CN108346961A - A kind of laser aid residue laser absorption device and its application method - Google Patents
A kind of laser aid residue laser absorption device and its application method Download PDFInfo
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- CN108346961A CN108346961A CN201810360018.0A CN201810360018A CN108346961A CN 108346961 A CN108346961 A CN 108346961A CN 201810360018 A CN201810360018 A CN 201810360018A CN 108346961 A CN108346961 A CN 108346961A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/02—Constructional details
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Abstract
The present invention relates to a kind of laser aid residue laser absorption device and its application methods,It is related to high power laser light technical field,The absorption plant includes the first absorbent assembly,Second absorbent assembly and braced frame,It is identical that first absorbent assembly includes at least 2 structures,It is arranged in parallel and at interval absorber,The absorber includes that first be in direct contact with remaining laser absorbs side and the second absorption side,And first absorption side and/or second absorption side be set as curved surface,The residue laser emits between adjacent absorbent body,The present invention passes through absorber is curving,Increase the incident area that absorption plant absorbs remaining laser,To reduce the luminous flux of absorption plant position,Simultaneously,It is combined and is arranged using absorber,Reflection-absorption number of the remaining laser of control between adjacent absorbent body,Final realize fully absorbs remaining laser,Improve absorber damage problem.
Description
Technical field
The invention belongs to high power laser light technical fields, relate in particular to a kind of laser aid residue laser absorption device
And its application method.
Background technology
In large scale laser instrument, stray light that laser transmission generates in the process, without remaining laser for utilizing etc. can pair
Optical element in device causes certain harm, it usually needs is absorbed by absorber.Currently, common absorber
There are plate, wedge type etc., each contact surface of absorber to be processed as plane.It is continuous with laser technology and its application
Development, laser aid gradually develop to high power high-energy direction, and therefore, the energy of remaining laser is also promoted therewith, and light beam exists
Absorber surface flux increases, and surface flux can bring serious damage once being higher than damage threshold.Although clapboard can
Reduce light beam in the flux of absorber surface, and is inversely proportional with inclination angle, but inclination angle is excessive similarly to be influenced to light beam
It absorbs, therefore, by increasing the effect of angle of inclination realization reduction surface flux, there are certain limitations.And traditional is put down
For the absorber of face, the damage that high throughput is brought is greatly reduced the service life of absorber.
Invention content
For various deficiencies of the prior art, to solve the above-mentioned problems, it is proposed that a kind of laser aid residue laser suction
Receiving apparatus and its application method.
To achieve the above object, the present invention provides the following technical solutions：
A kind of laser aid residue laser absorption device, including the first absorbent assembly, the second absorbent assembly and braced frame,
Second absorbent assembly is located at the lower section of the first absorbent assembly, and it is vertically arranged with the first absorbent assembly, and described first inhales
It receives component and the second absorbent assembly is respectively positioned on inside braced frame；
First absorbent assembly is including at least 2 structures are identical, are arranged in parallel and at interval absorber, the absorber
It is arranged along the transmission direction of remaining laser comprising absorb side and second with remaining laser is in direct contact first and absorb side
Face, and the first absorption side and/or the second absorption side are set as curved surface, described first, which absorbs the top of side and second, absorbs side
Connect at the top of face, second absorbent assembly is set as slab construction, and it is arranged perpendicular to the transmission direction of remaining laser, institute
Remaining laser is stated between adjacent absorbent body to emit.
Further, appoint and take the absorption point on the curved surface and arbitrarily set horizontal line, the absorption point and setting horizontal line
Spacing be h, the normal direction extended line for absorbing point and the horizontal intersection point of setting are away from the inverse for absorbing distance between point
For C, the angle for absorbing point to circle center line connecting and horizontal plane is θ, and radiation flux of the residue laser at absorber is
I0, the residue laser is I absorbing the incident flux at point, then I=I0× sin θ=I0× h × C, the absorber use
The damage threshold of material is Ith, then I<Ith。
Further, the linear formula in top of the top of first absorption side and the second absorption side connects.
Further, the top of the top of first absorption side and the second absorption side is connected by abutted surface, and phase
Junction is inclined surface.
Further, the angle of the inclined surface and horizontal plane is 45 ° -90 °.
In addition, the present invention also provides a kind of application method of laser aid residue laser absorption device, include the following steps：
S1：The height of the absorber is H, and the absorption coefficient to remaining laser is a, and the spacing of adjacent absorbent body is d,
It determines absorber design parameter and makes the first absorbent assembly；
S2：Second absorbent assembly is placed in below the first absorbent assembly, and first absorbent assembly and second are absorbed
Component is placed in inside braced frame；
S3：Adjustment braced frame is to ensure that the second absorbent assembly is arranged perpendicular to the transmission direction of remaining laser, you can.
Further, in the step S1, the determination method of absorber design parameter is：
S11：According to installation space and cost, determine that the height H of absorber and absorber use the damage threshold of material
Ith；
S12：Material according to absorber use determines the damage threshold I of absorberthAnd absorption coefficient a, change spacing d with
And the C reciprocal of distance, it is incident to the maximum on the assimilation effect schematic diagram and different curve of remaining laser logical to obtain absorber
Measure schematic diagram；
S13：It is less than damage threshold I meeting maximum incident fluxthUnder the premise of, take assimilation effect schematic diagram to enter with maximum
The intersection for penetrating flux schematic diagram, obtain spacing d, distance C and absorption coefficient a reciprocal.
Further, in the step S12, absorber is made using different materials, by changing absorbent structure, to obtain
The absorber of different absorption coefficients is to the assimilation effect schematic diagram of remaining laser, and the maximum for obtaining different absorption coefficients is incident logical
Measure schematic diagram.
Further, in the step S13, it is less than damage threshold I meeting maximum incident fluxthUnder the premise of, to same
The assimilation effect schematic diagram of absorption coefficient takes intersection with maximum incident flux schematic diagram, obtains the parameter designing of different absorption coefficients
The parameter designing schematic diagram is taken intersection by schematic diagram, obtain spacing d, distance C and absorption coefficient a reciprocal.
The beneficial effects of the invention are as follows：
By the way that absorber is curving, increase absorption plant absorbs the incident area of remaining laser, absorbs dress to reduce
The luminous flux of seated position, meanwhile, it is combined and is arranged using absorber, unabsorbed residue laser energy is carried out using adjacent absorbent body
Reflection is further absorbed, by preferred absorbent structure parameter, controls reflection-absorption of the remaining laser between adjacent absorbent body
Number, final realize fully absorb remaining laser, improve absorber damage problem.
Description of the drawings
Fig. 1 is the overall structure diagram of the present invention；
Fig. 2 is remaining laser absorption effect diagram；
Fig. 3 (a) be embodiment two in, absorption coefficient be 40% when, assimilation effect schematic diagram of the absorber to remaining laser；
Fig. 3 (b) be embodiment two in, absorption coefficient be 30% when, assimilation effect schematic diagram of the absorber to remaining laser；
Fig. 3 (c) be embodiment two in, absorption coefficient be 20% when, assimilation effect schematic diagram of the absorber to remaining laser；
Fig. 4 is in embodiment two, when absorption coefficient is 40%, the maximum incident flux schematic diagram on different curve；
Fig. 5 (a) is the parameter designing schematic diagram that absorption coefficient is 40% in embodiment two；
Fig. 5 (b) is the parameter designing schematic diagram that absorption coefficient is 30% in embodiment two；
Fig. 5 (c) is the parameter designing schematic diagram that absorption coefficient is 20% in embodiment two.
In attached drawing：The first absorbent assemblies of 1-, the second absorbent assemblies of 2-, 3- braced frames, 4- absorbers, 5- residue laser；
In Fig. 3, Fig. 4, Fig. 5, abscissa indicates that spacing d, unit mm, ordinate indicate the C reciprocal of distance, unit 1/
mm。
Specific implementation mode
It is right with reference to the attached drawing of the present invention in order to make those skilled in the art more fully understand technical scheme of the present invention
Technical scheme of the present invention carries out clear, complete description, and based on the embodiment in the application, those of ordinary skill in the art exist
The other similar embodiments obtained under the premise of not making creative work, shall fall within the protection scope of the present application.
In addition, the direction word mentioned in following embodiment, such as "upper" "lower" " left side " " right side " etc. are only the directions of refer to the attached drawing, because
This, the direction word used is for illustrative and not limiting the invention.
Embodiment one：
As shown in Figs. 1-2, a kind of laser aid residue laser absorption device, including the first absorbent assembly 1, the second absorption group
Part 2 and braced frame 3, first absorbent assembly 1, the second absorbent assembly 2 are used to absorb remaining laser, and the two may be used
Arbitrary medium material is made, meanwhile, the two can be used for absorbing the remaining laser 3 of arbitrary wavelength X, specifically, described second absorbs
Component 2 is set as slab construction, is located at the lower section of the first absorbent assembly 1, and it is vertically arranged with the first absorbent assembly 1, also
It is to say, the upper surface of second absorbent assembly 2 is connect with the bottom of the first absorbent assembly 1, first absorbent assembly 1 and
Two absorbent assemblies 2 are respectively positioned on inside braced frame 3.
First absorbent assembly 1 is including at least 2 structures are identical, are arranged in parallel and at interval absorber 4, the present embodiment
In, the absorber 4 shares 4.The absorber 4 is arranged along the transmission direction of remaining laser 5 comprising with remaining laser
5 the first absorption sides being in direct contact and second absorb side, and the first absorption side and/or the second absorption side are set as bent
Face, by the way that the first absorption side and/or the second absorption side is curving, to increase the incidence that absorber 4 absorbs remaining laser 5
Area.Meanwhile second absorbent assembly 2 is arranged perpendicular to the transmission direction of remaining laser 5, the residue laser 5 is adjacent
Repeatedly transmitting occurs between absorber 4.
Appoint take the absorption point on the curved surface and arbitrarily set horizontal line, the absorption point with set horizontal spacing as
H, it is described absorb point normal direction extended line and set horizontal intersection point away from absorb point between distance inverse as C (below
The referred to as C reciprocal of distance), the angle for absorbing point to circle center line connecting and horizontal plane is θ, and the residue laser 5 is absorbing
Radiation flux at body 4 is I0, the residue laser 5 is I absorbing the incident flux at point, then I=I0× sin θ=I0×h
× C, the absorber 4 use the damage threshold of material for Ith, then I<Ith, brought with improving when big energy residual laser 5 absorbs
Damage problem.
From the above：Incident flux I is directly proportional to the product of spacing h and C, and when h is fixed, C is smaller, and incident flux is got over
It is small, and the determination of h, it needs to consider installation space and the cost of absorber 4 etc. factor.
Connect at the top of the top of first absorption side and the second absorption side, that is to say, that the top of absorber 4
For closing structure.In order to avoid the top that remaining laser 5 is directly transmitted to absorber 4 causes absorber 4 to damage, in some implementations
In example, the linear formula in top of the top of first absorption side and the second absorption side connects.In the present embodiment, described
The top of the top of one absorption side and the second absorption side is connected by abutted surface, and abutted surface is inclined surface, that is to say, that
Obliqueization processing is done at the top of absorber 4, meanwhile, remaining laser 5 is escaped in order to prevent, and the angle of the inclined surface and horizontal plane is
45°-90°。
Using the application method of the laser aid residue laser absorption device, include the following steps：
S1：The height of the absorber 4 is H, and the absorption coefficient to remaining laser 5 is a, the spacing of adjacent absorbent body 4
The height H of absorber 4 is determined according to installation space and cost for d, the material used according to absorber 4 determines absorber 4
Damage threshold IthAnd absorption coefficient a changes the spacing d and C reciprocal of distance using traversal, obtains absorber 4 and swashs to residue
Maximum incident flux schematic diagram on the assimilation effect schematic diagram and different curve of light 5, meanwhile, absorber uses different materials
It is different that i.e. absorption coefficient a is made, to obtain assimilation effect schematic diagram of the absorber to remaining laser of different absorption coefficients, and obtains
The maximum incident flux schematic diagram for obtaining different absorption coefficients is less than damage threshold I meeting maximum incident fluxthUnder the premise of,
Intersection is taken to the assimilation effect schematic diagram and maximum incident flux schematic diagram of same absorption coefficient, obtains the ginseng of different absorption coefficients
Number design diagrams, intersection is taken by the parameter designing schematic diagram, obtain spacing d, distance C and absorption coefficient a reciprocal, and make
Make the first absorbent assembly 1；
S2：Second absorbent assembly 2 is placed in 1 lower section of the first absorbent assembly, and first absorbent assembly 1 and second is inhaled
Component 2 is received to be placed in inside braced frame 3；
S3：Adjust braced frame 3 to ensure that the second absorbent assembly 2 is arranged perpendicular to the transmission direction of remaining laser 5, i.e.,
It can.
Embodiment two：
The present embodiment part identical with embodiment one repeats no more, unlike：
Absorber 4 is two-sided curved surface, i.e., it is curved surface that the first of absorber 4, which absorbs side and the second absorption side, is absorbed
Body 4 is set as 3 altogether, i.e., the described absorption plant shares 6 curved surfaces.The wavelength X of remaining laser 5 to be absorbed is 1053nm, light spoke
It is I to penetrate flux0It is 1.28 × 1010W/cm2。
The height H of absorber 4 is set as 200mm, uses stainless steel to be made, damage threshold IthIt is 1.7 × 109W/
cm2, absorption coefficient a is 40%.Change d and C, obtains absorber 4 to the assimilation effect schematic diagram of remaining laser 5, such as Fig. 3
(a) shown in, White curves are the line of demarcation for fully absorbing He not fully absorbing in figure.Similarly, the material for replacing absorber 4, takes
Absorption coefficient a is 30%, assimilation effect schematic diagram of the absorber 4 to remaining laser 5 is obtained, as shown in Fig. 3 (b).Take absorption system
Number a is 20%, assimilation effect schematic diagram of the absorber 4 to remaining laser 5 is obtained, as shown in Fig. 3 (c), at this point, absorber 4 is right
5 almost all of remaining laser is not safely absorb, therefore, does not reset a=10%.It can be seen that by Fig. 3 (a)-Fig. 3 (c)：With
The increase of a, absorber 4 is easier to realize fully absorbing to remaining laser 5, meanwhile, with the reduction of d and the increase of C, remain
Order of reflection of the remaining laser 5 between adjacent absorbent body 4 increases, and is more advantageous to the fully absorbing to remaining laser 5 of absorber 4.
The case where for a=40%, changes d and C, analyzes the flux peak on 6 curved surfaces, obtain different curve
On maximum incident flux schematic diagram, as shown in figure 4, in figure Grey curves indicate design object 1.7 × 109W/cm2, meeting
Maximum incident flux is less than damage threshold IthUnder the premise of, Fig. 3 (a) and Fig. 4 are taken into intersection, the ginseng that the coefficient that is absorbed is 40%
Number design diagram, as shown in Fig. 5 (a), white area indicates intersection part in figure.Equally, when replacement absorption coefficient a is respectively
30%, when 20% material, using the method for traversal, the maximum incident flux obtained on different absorption coefficients and different curve shows
It is intended to, the parameter designing schematic diagram corresponding to absorbing material for being 30%, 20% to the coefficient that is absorbed, respectively such as Fig. 5
(b), shown in 5 (c).It can be seen that by Fig. 5 (a)-Fig. 5 (c)：For the lower material of absorption coefficient (absorption coefficient 20%),
Change d and C (changing structural parameters), it is difficult to while realizing the target fully absorbed with drop flux, therefore, by Fig. 5 (a) and figure
5 (b) takes intersection, obtains the parameter after the corresponding optimization of different absorption coefficients：A=40%, d=10mm, C=0.0008；A=
30%, d=9mm, C=0.0004.
The first absorbent assembly 1 is made according to the parameter after optimization, by first absorbent assembly, 1 and second absorbent assembly 2
It is placed in inside braced frame 3, and the transmission direction by the second absorbent assembly 2 perpendicular to remaining laser 5 is arranged.It is remaining absorbing
In the real process of laser 5, the maximum incident flux on curved surface is 2.7 × 109W/cm2, average flux 3.7 × 108W/cm2。
Embodiment three：
The present embodiment part identical with embodiment one, embodiment two repeats no more, unlike：
Absorber 4 is single side curved surface, i.e., it is curved surface that the first of absorber 4, which absorbs side, and second absorbs side for plane, inhales
Acceptor 4 is set as 6 altogether, i.e., the described absorption plant shares 6 curved surfaces.The wavelength X of remaining laser 5 to be absorbed is 1053nm, light
Radiation flux is I0It is 1.28 × 1010W/cm2.Parameter after optimization：H=300mm, d=30mm, C=0.0008, a=30%,
In the real process for absorbing remaining laser 5, the flux peak on curved surface is 6.0 × 109W/cm2, average flux be 1.0 ×
109W/cm2。
The present invention is described in detail above, described above, only the preferred embodiments of the invention, when cannot
Limit the scope of the present invention, i.e., it is all according to the made equivalent changes and modifications of the application range, it all should still belong to covering scope of the present invention
It is interior.
Claims (9)
1. a kind of laser aid residue laser absorption device, which is characterized in that including the first absorbent assembly, the second absorbent assembly and
Braced frame, second absorbent assembly is located at the lower section of the first absorbent assembly, and it is vertically arranged with the first absorbent assembly, institute
It states the first absorbent assembly and the second absorbent assembly is respectively positioned on inside braced frame；
First absorbent assembly include at least 2 structures are identical, are arranged in parallel and at interval absorber, the absorber along
The transmission direction of remaining laser is arranged comprising and it absorbs side and second with remaining laser is in direct contact first and absorbs side,
And first absorption side and/or the second absorption side be set as curved surface, described first, which absorbs the top of side and second, absorbs side
Top connect, second absorbent assembly is set as slab construction, and it is arranged perpendicular to the transmission direction of remaining laser, described
Remaining laser emits between adjacent absorbent body.
2. a kind of laser aid residue laser absorption device according to claim 1, which is characterized in that appoint and take the curved surface
On absorption point and arbitrarily set horizontal line, the absorption point and set horizontal spacing as h, the normal that the absorption is put is anti-
To extended line and set horizontal intersection point away from absorb point between distance inverse as C, the absorption point to circle center line connecting and water
The angle of plane is θ, and radiation flux of the residue laser at absorber is I0, the residue laser entering at absorption point
It is I to penetrate flux, then I=I0× sin θ=I0× h × C, the absorber use the damage threshold of material for Ith, then I<Ith。
3. a kind of laser aid residue laser absorption device according to claim 2, which is characterized in that described first absorbs
The linear formula in top of the top of side and the second absorption side connects.
4. a kind of laser aid residue laser absorption device according to claim 2, which is characterized in that described first absorbs
The top of the top of side and the second absorption side is connected by abutted surface, and abutted surface is inclined surface.
5. a kind of laser aid residue laser absorption device according to claim 4, which is characterized in that the inclined surface with
The angle of horizontal plane is 45 ° -90 °.
6. a kind of application method using laser aid residue laser absorption device as described in claim 3 or 4, feature exists
In including the following steps：
S1：The height of the absorber is H, and the absorption coefficient to remaining laser is a, and the spacing of adjacent absorbent body is d, is determined
Absorber design parameter simultaneously makes the first absorbent assembly；
S2：Second absorbent assembly is placed in below the first absorbent assembly, and by first absorbent assembly and the second absorbent assembly
It is placed in inside braced frame；
S3：Adjustment braced frame is to ensure that the second absorbent assembly is arranged perpendicular to the transmission direction of remaining laser, you can.
7. the application method of laser aid residue laser absorption device according to claim 6, which is characterized in that the step
In rapid S1, the determination method of absorber design parameter is：
S11：According to installation space and cost, the height H of absorber is determined；
S12：Material according to absorber use determines the damage threshold I of absorberthAnd absorption coefficient a, change spacing d and away from
From C reciprocal, obtain absorber the maximum incident flux on the assimilation effect schematic diagram and different curve of remaining laser is shown
It is intended to；
S13：It is less than damage threshold I meeting maximum incident fluxthUnder the premise of, take assimilation effect schematic diagram and maximum incidence logical
Measure schematic diagram intersection, obtain spacing d, distance C and absorption coefficient a reciprocal.
8. the application method of laser aid residue laser absorption device according to claim 7, which is characterized in that the step
In rapid S12, absorber is made using different materials, by changing absorbent structure, to obtain the absorber of different absorption coefficients
To the assimilation effect schematic diagram of remaining laser, and obtain the maximum incident flux schematic diagram of different absorption coefficients.
9. the application method of laser aid residue laser absorption device according to claim 8, which is characterized in that the step
In rapid S13, it is less than damage threshold I meeting maximum incident fluxthUnder the premise of, the assimilation effect of same absorption coefficient is illustrated
Figure takes intersection with maximum incident flux schematic diagram, the parameter designing schematic diagram of different absorption coefficients is obtained, by the parameter designing
Schematic diagram takes intersection, obtain spacing d, distance C and absorption coefficient a reciprocal.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201810360018.0A CN108346961B (en) | 2018-04-20 | 2018-04-20 | Laser device residual laser absorbing device and using method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810360018.0A CN108346961B (en) | 2018-04-20 | 2018-04-20 | Laser device residual laser absorbing device and using method thereof |
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| CN108346961B CN108346961B (en) | 2023-07-28 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112130319A (en) * | 2020-09-28 | 2020-12-25 | 中国工程物理研究院激光聚变研究中心 | Ultrahigh-flux laser beam trap and manufacturing method thereof |
| CN115793115A (en) * | 2022-11-08 | 2023-03-14 | 哈尔滨工业大学 | Scattered light absorption device and system |
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| CN208209231U (en) * | 2018-04-20 | 2018-12-07 | 中国工程物理研究院激光聚变研究中心 | A kind of laser aid residue laser absorption device |
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| JPH06324203A (en) * | 1993-05-13 | 1994-11-25 | Tachibana Seisakusho:Kk | Laser beam absorbing device |
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| CN115793115A (en) * | 2022-11-08 | 2023-03-14 | 哈尔滨工业大学 | Scattered light absorption device and system |
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| CN108346961B (en) | 2023-07-28 |
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