CN108376698B - Display substrate, manufacturing method thereof and display device - Google Patents
Display substrate, manufacturing method thereof and display device Download PDFInfo
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- CN108376698B CN108376698B CN201810175599.0A CN201810175599A CN108376698B CN 108376698 B CN108376698 B CN 108376698B CN 201810175599 A CN201810175599 A CN 201810175599A CN 108376698 B CN108376698 B CN 108376698B
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/122—Pixel-defining structures or layers, e.g. banks
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/1201—Manufacture or treatment
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
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Abstract
The invention discloses a display substrate, a manufacturing method thereof and a display device, relates to the technical field of display, and aims to solve the problem that in the prior art, spacers formed on a pixel defining layer and used for supporting a mask plate increase the thickness of a display device, so that the aperture opening ratio and the resolution ratio of the formed display device are affected. The manufacturing method of the display substrate comprises the following steps: forming a spacer for supporting a mask plate on a substrate before preparing a light emitting unit on the substrate by using the mask plate; and after preparing the light-emitting units on the substrate by using the mask plate, reducing the height of the spacer. The manufacturing method of the display substrate is used for manufacturing the display substrate.
Description
Technical Field
The invention relates to the technical field of display, in particular to a display substrate, a manufacturing method of the display substrate and a display device.
Background
With the continuous development of display technology, the types of display devices are increasing, and among them, the Organic Light-Emitting Diode (OLED) display device has received wide attention due to its characteristics of self-luminescence, high color gamut, ultra-thin, flexible display, etc.
At present, a light emitting layer in an OLED display device is mainly prepared by an evaporation process, that is, an organic material for preparing the light emitting layer is heated to a certain temperature under a vacuum condition and is raised to the surface of a substrate to form the light emitting layer. In the process of actually preparing the light emitting layers, in order to prevent the problems of color mixing, process scratch and the like between the adjacent light emitting layers with different colors, in the prior art, a spacer is generally arranged on a pixel defining layer between the adjacent light emitting layers with different colors, a high-precision Mask (hereinafter, referred to as FMM) is supported by the spacer, and then the FMM is used for forming the light emitting layers on the substrate, so that the problems are avoided, and the light emitting layers with different colors can be formed in the designated area of the substrate. But the thickness of the formed display device is increased due to the existence of the spacer, so that the aperture ratio and the resolution of the formed display device are affected.
Disclosure of Invention
The invention aims to provide a display substrate, a manufacturing method thereof and a display device, which are used for solving the problem that in the prior art, spacers formed on a pixel defining layer and used for supporting a mask plate increase the thickness of a display device, so that the aperture opening ratio and the resolution ratio of the formed display device are influenced.
In order to achieve the above purpose, the invention provides the following technical scheme:
a first aspect of the present invention provides a method for manufacturing a display substrate, including:
forming a spacer for supporting a mask plate on a substrate before preparing a light emitting unit on the substrate by using the mask plate;
and after preparing the light-emitting units on the substrate by using the mask plate, reducing the height of the spacer.
Further, before forming a spacer for supporting the mask plate on the substrate, the manufacturing method further includes:
forming a pixel defining layer on the substrate, and forming a groove on the surface of the pixel defining layer opposite to the substrate;
the step of forming a spacer for supporting the mask plate on the substrate specifically includes:
forming a first spacer in the groove, wherein the height of the first spacer is greater than the depth of the groove, and the first spacer occupies partial area of the bottom of the groove;
the step of reducing the height of the spacer specifically comprises:
liquefying the first shock insulator, wherein the liquefied first shock insulator flows into the groove;
and solidifying the leveled liquid material to form a second shock insulator, wherein the height of the second shock insulator is smaller than that of the first shock insulator.
Further, the step of forming a pixel defining layer on the substrate and forming a groove on a surface of the pixel defining layer opposite to the substrate specifically includes:
and forming a pixel defining layer on the substrate and a groove on the surface of the pixel defining layer opposite to the substrate through a one-time composition process.
Further, the step of forming a pixel defining layer on the substrate and forming a groove on a surface of the pixel defining layer opposite to the substrate specifically includes:
forming a pixel defining layer on the substrate through a patterning process;
and forming a groove on the surface of the pixel defining layer, which is opposite to the substrate, by means of laser burning.
Further, the depth of the groove is 1/3-1/2 of the thickness of the pixel defining layer.
Further, the area of the opening surface of the groove is smaller than the area of the bottom surface of the groove.
Further, the step of forming the first spacer in the groove specifically includes:
forming the first spacer in the groove by a stamping process using a photoisomerization material;
the step of liquefying the first spacer specifically includes:
irradiating the first spacer by using ultraviolet light to convert the first spacer into a liquid material;
the step of solidifying the leveled liquid material to form a second spacer specifically comprises the following steps:
and irradiating the leveled liquid material by using visible light to convert the liquid material into a second shock insulator.
Further, the photoisomerization material is a photoisomerization organic material containing azobenzene molecules.
Based on the above technical solution of the manufacturing method of the display substrate, a second aspect of the present invention provides a display substrate, including:
the pixel defining layer is positioned on the substrate, and a groove is arranged on the surface of the pixel defining layer, which is opposite to the substrate;
and the height of the second spacer is less than or equal to the depth of the groove.
Based on the technical solution of the display substrate, a third aspect of the present invention provides a display device, including the display substrate.
According to the technical scheme provided by the invention, before the light-emitting units are prepared on the substrate by using the mask plate, the spacer for supporting the mask plate is formed on the substrate, so that the light-emitting units formed by using the mask plate can be positioned in the appointed area of the substrate, and the problems of color mixing, process scratch and the like between the adjacent light-emitting units with different colors are well prevented; in addition, in the technical scheme provided by the invention, after the light-emitting units are prepared on the substrate by using the mask plate, the height of the spacer is reduced, so that the influence of the spacer on the thickness of the display substrate is reduced, the manufactured display substrate is ensured to be thin, and the problems that the thickness of the display substrate is increased and the aperture opening ratio and the resolution ratio of the display substrate are influenced due to the spacer are solved. In addition, after the light-emitting units are prepared on the substrate by using the mask plate, the height of the spacer is reduced, so that the cathode layer prepared in the subsequent process is not influenced by the spacer, and the yield of the manufactured display substrate is better ensured.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention and not to limit the invention. In the drawings:
fig. 1 is a top view of a display substrate according to an embodiment of the invention;
FIG. 2 is a schematic diagram of forming a recess on a pixel defining layer according to an embodiment of the invention;
FIG. 3 is a schematic view of forming a first spacer in a groove according to an embodiment of the present invention;
FIG. 4 is a schematic cross-sectional view taken along line A1-A2 in FIG. 1.
Reference numerals:
1-a substrate, 2-a light-emitting unit,
3-a mask plate, 4-a first spacer,
5-a pixel defining layer, 6-a second spacer,
7-grooves.
Detailed Description
In order to further explain the display substrate, the manufacturing method thereof and the display device provided by the embodiment of the invention, the following detailed description is made with reference to the accompanying drawings.
The embodiment of the invention provides a manufacturing method of a display substrate, which comprises the following steps:
step S101, before a light-emitting unit is prepared on a substrate by using a mask plate, a spacer for supporting the mask plate is formed on the substrate;
specifically, taking an OLED display device as an example, a light emitting unit in the OLED display device generally includes a hole injection layer, a hole transport layer, an organic light emitting layer, an electron transport layer, an electron injection layer, and the like. When forming the light emitting unit, the functional layers in the light emitting unit are generally formed by using a vapor deposition technique and using a corresponding mask. The mask plate is supported by forming the spacer on the substrate, so that the problems of color mixing, process scratch and the like between the adjacent light-emitting units with different colors can be better prevented.
Step S102, after preparing the light emitting unit on the substrate using the mask plate, reducing the height of the spacer.
Specifically, after the light emitting unit is fabricated using the mask, the mask is removed, and then the height of the spacer for supporting the mask is reduced. After reducing the height of the spacer, the entire cathode layer capable of covering the light emitting cells may be manufactured.
According to the specific manufacturing process of the display substrate, in the manufacturing method of the display substrate provided by the embodiment of the invention, before the light-emitting units are prepared on the substrate by using the mask plate, the spacer for supporting the mask plate is formed on the substrate, so that the light-emitting units formed by using the mask plate can be positioned in the appointed area of the substrate, and the problems of color mixing, process scratch and the like between the adjacent light-emitting units with different colors are well prevented; in addition, in the manufacturing method of the display substrate provided by the embodiment of the invention, after the light-emitting unit is prepared on the substrate by using the mask plate, the height of the spacer is reduced, so that the influence of the spacer on the thickness of the display substrate is reduced, the manufactured display substrate is ensured to be thin, and the problems that the thickness of the display substrate is increased and the aperture ratio and the resolution ratio of the display substrate are influenced due to the spacer are solved. In addition, after the light-emitting units are prepared on the substrate by using the mask plate, the height of the spacer is reduced, so that the cathode layer prepared in the subsequent process is not influenced by the spacer, and the yield of the manufactured display substrate is better ensured.
Further, as shown in fig. 1 to 3, before forming the spacer for supporting the mask 3 on the substrate 1, the method for manufacturing a display substrate according to the embodiment further includes:
step S100, forming a pixel defining layer 5 on a substrate 1, and forming a groove 7 on the surface of the pixel defining layer 5 opposite to the substrate 1;
specifically, the substrate 1 may be a glass substrate on which a thin film transistor array layer and an anode layer are formed, and an organic thin film layer may be formed on the substrate 1 using a photosensitive resin organic material, and then the organic thin film layer may be exposed and developed to form the pixel defining layer 5 on the substrate 1. The thickness of the pixel defining layer 5 can be selected to be between 1 μm and 5 μm, but is not limited thereto.
Further, the groove may be formed on the pixel defining layer in various ways, and two specific ways are exemplified below, but not limited thereto.
In a first mode, as shown in fig. 2, a pixel defining layer 5 and a groove 7 located on a surface of the pixel defining layer 5 opposite to the substrate 1 are formed on the substrate 1 through a one-step patterning process; in more detail, a pixel defining layer film is formed on the substrate 1, then exposed using a corresponding mask plate, and then the exposed pixel defining layer film is developed, thereby forming the pixel defining layer 5 with the grooves 7. Further, in the operation of forming the groove 7 by exposure, the shape of the formed groove 7 can be controlled by gradually reducing the exposure intensity; for example: the grooves having a trapezoidal cross section can be formed by gradually reducing the exposure intensity.
In the second mode, as shown in fig. 2, a pixel defining layer 5 is formed on a substrate 1 through a patterning process, and then a groove 7 is formed on a surface of the pixel defining layer 5 opposite to the substrate 1 through a laser burning method. In more detail, after the pixel defining layer 5 is formed through the patterning process, a region for forming the groove 7 in the pixel defining layer 5 may be irradiated with laser light, thereby forming the groove 7.
It is noted that whatever the above-mentioned manner of forming the groove 7, the shape and size of the formed groove 7 can satisfy practical requirements. Preferably, the depth of the groove 7 is formed to be 1/3-1/2 of the thickness of the pixel defining layer 5; the area of the opening surface of the formed groove 7 is smaller than the area of the bottom surface of the groove 7; when the shape and the size of the formed groove 7 meet the requirements, the groove 7 has a large accommodating space, and when the first spacers 4 are liquefied to form a liquid material, the groove 7 can effectively prevent the liquid material from overflowing, so that the manufacturing yield of the display substrate is ensured.
In step S101, the step of forming the spacer for supporting the mask on the substrate 1 specifically includes:
step S1011, as shown in fig. 3, forming a first spacer 4 in the groove 7, wherein the height of the first spacer 4 is greater than the depth of the groove 7, and the first spacer 4 occupies a partial area of the bottom of the groove;
specifically, the first spacer 4 may be formed in the groove 7 in various ways, such as: the first spacers 4 are formed in the grooves 7 by a stamping process using a photo-isomerisable material. In more detail, a sacrificial layer may be formed on a carrier, a first spacer 4 may be formed on the sacrificial layer by using a photoisomerization material, the carrier with the first spacer 4 may be aligned with the substrate 1 with the pixel defining layer 5, the first spacer 4 may be imprinted into the corresponding groove 7, and the carrier and the sacrificial layer formed on the carrier may be separated from the first spacer 4, thereby completing the fabrication of the first spacer 4 in the groove 7.
It is noted that the groove 7 formed on the pixel defining layer 5 may be a stripe-shaped groove, the first spacers 4 formed in the stripe-shaped groove may be a column-shaped spacer, and one or more column-shaped spacers may be accommodated in the same groove 7, as shown in fig. 1. In addition, the first spacer 4 can only occupy a partial area of the bottom of the groove, so that the groove 7 can contain all liquefied liquid materials when the first spacer 4 is liquefied subsequently, and the liquid materials are prevented from overflowing the groove 7 to influence the manufacturing yield of the display substrate. In addition, the height of the portion of the first spacer 4 beyond the groove 7 may be selected to be between 2 μm and 5 μm, and the diameter of the cross section of the first spacer 4 may be selected to be between 5 μm and 20 μm.
In step S102, the step of lowering the height of the spacer specifically includes the following steps S1021 and S1022.
Step S1021, liquefying the first spacer 4, wherein the liquefied first spacer 4 is leveled in the groove;
specifically, ultraviolet light can be used to intensively irradiate the first spacer 4, so that the first spacer 4 is converted from a solid state into a liquid state material, and the converted liquid state material can flow into the groove 7. Notably, the wavelength of the ultraviolet light utilized is from 350nm to 400 nm.
Step S1022, the leveled liquid material is cured to form a second spacer 6, where the height of the second spacer is smaller than that of the first spacer, as shown in fig. 4.
Specifically, the leveled liquid material is irradiated by visible light, so that the liquid material is converted into a solid second spacer 6, the height of the formed solid second spacer 6 is less than that of the first spacer 4, and further, the height of the formed solid second spacer 6 is less than or equal to the depth of the groove 7. Notably, the visible wavelengths utilized are 500nm to 550 nm.
Further, the photoisomerization organic material selected for forming the spacer may preferably be a photoisomerization organic material containing azobenzene molecules.
Specifically, the photoisomerization organic material containing azobenzene molecules is an organic substance having an azobenzene group in the molecular formula, and the azobenzene group is an isomer having both a metastable cis state and a thermodynamically stable trans state. Under the irradiation of ultraviolet light, the azobenzene group can be converted from a trans state to a cis state, namely, the photoisomerization organic material is converted from a solid state to a liquid state; and because the azobenzene group in the cis state is unstable, the azobenzene group can be converted into the trans state from the cis state under the irradiation of visible light with specific wavelength, namely the photoisomerization organic material is converted into a solid state from a liquid state.
In order to more clearly illustrate the manufacturing method of the display substrate provided in the above embodiments, a specific embodiment is provided below to describe the manufacturing process of the display substrate in detail.
Providing a substrate (a thin film transistor array layer, a flat layer and an anode layer are formed on the substrate), manufacturing a pixel defining layer with the height of 5 mu m on the substrate, and forming a strip-shaped groove with the depth of 2 mu m by adopting a mode of gradually reducing the exposure amount in the process of forming the pixel defining layer by exposure; then, a photo-isomerization material is adopted, and a first spacer with the height of 5 microns and the cross section diameter of 10 microns is formed in the groove by utilizing a stamping process; then, supporting the FMM by using a columnar spacer, and manufacturing each organic functional layer in the light-emitting unit through the FMM; after the light-emitting unit is manufactured, ultraviolet light is adopted to intensively irradiate the first spacer 4, so that the first spacer is converted from a solid state to a liquid state and is flatly paved in the groove; then irradiating the liquid-phase photoisomerization material by using visible light to solidify the photoisomerization material into a second spacer; and finally, adopting materials such as metal Mg, Ag and the like, and manufacturing a cathode layer covering the light-emitting unit through a common mask plate to finish the manufacturing of the display substrate.
The embodiment of the invention also provides a display substrate, which is manufactured by adopting the manufacturing method of the display substrate provided by the embodiment as shown in fig. 1-4. The display substrate includes:
the pixel defining layer 5 is positioned on the substrate 1, and a groove 7 is formed on the surface, opposite to the substrate 1, of the pixel defining layer 5;
and the second shock insulator 6 is positioned in the groove 7, and the height of the second shock insulator 6 is less than or equal to the depth of the groove 7.
The display substrate further includes: light emitting cells 2 located within the pixel areas defined by the pixel definition layer 5, and an entire cathode layer covering each pixel cell 2. In addition, a thin film transistor array layer, a planarization layer and an anode layer are formed on the substrate.
Because the display substrate provided by the embodiment of the invention is manufactured by adopting the manufacturing method provided by the embodiment of the invention, the light-emitting units included in the display substrate provided by the embodiment of the invention can be positioned in the designated area of the display substrate, the problems of color mixing, process scratch and the like between the adjacent light-emitting units with different colors in the display substrate are well prevented, and the yield of the display substrate is improved. And because the height of the second spacer included in the display substrate is less than or equal to the depth of the groove formed in the pixel defining layer, the second spacer is prevented from influencing the thickness of the display substrate, so that the display substrate not only meets the thinning requirement, but also has higher aperture ratio and resolution.
The embodiment of the invention also provides a display device which comprises the display substrate provided by the embodiment. Since the display substrate provided by the embodiment has a high production yield, a high aperture ratio and a high resolution, the embodiment of the invention also has the advantages when the display substrate is included, and details are not repeated herein.
The display device may be: the display device comprises a television, a display, a digital photo frame, a mobile phone, a tablet personal computer and any other product or component with a display function, wherein the display device further comprises a flexible circuit board, a printed circuit board, a back plate and the like.
Unless defined otherwise, technical or scientific terms used herein shall have the ordinary meaning as understood by one of ordinary skill in the art to which this invention belongs. The use of "first," "second," and similar terms in this disclosure is not intended to indicate any order, quantity, or importance, but rather is used to distinguish one element from another. The word "comprising" or "comprises", and the like, means that the element or item listed before the word covers the element or item listed after the word and its equivalents, but does not exclude other elements or items. The terms "connected" or "coupled" and the like are not restricted to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "upper", "lower", "left", "right", and the like are used merely to indicate relative positional relationships, and when the absolute position of the object being described is changed, the relative positional relationships may also be changed accordingly.
It will be understood that when an element such as a layer, film, region, or substrate is referred to as being "on" or "under" another element, it can be "directly on" or "under" the other element or intervening elements may be present.
In the foregoing description of embodiments, the particular features, structures, materials, or characteristics may be combined in any suitable manner in any one or more embodiments or examples.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention, and all the changes or substitutions should be covered within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the appended claims.
Claims (10)
1. A method for manufacturing a display substrate is characterized by comprising the following steps:
forming a spacer for supporting a mask plate on a substrate before preparing a light emitting unit on the substrate by using the mask plate;
and after preparing the light-emitting units on the substrate by using the mask plate, reducing the height of the spacer.
2. The method of manufacturing a display substrate according to claim 1,
before forming a spacer for supporting the mask plate on the substrate, the manufacturing method further includes:
forming a pixel defining layer on the substrate, and forming a groove on the surface of the pixel defining layer opposite to the substrate;
the step of forming a spacer for supporting the mask plate on the substrate specifically includes:
forming a first spacer in the groove, wherein the height of the first spacer is greater than the depth of the groove, and the first spacer occupies partial area of the bottom of the groove;
the step of reducing the height of the spacer specifically comprises:
liquefying the first shock insulator, wherein the liquefied first shock insulator flows into the groove;
and solidifying the leveled liquid material to form a second shock insulator, wherein the height of the second shock insulator is smaller than that of the first shock insulator.
3. The method for manufacturing a display substrate according to claim 2, wherein the step of forming a pixel defining layer on the substrate and forming a groove on a surface of the pixel defining layer opposite to the substrate specifically comprises:
and forming a pixel defining layer on the substrate and a groove on the surface of the pixel defining layer opposite to the substrate through a one-time composition process.
4. The method for manufacturing a display substrate according to claim 2, wherein the step of forming a pixel defining layer on the substrate and forming a groove on a surface of the pixel defining layer opposite to the substrate specifically comprises:
forming a pixel defining layer on the substrate through a patterning process;
and forming a groove on the surface of the pixel defining layer, which is opposite to the substrate, by means of laser burning.
5. The method as claimed in claim 3 or 4, wherein the depth of the groove is 1/3-1/2 of the thickness of the pixel defining layer.
6. The method of manufacturing a display substrate according to claim 3 or 4, wherein an area of an opening surface of the groove is smaller than an area of a bottom surface of the groove.
7. The method for manufacturing a display substrate according to claim 2, wherein the step of forming the first spacer in the groove specifically comprises:
forming the first spacer in the groove by a stamping process using a photoisomerization material;
the step of liquefying the first spacer specifically includes:
irradiating the first spacer by using ultraviolet light to convert the first spacer into a liquid material;
the step of solidifying the leveled liquid material to form a second spacer specifically comprises the following steps:
and irradiating the leveled liquid material by using visible light to convert the liquid material into a second shock insulator.
8. The method of claim 7, wherein the photoisomerization material is an organic photoisomerization material containing azobenzene molecules.
9. A display substrate manufactured by the method for manufacturing a display substrate according to any one of claims 2 to 8, the display substrate comprising:
the pixel defining layer is positioned on the substrate, and a groove is arranged on the surface of the pixel defining layer, which is opposite to the substrate;
and the height of the second spacer is less than or equal to the depth of the groove.
10. A display device comprising the display substrate according to claim 9.
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| WO2020056666A1 (en) * | 2018-09-20 | 2020-03-26 | 深圳市柔宇科技有限公司 | Organic light-emitting diode back plate and manufacturing method therefor |
| CN111224013B (en) * | 2019-11-28 | 2022-08-09 | 京东方科技集团股份有限公司 | Display panel packaging structure and preparation method thereof |
| CN110911466B (en) * | 2019-11-29 | 2022-08-19 | 京东方科技集团股份有限公司 | Substrate and preparation method thereof, preparation method of mother board, mask and evaporation device |
| CN111916578B (en) * | 2020-07-15 | 2023-12-19 | 京东方科技集团股份有限公司 | Array substrate, preparation method thereof and display device |
| CN112164705B (en) * | 2020-10-26 | 2021-04-09 | 厦门强力巨彩光电科技有限公司 | Micro-LED display panel and Micro-LED display device |
| CN112768475B (en) * | 2021-01-07 | 2022-07-12 | 武汉华星光电半导体显示技术有限公司 | OLED display panel and preparation method thereof |
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