CN108370023A - The engraving method of electrode and the secondary cell for including the electrode etched by this method - Google Patents
The engraving method of electrode and the secondary cell for including the electrode etched by this method Download PDFInfo
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- CN108370023A CN108370023A CN201680072414.2A CN201680072414A CN108370023A CN 108370023 A CN108370023 A CN 108370023A CN 201680072414 A CN201680072414 A CN 201680072414A CN 108370023 A CN108370023 A CN 108370023A
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- laser
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The present invention relates to a kind of engraving method of electrode, secondary cells and its manufacturing method comprising the electrode etched by the method.According to the present invention it is possible to by economically improving the speed of laser ablation process come effectively etched electrodes, the degree of freedom of cell shapes is improved, and by removing upper layer with focusing energy selectivity.Therefore, the present invention can provide the secondary cell of high-quality in an economical manner.
Description
Technical field
The Korean Patent Application No. 10-2015- submitted in Korean Intellectual Property Office this application claims on December 9th, 2015
0174806 priority and right, and be by reference incorporated herein entire contents.
Include the system that the electrode is etched by the engraving method of the electrode the present invention relates to the engraving method of electrode
The method for making secondary cell, and include the secondary cell of the electrode after being etched by the engraving method.
Background technology
With technology development and the increase to mobile device demand, the demand to the secondary cell as the energy quickly increases
Add.As a result, to disclosure satisfy that the various different secondary cells needed, numerous studies are had been carried out.
Such secondary cell is manufactured into the type that will be housed in together with electrode assembly and electrolyte in battery case.It is described
Electrode assembly can be classified into stacked, folded form according to manufacturing method and stack folded form.In stacked or heap stack of folded
In the case of type, unit block has the structure that wherein anode and cathode are sequentially stacked in the case where diaphragm is placed in therebetween.
In order to manufacture such electrode assembly, manufacture respectively anode and cathode with electrode tabs are needed.
That is, in order to manufacture the cell electrode with electrode tabs, it is necessary first to which notch process is in a table
It is coated on face or two surfaces on the continuous electrode plate of electrode active material and forms electrode tabs.The notch process is usually logical
It crosses and electrode plate is placed on punch die and is carried out using a part for forcing press punching press electrode plate.
Invention content
[technical problem]
Meanwhile inventors have recognized that arriving, when carrying out notch process as described above, there is the electricity of electrode tabs
The shape of pole is limited, and the degree of freedom of cell shapes reduces.Therefore, according to carefully studying as a result, the inventors discovered that logical
It crosses and laser ablation process is introduced into the manufacture of secondary cell, the degree of freedom of cell shapes can be improved.In addition, the present inventor
It was found that when such laser ablation process to be introduced into the manufacture of secondary cell, exist in terms of the power for improving laser
As a result limitation is difficult to improve process speed, and by studying the method that can economically improve process speed, human hair of the present invention
The present invention is illustrated, the secondary cell of high-quality can be economically provided.
That is, it is an object of the invention to solve the problems in related field, and the engraving method of electrode is provided,
It improves the degree of freedom of cell shapes by introducing laser ablation process in etched electrodes, and by using heat gun and swashs
Light transmits energy to reduce the amount of the energy by laser transfer together, thus economically improves the process speed of laser ablation.
It is a further object to provide secondary cells comprising after the engraving method etching of the electrode
Electrode.
[technical solution]
In order to solve described problem, the present invention provides through remove to be formed at the electrode surface one via laser irradiation
The engraving method for the electrode that the laser ablation process of amount of activated material membrane carries out, the method includes heating electricity before etching
Pole.
In addition, the method that the present invention provides manufacture secondary cell comprising etched by the engraving method of the electrode
Electrode.
In addition, the present invention provides secondary cell, it includes the electrodes after the engraving method etching by the electrode.
[advantageous effect]
According to the present invention it is possible to the degree of freedom of cell shapes be improved, by the speed for economically improving laser ablation process
Carry out effectively etched electrodes, and by removing upper layer with focusing energy selectivity.Therefore, the present invention can carry in an economical manner
For the secondary cell of high-quality.
Description of the drawings
Fig. 1 is the photo for showing the result according to 1 etched electrodes of embodiment.
Fig. 2 is the enlarged photograph of Fig. 1.
Fig. 3 is the photo for showing the result according to 1 etched electrodes of comparative example.
Fig. 4 is the enlarged photograph of Fig. 3.
Fig. 5 is the photo for showing the result according to 2 etched electrodes of embodiment.
Fig. 6 is the enlarged photograph of Fig. 5.
Fig. 7 is the photo for showing the result according to 2 etched electrodes of comparative example.
Fig. 8 is the enlarged photograph of Fig. 7.
Fig. 9 is the schematic diagram for the laser ablation process for schematically showing the embodiment of the present invention 1 to 4.
Figure 10 is the schematic diagram for the metal notch process for schematically showing the comparative example 1 and 2 of the present invention.
Specific implementation mode
The present invention relates to form a part of active material film at the electrode surface by being irradiated via laser to remove
The engraving method for the electrode that laser ablation process carries out, the method includes the electrode is heated before the etching.
In the present specification, term " electrode " is not particularly limited, but can be preferably electrolytic cell electrod assembly.
In the present specification, term " laser ablation process " refers to two-dimensionally being formed in electricity by irradiation laser beam to remove
The method of the subregion of film on the substrate of pole.
In the present invention, the degree of freedom of cell shapes is improved by laser ablation process etched electrodes.It is carried in related field
The electrode assembly with lug supplied also has many limitations with dull shape, such as even if uses two in design
Also the shape of such secondary cell is considered when the part of the device of primary cell.It is preferable, however, that provide through the invention
The engraving method of electrode can improve the degree of freedom of cell shapes, and can more diversely design device without by electricity
The limitation of pole element shapes.
That is, when applying laser ablation process during etching electrode, electrode activity material can be located at lug
Expect that the mode at the part being etched is cut into lug, thus to obtain the lug part of intended shape.It is for instance possible to obtain in electricity
Extremely internal structure, the electrode higher than lug part and the lug shape etc. in addition to rectangle with lug, but the present invention is not
It is limited to this.
In the present invention, the method includes heating the electrode before the etching work procedure, this is because by adding
Thermode simultaneously uses laser transfer energy, can economically improve process speed by the amount of the energy of laser transfer by reducing
Degree.
Etching speed is determined by the pulse energy and peak power of laser.However, there is limit in the raising due to laser power
System, therefore, it is difficult to improve process speed.In order to improve laser ablation process speed, the scanning using multiple optical systems is had studied
The methods of instrument, but it is unfavorable in terms of cost, and the present invention solves these disadvantages.
In an example of the present invention, the active material film can be positive electrode active materials film or negative electrode active material
Film.
In another example of the present invention, the positive electrode active materials film as the material that can cause electrochemical reaction can
To be metal oxide or sulphur compound containing lithium, specifically, the metal oxide containing lithium is preferably by being selected from following structure
At at least one of group constitute：LiCoO2, LiMnxO2x(x=1 or 2), LiFePO4, LiNi1/3Co1/3Mn1/3O2With
LiNi1-xCoxMyO2(x=0 to 0.2, M=is selected from by least one of Mg, Ca, Sr, Ba and La group constituted element, and y
=0.001 to 0.02), but not limited to this.
In another example of the present invention, negative electrode active material film is preferably by being selected from by graphite, silicon base compound, germanic
At least one of the group that material and tin-containing material are constituted is made, but not limited to this.
In another example of the present invention, can by be selected from by heat gun, RF inductors, infrared (IR) lamp of induction and
At least one of group that hot plate is constituted is heated.Due to the availability that business efficiency and equipment are installed, it is expected that using hot wind
Rifle is heated, but there is no limit as long as heat radiation means can realize same effect to the type of heating.
In an example of the present invention, laser is pulse laser, but not limited to this.
Hereinafter, the device used in laser ablation process and process conditions be will be explained in.
The device used in laser ablation process include laser oscillator for emitting laser beam and for focus from
The laser beam that the laser oscillator is sent out and the condenser lens by laser beam irradiation on the electrode.Preferably, pass through institute
The focal spot for stating the laser beam of condenser lens contacts the surface of the electrode.Herein, focal spot refers to that focus described below is deep
Laser beam within degree.
The depth of focus refers to when the least radius of the laser facula focused is Wo and the focal length of condenser lens is f
When, the radius of the laser facula of focusing is the distance between two points of Wo.Only when electrode is located at as in the depth of focus
Laser beam focal spot within when, sufficient laser ablation could be carried out, and when electrode deviates the focal spot, laser beam
Energy is remarkably decreased, and as a result the laser ablation process carries out not exclusively.
Focal spot size (Wo) can be indicated by following formula 1.
[formula 1]
In formula 1, λ represents the wavelength of laser, the M as the variable for being referred to as beam mode parameter2Represent the product of laser
Matter, f represent the focal length of condenser lens, and D represent be incident on the laser beam in condenser lens light it is wide.
The depth of focus can be indicated by following formula 2, and L refers to the depth of focus in following formula 2.
[formula 2]
Go out following formula 3 from the relation derivation of equation 1 above and 2.
[formula 3]
When focal spot size (Wo) hour, the energy of laser beam concentrates on narrow zone and is easy to carry out laser ablation work
Sequence, when the depth of focus is long, although the position change of electrode or the uneven surface of electrode, laser for laser beam
Ablation can carry out to continued smooth, as a result, preferred focal spot size (Wo) is ideally small and the depth of focus is long.
However, with reference to formula 3, the depth of focus is directly proportional to the size of laser facula.
Therefore, when the size of focal spot is small, the energy density of the laser beam of per unit area can be improved, but due to
Density improves the depth of focus and also shortens, therefore when object to be cut is relative to the position change of laser beam or the table of object to be cut
When the unevenness of face, object to be cut cannot successfully be cut.
In contrast, when the depth of focus is long, when the position for the electrode for being subjected to laser ablation process changes relative to laser beam
When change or when the uneven surface of electrode, sensitivity is relatively low.Therefore, the position of easy setting electrode or focus, but focal spot
Size also increases together with the depth of focus, and the energy density that as a result there is the laser beam of per unit area gets lower than and can carry out
The horizontal problem of laser ablation process.
Therefore, because the depth of focus cannot be made very long and at the same time keeping focal spot size very small, therefore swashing in electrode
The depth of focus is balanced in light ablation process and focal spot size is very important.Furthermore, it is necessary to which it is using sharp to grasp which variable
Significant variable in light ablation electrode.
In another example of the present invention, the focal length of the condenser lens of laser can be 100mm to 300mm, but unlimited
In this.
In another example of the present invention, the pulse width of laser be preferably 1ns to 300ns, more preferably 5ns extremely
30ns, but not limited to this.
When the size of laser pulse width is more than the numberical range, the heat transfer time of laser to electrode is long and right
The fuel factor of outer peripheral portion is big, when the pulse width of laser is less than the numberical range, cannot carry out sufficient energy transmission
And thus etching efficiency declines, as a result the size of preferred pulse width within the numberical range, but the present invention is not limited to
This.
In an example of the present invention, M2It is known as the variable of beam mode parameter and represents the quality of laser, and
And theoretical value is 1, is of virtually about 1.3 value.The M for the laser being used in the present invention2Value is preferably close to 1, but can
To be changed according to laser output power and laser generation method.In M2Value be 2 or more in the case of, in order to reduce focal spot
Size becomes larger the depth of focus so that preferred M2Value have 1.0 to 2.0 value, however, the present invention is not limited thereto.
In another example of the present invention, the frequency of laser be preferably 20kHz to 1000kHz, more preferably 70kHz extremely
500kHz, but not limited to this.
Due to the superposition rate between laser beam, when the frequency of laser is more than the numberical range, there are between light beam
Be spaced disadvantage narrow and that the heat affecting caused by laser is big, when the frequency of laser be less than the numberical range when, light beam it
Between interval it is wide, therefore there are the small part of influence of light beam, as a result active material particle is not removed.Therefore, laser
Frequency preferably within above range, but not limited to this.
In another example of the present invention, the speed of laser is preferably 0.5m/s to 5m/s, more preferably 3m/s to 5m/
S, but not limited to this.
In an example of the present invention, laser facula is preferably dimensioned to be 18 μm to 86 μm, more preferably 25 μm to 60 μ
M, but not limited to this.
The size of laser facula significantly affects the processing result on electrode surface in laser ablation process.Work as laser facula
Size be more than the numberical range when, the energy intensity of laser is too low, thus can not achieve sufficient etching.Work as laser facula
Size be less than the numberical range when, etching efficiency deterioration.As a result, the size of laser facula preferably the numberical range it
It is interior.
In another example of the present invention, the pulse energy of laser is preferably 0.1 μ J to 1000 μ J, but not limited to this.
When the processing result in the laser ablation process that the pulse energy of laser significantly affects the present invention on electrode surface
When, and when the pulse energy of laser is more than 100 μ J, the electrode under active material and active material is etched, and is as a result difficult to
It is etched selectively to active material, and when the pulse energy of laser is less than 0.1 μ J, cannot adequately be etched, and
Thus etching efficiency declines, therefore the pulse energy of laser is preferably within the numberical range.
In addition, the present invention relates to the methods for manufacturing secondary cell comprising described in engraving method etching
Electrode.
In addition, the present invention relates to secondary cell, it includes the electrodes after being etched by the engraving method.
Hereinafter, the present invention will be described in more detail using non-limiting embodiment.The implementation of the following public present invention
Example is merely illustrative, and the scope of the present invention is not limited to the embodiment.The scope of the present invention is wanted by the right being appended
It asks book to show and includes all changes fallen being equal within the meaning and scope of claims.In addition, in following reality
It applies in example and comparative example, unless otherwise prescribed, indicates that " % " and " number " of content is in mass.
Embodiment
The positive electrode active materials film on 1. etched electrodes surface of embodiment
(1) by each Self cleavage of aluminium foil to form electrode tabs on side to prepare positive plate.By to being used as solvent
N-Methyl pyrrolidone add LiCoO as active material2, carbon black as conductive material and graphite and as bonding
The polyvinylidene fluoride (PVdF) of agent prepares cathode mix, and is applied to two of the aluminium foil other than electrode tabs
Each plane of a plane.Using heat gun (H1600 is manufactured by Metabo companies) while being kept at a distance from 30cm with electrode
Electrode (being manufactured by LG Chemical Ltd.) to being coated with the positive electrode active materials film so manufactured heats.
(2) by described in following table 1 under conditions of, by laser irradiation (being manufactured by SPI companies, G4) to heating
The positive electrode active materials film of electrode surface carries out laser ablation process.Confirmed that umber of exposures ought be increased under the same conditions
When, the number when etching degree of electrode is optimised.
Confirm that result is shown in Fig. 1 and Fig. 2, and it is optimised when laser irradiates 5 times to etch degree.
[table 1]
The negative electrode active material film on 2. etched electrodes surface of embodiment
(1) by each Self cleavage of copper foil to form electrode tabs on side to prepare negative plate.By to being used as solvent
Distilled water addition the artificial graphite as negative electrode active material, the carbon black as conductive material, the styrene-as binder
Butadiene rubber (SBR) and negative electrode mix slurry is prepared as the carboxymethyl cellulose (CMC) of additive, and be coated with
To each plane of two planes of the copper foil other than electrode tabs.Use heat gun (H1600, by Metabo corporations
Make) with electrode keep 30cm at a distance from while to being coated with the electrode of the negative electrode active material film so manufactured (by LGization
Learn Co., Ltd.'s manufacture) it is heated.
(2) by described in following table 2 under conditions of, by laser irradiation (being manufactured by SPI companies, G4) to heating
The negative electrode active material film of electrode surface carries out laser ablation process.Confirmed that umber of exposures ought be increased under the same conditions
When, the number when etching degree of electrode is optimised.
Confirm that result is shown in Fig. 5 and Fig. 6, and it is optimised when laser irradiates 4 times to etch degree.
[table 2]
The positive electrode active materials film on 3. etched electrodes surface of embodiment
Other than the step of without embodiment 1 (1), it confirmed that the etching degree of electrode is optimised in the same way
Umber of exposures.
Confirm that result is shown in Fig. 3 and Fig. 4, and it is optimised when laser irradiates 7 times to etch degree.
The negative electrode active material film on 4. etched electrodes surface of embodiment
Other than the step of without embodiment 2 (1), it confirmed that the etching degree of electrode is optimised in the same way
Umber of exposures.
Confirm that the result is shown in Fig. 7 and Fig. 8, and it is optimised when laser irradiates 5 times to etch degree.
The positive electrode active materials film on 1. etched electrodes surface of comparative example
To be coated with negative electrode active material film electrode (being manufactured by LG Chemical Ltd.) surface into row metal notch.
By the method disclosed in Korean patent registration No. 1370855 come into row metal notch.
The negative electrode active material film on 2. etched electrodes surface of comparative example
To the negative electrode active material film of electrode surface into row metal notch.
It is located at activity as a result, can be cut into as shown in Figure 9 as according to 1 to 4 etch activity material membrane of embodiment
The lug for being etched part of material membrane, to the position of arbitrarily devised lug and the shape of lug.In contrast, in comparative example
In the case of 1 and 2, due to forming linear lug part in coating electrode, into lug portion after row metal notch process
The shape divided is restricted, as shown in Figure 10.
In addition, according to embodiment 1 to 4, the etching degree of active material film is compared, to confirm that production time per piece (is
Refer to the maximum time of each process time, and single-piece work is measured by the way that whether range estimation confirmation active material film is fully etched
When) reduction degree.
In the case of positive electrode active materials film, with 3 phase of embodiment being etched without using heat gun
Than in the case of embodiment 1 being etched together using heat gun, production time per piece reduces about 28%.
In the case of negative electrode active material film, with 4 phase of embodiment being etched without using heat gun
Than in the case of embodiment 2 being etched together using heat gun, production time per piece reduces about 20%.
According to described as a result, finding in the Examples 1 and 2 using heat gun, laser ablation process speed improves.Also
It is to say, when carrying out laser ablation process to active material film, what the energy needed for ablation was to determine.In this case, one
By being used as the heat gun of heat radiation approach rather than laser transmits, reducing will be by the energy of laser transfer for a little energy
Amount, to economically improve laser ablation process speed.
Claims (14)
1. a kind of method by laser ablation process etched electrodes to be formed at the electrode surface by laser irradiation to remove
A part of active material film, the method includes
Electrode is heated before the etching.
2. the method for the etched electrodes of claim 1, wherein
The active material film is positive electrode active materials film, by selected from being made of at least one of the group constituted as follows：
LiCoO2；LiMnxO2x, wherein x is 1 or 2；LiFePO4；LiNi1/3Co1/3Mn1/3O2；And LiNi1-xCoxMyO2, wherein x be 0 to
0.2, M is selected from least one of the group being made of Mg, Ca, Sr, Ba and La element, and y is 0.001 to 0.02.
3. the method for the etched electrodes of claim 1, wherein
The active material film is negative electrode active material film, by being selected from by graphite, silicon base compound, contain germanium material and stanniferous material
Expect that at least one of group constituted is made.
4. the method for the etched electrodes of claim 1, wherein
By being selected from least one of the group being made of heat gun, radio frequency (RF) inductor, infrared (IR) lamp of induction and hot plate
To carry out the heating.
5. the method for the etched electrodes of claim 1, wherein
The laser is pulse laser.
6. the method for the etched electrodes of claim 1, wherein
The focal length of condenser lens for the laser is in the range of 100mm to 300mm.
7. the method for the etched electrodes of claim 1, wherein
The pulse width of the laser is in the range of 1ns to 300ns.
8. the method for the etched electrodes of claim 1, wherein
Beam mode parameter (M as the variable for indicating laser quality2) value in the range of 1 to 2.0.
9. the method for the etched electrodes of claim 1, wherein
The frequency of the laser is in the range of 20kHz to 1000kHz.
10. the method for the etched electrodes of claim 1, wherein
The speed of the laser is in the range of 0.5m/s to 5m/s.
11. the method for the etched electrodes of claim 1, wherein
The size of the laser facula is in the range of 18 μm to 86 μm.
12. the method for the etched electrodes of claim 1, wherein
The pulse energy of the laser is 0.1 μ J to 1000 μ J.
13. a kind of method of manufacture secondary cell, the method includes the etched electrodes by any one of claim 1 to 12
Method carry out etched electrodes.
14. a kind of secondary cell, the electricity after being etched it includes the method for the etched electrodes by any one of claim 1 to 12
Pole.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2015-0174806 | 2015-12-09 | ||
| KR1020150174806A KR20170068064A (en) | 2015-12-09 | 2015-12-09 | An etching method for substarate and a secondary battery comprising substrate ethched by the same |
| PCT/KR2016/013898 WO2017099407A2 (en) | 2015-12-09 | 2016-11-29 | Method for etching electrode, and secondary battery comprising electrode etched thereby |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108370023A true CN108370023A (en) | 2018-08-03 |
Family
ID=59013423
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201680072414.2A Pending CN108370023A (en) | 2015-12-09 | 2016-11-29 | The engraving method of electrode and the secondary cell for including the electrode etched by this method |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR20170068064A (en) |
| CN (1) | CN108370023A (en) |
| WO (1) | WO2017099407A2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114365306A (en) * | 2019-12-23 | 2022-04-15 | 株式会社Lg新能源 | Apparatus and method for manufacturing electrode of secondary battery using laser and electrode of secondary battery manufactured thereby |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102549528B1 (en) | 2019-05-09 | 2023-06-30 | 주식회사 엘지에너지솔루션 | The Electrode And The Method For Manufacturing Thereof |
| KR20210048702A (en) | 2019-10-24 | 2021-05-04 | 주식회사 엘지화학 | A manufacturing method and equipment for Electrode using laser etching |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10048207A1 (en) * | 2000-09-28 | 2002-05-02 | Mcgavigan John Ltd | Production of plastic parts for automobiles that may be integrated with painted metal, comprises use of a plastic film in an injection mold that is sprayed with additional polymer. |
| CN1702887A (en) * | 2005-05-20 | 2005-11-30 | 清华大学 | Process for preparing carbon electrode array with high surface area and high gap filling capacity |
| CN101415549A (en) * | 2006-04-07 | 2009-04-22 | 日立金属株式会社 | Soft magnetic metal strip laminate and process for production thereof |
| EP1674192B1 (en) * | 2004-12-23 | 2009-08-05 | Reinhard Greiwe | Process for manufacturing a light-weight part from hollow spheres |
| JP4701463B2 (en) * | 1998-11-05 | 2011-06-15 | パナソニック株式会社 | Method for removing active material from battery electrode plate |
| CN103258836A (en) * | 2012-02-17 | 2013-08-21 | 华新丽华股份有限公司 | High-voltage light-emitting diode chip and manufacturing method thereof |
| US20140011067A1 (en) * | 2010-12-27 | 2014-01-09 | Mamoru Baba | Method for manufacturing thin film lithium-ion rechargeable battery, and thin film lithium-ion rechargeable battery |
| KR101400109B1 (en) * | 2013-03-26 | 2014-05-30 | (주)중앙에프에이 | Pet film production apparatus and pet film production method for touch panel using laser etching |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101093306B1 (en) * | 2007-05-18 | 2011-12-14 | 주식회사 엘지화학 | Process for Preparing Electrode of Lithium Secondary Battery Using Fiber Pulse Type Laser |
| KR101406659B1 (en) * | 2012-11-09 | 2014-06-11 | 한국과학기술원 | Method for separating device and manufacturing flexible device using laser |
| JP2014107533A (en) * | 2012-11-29 | 2014-06-09 | Pelnox Ltd | Conductive paste composition for laser etching |
-
2015
- 2015-12-09 KR KR1020150174806A patent/KR20170068064A/en not_active Application Discontinuation
-
2016
- 2016-11-29 CN CN201680072414.2A patent/CN108370023A/en active Pending
- 2016-11-29 WO PCT/KR2016/013898 patent/WO2017099407A2/en active Application Filing
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4701463B2 (en) * | 1998-11-05 | 2011-06-15 | パナソニック株式会社 | Method for removing active material from battery electrode plate |
| DE10048207A1 (en) * | 2000-09-28 | 2002-05-02 | Mcgavigan John Ltd | Production of plastic parts for automobiles that may be integrated with painted metal, comprises use of a plastic film in an injection mold that is sprayed with additional polymer. |
| EP1674192B1 (en) * | 2004-12-23 | 2009-08-05 | Reinhard Greiwe | Process for manufacturing a light-weight part from hollow spheres |
| CN1702887A (en) * | 2005-05-20 | 2005-11-30 | 清华大学 | Process for preparing carbon electrode array with high surface area and high gap filling capacity |
| CN101415549A (en) * | 2006-04-07 | 2009-04-22 | 日立金属株式会社 | Soft magnetic metal strip laminate and process for production thereof |
| US20140011067A1 (en) * | 2010-12-27 | 2014-01-09 | Mamoru Baba | Method for manufacturing thin film lithium-ion rechargeable battery, and thin film lithium-ion rechargeable battery |
| CN103258836A (en) * | 2012-02-17 | 2013-08-21 | 华新丽华股份有限公司 | High-voltage light-emitting diode chip and manufacturing method thereof |
| KR101400109B1 (en) * | 2013-03-26 | 2014-05-30 | (주)중앙에프에이 | Pet film production apparatus and pet film production method for touch panel using laser etching |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114365306A (en) * | 2019-12-23 | 2022-04-15 | 株式会社Lg新能源 | Apparatus and method for manufacturing electrode of secondary battery using laser and electrode of secondary battery manufactured thereby |
| CN114365306B (en) * | 2019-12-23 | 2024-04-16 | 株式会社Lg新能源 | Apparatus and method for manufacturing electrode of secondary battery using laser and electrode of secondary battery manufactured by the same |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20170068064A (en) | 2017-06-19 |
| WO2017099407A2 (en) | 2017-06-15 |
| WO2017099407A3 (en) | 2018-03-08 |
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