CN108376649B - Shaping device for QFP semiconductor device - Google Patents
Shaping device for QFP semiconductor device Download PDFInfo
- Publication number
- CN108376649B CN108376649B CN201810323696.XA CN201810323696A CN108376649B CN 108376649 B CN108376649 B CN 108376649B CN 201810323696 A CN201810323696 A CN 201810323696A CN 108376649 B CN108376649 B CN 108376649B
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- China
- Prior art keywords
- symmetrically
- shaping
- cavity
- workbench
- threaded rod
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4885—Wire-like parts or pins
- H01L21/4896—Mechanical treatment, e.g. cutting, bending
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The invention discloses a shaping device for a QFP semiconductor device, which comprises a base, wherein the upper end of the base is fixedly connected with a workbench, the upper end of the workbench is provided with a supporting groove, a plurality of first springs are symmetrically arranged in the supporting groove, the upper end of each first spring is commonly connected with a placing plate, two cavities are symmetrically arranged on the workbench, the cavities are symmetrically arranged on two sides of the supporting groove, a driving mechanism is arranged in each cavity, the upper ends of the workbench are symmetrically and slidingly connected with two shaping blocks, the two shaping blocks are arranged at the upper ends of the cavities, the lower ends of the two shaping blocks penetrate through the side walls of the cavities and are connected with the driving mechanism, and two mounting plates are symmetrically and fixedly connected with two mounting plates on two sides of the base. The invention has the advantages of stable structure, simple operation, scientific and reasonable design, short production period, low manufacturing cost, good shock resistance, convenient fixation of the whole equipment, convenient protection of QFP devices and good shaping effect of pins.
Description
Technical Field
The invention relates to the technical field of QFP devices, in particular to a shaping device for a QFP semiconductor device.
Background
Currently, a large number of QFP four-side lead flat package devices are used in electronic products, the QFP device is one of surface mount packages, and is composed of a base body and pins, the base body is a block body with a ceramic material, a metal material or a plastic material as a base material, and the pins are positioned on four sides of the base body and led out to be gull wing shapes. When the QFP device is used, the QFP device needs to be welded on a circuit board through a surface mounting process, pins on four sides of the QFP device are used as bridges for connecting an internal circuit of a base body of the QFP device with the circuit of the circuit board, and extremely strict requirements are imposed on the size and the shape of the QFP device, in particular to offset, spacing, standing degree, coplanarity and the like of the pins.
However, because of the reasons of more pins, small spacing, low strength and the like of the QFP device, the QFP device is easy to deform in the occasions of transportation, turnover, production and the like, so that the offset, spacing, standing degree, coplanarity and the like of the pins are out of tolerance, and the pins are welded and/or contacted and the like, particularly, the phenomena of difficulty in identifying the mounting machine, difficulty in aligning with the bonding pad during manual welding and the like are caused, so that a lot of inconvenience is brought to the automatic production of the circuit board, even the mounting quality and the mounting production efficiency are influenced, the working of partial components is poor due to light weight, and the whole equipment is damaged due to heavy weight.
In order to better solve the problem of shaping pins of the QFP, a QFP device shaping device is further provided. The existing shaping device of the QFP device has simple integral structure, complex operation, inconvenient fixation of integral equipment, the QFP device is not convenient to protect, and the shaping effect of the pins is poor.
Disclosure of Invention
The invention aims to solve the problems of simple structure, complex operation, inconvenient fixation of the whole equipment, inconvenient protection of a QFP device and poor shaping effect of pins in the prior art, and provides a shaping device for a QFP semiconductor device.
In order to achieve the above purpose, the present invention adopts the following technical scheme: the shaping device for the QFP semiconductor device comprises a base, wherein the upper end of the base is fixedly connected with a workbench, the upper end of the workbench is provided with a supporting groove, a plurality of first springs are symmetrically arranged in the supporting groove, and the upper end of each first spring is commonly connected with a placing plate;
two cavities are symmetrically formed in the workbench, the cavities are symmetrically arranged on two sides of the supporting groove, a driving mechanism is arranged in each cavity, two shaping blocks are symmetrically and slidably connected to the upper end of the workbench, the two shaping blocks are arranged at the upper end of the cavity, and the lower ends of the two shaping blocks penetrate through the side wall of the cavity and are connected with the driving mechanism;
the driving mechanism comprises a supporting plate arranged in a cavity, a motor is arranged in the cavity and positioned below the supporting plate, a worm is arranged at the driving end of the motor, the upper end of the worm penetrates through the supporting plate and is connected with the top wall of the cavity, a threaded rod is horizontally connected in a rotating mode in the cavity and positioned above the supporting plate, a fixing sleeve is sleeved on the threaded rod and fixed above the supporting plate, a worm wheel is sleeved on the threaded rod and positioned on one side of the fixing sleeve, and the worm is meshed with the worm wheel;
two mounting plates are symmetrically and fixedly connected to the two sides of the base, a plurality of clamping grooves are formed in the shaping block, two rollers are symmetrically and rotationally connected in each clamping groove, and the two rollers are symmetrically and rotationally connected to the side walls of the clamping grooves.
The further improved scheme in the technical scheme is as follows:
1. in the above scheme, two spouts have been seted up to the symmetry on the roof of cavity, the lower extreme symmetry of plastic piece is equipped with two connecting rods, and the connecting rod is located the spout and overlaps to establish on the threaded rod and be connected with the threaded rod.
2. In the above scheme, a plurality of recesses have been seted up to the lower extreme symmetry of base, every in the recess all symmetry take photograph in a plurality of second springs, every the one end that the recess roof was kept away from to the second spring is connected with the sucking disc jointly.
3. In the above scheme, the upper end of placing the board is equipped with the protection pad.
4. In the above scheme, a plurality of fixing holes are symmetrically formed in each mounting plate.
Due to the application of the technical scheme, compared with the prior art, the invention has the following advantages:
1. the shaping device for the QFP semiconductor device can better shape pins of the QFP through the motor, the worm, the supporting plate, the threaded rod, the connecting plate, the shaping block and the roller wheel which are arranged in the cavity, and saves more manpower.
2. The shaping device for the QFP semiconductor device has the advantages of stable structure, simple operation, scientific and reasonable design, short production period, low manufacturing cost, good shock resistance, convenient fixation of the whole equipment, convenient protection of the QFP device and good shaping effect of pins.
Drawings
Fig. 1 is a schematic structural view of a shaping apparatus for a QFP semiconductor device according to the present invention;
FIG. 2 is a schematic diagram of the driving structure of the shaping device of the present invention;
fig. 3 is a schematic diagram of a shaping block structure of the shaping device of the present invention.
In the above figures: 1. a base; 2. a mounting plate; 3. a second spring; 4. a suction cup; 5. a work table; 6. placing a plate; 7. a protective pad; 8. a first spring; 9. shaping blocks; 10. a motor; 11. a support plate; 12. a worm; 13. a threaded rod; 14. and a roller.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments.
In the description of the present invention, it should be understood that the terms "upper," "lower," "front," "rear," "left," "right," "top," "bottom," "inner," "outer," and the like indicate or are based on the orientation or positional relationship shown in the drawings, merely to facilitate description of the present invention and to simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention.
Referring to fig. 1 to 3, a shaping device for a QFP semiconductor device includes a base 1, a workbench 5 fixedly connected to an upper end of the base 1, a supporting groove provided at an upper end of the workbench 5, a plurality of first springs 8 symmetrically provided in the supporting groove for buffering devices placed at an upper end of a supporting plate 6, a placing plate 6 commonly connected to an upper end of each first spring 8, and a protection pad 7 provided at an upper end of the placing plate 6 for protecting the devices; two cavities are symmetrically arranged on the workbench 5, two sides of a supporting groove are symmetrically arranged on the cavities, a driving mechanism comprises a supporting plate 11 arranged in the cavities and used for supporting a fixing sleeve, a motor 10 is arranged in the cavities, the motor 10 is located below the supporting plate 11, a worm 12 is arranged at the driving end of the motor 10, the upper end of the worm 12 penetrates through the supporting plate 11 and is connected with the top wall of the cavities, a threaded rod 13 is horizontally rotated in the cavities and connected with the cavities, the threaded rod 13 is located above the supporting plate 11, the fixing sleeve is sleeved on the threaded rod 13 and is fixed above the supporting plate 11, a worm wheel is sleeved on the threaded rod 13 and is located on one side of the fixing sleeve, and the worm 12 is meshed with the worm wheel.
Two sliding grooves are symmetrically formed in the top wall of the cavity, so that the shaping block 9 can conveniently slide, two connecting rods are symmetrically arranged at the lower end of the shaping block 9, and the connecting rods are positioned in the sliding grooves, sleeved on the threaded rod 13 and connected with the threaded rod 13; a driving mechanism is arranged in each cavity, two shaping blocks 9 are symmetrically and slidingly connected to the upper end of the workbench 5, the two shaping blocks 9 are arranged at the upper end of the cavity, the lower ends of the two shaping blocks 9 penetrate through the side wall of the cavity and are connected with the driving mechanism, two mounting plates 2 are symmetrically and fixedly connected to the two sides of the base 1, and a plurality of fixing holes are symmetrically formed in each mounting plate 2 and used for fixing the whole equipment; the shaping block 9 is provided with a plurality of clamping grooves, two rollers 14 are symmetrically and rotationally connected in each clamping groove, and the two rollers 14 are symmetrically and rotationally connected on the side wall of the clamping groove; the lower extreme symmetry of base 1 has seted up a plurality of recesses, all symmetry take photograph in a plurality of second springs 3 in every recess, and the one end that recess roof was kept away from to every second spring 3 is connected with sucking disc 4 jointly, better messenger's whole equipment's stability.
The electrical components are all connected with an external main controller and 220V mains supply, and the main controller can be conventional known equipment for controlling a computer and the like.
In the invention, the QFP device is placed on the placing plate 6, then the pins are placed in the clamping grooves on the shaping block 9, and then the motor 10 drives the worm 12 on the driving end to rotate, and as the worm 12 is meshed with the worm wheel on the threaded rod 13, the threaded rod 13 can rotate on the fixed sleeve, and then the shaping block 9 can be moved, and then the pins are shaped under the action of the roller 14, thereby achieving the standard of installation and use.
The above embodiments are provided to illustrate the technical concept and features of the present invention and are intended to enable those skilled in the art to understand the content of the present invention and implement the same, and are not intended to limit the scope of the present invention. All equivalent changes or modifications made in accordance with the spirit of the present invention should be construed to be included in the scope of the present invention.
Claims (3)
1. A shaping apparatus for a QFP semiconductor device, characterized by: the automatic lifting device comprises a base (1), wherein the upper end of the base (1) is fixedly connected with a workbench (5), a supporting groove is formed in the upper end of the workbench (5), a plurality of first springs (8) are symmetrically arranged in the supporting groove, the upper end of each first spring (8) is commonly connected with a placing plate (6), and a protection pad (7) is arranged at the upper end of each placing plate (6);
two cavities are symmetrically formed in the workbench (5), the cavities are symmetrically arranged on two sides of the supporting groove, a driving mechanism is arranged in each cavity, two shaping blocks (9) are symmetrically and slidably connected to the upper end of the workbench (5), the two shaping blocks (9) are arranged at the upper end of the cavity, and the lower ends of the two shaping blocks (9) penetrate through the side walls of the cavities and are connected with the driving mechanism;
the driving mechanism comprises a supporting plate (11) arranged in a cavity, a motor (10) is arranged in the cavity, the motor (10) is positioned below the supporting plate (11), a worm (12) is arranged at the driving end of the motor (10), the upper end of the worm (12) penetrates through the supporting plate (11) and is connected with the top wall of the cavity, a threaded rod (13) is horizontally connected in the cavity in a rotating mode, the threaded rod (13) is positioned above the supporting plate (11), a fixing sleeve is sleeved on the threaded rod (13), the fixing sleeve is fixed above the supporting plate (11), a worm wheel is sleeved on the threaded rod (13), the worm wheel is positioned on one side of the fixing sleeve, and the worm (12) is meshed with the worm wheel;
two mounting plates (2) are symmetrically and fixedly connected to the two sides of the base (1), a plurality of clamping grooves are formed in the shaping block (9), two rollers (14) are symmetrically and rotationally connected in each clamping groove, the two rollers (14) are symmetrically and rotationally connected to the side walls of the clamping grooves, and a plurality of fixing holes are symmetrically formed in each mounting plate (2).
2. The shaping device for the QFP semiconductor device according to claim 1, wherein two sliding grooves are symmetrically formed in the top wall of the cavity, two connecting rods are symmetrically arranged at the lower end of the shaping block (9), and the connecting rods are located in the sliding grooves, sleeved on the threaded rod (13) and connected with the threaded rod (13).
3. The shaping device for the QFP semiconductor device according to claim 1, wherein a plurality of grooves are symmetrically formed in the lower end of the base (1), a plurality of second springs (3) are symmetrically shot in each groove, and a sucker (4) is commonly connected to one end of each second spring (3) away from the top wall of the groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810323696.XA CN108376649B (en) | 2018-04-12 | 2018-04-12 | Shaping device for QFP semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810323696.XA CN108376649B (en) | 2018-04-12 | 2018-04-12 | Shaping device for QFP semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108376649A CN108376649A (en) | 2018-08-07 |
| CN108376649B true CN108376649B (en) | 2023-10-10 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810323696.XA Active CN108376649B (en) | 2018-04-12 | 2018-04-12 | Shaping device for QFP semiconductor device |
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| Country | Link |
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| CN (1) | CN108376649B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1125897A (en) * | 1994-12-28 | 1996-07-03 | 三菱电机株式会社 | Method and device for correcting IC guiding wire |
| KR20090031825A (en) * | 2007-09-25 | 2009-03-30 | 다이니폰 스크린 세이조우 가부시키가이샤 | Alignment mark forming apparatus |
| CN204348684U (en) * | 2014-10-20 | 2015-05-20 | 中国航空工业集团公司洛阳电光设备研究所 | A kind of QFP device pin apparatus for shaping |
| CN207154615U (en) * | 2017-09-27 | 2018-03-30 | 黄耿 | A kind of end pin apparatus for shaping for electronic component |
| CN208111398U (en) * | 2018-04-12 | 2018-11-16 | 盐城芯丰微电子有限公司 | Apparatus for shaping for QFP semiconductor devices |
-
2018
- 2018-04-12 CN CN201810323696.XA patent/CN108376649B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1125897A (en) * | 1994-12-28 | 1996-07-03 | 三菱电机株式会社 | Method and device for correcting IC guiding wire |
| JPH08186222A (en) * | 1994-12-28 | 1996-07-16 | Mitsubishi Electric Corp | Method of reforming lead of ic and reforming device |
| KR20090031825A (en) * | 2007-09-25 | 2009-03-30 | 다이니폰 스크린 세이조우 가부시키가이샤 | Alignment mark forming apparatus |
| CN204348684U (en) * | 2014-10-20 | 2015-05-20 | 中国航空工业集团公司洛阳电光设备研究所 | A kind of QFP device pin apparatus for shaping |
| CN207154615U (en) * | 2017-09-27 | 2018-03-30 | 黄耿 | A kind of end pin apparatus for shaping for electronic component |
| CN208111398U (en) * | 2018-04-12 | 2018-11-16 | 盐城芯丰微电子有限公司 | Apparatus for shaping for QFP semiconductor devices |
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| Publication number | Publication date |
|---|---|
| CN108376649A (en) | 2018-08-07 |
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