CN108358438A - A kind of adsorbent equipment and cutter device - Google Patents
A kind of adsorbent equipment and cutter device Download PDFInfo
- Publication number
- CN108358438A CN108358438A CN201810411179.8A CN201810411179A CN108358438A CN 108358438 A CN108358438 A CN 108358438A CN 201810411179 A CN201810411179 A CN 201810411179A CN 108358438 A CN108358438 A CN 108358438A
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- CN
- China
- Prior art keywords
- adsorbent equipment
- glass substrate
- enclosing
- cutter head
- clast
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
Abstract
The present invention relates to for a kind of adsorbent equipment and cutter device.The adsorbent equipment includes：Enclosing structure, the cutter head for surrounding cutter device so that the enclosing inside configuration forms an enclosure space；Enclosing structure is contacted with the glass substrate cut；Knife rest, for fixing the enclosing structure；Sorption channel connects suction unit.The clast caused by cutting is trapped in the enclosure space in the technical solution, clast cannot easily fly out the enclosure space, therefore, solve due to clast splash it is too far, the problem of suction unit can not be absorbed, and clast is prevented to be splashed to the glass substrate except enclosure space, cause to cause unnecessary scuffing to glass substrate.
Description
Technical field
The present invention relates to adsorbent equipment more particularly to a kind of adsorbent equipments and cutter device.
Background technology
Currently, glass substrate is applied in different display equipment or chip, need to carry out different cuttings to prepare, and
Will produce clast in glass substrate cutting process, need to clear up clast in production technology so as not to follow-up process and
Product yield impacts.
In the related technology, a kind of debris collection device of liquid-crystalline glasses plate cutting is provided, including：Glass substrate, break bar, suction
Attached channel, suction unit, fixing device；One end of sorption channel is connect with suction unit, and one end connection is arranged at break bar
It aspirates at nozzle.Glass chip is absorbed into suction unit in this way, however in aspiration procedure or can splash to glass
It moves on substrate or on the glass substrate, not only glass substrate can be caused to scratch, fall on the glass chip on glass film surface
Film layer may also be caused to damage in the subsequent process.
Invention content
A kind of adsorbent equipment of present invention offer and cutter device avoid glass to solve technical problem of the existing technology
The glass chip generated in glass substrate cut moves around, and removing is not enough and influences subsequent processing.
The present invention provides a kind of adsorbent equipment, including：
Enclosing structure, the cutter head for surrounding cutter device so that the enclosing inside configuration forms an enclosure space；
Enclosing structure is contacted with the glass substrate cut；
Knife rest, for fixing the enclosing structure；
Sorption channel connects suction unit.
Technical solution provided by the invention can include the following benefits：Clast is trapped in the closing caused by cutting
In space, cannot easily fly out the enclosure space, therefore, solve since clast splashes too far, suction unit can not be inhaled
Except the problem of, and clast is prevented to be splashed to the glass substrate except enclosure space, causes to cause unnecessary stroke to glass substrate
Wound.
In one embodiment, the enclosing structure includes：
Enclosing ontology, the clast for generating the cutter head glass-cutting substrate are enclosed in the enclosure space；
Fixed part, for the enclosing ontology to be fixed on the knife rest.
In one embodiment, the enclosing ontology uses the material that glass substrate is contacted but do not damaged with glass substrate.
In one embodiment, the intrusion of the enclosing ontology and the glass substrate 0 between 1mm.
In one embodiment, the enclosing ontology includes the staggered hairbrush of bristle.
In one embodiment, the diameter of single bristle is between 0.05mm to 0.1mm.
In one embodiment, the sorption channel is arranged in the enclosing structure side wall, one end of the sorption channel
It is connected to the enclosure space；The other end of the sorption channel is connect with the suction unit.
In one embodiment, the sorption channel is at least arranged two, wherein one is arranged and advances in the cutter head
Direction, one is arranged the negative direction to advance in the cutter head.
In one embodiment, the sorption channel is at least arranged four, wherein one is arranged and advances in the cutter head
Direction, one is arranged the negative direction to advance in the cutter head, and two sorption channels are separately positioned on advances perpendicular to the cutter head
The both direction in direction.
In one embodiment, the adsorbent equipment further includes：
Destaticizing device, the electrostatic generated with the glass substrate for removing enclosing structure；
Wherein, the Destaticizing device be fixed on the fixed part and or knife rest on.
In one embodiment, the glass substrate is solar chip glass or liquid crystal glass base.
The present invention also provides a kind of cutter devices, including：
The adsorbent equipment of aforementioned either a program.
In one embodiment, the cutter device is for cutting solar chip glass or liquid crystal glass base.
It should be understood that above general description and following detailed description is only exemplary and explanatory, not
It can the limitation present invention.
Description of the drawings
The drawings herein are incorporated into the specification and forms part of this specification, and shows the implementation for meeting the present invention
Example, and be used to explain the principle of the present invention together with specification.
Fig. 1 is the sectional drawing according to the adsorbent equipment shown in an exemplary embodiment.
Fig. 2 is the schematic diagram according to the adsorbent equipment shown in an exemplary embodiment.
Fig. 3 is the schematic diagram according to the adsorbent equipment shown in an exemplary embodiment.
Fig. 4 is the schematic diagram according to the adsorbent equipment shown in an exemplary embodiment.
Fig. 5 is the schematic diagram according to the adsorbent equipment shown in an exemplary embodiment.
Fig. 6 is the upward view according to the adsorbent equipment shown in an exemplary embodiment.
Fig. 7 is the upward view according to the adsorbent equipment shown in an exemplary embodiment.
Fig. 8 is the schematic diagram according to the adsorbent equipment shown in an exemplary embodiment.
Fig. 9 is the schematic diagram according to the cutter device shown in an exemplary embodiment.
Specific implementation mode
Example embodiments are described in detail here, and the example is illustrated in the accompanying drawings.Following description is related to
When attached drawing, unless otherwise indicated, the same numbers in different drawings indicate the same or similar elements.Following exemplary embodiment
Described in embodiment do not represent and the consistent all embodiments of the present invention.On the contrary, they be only with it is such as appended
The example of the consistent device and method of some aspects being described in detail in claims, of the invention.
Embodiment one
Fig. 1 is a kind of sectional drawing of adsorbent equipment shown according to an exemplary embodiment, as shown in Figure 1, adsorbent equipment
May include：
Enclosing structure 101, the cutter head 20 for surrounding cutter device so that 102 inside of enclosing structure forms a closing
Space.Enclosing structure 102 is contacted with the glass substrate cut.
The cutter head 20 of the present embodiment generates clast, adsorbent equipment provided in this embodiment during glass-cutting substrate
It is adsorbed on the clast generated in cutting process.
Preferably, as shown in Fig. 2, enclosing structure 101 can surround cutter head 20 1 weeks, the shape of enclosing structure 101 can be with
It is circular, can also be rectangular, the present embodiment is not construed as limiting this.Here, enclosing structure 101 is corral gear.
In the present embodiment, when cutter head 20 is cut, the clast of splashing is limited in the enclosure space by enclosing structure 101
It is interior, it prevents from being splashed on the glass substrate except the enclosure space, reduces the possibility of the secondary scuffing to glass substrate.This
In enclosure space collectively constituted by enclosing structure 102 and glass substrate.
Knife rest 102, for fixing enclosing structure 101.
Sorption channel 103 connects suction unit.Here, suction unit can be cleaning vacuum plant.Vacuum cleaning fills
It sets and is internally provided with an electric exhaust fan, run at high speed after energization, make to form moment vacuum inside cleaning vacuum plant, it is internal
Air pressure be significantly less than extraneous air pressure, under the action of this draught head, clast enters cleaning vacuum plant bucket with air-flow
In vivo, using the filtering of dust bag, clast stays in dust bag, and the air of purification then escapes into interior again by motor, rises
To the effect of cooling motor, purification air.
The suction unit that sorption channel 103 is connected can provide one big suction by clast by sorption channel 103 from
Enclosure space is absorbed, since cutter head 20 as long as cutting as long as will produce clast, then suction unit needs to work therewith, because
This, suction unit is opened as cutter head 20 is opened, and stops suction dress again after cutter head 20 is stopped, after preset time period
Set, for example preset time period can be 5 seconds, in this way, ensure can clast will not omit.
In the present embodiment, cutter head 20 is arranged on knife rest 102, and one end of enclosing structure 101 is fixed on knife rest 102, is enclosed
The other end of gear structure 101 is contacted with the glass substrate cut.
In the present embodiment, the clast caused by cutting is trapped in the enclosure space, and clast cannot easily fly out this
Therefore enclosure space is solved since clast splashes too far, the problem of suction unit can not be absorbed, and prevent clast from splashing
Glass substrate except to enclosure space causes to cause unnecessary scuffing to glass substrate.
Adsorbent equipment provided in this embodiment can be used for cutting the cutter device of solar chip glass, it can also be used to cut
The cutter device of liquid crystal glass base, as long as clast caused by glass by fine cut, it can be by the absorption
Device is absorbed.
Embodiment two
Fig. 3 is a kind of schematic diagram of adsorbent equipment shown according to an exemplary embodiment, as shown in figure 3, adsorbent equipment
Including：
Enclosing structure 301, the cutter head 20 for surrounding cutter device so that 301 inside of enclosing structure forms a closing
Space；Enclosing structure 301 is contacted with the glass substrate cut.
Knife rest 302；For fixing enclosing structure 301.
Sorption channel 303 connects suction unit.
Wherein, enclosing structure 301 includes：
Enclosing ontology 3011, the clast closing for generating 20 glass-cutting of cutter head is in the enclosed space；
Fixed part 3012, for enclosing ontology 3011 to be fixed on knife rest 302.
In the present embodiment, enclosing ontology 3011 and fixed part 3012 can act as the effect of blocking clast, but fix
Portion 3012 also acts as the effect of fixed enclosing structure 3011.The selection of enclosing ontology 3011 can be contacted with glass substrate but not damaged
The material of glass substrate；It is preferred that more soft material, in this way, in 20 moving process of cutter head, enclosing ontology 3011 moves therewith
It is dynamic to injure glass substrate.
Preferably, the intrusion of enclosing ontology 3011 and glass substrate 0 between 1mm.
Preferably, as shown in figure 4, enclosing ontology 3011 includes the staggered hairbrush 30111 of bristle.Here, bristle is handed over
The density of mistake arrangement needs to reach to a certain degree, so that it may to stop that tiny clast flies out from hairbrush gap.And hairbrush 30111 is same
When have cleaning function, the clast that do not absorb before can be swept into enclosure space, be absorbed again by suction unit.The present embodiment
The size of hairbrush 30111 can control, and also can directly be contacted with the dead space of glass substrate.
Preferably, the diameter of single bristle is between 0.05mm to 0.1mm.
If clast is embedded in some dead angle of glass substrate, alternatively, hairbrush 20111 fails to stop several clasts, then, hair
The cleaning function of brush just embodies, and hairbrush 20111 can clean the path having already passed through, will not inhale with the movement of knife rest 202
The clast removed is received into enclosure space again, is absorbed again to these clasts, to greatest extent attracting debris.
In the present embodiment, the staggered density of bristle 20111 needs to ensure that clast can not splash away from hairbrush.And
Hairbrush 20111 has cleaning function simultaneously, can clear up the clast that do not absorb before to enclosure space, be absorbed again,
Therefore, the clast of generation is absorbed to greatest extent, improves adsorption effect, avoids damage to.
Embodiment three
Fig. 5 is a kind of schematic diagram of adsorbent equipment shown according to an exemplary embodiment, as shown in figure 5, it is compared to real
The main setting for theing improvement is that sorption channel of example one, two is applied, other structures can be used and embodiment one or embodiment two
Identical structure.
In the present embodiment, adsorbent equipment includes：
Enclosing structure 401, the cutter head 20 for surrounding cutter device so that 401 inside of enclosing structure forms a closing
Space；Enclosing structure 401 is contacted with the glass substrate cut.
Knife rest 402, for fixing enclosing structure 401.
Sorption channel 403 connects suction unit.
Wherein, the setting of sorption channel 403 connects in 401 side wall of enclosing structure, one end and the enclosure space of sorption channel 403
It is logical；The other end of sorption channel 403 is connect with suction unit.In the present embodiment, enclosing structure 401 can be with embodiment one, two
In enclosing structure it is identical.
Suction unit absorbs the clast in close enclosure space, the suction of suction unit by sorption channel 403 in the present embodiment
Entrance is connected to sorption channel 403.If suction unit is small-sized suction unit, the outer wall in enclosing structure 401 can be set；
Suction unit can also be fixed on knife rest 402, just need to extend sorption channel 403 at this time.
Sorption channel setting in 401 side wall of enclosing structure, can be arranged it is multiple, to reduce in clast adsorption process clast in glass
The path length moved on glass.
Preferably, the setting of sorption channel 403 at least two, upward view as shown in FIG. 6, wherein one in sorption channel 403
A to be arranged in the direction that cutter head 20 advances, one is arranged the negative direction to advance in cutter head 20.
If a sorption channel is only arranged, clast can be in glass surface during being adsorbed to sorption channel 403
Mobile, moving process also can generate scuffing to glass baseplate surface.And at least two sorption channels 403 are set, clast can divide
Do not walked by the absorption of at least two sorption channels 403, it is opposite shorten clast in adsorption process glass baseplate surface may be through
The path length crossed, to reduce clast in adsorption process by the mobile damage for leading to glass substrate.
Preferably, at least four sorption channels 403 can be arranged in upward view as shown in Figure 7, and one is arranged before cutter head 20
Into direction, one is arranged the negative direction to advance in cutter head 20, and remaining two sorption channels 403 are separately positioned on perpendicular to knife
The both direction of first 20 direction of advance.
Four sorption channels 403 are at least set in the present embodiment, clast can be absorbed from four direction multi-angle, if taken out
If inhaling device to fail to absorb all clasts from the direction of advance and negative direction, the sorption channel for being left both sides can also be again
Remaining clast is absorbed, adsorption efficiency is improved；And sorption channel is more, the path for absorbing glass chip is shorter, absorption speed
Degree also can be faster.
Preferably, as shown in figure 8, cutter device further includes：
Destaticizing device 404, the electrostatic generated with glass substrate for removing enclosing structure 401.
Optionally, Destaticizing device 404 be fixed on enclosing structure 401 fixed part and or knife rest 402 on.
Optionally, the glass substrate described in embodiment one to embodiment three is solar chip glass or liquid-crystalline glasses base
Plate.
In the present embodiment, Destaticizing device 404 can be drawn onto to avoid clast electrostatic on glass substrate and enclosing structure 401,
Adsorption effect is further increased, is avoided damage to.
Example IV
Fig. 9 is a kind of schematic diagram of cutter device shown according to an exemplary embodiment, as shown in figure 9, cutter device
May include：
Adsorbent equipment 50, including enclosing structure, the cutter head 20 for surrounding the cutter device so that the enclosing structure
Inside forms an enclosure space；Enclosing structure is contacted with the glass substrate cut；Knife rest, for fixing cutter head 20 and described
Enclosing structure；Sorption channel connects suction unit.
Adsorbent equipment 50 can be the adsorbent equipment of any embodiment in embodiment one to three.Here, cutter device may be used also
To include：Cutter head 20 for glass-cutting substrate, the fixed plate 60 etc. for fixing glass substrate.
In one embodiment, cutter device is for cutting solar chip glass or liquid crystal glass base.
Before cutter device start-up operation, first glass substrate is fixed in fixed plate 60, opens cutter device, knife rest
It is reduced to the position that cutter head 20 can be contacted with glass substrate, cutter head 20 begins to be cut on the glass substrate, suction dress
It sets and is opened as cutter head 20 is opened；Clast is sputtered in cutting process, the closing that clast is limited in the encirclement of enclosing structure is empty
In, suction unit absorbs these clasts by sorption channel from enclosure space.When cutter head 20 is stopped, suction unit
It can be stopped, or be stopped again after being set in preset time period, to ensure that clast is cleaned.
Those skilled in the art after considering the specification and implementing the invention disclosed here, will readily occur to its of the present invention
Its embodiment.This application is intended to cover the present invention any variations, uses, or adaptations, these modifications, purposes or
Person's adaptive change follows the general principle of the present invention and includes undocumented common knowledge in the art of the invention
Or conventional techniques.The description and examples are only to be considered as illustrative, and true scope and spirit of the invention are by following
Claim is pointed out.
It should be understood that the invention is not limited in the precision architectures for being described above and being shown in the accompanying drawings, and
And various modifications and changes may be made without departing from the scope thereof.The scope of the present invention is limited only by the attached claims.
Claims (13)
1. a kind of adsorbent equipment, which is characterized in that including：
Enclosing structure, the cutter head for surrounding cutter device so that the enclosing inside configuration forms an enclosure space；Enclosing
Structure is contacted with the glass substrate cut；
Knife rest, for fixing the enclosing structure；
Sorption channel connects suction unit.
2. adsorbent equipment according to claim 1, which is characterized in that the enclosing structure includes：
Enclosing ontology, the clast for generating the cutter head glass-cutting substrate are enclosed in the enclosure space；
Fixed part, for the enclosing ontology to be fixed on the knife rest.
3. adsorbent equipment according to claim 2, which is characterized in that the enclosing ontology using being contacted with glass substrate but
The material of glass substrate is not damaged.
4. adsorbent equipment according to claim 2, which is characterized in that the indentation of the enclosing ontology and the glass substrate
Amount is 0 between 1mm.
5. adsorbent equipment according to claim 2, which is characterized in that the enclosing ontology includes the staggered hair of bristle
Brush.
6. adsorbent equipment according to claim 5, which is characterized in that the diameter of single bristle 0.05mm to 0.1mm it
Between.
7. according to claim 1-6 any one of them adsorbent equipments, which is characterized in that the sorption channel setting is enclosed described
Structure side wall is kept off, one end of the sorption channel is connected to the enclosure space；The other end of the sorption channel and the pumping
Inhale device connection.
8. adsorbent equipment according to claim 7, which is characterized in that the sorption channel is at least arranged two, wherein one
A to be arranged in the direction that the cutter head advances, one is arranged the negative direction to advance in the cutter head.
9. adsorbent equipment according to claim 7, which is characterized in that the sorption channel is at least arranged four, wherein one
A to be arranged in the direction that the cutter head advances, one is arranged the negative direction to advance in the cutter head, and two sorption channels are set respectively
It sets in the both direction perpendicular to the cutter head direction of advance.
10. adsorbent equipment according to claim 2, which is characterized in that the cutter device further includes：
Destaticizing device, the electrostatic generated with the glass substrate for removing enclosing structure；
Wherein, the Destaticizing device be fixed on the fixed part and or knife rest on.
11. according to claim 1-6,8-10 any one of them adsorbent equipment, which is characterized in that the glass substrate is the sun
It can chip glass or liquid crystal glass base.
12. a kind of cutter device, which is characterized in that including：
According to claim 1-11 any one of them adsorbent equipments.
13. cutter device according to claim 12, which is characterized in that the cutter device is for cutting solar chip
Glass or liquid crystal glass base.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810411179.8A CN108358438A (en) | 2018-05-02 | 2018-05-02 | A kind of adsorbent equipment and cutter device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810411179.8A CN108358438A (en) | 2018-05-02 | 2018-05-02 | A kind of adsorbent equipment and cutter device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108358438A true CN108358438A (en) | 2018-08-03 |
Family
ID=63011505
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810411179.8A Pending CN108358438A (en) | 2018-05-02 | 2018-05-02 | A kind of adsorbent equipment and cutter device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108358438A (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040211218A1 (en) * | 2003-04-24 | 2004-10-28 | Nec Plasma Display Corporation | Method and apparatus for cutting a glass sheet and method for manufacturing a PDP |
| CN102503106A (en) * | 2011-10-28 | 2012-06-20 | 深圳市华星光电技术有限公司 | Debris collecting device of cutting mechanism and cutting debris suction device of liquid crystal display (LCD) panel |
| CN103979786A (en) * | 2014-05-16 | 2014-08-13 | 深圳市华星光电技术有限公司 | Cutting method of single-plate glass substrate |
| CN206047353U (en) * | 2016-06-20 | 2017-03-29 | 昆山国显光电有限公司 | A kind of laser preparing protection system |
| CN206426735U (en) * | 2017-01-19 | 2017-08-22 | 杭州杭景模型有限公司 | A kind of engraving machine of Anti-splash |
| CN206968263U (en) * | 2017-07-05 | 2018-02-06 | 浙江高光数控科技有限公司 | A kind of plug-type engraving machine dust shield |
| CN208562147U (en) * | 2018-05-02 | 2019-03-01 | 北京铂阳顶荣光伏科技有限公司 | A kind of adsorbent equipment and cutter device |
-
2018
- 2018-05-02 CN CN201810411179.8A patent/CN108358438A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040211218A1 (en) * | 2003-04-24 | 2004-10-28 | Nec Plasma Display Corporation | Method and apparatus for cutting a glass sheet and method for manufacturing a PDP |
| CN102503106A (en) * | 2011-10-28 | 2012-06-20 | 深圳市华星光电技术有限公司 | Debris collecting device of cutting mechanism and cutting debris suction device of liquid crystal display (LCD) panel |
| CN103979786A (en) * | 2014-05-16 | 2014-08-13 | 深圳市华星光电技术有限公司 | Cutting method of single-plate glass substrate |
| CN206047353U (en) * | 2016-06-20 | 2017-03-29 | 昆山国显光电有限公司 | A kind of laser preparing protection system |
| CN206426735U (en) * | 2017-01-19 | 2017-08-22 | 杭州杭景模型有限公司 | A kind of engraving machine of Anti-splash |
| CN206968263U (en) * | 2017-07-05 | 2018-02-06 | 浙江高光数控科技有限公司 | A kind of plug-type engraving machine dust shield |
| CN208562147U (en) * | 2018-05-02 | 2019-03-01 | 北京铂阳顶荣光伏科技有限公司 | A kind of adsorbent equipment and cutter device |
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