CN108364765A - A kind of potting core inductance and preparation method thereof - Google Patents
A kind of potting core inductance and preparation method thereof Download PDFInfo
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- CN108364765A CN108364765A CN201810135416.2A CN201810135416A CN108364765A CN 108364765 A CN108364765 A CN 108364765A CN 201810135416 A CN201810135416 A CN 201810135416A CN 108364765 A CN108364765 A CN 108364765A
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- inductance
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/24—Magnetic cores
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/34—Special means for preventing or reducing unwanted electric or magnetic effects, e.g. no-load losses, reactive currents, harmonics, oscillations, leakage fields
- H01F27/346—Preventing or reducing leakage fields
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/0206—Manufacturing of magnetic cores by mechanical means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/041—Printed circuit coils
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
- H01F2027/2809—Printed windings on stacked layers
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Coils Or Transformers For Communication (AREA)
Abstract
A kind of potting core inductance and preparation method thereof, belongs to integrated inductor technical field.The present invention is by joining end to end substrate both sides inductance coil to form closed circuit, and plated-through hole is arranged in the region between the adjacent lines of inductance coil, and form magnetic core column in plated-through hole, in the energized state, when electric current flows through the conducting wire of the induction structure, space that can be around conducting wire forms spherical magnetic field, so that substrate aperture inner magnetic core column and the inductance coil of substrate both sides form the magnetic conduction loop of high magnetic conduction.It can be reduced through the magnetic flux of substrate in this way, be conducive to alleviate leakage field phenomenon to improve the inductance value of inductance, and the present invention proposes that the production method of induction structure is simple, production cost is low, is conducive to industrialized development.
Description
Technical field
The invention belongs to integrated inductor technical field, more particularly to a kind of potting core inductance and preparation method thereof.
Background technology
As electronic product gradually develops to miniaturization, lightness direction, printed circuit board (Printed Circuit
Board, PCB) also develop towards multiple stratification, densification direction.Potting core inductance not only occupies less space, Er Qie
Production efficiency and product reliability can be improved during processing and manufacturing, cause extensive concern.General magnetic core magnetic permeability
More than ten times big compared to the magnetic permeability of air, hundreds of times or more, after magnetic core is added in the inductance coil of same geometric dimension and the number of turns,
Inductance value will improve much than air core inductor.Therefore core inductance has obtained a large amount of application (bibliography [1] Gardner D
S,Schrom G,Paillet F,et al.Review of on-chip inductor structures with
magnetic films[J].IEEE Transactions on Magnetics,2009,45(10):4760-4766.)。
Coiling is even closer between screw type winding structure enables to inductance coil so that generate inductance in addition to
Outside the self-induction that coil itself generates, since identical then its mutual inductance of current direction is just in adjacent inductive line, mutual inductance is for inductance value
With notable contribution, the inductance value of such induction structure is equal to the sum of self-induction and mutual inductance of conductor coils, therefore has higher
Inductance value.In printed circuit board and field of microelectronics, the thickness of the insulating substrate accompanying by inductance coil is commonly greater than inductance
The thickness of circuit, such as：The thickness of the inductance copper wire of common printed circuit board is 18 μm, line width generally 100 to 300 μm it
Between, and the thickness of insulating substrate is between 100 μm to 500 μm.In order to be reduced through the magnetic flux of insulating substrate, insulating substrate is reduced
Magnetic dispersion losses, and then ensure inductance performance requirement, screw type inductance coil structure is often laterally disposed by magnetic core, however this
Sample is unfavorable for
The miniaturization trend of electronic component.It can be seen that from above, it is logical that insulating substrate already becomes inductance coil magnetic conduction
The obstacle on road, therefore, how to eliminate insulating substrate becomes those skilled in the art for the obstacle of inductance coil magnetism guiding access
Technical problem urgently to be resolved hurrily.
Invention content
It is an object of the invention to：Asking for inductance coil magnetism guiding access is hindered for insulating substrate present in the prior art
Topic, provides a kind of potting core inductance that can reduce leakage field and promote inductance value, which can be used electroless plating technology making, work
Skill is simple, of low cost.
To achieve the goals above, the present invention adopts the following technical scheme that：
On the one hand the present invention provides a kind of potting core inductance, which is characterized in that including：Setting is in substrate side and relatively
Two conductive coils of side surface, described two conductive coil sides are coated with core layer and form inductance coil；Two inductor wires
Circle is symmetrical about the substrate minute surface, and two inductance coils form magnetic conduction loop, inductance by end to end series connection
Region in coil between adjacent inductive circuit is at least provided with row plated-through hole identical with inductive circuit path, the gold
Inside categoryization through-hole there is magnetic material to form magnetic core column so that the core layer of magnetic core column and inductance coil forms magnetic conduction and closes back
Road.
Further, the electric current transmission direction under energized state in two inductance coils is identical.
It is described end to end to be gone here and there in order to ensure that the electric current transmission direction under energized state in two inductance coils is identical
Connection is specifically：The inductance coil of one side surface of substrate is separate close to one end of hub of a spool and the inductance coil of substrate opposite side
One end of hub of a spool is connected by plated-through hole in substrate.
On the other hand, the present invention provides a kind of preparation method of potting core inductance, which is characterized in that including walking as follows
Suddenly：
Step A：It is made on the surface of opposite sides about the mirror-symmetrical conductive coil of substrate, is being led respectively on substrate
The gap of adjacent conductive tracks in electric coil opens up plated-through hole to run through substrate along the path of conducting wire, is then leading
Substrate any position outside electric coil opens up plated-through hole, then by substrate side lead loop close to one end of hub of a spool
It is connected with the one end of substrate other side conductive coil far from conductive coil center；
Step B：To being pre-processed on induction structure made from step A, target deposition area is then pre-set on it
Domain, then place it in chemical plating fluid so that conductive coil surrounding coated magnetic material forms core layer, obtains potting magnetic core
Inductance.
The beneficial effects of the invention are as follows：
Potting core inductance proposed by the present invention by joining end to end substrate both sides inductance coil to form closed circuit, and
And in addition to core layer, the via holes of substrate deposition of magnetic material shape also in conducting wire gap is arranged in coil upper surface and side
At magnetic core column, according to electromagnetic coupling theory, for electric current when flowing through conducting wire, the space around conducting wire will generate spherical magnetic
So that the inductance coil of substrate aperture inner magnetic core column and substrate both sides forms the magnetic conduction loop of high magnetic conduction.It can subtract in this way
The small magnetic flux across substrate improves the inductance value of inductance to be conducive to alleviate leakage field phenomenon；Also, such induction structure
Production method is simple, production cost is low, is conducive to industrialized development.
Description of the drawings
Fig. 1 is the stereoscopic schematic diagram of the induction structure of non-chemical plating magnetic core provided in an embodiment of the present invention.
Fig. 2 is the diagrammatic cross-section of the induction structure of non-chemical plating magnetic core provided in an embodiment of the present invention.
Fig. 3 is the stereoscopic schematic diagram of the induction structure of chemical plating magnetic core provided in an embodiment of the present invention.
Fig. 4 is the diagrammatic cross-section of the induction structure of chemical plating magnetic core provided in an embodiment of the present invention.
In figure：1 is inductance coil, and 2 be PCB substrate, and 3 be magnetic core column.
Specific implementation mode
The principle of the present invention and characteristic are described in detail with specific embodiment with reference to the accompanying drawings of the specification：
Embodiment 1：
(1) it selects raw benefit 0.4mm to contain the double face copper of copper foil (thickness for 18 μm of copper wire), is made by subtractive process
Hollow two sided pcb potting copper coil, by copper coil on one side surface of printed circuit board close to one end of hub of a spool with
The one end of copper coil far from conductive coil center is connected on its another side surface, as shown in Figure 1, 2；
(2) substrate upper edge coil tracks of the mechanical punching mode in adjacent copper ring gap is used to be formed through substrate
Through-hole, a diameter of 0.5mm of through-hole, the distance between two through-holes of arbitrary neighborhood are 0.5mm, and through-hole is apart from both sides copper coil
Apart from equal, the electroless copper on the hole wall of through-hole, about 2~5 μm of thickness of coating；
(3) by hollow two sided pcb potting copper coil carry out removal operation with remove the impurity on inductance coil and
Oxide；The present invention does not limit removal operation and degreasing fluid composition, and the present embodiment selects the group of degreasing fluid to become：30g/L
NaOH, 30g/L Na2CO3,45g/L Na3PO4；Then hollow two sided pcb potting copper coil is soaked in degreasing fluid
In at 50 DEG C oil removing 10 minutes；
(4) cleaned hollow two sided pcb potting copper coil is subjected to chemical plating, the present invention is to chemistry
Plating operation and chemical plating fluid composition do not limit, and the present embodiment selects the group of chemical plating fluid to become：40g/L NaH2PO2, 8~9g/
L NiSO4·7H2O, C (NH4)2Fe(SO4)2, C (NH4)2Fe(SO4)2, 45g/L citrates, 1g/L sodium potassium tartrate tetrahydrates, 5g/L fourths
Diacid, 5g/L HBO3, the ratio of 2mg/L thiocarbamides and 2g/L maltose metal salts should meet：C(NH4)2Fe(SO4)2/[C(NH4)2Fe(SO4)2+CNiSO4·7H2O]=0.4, chemical plating fluid component is pH value 9~10；Then by hollow two sided pcb
Potting copper coil is placed in chemical plating fluid plating 1 hour at 85 DEG C so that copper coil upper surface and side are co-deposited layer of Ni-
Two sided pcb potting inductance coil (referred to as novel two-sided core inductance) is finally made in Fe-P composite cores coating,
As shown in Figure 3,4.
The inductance value that obtained novel two-sided magnetic core is tested using automatic component analyzer is
2.14μH@1kHz。
Comparative example 1：
Raw benefit 0.4mm is selected containing the double face copper of copper foil (copper wire that thickness is 18 μm), passes through subtractive process making sky
Heart two sided pcb potting inductance copper coil, by copper coil on one side surface of printed circuit board close to one end of hub of a spool
It is connected with the one end of copper coil far from conductive coil center on its another side surface (referred to as Dual-side hollow inductance).
The inductance value that obtained Dual-side hollow inductance is tested using automatic component analyzer is 1.19 μ
H@1kHz。
Comparative example 2：
(1) it selects raw benefit 0.4mm to contain the double face copper of copper foil (thickness for 18 μm of copper wire), is made by subtractive process
Hollow two sided pcb potting copper coil, by copper coil on one side surface of printed circuit board close to one end of hub of a spool with
The one end of copper coil far from conductive coil center is connected on its another side surface；
(2) by hollow two sided pcb potting copper coil carry out removal operation with remove the impurity on inductance coil and
Oxide；The present invention does not limit removal operation and degreasing fluid composition, and the present embodiment selects the group of degreasing fluid to become：30g/L
NaOH, 30g/L Na2CO3,45g/L Na3PO4；Then hollow two sided pcb potting copper coil is soaked in degreasing fluid
In at 50 DEG C oil removing 10 minutes；
(3) cleaned hollow two sided pcb potting copper coil is subjected to chemical plating, the present invention is to chemistry
Plating operation and chemical plating fluid composition do not limit, and the present embodiment selects the group of chemical plating fluid to become：40g/L NaH2PO2, 8~9g/
L NiSO4·7H2O, C (NH4)2Fe(SO4)2, C (NH4)2Fe(SO4)2, 45g/L citrates, 1g/L sodium potassium tartrate tetrahydrates, 5g/L fourths
Diacid, 5g/L HBO3, the ratio of 2mg/L thiocarbamides and 2g/L maltose metal salts should meet：C(NH4)2Fe(SO4)2/[C(NH4)2Fe(SO4)2+CNiSO4·7H2O]=0.4, chemical plating fluid component is pH value 9~10；Then by hollow two sided pcb
Potting copper coil is placed in chemical plating fluid plating 1 hour at 85 DEG C so that copper coil upper surface and side are co-deposited layer of Ni-
Two sided pcb potting inductance coil (referred to as two-sided core inductance) is finally made in Fe-P composite cores coating.
It is 1.78 μ H to test obtained two-sided magnetic core inductance value using automatic component analyzer
1kHz。
The inductance value row of the three kinds of induction structures to sum up provided through embodiment 1, comparative example 1 and 2 are in the following table：
| Induction structure type | Inductance value |
| Dual-side hollow inductance | 1.19@1kHz |
| Two-sided core inductance | 1.78@1kHz |
| Novel two-sided core inductance | 2.14@1kHz |
As can be seen from the above table：The two-sided magnetic core induction structure of the present invention has the inductance value of bigger.
Be above the preferred embodiment of the present invention, by above description content, those skilled in the art can without departing from
In the range of technical thought of the invention, diversified change and modification are carried out.Therefore the technical scope of the present invention is not
It is confined to the content of specification, it is all according to equivalent changes and modifications made by scope of the present invention patent, it should all belong to the present invention
Covering scope.
Claims (4)
1. a kind of potting core inductance, which is characterized in that including：Two conductor wires in substrate side and opposite flank are set
Circle, described two conductive coil sides are coated with core layer and form inductance coil；Two inductance coils are about the substrate minute surface
Symmetrically, and two inductance coils form magnetic conduction loop by end to end connect, adjacent inductive circuit in inductance coil
Between region at least provided with row plated-through hole identical with the path of inductive circuit, filling inside the plated-through hole
Magnetic material forms magnetic core column so that the core layer of the magnetic core column and inductance coil forms magnetic conduction loop.
2. a kind of potting core inductance according to claim 1, it is characterised in that：Under energized state in two inductance coils
Electric current transmission direction it is identical.
3. a kind of potting core inductance according to claim 2, it is characterised in that：In order to ensure two electricity under energized state
The electric current transmission direction felt in coil is identical, described end to end to be connected specifically：By the inductor wire of one side surface of substrate
One end of the close hub of a spool of circle is with the one end of inductance coil far from hub of a spool of substrate opposite side by metallizing in substrate
Through-hole is connected.
4. a kind of preparation method of potting core inductance, which is characterized in that include the following steps：
Step A：It is made respectively on the surface of opposite sides about the mirror-symmetrical conductive coil of substrate, in conductor wire on substrate
The gap of adjacent conductive tracks in circle opens up plated-through hole to run through substrate, then in conductor wire along the path of conducting wire
Substrate any position outside circle opens up plated-through hole, then by substrate side lead loop close to one end of hub of a spool and base
The one end of plate other side conductive coil far from conductive coil center is connected；
Step B：To being pre-processed on induction structure made from step A, target deposition region is then pre-set on it, then
It places it in chemical plating fluid so that conductive coil surrounding coated magnetic material forms core layer, obtains potting core inductance.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810135416.2A CN108364765B (en) | 2018-02-09 | 2018-02-09 | A kind of potting core inductance and preparation method thereof |
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| CN201810135416.2A CN108364765B (en) | 2018-02-09 | 2018-02-09 | A kind of potting core inductance and preparation method thereof |
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| CN108364765A true CN108364765A (en) | 2018-08-03 |
| CN108364765B CN108364765B (en) | 2019-07-12 |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020057171A1 (en) * | 2000-02-01 | 2002-05-16 | Patel Raoji A. | Apparatus and method for pcb winding planar magnetic devices |
| CN103928219A (en) * | 2014-03-21 | 2014-07-16 | 长兴柏成电子有限公司 | Multi-winding planar transformer manufactured on PCBs (printed circuit boards) |
| CN106332447A (en) * | 2016-08-31 | 2017-01-11 | 电子科技大学 | Inductor structure used for printed circuit board embedding technology and manufacturing method thereof |
| CN107633941A (en) * | 2017-09-14 | 2018-01-26 | 电子科技大学 | A kind of closo integrated inductor and preparation method thereof |
-
2018
- 2018-02-09 CN CN201810135416.2A patent/CN108364765B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020057171A1 (en) * | 2000-02-01 | 2002-05-16 | Patel Raoji A. | Apparatus and method for pcb winding planar magnetic devices |
| CN103928219A (en) * | 2014-03-21 | 2014-07-16 | 长兴柏成电子有限公司 | Multi-winding planar transformer manufactured on PCBs (printed circuit boards) |
| CN106332447A (en) * | 2016-08-31 | 2017-01-11 | 电子科技大学 | Inductor structure used for printed circuit board embedding technology and manufacturing method thereof |
| CN107633941A (en) * | 2017-09-14 | 2018-01-26 | 电子科技大学 | A kind of closo integrated inductor and preparation method thereof |
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| CN108364765B (en) | 2019-07-12 |
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