 includes preset first threshold, when first microprocessor 3 receives the first distance
After information, the numerical value of first range information is compared by first microprocessor 3 with preset first threshold.When the first distance
When the numerical value of information is more than first threshold, first microprocessor 3 controls power supply 4 and is normally led for the first conductive bumps 111 and second
Electric protrusion 121 provides electric power；When the numerical value of the first range information is less than or equal to first threshold, first microprocessor 3 controls electricity
Source 4 is not that the first conductive bumps 111 and the second conductive bumps 121 provide electric power.Enable first microprocessor 3 by first
Range information timely carries out feedback control.
In some embodiments, further include the first alarm 5 being connect with first microprocessor 3.First alarm 5 and
One microprocessor, 3 signal connects.When the numerical value of the first range information is less than or equal to first threshold, the first alarm 5 is reported
It is alert.
In some embodiments, as depicted in figs. 1 and 2, in order to enable above-mentioned sputter ring is more safe when using,
Above-mentioned sputter ring further includes second distance sensor 6 and the second microprocessor 7, wherein：Second distance sensor 6 is set to the
On two ends 12, for acquire second distance information between the second conductive bumps 121 and board, second distance sensor 6 and
Second microprocessor 7 connects, for second distance information to be sent to the second microprocessor 7；Second microprocessor 7 is used for and electricity
Source 4 connects, and is additionally operable to receive second distance information and controls whether power supply 4 is the first conductive bumps 111 and the second conductive bumps
121 provide electric power.Second distance sensor 6 can be electrically connected with the second microprocessor 7, and the second microprocessor 7 can be with power supply 4
Signal connects.
When the distance between the second conductive bumps 121 and board are excessively close, i.e., the second conductive bumps 121 will contact board
When, the second microprocessor 7 control power supply 4 is not that the first conductive bumps 111 and the second conductive bumps 121 provide electric power, is avoided out
It now leaks electricity accident；The distance between second conductive bumps 121 and board it is normal or farther out when, i.e., the second conductive bumps 121 do not have
When having the tendency that contacting board, it is the first conductive bumps 111 and the second conductive bumps that the second microprocessor 7, which controls power supply 4 normally,
121 provide electric power, ensure the normal work of ring ontology 1.The setting of second distance sensor 6 and the second microprocessor 7 can
Control whether power supply 4 is that the first conductive bumps 111 and second are conductive according to the distance between the second conductive bumps 121 and board
Protrusion 121 provides electric power, effectively avoids electric leakage accident so that above-mentioned sputter ring is more safe when using.
Specifically, the second microprocessor 7 includes preset second threshold, when the second microprocessor 7 receives the first distance
After information, the numerical value of the second distance information is compared by the second microprocessor 7 with preset second threshold.Work as second distance
When the numerical value of information is more than second threshold, the second microprocessor 7 control power supply 4 is normally led for the first conductive bumps 111 and second
Electric protrusion 121 provides electric power；When the numerical value of second distance information is less than or equal to first threshold, the second microprocessor 7 controls electricity
Source 4 is not that the first conductive bumps 111 and the second conductive bumps 121 provide electric power.Enable the second microprocessor 7 by second
Range information timely carries out feedback control.
In some embodiments, further include the second alarm 8 being connect with the second microprocessor 7.Second alarm 8 and
Two microprocessors, 7 signal connects.When the numerical value of second distance information is less than or equal to second threshold, the second alarm 8 is reported
It is alert.
In at least one embodiment, above-mentioned sputter ring is simultaneously including the first range sensor 2, first microprocessor
3, the first alarm 5, second distance sensor 6, the second microprocessor 7 and the second alarm 8.
Finally it should be noted that：The above embodiments are only used to illustrate the technical solution of the present invention., rather than its limitations；To the greatest extent
Present invention has been described in detail with reference to the aforementioned embodiments for pipe, it will be understood by those of ordinary skill in the art that：Its according to
So can with technical scheme described in the above embodiments is modified, either to which part or all technical features into
Row equivalent replacement；And these modifications or replacements, various embodiments of the present invention technology that it does not separate the essence of the corresponding technical solution
The range of scheme.
Claims (10)
1. a kind of sputter ring, which is characterized in that including ring ontology (1), the ring ontology (1), which has, forms ring end
The first end (11) and the second end (12) of mouth, wherein：
The first end (11) is equipped with the first conductive bumps (111), with described first on first conductive bumps (111)
One end of end (11) connection is the first inner end, and the circumferential size of the first conductive bumps (111) end is less than described first
The circumferential size of inner end；
The second end (12) is equipped with the second conductive bumps (121), with described second on second conductive bumps (121)
One end of end (12) connection is the second inner end, and the circumferential size of the second conductive bumps (121) end is less than described second
The circumferential size of inner end.
2. sputter ring according to claim 1, which is characterized in that the longitudinal section of first conductive bumps (111)
In convex shape structure；
The longitudinal section of second conductive bumps (121) is in convex shape structure.
3. sputter ring according to claim 1, which is characterized in that the axis edge of first conductive bumps (111)
Radially extending for ring ontology (1)；
Axis the radially extending along ring ontology (1) of second conductive bumps (121).
4. sputter ring according to claim 1, which is characterized in that be additionally provided with multiple on the ring ontology (1)
Three conductive bumps (13), the third conductive bumps (13) are cylindrical.
5. sputter ring according to claim 4, which is characterized in that two third conductive bumps of arbitrary neighborhood
(13) spacing distance between is identical.
6. sputter ring according to claim 4, which is characterized in that the third conductive bumps (13) are five.
7. sputter ring according to claim 1, which is characterized in that further include the first range sensor (2) and first
Microprocessor (3), wherein：
First range sensor (2) is set on the first end (11), for acquiring first conductive bumps (111)
The first range information between board, first range sensor (2) connect with the first microprocessor (3), are used for
First range information is sent to the first microprocessor (3)；
The first microprocessor (3) is additionally operable to receive described in first range information and control for connecting with power supply (4)
Whether power supply (4) is that first conductive bumps (111) and second conductive bumps (121) provide electric power.
8. sputter ring according to claim 7, which is characterized in that further include connecting with the first microprocessor (3)
The first alarm (5) connect.
9. sputter ring according to claim 1, which is characterized in that further include second distance sensor (6) and second
Microprocessor (7), wherein：
The second distance sensor (6) is set on the second end (12), for acquiring second conductive bumps (121)
Second distance information between board, the second distance sensor (6) connect with second microprocessor (7), are used for
The second distance information is sent to second microprocessor (7)；
Second microprocessor (7) is additionally operable to receive described in the second distance information and control for connecting with power supply (4)
Whether power supply (4) is that first conductive bumps (111) and second conductive bumps (121) provide electric power.
10. sputter ring according to claim 9, which is characterized in that further include connecting with second microprocessor (7)
The second alarm (8) connect.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810554409.6A CN108396297B (en) | 2018-06-01 | 2018-06-01 | Sputtering machine ring piece |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810554409.6A CN108396297B (en) | 2018-06-01 | 2018-06-01 | Sputtering machine ring piece |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108396297A true CN108396297A (en) | 2018-08-14 |
| CN108396297B CN108396297B (en) | 2020-06-19 |
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ID=63102622
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810554409.6A Active CN108396297B (en) | 2018-06-01 | 2018-06-01 | Sputtering machine ring piece |
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| Country | Link |
|---|---|
| CN (1) | CN108396297B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111575663A (en) * | 2020-05-15 | 2020-08-25 | 宁波江丰电子材料股份有限公司 | Magnetron sputtering ring piece and machining method of matching hole of magnetron sputtering ring piece |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101920435A (en) * | 2010-08-20 | 2010-12-22 | 宁夏东方钽业股份有限公司 | Preparation process of sputtering tantalum ring |
| CN105695942A (en) * | 2014-11-28 | 2016-06-22 | 宁波江丰电子材料股份有限公司 | Ring part structure and manufacturing method thereof |
| US20160177434A1 (en) * | 2014-12-17 | 2016-06-23 | Rolls-Royce Plc | Metal coated fibre forming apparatus and method of forming a metal coated fibre |
-
2018
- 2018-06-01 CN CN201810554409.6A patent/CN108396297B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101920435A (en) * | 2010-08-20 | 2010-12-22 | 宁夏东方钽业股份有限公司 | Preparation process of sputtering tantalum ring |
| CN105695942A (en) * | 2014-11-28 | 2016-06-22 | 宁波江丰电子材料股份有限公司 | Ring part structure and manufacturing method thereof |
| US20160177434A1 (en) * | 2014-12-17 | 2016-06-23 | Rolls-Royce Plc | Metal coated fibre forming apparatus and method of forming a metal coated fibre |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111575663A (en) * | 2020-05-15 | 2020-08-25 | 宁波江丰电子材料股份有限公司 | Magnetron sputtering ring piece and machining method of matching hole of magnetron sputtering ring piece |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108396297B (en) | 2020-06-19 |
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